CN216816943U - Device for detecting chip by utilizing TOF (time of flight) - Google Patents
Device for detecting chip by utilizing TOF (time of flight) Download PDFInfo
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- CN216816943U CN216816943U CN202123321472.1U CN202123321472U CN216816943U CN 216816943 U CN216816943 U CN 216816943U CN 202123321472 U CN202123321472 U CN 202123321472U CN 216816943 U CN216816943 U CN 216816943U
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Abstract
The utility model discloses a device for detecting a chip by utilizing TOF (time of flight), which relates to the technical field of 3D (three-dimensional) detection and comprises a lamp box, an infrared emitter arranged at the top in the lamp box, two reflecting plates capable of being pulled out of the lamp box, and a test base arranged below the lamp box and used for testing laser ranging and infrared imaging of a photosensitive chip, wherein the test base is provided with a laser emitter and a communication interface; infrared light emitted by the infrared emitter faces the bottom of the lamp box; the front surface of the reflecting plate is a reflecting surface for reflecting laser, and the back surface of the reflecting plate is a transmitting surface for transmitting infrared light; when the reflecting plate is arranged on the lamp box, the reflecting surface faces downwards; the two reflecting plates are arranged at different heights in the lamp box; the laser emitted by the laser emitter faces the top of the lamp box; the laser transmitter, the communication interface and the test base are electrically connected. The utility model can finish the laser ranging test and the infrared imaging test of the chip through one-time disassembly and assembly of the chip.
Description
Technical Field
The utility model relates to the technical field of 3D detection, in particular to a device for detecting a chip by utilizing TOF.
Background
Conventional 2D imaging devices, such as cameras, can only acquire planar information of an object; the 3D imaging device can also acquire depth information of an object and construct a three-dimensional 3D model, so that the 3D imaging device is widely applied to the fields of industrial measurement, part modeling, medical diagnosis, security monitoring, machine vision, biological recognition, augmented reality AR, virtual reality VR and the like, and has great application value. The photosensitive chip in the 3D imaging device is particularly important, and the photosensitive chip needs to receive laser light to determine a distance and infrared light to sense an image.
During laser ranging of the photosensitive chip, a TOF principle is generally adopted. TOF is an abbreviation of Time flight, interpreted as the meaning of Time of flight. Time-of-flight techniques are understood in a broad sense to be techniques for further understanding certain properties of ions or media by measuring the time it takes for an object, particle or wave to fly a certain distance in a fixed medium (both medium/distance/time being known or measurable).
In the prior art, three stations are required to be arranged for detecting the photosensitive chip, two stations are used for carrying out laser test, and one station is used for carrying out infrared light test, so that the detection is very complicated, and unnecessary errors can be caused by repeated assembly and disassembly.
SUMMERY OF THE UTILITY MODEL
Aiming at the technical problem, the device for detecting the chip by using the TOF provided by the utility model can finish the laser ranging detection and the detection of the induction infrared ray of the photosensitive chip only by finishing the installation of the photosensitive chip once. The device for detecting the chip by utilizing the TOF simplifies the procedure of testing the photosensitive chip and can reduce the error influence caused by the repeated chip disassembly and assembly.
In order to achieve the purpose, the utility model adopts the technical scheme that:
the utility model provides a device for detecting a chip by utilizing TOF (time of flight), which comprises a lamp box, an infrared emitter arranged at the top in the lamp box, two reflecting plates capable of being pulled out of the lamp box, and a test base arranged below the lamp box and used for testing laser ranging and infrared imaging of a photosensitive chip, wherein the test base is provided with a laser emitter and a communication interface; the infrared light emitted by the infrared emitter faces the bottom of the lamp box; the reflecting plate is plate-shaped, the front surface of the reflecting plate is a reflecting surface for reflecting laser, and the back surface of the reflecting plate is a transmitting surface for transmitting infrared light; when the reflecting plate is arranged on the lamp box, the reflecting surface faces downwards; the two reflecting plates are arranged at different heights in the lamp box; the laser emitted by the laser emitter faces the top of the lamp box; the laser transmitter, the communication interface and the test base are electrically connected.
According to the device for detecting the chip by using the TOF, the two reflecting plates are preferably a first reflecting plate and a second reflecting plate, and the first reflecting plate is arranged at the position, 8cm-12cm away from the laser emitter, of the reflecting surface of the first reflecting plate; the second reflecting plate is arranged at the position, 25cm-35cm away from the laser emitter, of the reflecting surface of the second reflecting plate.
According to the device for detecting the chip by using the TOF, the infrared emitter is preferably electrically connected with an external power supply.
The utility model provides a device for detecting a chip by utilizing TOF (time of flight), preferably, the test base comprises a chip control module which is electrically connected with the chip to be detected and used for collecting and transmitting a laser transmitter signal to the chip to be detected, and a laser control module which is used for controlling the laser transmitter to work; the chip control module is electrically connected with the laser control module; the test base is electrically connected with an external power supply, and the external power supply supplies power to the chip control module and the laser control module.
The technical scheme has the following advantages or beneficial effects:
the utility model discloses a device for detecting a chip by utilizing TOF, which relates to the technical field of 3D detection and comprises a lamp box, an infrared emitter arranged at the top in the lamp box, two reflecting plates capable of being pulled out of the lamp box, and a test base arranged below the lamp box and used for testing laser ranging and infrared imaging of a photosensitive chip, wherein the test base is provided with a laser emitter and a communication interface; infrared light emitted by the infrared emitter faces the bottom of the lamp box; the reflecting plate is plate-shaped, the front surface of the reflecting plate is a reflecting surface for reflecting laser, and the back surface of the reflecting plate is a transmitting surface for transmitting infrared light; when the reflecting plate is arranged on the lamp box, the reflecting surface faces downwards; the two reflecting plates are arranged at different heights in the lamp box; the laser emitted by the laser emitter faces the top of the lamp box; the laser transmitter, the communication interface and the test base are electrically connected. The utility model can complete the laser ranging test and the infrared imaging test of the chip through one-time disassembly and assembly of the chip.
Drawings
The utility model and its features, aspects and advantages will become more apparent from reading the following detailed description of non-limiting embodiments with reference to the accompanying drawings. Like reference symbols in the various drawings indicate like elements. The drawings are not necessarily to scale, emphasis instead being placed upon illustrating the principles of the utility model.
Fig. 1 is a diagram of an operating state of an apparatus for detecting a chip by TOF according to embodiment 1 of the present invention, in which a first reflective plate extends into a light box and a second reflective plate extends out of the light box.
Fig. 2 is a diagram of an operating state of the apparatus for detecting a chip by TOF according to embodiment 1 of the present invention, in which the first reflective plate extends out of the light box and the second reflective plate extends into the light box.
Detailed Description
It should be noted that the embodiments and features of the embodiments in the present application may be combined with each other without conflict. It is noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of example embodiments according to the present application.
It will be understood that the terms "comprises" and/or "comprising," when used in this specification, specify the presence of stated features, steps, operations, devices, components, and/or combinations thereof.
As used herein, the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," "outer," and the like are used in the positional or orientational relationship illustrated in the figures to facilitate the description of the utility model and to simplify the description, and are not intended to indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and are therefore not to be construed as limiting the utility model.
The appearances of the terms first, second, and third, if any, are used for descriptive purposes only and are not intended to be limiting or imply relative importance.
Unless expressly stated or limited otherwise, the terms "mounted," "connected," and "connected" are intended to be inclusive and mean, for example, that they may be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
The technical solutions in the embodiments of the present invention are described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments. Thus, the following detailed description of the embodiments of the present invention, presented in the figures, is not intended to limit the scope of the utility model, as claimed, but is merely representative of selected embodiments of the utility model. All other embodiments, which can be derived by a person skilled in the art from the embodiments of the utility model without making creative efforts, belong to the protection scope of the utility model.
Example 1:
in order to solve the problems that the steps for detecting the photosensitive chip are complicated and the chip is easily assembled and disassembled for many times in the prior art, the device for detecting the chip by using the TOF in embodiment 1 of the utility model is shown in fig. 1 and 2, and comprises a lamp box 1, an infrared emitter 2 arranged at the top in the lamp box 1, two reflecting plates 4 capable of being pulled out of the lamp box, and a test base 3 arranged below the lamp box and used for testing the laser ranging and infrared imaging of the photosensitive chip, wherein the test base 3 is provided with a laser emitter 31 and a communication interface 32; the infrared light emitted by the infrared emitter 31 is directed towards the bottom of the light box 1; the reflecting plate 4 is plate-shaped, the front surface of the reflecting plate 4 is a reflecting surface 51 for reflecting laser, and the back surface of the reflecting plate 4 is a transmitting surface 52 for transmitting infrared light; when the reflecting plate 4 is connected to the lamp box 1, the reflecting surface 51 is placed downwards; the two reflection plates 4 are a first reflection plate 41 and a second reflection plate 42; the first reflection plate 41 and the second reflection plate 42 are disposed at different heights inside the lamp box 1; the laser emitted by the laser emitter 31 faces the top of the lamp box; the laser transmitter 31, the communication interface and the testing base 32 are electrically connected.
When the device for detecting the chip by using the TOF provided by the embodiment 1 of the utility model works, the chip is arranged on the test base 3, and the photosensitive part of the chip is just flush with the emitting opening of the laser emitter 31; a communication interface 32 for connecting the computer and the chip connecting component by a data line; adjusting the first reflection plate 41 to be in a plug-in state and the second reflection plate 42 to be in a pull-out state, controlling the laser transmitter 31 to emit light, and at the moment, the chip receives a first signal; the laser reaches the first reflecting plate 41 and then reflects the laser to the chip, and the chip receives a second signal; the time interval between the first signal and the second signal is a first interval time; adjusting the first reflecting plate 41 to be in a pull-out state and the second reflecting plate 42 to be in an insertion state, controlling the laser emitter to emit light, and receiving a third signal by the chip; the laser reaches the second reflecting plate 42 and is reflected to the chip, and the chip receives a fourth signal; the time interval between the third signal and the fourth signal is a second interval time; the chip obtains the relation between the speed and the distance of the laser through a TOF method according to the first interval time and the distance from the first reflecting plate 41 to the transmitting opening of the laser transmitter 31; by this relationship, the theoretical distance can be calculated later as long as the time is known; the chip calculates a theoretical distance according to the second interval time, and the theoretical distance is compared with an actual distance from the second reflecting plate 42 to the transmitting port of the laser transmitter 31 to obtain whether the laser ranging capability of the chip is qualified or not; an infrared emitter 2 at the top of the lamp box is turned on, infrared light irradiates the chip through a reflecting plate 4, and the chip can sense an image; comparing the induction image with a preset infrared image to obtain whether the imaging capability of the chip is qualified or not; all data and results during the test are presented on a computer connected to the communication interface 32. The device for detecting the chip by using the TOF provided by the embodiment 1 of the utility model has the beneficial effects that: the chip is directly arranged on the test base 3, and the laser emitter 31 emits laser; the detection of the chip laser ranging function is completed by drawing the first reflecting plate 41 and the second reflecting plate 42; the chip can receive infrared light signals while laser ranging, so that detection of infrared imaging of the chip at different distances is completed; the detected result is transmitted to the computer through the communication interface 32; the staff directly looks over the result on the computer and just can know whether qualified the chip, has promoted the efficiency that the chip detected.
In embodiment 1 of the present invention, a first reflection plate is disposed at a position where a reflection surface of the first reflection plate is 10cm away from a laser emission port; the second reflecting plate is arranged at a position that the reflecting surface of the second reflecting plate is 30cm away from the laser emitting port. The beneficial effects are that: the relative error of too short distance is larger, and too large distance needs more material to be spent, thus wasting cost; calculating the relationship between the laser flight distance and the laser flight time by using a TOF method and a first reflecting plate at a position of 10cm and first transmitting and receiving laser; the ability to verify the laser range of the chip with a second reflector at 30cm is relatively accurate and cost effective.
The infrared emitter 2 of embodiment 1 of the present invention is electrically connected to an external power source. The beneficial effects are that: the external power source may continuously supply power to the infrared ray emitter 2 so that the infrared ray emitter 2 stably operates.
The test base 3 in embodiment 1 of the present invention includes a chip control module electrically connected to a chip to be tested, for collecting and transmitting a signal from the laser emitter 31 to the chip to be tested, and a laser control module for controlling the laser emitter 31 to operate; the chip control module is electrically connected with the laser control module; the test base 3 is electrically connected with an external power supply, and the external power supply supplies power to the chip control module and the laser control module. The beneficial effects are that: the test base 3 is electrically connected to an external power supply and can provide power for the test base 3; the chip control module is a part of the test base 3, and a power supply obtained on the test base 3 can be transmitted to a chip connected to the chip control module to supply power to a circuit in the chip; the laser control module is also a part of the test base 3, and the laser control module can work after the test base 3 receives power supplied by an external power supply; the laser control module can control the work of the laser emitter 31 and can also transmit a signal of laser emitted by the laser emitter to the chip control module, and the chip control module transmits the signal to the chip; the chip control module of the test base 3 realizes physical connection and electrical connection between the device for detecting the chip by using the TOF and the chip, and gives an accurate signal to the chip through the laser control module, so that the detection process is more supervised and accurate.
The electrical connection described in embodiment 1 of the present invention can be implemented in various ways such as a printed circuit board and an electric wire; the method for obtaining the relationship through the time and the distance and then calculating the distance through the time as explained in the embodiment 1 of the utility model belongs to the common knowledge in the field.
In summary, the utility model discloses a device for detecting a chip by using a TOF, which relates to the technical field of 3D detection, and comprises a lamp box, an infrared emitter arranged at the top in the lamp box, two reflecting plates capable of being pulled out of the lamp box, and a test base arranged below the lamp box and used for testing laser ranging and infrared imaging of a photosensitive chip, wherein the test base is provided with a laser emitter and a communication interface; infrared light emitted by the infrared emitter faces the bottom of the lamp box; the reflecting plate is plate-shaped, the front surface of the reflecting plate is a reflecting surface for reflecting laser, and the back surface of the reflecting plate is a transmitting surface for transmitting infrared light; when the reflecting plate is arranged on the lamp box, the reflecting surface faces downwards; the two reflecting plates are arranged at different heights in the lamp box; the laser emitted by the laser emitter faces the top of the lamp box; the laser transmitter, the communication interface and the test base are electrically connected. The utility model can complete the laser ranging test and the infrared imaging test of the chip through one-time disassembly and assembly of the chip.
The above description is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention, and all equivalent structural changes made by using the contents of the specification and drawings, or any other related technical fields, are all included in the scope of the present invention.
Claims (4)
1. A device for detecting a chip by utilizing TOF (time of flight) is characterized by comprising a light box, an infrared emitter arranged at the top in the light box, two reflecting plates capable of being pulled out of the light box, and a test base arranged below the light box and used for testing laser ranging and infrared imaging of a photosensitive chip, wherein the test base is provided with a laser emitter and a communication interface;
the infrared light emitted by the infrared emitter faces the bottom of the lamp box;
the reflecting plate is plate-shaped, the front surface of the reflecting plate is a reflecting surface for reflecting laser, and the back surface of the reflecting plate is a transmitting surface for transmitting infrared light; when the reflecting plate is arranged on the lamp box, the reflecting surface faces downwards; the two reflecting plates are arranged at different heights in the lamp box;
the laser emitted by the laser emitter faces the top of the lamp box;
the laser transmitter, the communication interface and the test base are electrically connected.
2. The apparatus of claim 1, wherein the two reflecting plates are a first reflecting plate and a second reflecting plate, and the first reflecting plate is disposed at a position where the reflecting surface of the first reflecting plate is 8cm to 12cm away from the laser transmitter; the second reflecting plate is arranged at a position of 25cm-35cm away from the laser emitter, wherein the reflecting surface of the second reflecting plate is provided with a light source.
3. The apparatus of claim 1, wherein the infrared emitter is electrically connected to an external power source.
4. The apparatus of claim 1, wherein the test base comprises a chip control module for electrically connecting the chip under test and collecting and transmitting the laser transmitter signal to the chip under test, a laser control module for controlling the laser transmitter;
the chip control module is electrically connected with the laser control module;
the test base is electrically connected with an external power supply, and the external power supply supplies power to the chip control module and the laser control module.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123321472.1U CN216816943U (en) | 2021-12-27 | 2021-12-27 | Device for detecting chip by utilizing TOF (time of flight) |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123321472.1U CN216816943U (en) | 2021-12-27 | 2021-12-27 | Device for detecting chip by utilizing TOF (time of flight) |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216816943U true CN216816943U (en) | 2022-06-24 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202123321472.1U Active CN216816943U (en) | 2021-12-27 | 2021-12-27 | Device for detecting chip by utilizing TOF (time of flight) |
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| CN (1) | CN216816943U (en) |
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- 2021-12-27 CN CN202123321472.1U patent/CN216816943U/en active Active
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Effective date of registration: 20221214 Address after: 302, Building 1, No. 10, Lexing Road, Xinwu District, Wuxi City, Jiangsu Province, 214000 Patentee after: Wuxi Hongwei Electronic Technology Co.,Ltd. Address before: 214024 room 20-202, ruixiyuan, Liangxi District, Wuxi City, Jiangsu Province Patentee before: Tan Lei |