CN216809018U

CN216809018U - Monocrystalline silicon piece annealing cooling vehicle

Info

Publication number: CN216809018U
Application number: CN202221173103.4U
Authority: CN
Inventors: 薛佳伟; 王海军; 薛佳勇
Original assignee: Tianjin Zhongjing Semiconductor Material Co ltd
Current assignee: Tianjin Zhongjing Semiconductor Material Co ltd
Priority date: 2022-05-17
Filing date: 2022-05-17
Publication date: 2022-06-24
Anticipated expiration: 2032-05-17

Abstract

A monocrystalline silicon piece annealing cooling vehicle comprises a vehicle body (1), wherein a plurality of silicon piece placing layers (2) are arranged on the vehicle body (1), the heights of the silicon piece placing layers (2) are consistent with the height of a furnace tube of a monocrystalline silicon piece furnace body, and grooves (3) corresponding to the furnace tube are arranged on the silicon piece placing layers (2); the fan (4) is installed at the top of the vehicle body (1), and the caster wheels (5) are installed at the bottom of the vehicle body (1). The silicon wafer discharged from the furnace is convenient to drag, the temperature is rapidly reduced, and materials can be transported away at any time after the monocrystalline silicon wafer is cooled; the operation is convenient and simple, and the safety of personnel and the annealing quality are ensured.

Description

Monocrystalline silicon piece annealing cooling vehicle

Technical Field

The utility model relates to an annealing cooling device, in particular to a monocrystalline silicon piece annealing cooling vehicle, and belongs to the technical field of accessories used for a monocrystalline furnace.

Background

At present, the purpose of high-temperature goods return of the monocrystalline silicon wafer is to display real resistance, which requires that the temperature of the silicon wafer is rapidly reduced and cooled in a high-temperature state, conduction band electrons and valence band holes in the czochralski silicon are transited from a high-energy state to a low-energy state, and certain energy is released at the same time, so that drifting current carriers are compounded; meanwhile, oxygen in the czochralski silicon can be converted into oxygen donors, the oxygen donors can return to the state of interstitial oxygen in the rapid cooling process, the adverse effect of the oxygen donors on resistivity test is eliminated, the rapid cooling process plays an extremely important role in the accuracy of resistivity measurement, and the rapid cooling process is one of the most important steps of the czochralski silicon annealing. In a high-temperature return state, the surface heat of the silicon wafer is difficult to cool in a short time, and the silicon wafer needs to be cooled. In the traditional equipment, the carrier carrying the silicon wafer is taken out manually and is blown with air for cooling, so that the efficiency is low, the operation is difficult, the temperature is slow, and the safety is poor.

Disclosure of Invention

The utility model aims to provide a monocrystalline silicon wafer annealing cooling trolley aiming at the problems in the prior art.

In order to achieve the purpose, the technical solution of the utility model is as follows: a monocrystalline silicon piece annealing cooling vehicle comprises a vehicle body, wherein a plurality of silicon piece placing layers are arranged on the vehicle body, the height of each silicon piece placing layer is consistent with that of a furnace tube of a monocrystalline silicon piece furnace body, and grooves corresponding to the furnace tubes are formed in the silicon piece placing layers.

And a fan is arranged at the top of the vehicle body.

The bottom of the vehicle body is provided with a caster.

Compared with the prior art, the utility model has the beneficial effects that:

according to the utility model, the discharged silicon wafer is convenient to drag into the groove, the temperature is rapidly reduced, and the material can be transported away at any time after the monocrystalline silicon wafer is cooled; the operation is convenient and simple, and the safety of personnel and the annealing quality are ensured.

Drawings

FIG. 1 is a schematic diagram of the present invention.

FIG. 2 is a schematic view of a structure of a silicon wafer placing layer according to the present invention.

In the figure: the silicon wafer placing device comprises a vehicle body 1, a silicon wafer placing layer 2, a groove 3, a fan 4 and a caster 5.

Detailed Description

The utility model is described in further detail below with reference to the following description of the drawings and the detailed description.

Referring to fig. 1 to 2, the monocrystalline silicon wafer annealing cooling vehicle comprises a vehicle body 1, wherein a plurality of silicon wafer placing layers 2 are arranged on the vehicle body 1. The height of the silicon wafer placing layer 2 is consistent with that of a furnace tube of a monocrystalline silicon wafer furnace body, so that the discharged silicon wafers can be conveniently dragged; the silicon wafer placing layer 2 is provided with a groove 3 corresponding to the furnace tube, and the monocrystalline silicon wafer is pulled out and then is easily put into the groove 3, so that the monocrystalline silicon wafer is very stable.

Referring to fig. 1 to 2, a fan 4 is installed on the top of the car body 1, so that the cooling of the monocrystalline silicon wafer can be directly and rapidly realized.

Referring to fig. 1 to 2, the bottom of the vehicle body 1 is provided with a caster 5 which can be pushed to a proper position in time for cooling.

Referring to fig. 1 to 2, the monocrystalline silicon piece annealing cooling vehicle is convenient for pulling a discharged silicon piece, is rapid in cooling, and can transport away materials at any time after the monocrystalline silicon piece is cooled. The operation is convenient and simple, and the safety of personnel and the annealing quality are ensured.

The foregoing is a further detailed description of the utility model in connection with specific preferred embodiments and it is not intended to limit the utility model to the specific embodiments described. For those skilled in the art to which the utility model relates, several simple deductions or substitutions may be made without departing from the spirit of the utility model, and the above-mentioned structures should be considered as belonging to the protection scope of the utility model.

Claims

1. A monocrystalline silicon piece annealing cooling car is characterized in that: the silicon wafer placing device comprises a vehicle body (1), wherein a plurality of silicon wafer placing layers (2) are arranged on the vehicle body (1), the height of each silicon wafer placing layer (2) is consistent with the height of a furnace tube of a monocrystalline silicon wafer furnace body, and grooves (3) corresponding to the furnace tubes are formed in the silicon wafer placing layers (2).

2. The monocrystalline silicon wafer annealing cooling cart according to claim 1, characterized in that: a fan (4) is installed at the top of the vehicle body (1).

3. The monocrystalline silicon wafer annealing cooling cart according to claim 1, characterized in that: the bottom of the vehicle body (1) is provided with a caster (5).