CN216802943U - Polishing equipment with cleaning mechanism for electronic component processing - Google Patents
Polishing equipment with cleaning mechanism for electronic component processing Download PDFInfo
- Publication number
- CN216802943U CN216802943U CN202122530137.6U CN202122530137U CN216802943U CN 216802943 U CN216802943 U CN 216802943U CN 202122530137 U CN202122530137 U CN 202122530137U CN 216802943 U CN216802943 U CN 216802943U
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- Prior art keywords
- fixed
- bracket
- hose
- suction pump
- polishing
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000005498 polishing Methods 0.000 title claims abstract description 24
- 238000012545 processing Methods 0.000 title claims abstract description 16
- 238000004140 cleaning Methods 0.000 title claims abstract description 10
- 206010024796 Logorrhoea Diseases 0.000 abstract description 10
- 239000002184 metal Substances 0.000 abstract description 9
- 230000005389 magnetism Effects 0.000 abstract description 8
- 229920003023 plastic Polymers 0.000 abstract description 5
- 239000004033 plastic Substances 0.000 abstract description 5
- 238000000926 separation method Methods 0.000 abstract description 5
- 238000010521 absorption reaction Methods 0.000 abstract description 3
- 238000000034 method Methods 0.000 abstract description 2
- 238000012805 post-processing Methods 0.000 abstract 1
- 239000000843 powder Substances 0.000 description 16
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000011812 mixed powder Substances 0.000 description 2
- 238000007517 polishing process Methods 0.000 description 2
- 229910001111 Fine metal Inorganic materials 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
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- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
The utility model discloses a polishing device with a cleaning mechanism for processing electronic elements, which comprises a rack, an operation box and a polishing piece, wherein the operation box is fixed above the rack, the polishing piece is fixed on the side surface of the operation box, a suction pump is fixed at the bottom of the operation box, a controller is arranged on the end surface of the suction pump, a hose is connected above the suction pump, a bracket is fixed at the other end of the hose, and a suction head is fixed at the other end of the bracket. Will attach to the garrulous end absorption processing on machine surface through the suction pump, set up magnetism in that the bracket is inside to inhale the piece and can reduce garrulous end post processing's trouble with metal garrulous end and other plastics garrulous end separation processing absorbing garrulous end in-process.
Description
Technical Field
The utility model belongs to the field of electronic element polishing equipment, and particularly relates to electronic element processing polishing equipment with a cleaning mechanism.
Background
Electronic components, which are basic elements in electronic circuits, are usually packaged individually and have two or more leads or metal contacts, and the electronic components are connected to each other to form an electronic circuit with specific functions, such as: amplifiers, radio receivers, oscillators, etc., one of the common ways to connect electronic components, which are divided into individual packages and integrated circuits, is to solder them to a printed circuit board, and the electronic component polishing apparatus is an apparatus for processing the electronic components.
When polishing electronic components, many fine metal and plastic powders are generated and attached to the surface of the machine equipment, which makes the cleaning troublesome.
Disclosure of Invention
Technical problem to be solved
In order to overcome the defects in the prior art, the utility model aims to provide a polishing device with a cleaning mechanism for processing electronic components, so as to solve the problems in the background technology.
(II) technical scheme
In order to achieve the purpose, the utility model is realized by the following technical scheme: the utility model provides an electronic component processing is with polishing equipment with wiper mechanism, includes frame, operation case, polishing piece, the frame top is fixed with the operation case, operation case side is fixed with polishing piece, its characterized in that: the suction pump is fixed to the bottom of the operation box, a controller is arranged on the end face of the suction pump, a hose is connected to the upper portion of the suction pump, a bracket is fixed to the other end of the hose, and a suction head is fixed to the other end of the bracket.
Preferably, the hose with the inside holding tank that is equipped with of junction of bracket, the holding tank is fixed through the bracing piece, the holding tank is equipped with four.
Preferably, the surface of the bracket is provided with a rotating handle.
Preferably, four magnetic blocks are arranged inside the bracket.
(III) advantageous effects
The utility model has the advantages that a great amount of micro-powder generated in the polishing process of the electronic element is attached to the surface of the machine equipment, the suction pump is controlled to operate in order to better absorb the micro-powder, the suction head is aligned to the surface of the position where the micro-powder is attached, and the micro-powder is absorbed from the suction head to flow to the hose and is finally stored in the suction pump for centralized treatment. The electronic component can be separated by mixing some metal powder with other plastic powder, before absorption, the magnetic block is rotated out of the accommodating groove of the hose by rotating the bracket, and when the mixed powder passes through the hose, the metal powder can be absorbed by the magnetic block, so that the separation treatment is realized.
Drawings
The present invention will be described in further detail with reference to the accompanying drawings.
Other features, objects and advantages of the utility model will become more apparent upon reading of the detailed description of non-limiting embodiments with reference to the following drawings:
fig. 1 is a schematic view of the overall structure of the present invention.
FIG. 2 is a connection diagram of a suction pump.
Fig. 3 is an internal view of the hose.
Fig. 4 is a diagram showing a structure of the bracket.
Description of reference numerals:
the polishing machine comprises a frame 1, a working box 2, a polishing piece 3, a suction pump 4, a controller 5, a hose 6, a containing groove 61, a support rod 62, a bracket 7, a rotating handle 71, a magnetic suction block 72 and a suction head 8.
Detailed Description
In order to make the technical means, the characteristics, the achievement purposes and the effects of the utility model easy to understand, the preferred embodiment of the utility model is further explained by combining the detailed description and the attached drawings.
In connection with the detailed description and the accompanying figures 1-4:
as shown in fig. 1 and 2, the electronic element processing polishing device with the cleaning mechanism comprises a frame 1, an operation box 2 and a polishing part 3, wherein the operation box 2 is fixed above the frame 1, the polishing part 3 is fixed on the side surface of the operation box 2, a suction pump 4 is fixed at the bottom of the operation box 2, a controller 5 is arranged on the end surface of the suction pump 4, a hose 6 is connected above the suction pump 4, a bracket 7 is fixed at the other end of the hose 6, and a suction head 8 is fixed at the other end of the bracket 7.
The controller 5 controls the suction pump 4 to operate, the suction head 8 is aligned to the position needing to be absorbed, and the crushed powder can be absorbed from the suction head 8 and flows to the suction pump 4 through the hose 6 for processing; the bracket 7 is in an in-line relationship with the hose 6 and the bracket 7 is capable of an angularly limited one rotation inside the hose 6.
As shown in fig. 3, the joint between the hose 6 and the bracket 7 is provided with four receiving grooves 61, the receiving grooves 61 are fixed by supporting rods 62, and the number of the receiving grooves 61 is four.
As shown in fig. 4, the surface of the bracket 7 is provided with a rotating handle 71 for controlling the rotation of the suction head 8 and the bracket 7; the inside four magnetism of being equipped with of bracket 71 is inhaled piece 72, and through the turned angle regulation of bracket 71 and hose 6, can make magnetism inhale piece 72 hide and arrange in inside holding tank 61, also can make magnetism inhale piece 72 break away from in holding tank 61, this is the biggest angle turned range of bracket 7 and hose 6 promptly.
When the piece 72 of inhaling of magnetism breaks away from holding tank 61, when the piece 72 is inhaled to the garrulous end process magnetism of being adsorbed by suction head 8, the metal garrulous end can be inhaled the piece 72 absorption by magnetism to reach the garrulous end of metal and the garrulous end's of plastics separation, in adsorbing, the adsorption affinity of the piece 72 of inhaling of magnetism is greater than the suction of suction pump 4, separation metal garrulous end that can be better.
The use principle is as follows: a great deal of micro-powder generated in the polishing process of electronic components is attached to the surface of machine equipment, and in order to better absorb the micro-powder, the suction pump 4 is controlled to operate, the suction head 8 is aligned to the surface of the position where the micro-powder is attached, the micro-powder is absorbed from the suction head 8 to flow to the hose 6 and is finally stored in the suction pump 4 for centralized processing. When the electronic component is cut open, some metal powder and other plastic powder are mixed together, and before the electronic component is separated, the bracket 7 is rotated to enable the magnetic block 72 to rotate out of the accommodating groove 61 of the hose 6, and when the mixed powder passes through the hose 6, the metal powder is sucked by the magnetic block, so that the separation treatment is realized.
While there have been shown and described what are at present considered the fundamental principles and essential features of the utility model and its advantages, it will be apparent to those skilled in the art that the utility model is not limited to the details of the foregoing exemplary embodiments, but is capable of other specific forms without departing from the spirit or essential characteristics thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the utility model being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.
Claims (4)
1. The utility model provides an electronic component processing is with polishing equipment with wiper mechanism, includes frame (1), operation case (2), polishing piece (3), frame (1) top is fixed with operation case (2), operation case (2) side is fixed with polishing piece (3), its characterized in that: the suction pump (4) is fixed to the bottom of the operation box (2), the controller (5) is arranged on the end face of the suction pump (4), the hose (6) is connected to the upper portion of the suction pump (4), a bracket (7) is fixed to the other end of the hose (6), and a suction head (8) is fixed to the other end of the bracket (7).
2. The electronic component processing polishing apparatus with a cleaning mechanism according to claim 1, wherein: hose (6) with holding tank (61) are equipped with inside the junction of bracket (7), holding tank (61) are fixed through bracing piece (62), holding tank (61) are equipped with four.
3. The electronic component processing polishing apparatus with a cleaning mechanism according to claim 1, wherein: the surface of the bracket (7) is provided with a rotating handle (71).
4. The electronic component processing polishing apparatus with a cleaning mechanism according to claim 1, wherein: four magnetic suction blocks (72) are arranged in the bracket (7).
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202122530137.6U CN216802943U (en) | 2021-10-21 | 2021-10-21 | Polishing equipment with cleaning mechanism for electronic component processing |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202122530137.6U CN216802943U (en) | 2021-10-21 | 2021-10-21 | Polishing equipment with cleaning mechanism for electronic component processing |
Publications (1)
Publication Number | Publication Date |
---|---|
CN216802943U true CN216802943U (en) | 2022-06-24 |
Family
ID=82047901
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202122530137.6U Active CN216802943U (en) | 2021-10-21 | 2021-10-21 | Polishing equipment with cleaning mechanism for electronic component processing |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN216802943U (en) |
-
2021
- 2021-10-21 CN CN202122530137.6U patent/CN216802943U/en active Active
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Legal Events
Date | Code | Title | Description |
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GR01 | Patent grant | ||
GR01 | Patent grant | ||
TR01 | Transfer of patent right |
Effective date of registration: 20240111 Address after: 215000 East side of the first floor, No. 69 Fangzhou Road, Industrial Park, Suzhou City, Jiangsu Province Patentee after: Suzhou Kaichuangle Electronic Technology Co.,Ltd. Address before: 362100 No. 236, Dapan village, Wangchuan Town, Hui'an County, Quanzhou City, Fujian Province Patentee before: Huian Yishangshou New Material Co.,Ltd. |
|
TR01 | Transfer of patent right |