CN216793681U

CN216793681U - SOT23 high power encapsulation frame

Info

Publication number: CN216793681U
Application number: CN202220433659.6U
Authority: CN
Inventors: 廖弘昌; 钱进; 刘振东; 田亚南; 陈晓林
Original assignee: Riyuexin Semiconductor Weihai Co ltd
Current assignee: Riyuexin Semiconductor Weihai Co ltd
Priority date: 2022-03-01
Filing date: 2022-03-01
Publication date: 2022-06-21
Anticipated expiration: 2032-03-01

Abstract

The utility model discloses an SOT23 high-power packaging frame which comprises a frame main body, wherein a clamping groove is formed in the left side of the frame main body, a positioning hole and a cutting groove are formed in the top of the frame main body respectively, a packaging element is fixedly connected to the inner wall of the cutting groove, a bottom protection plate is movably connected to the bottom of the frame main body, a protection cover is fixedly connected to the top of the bottom protection plate, the packaging element comprises a packaging base, welding pins are welded to the top of the packaging base, connecting pieces are arranged on the front side, the rear side, the left side and the right side of the packaging base, and the positioning holes are distributed on the front side and the rear side of the top of the frame main body respectively. The utility model has the advantage of the efficient, has solved SOT23 semiconductor element and is carrying out the in-process of capsulating, is not convenient for carry out the simultaneous encapsulation to a plurality of SOT23 semiconductor element semiconductor elements, has reduced SOT23 semiconductor element packaging efficiency's problem.

Description

SOT23 high power encapsulation frame

Technical Field

The utility model relates to the technical field of semiconductor element packaging, in particular to an SOT23 high-power packaging frame.

Background

The SOT small-outline transistor is a surface-mounted packaging form, generally, the number of pins is less than or equal to 5, a packaging frame is the most important packaging carrier of a chip, is also a connection channel between chip information and the outside, and is always a very important basic material in the semiconductor industry, the main function of the packaging frame is to provide a mechanical support carrier for the chip, simultaneously, the packaging frame is used as a conductive medium to be internally and externally connected with a chip circuit to form an electric signal path, and the electric signal path and a packaging shell are used together to externally dissipate heat generated during the operation of the chip to form a heat dissipation channel, the SOT small-outline transistor is a key structural member for forming an electric circuit by means of realizing the electrical connection between a leading-out end of the internal circuit of the chip and an external lead by means of an internal interconnection line, and the packaging frame is required to be used in most of semiconductor devices.

In the process of packaging the SOT23 semiconductor element, a plurality of SOT23 semiconductor elements are inconvenient to package simultaneously, the packaging efficiency of the SOT23 semiconductor element is reduced, and the production cost of the SOT23 semiconductor element is increased.

Disclosure of Invention

The utility model aims to provide an SOT23 high-power packaging frame which has the advantage of high efficiency and solves the problems that a plurality of SOT23 semiconductor elements are inconvenient to package simultaneously in the packaging process of an SOT23 semiconductor element, the packaging efficiency of the SOT23 semiconductor element is reduced, and the production cost of the SOT23 semiconductor element is increased.

In order to achieve the purpose, the utility model provides the following technical scheme: the utility model provides a SOT23 high power encapsulation frame, includes the frame main part, the draw-in groove has been seted up in the left side of frame main part, the locating hole has been seted up respectively at the top of frame main part and has been cut groove, cut the inner wall fixedly connected with encapsulation component in cut groove, the bottom swing joint of frame main part has the bottom guard plate, the top fixedly connected with protection casing of bottom guard plate, the encapsulation component includes encapsulation base, encapsulation base's top welding has the welding pin, both sides and the left and right sides all are provided with the connecting piece around the encapsulation base.

In order to facilitate accurate positioning of the frame main body, the preferred SOT23 high-power packaging frame of the utility model is that the number of the positioning holes is several, and the positioning holes are respectively distributed on the front side and the rear side of the top of the frame main body.

In order to facilitate the frame main body to be taken out of the protective cover, the SOT23 high-power packaging frame is preferably used, the inner surface of the protective cover is movably connected with the outer surface of the frame main body, and the front side and the rear side of the frame main body and the front side and the rear side of the bottom protection plate are respectively provided with a taking groove.

In order to increase the connection strength between the package base and the cutting groove, the SOT23 high-power package frame is preferably used, the welding pins are located on the left side and the right side of the package groove, and the number of the connecting pieces is several.

In order to facilitate the safety protection of the frame body, it is preferable that the material of the bottom protection plate is polytetrafluoroethylene, and the height of the protection cover is matched with the height of the frame body, as the SOT23 high-power packaging frame of the utility model.

For the convenience of mounting the chip, as a preferred example of the SOT23 high-power package frame of the present invention, the top of the package base is provided with a package slot.

Compared with the prior art, the utility model has the following beneficial effects:

1. the utility model solves the problems that a plurality of SOT23 semiconductor elements are inconvenient to be packaged simultaneously in the packaging process of the SOT23 semiconductor elements, the packaging efficiency of the SOT23 semiconductor elements is reduced, and the production cost of the SOT23 semiconductor elements is increased by matching the frame main body, the protective cover, the packaging elements, the bottom protective plate, the welding pins, the packaging base and the connecting piece.

2. According to the utility model, the taking groove is arranged, so that the packaged positioning hole can be conveniently cut, the frame main body can be conveniently limited and fixed by matching the clamping groove and the positioning hole to prevent the frame main body from shaking, the bottom protection plate and the protection cover can be matched to prevent the bottom and the corners of the frame main body from being worn and damaged, the frame main body and the packaging element can be conveniently taken down by arranging the taking groove, the chip can be conveniently borne by arranging the packaging element, and the chip can be conveniently led by arranging the welding pins.

Drawings

FIG. 1 is an isometric view of the present invention;

FIG. 2 is an exploded view of the present invention;

FIG. 3 is a schematic diagram of the packaging device mechanism of the present invention.

In the figure: 1. a frame body; 2. a protective cover; 3. a card slot; 4. packaging the component; 5. positioning holes; 6. cutting a groove; 7. taking the groove; 8. a bottom guard plate; 9. welding pins; 10. a package base; 11. a packaging groove; 12. a connecting member.

Detailed Description

Referring to fig. 1-3, an SOT23 high power package frame includes a frame body 1, a clamping groove 3 is provided on the left side of the frame body 1, a positioning hole 5 and a cutting groove 6 are respectively provided on the top of the frame body 1, an inner wall fixedly connected with package element 4 of the cutting groove 6, a bottom movable connection of the frame body 1 has a bottom protection plate 8, a top fixedly connected with protection cover 2 of the bottom protection plate 8, the package element 4 includes a package base 10, a welding pin 9 is welded on the top of the package base 10, and connectors 12 are provided on the front side, the rear side, the left side and the right side of the package base 10.

In this embodiment: bottom guard plate 8 and protection casing 2 protect the surface and the bottom of frame main part 1, prevent that frame main part 1 from damaging, when needs use encapsulation component 4 to encapsulate the chip, take out the inner chamber of protection casing 2 to frame main part 1, place frame main part 1 in encapsulation equipment, encapsulation equipment carries out spacingly through draw-in groove 3 to the left end of frame main part 1, encapsulation equipment installs the chip in encapsulation groove 11, and through pin connection chip and welding pin 9, carry out subsequent plastics encapsulation after the connection is accomplished, plastics are accomplished the back, cut connecting piece 12 through cutting device, take out the semiconductor element after the encapsulation.

As a technical optimization scheme of the utility model, the number of the positioning holes 5 is a plurality, and the positioning holes are respectively distributed on the front side and the rear side of the top of the frame main body 1.

In this embodiment: the encapsulation equipment is spacing to frame body 1's front and back both sides through locating hole 5, prevents the in-process of chip package, and frame body 1 drives encapsulation component 4 skew, influences the precision of chip package.

As a technical optimization scheme of the utility model, the inner surface of the protective cover 2 is movably connected with the outer surface of the frame main body 1, and the front side and the rear side of the frame main body 1 and the bottom protection plate 8 are both provided with the taking grooves 7.

In this embodiment: the staff makes it break away from the inner chamber of protection casing 2 through 7 upward removal frame main parts 1 of the groove of taking, and the groove of taking 7 can be convenient for the staff contact frame main part 1's bottom, makes the quick frame main part 1 that takes out of staff, has increased the encapsulation efficiency of chip.

As a technical optimization scheme of the utility model, the welding pins 9 are positioned at the left side and the right side of the packaging groove 11, and the number of the connecting pieces 12 is a plurality.

In this embodiment: through setting up a plurality of connecting pieces 12, can be convenient for cutting device cuts packaging base 10 to and increase packaging base 10 and the joint strength who cuts 6 inner walls of cut groove, avoid the displacement to appear in packaging base 10's of the in-process of encapsulation chip position.

As a technical optimization scheme of the utility model, the bottom protection plate 8 is made of polytetrafluoroethylene, and the height of the protection cover 2 is matched with that of the frame main body 1.

In this embodiment: the material of bottom guard plate 8 is polytetrafluoroethylene, can be convenient for increase the use strength and the abrasion strength of bottom guard plate 8, increases its life, and the high looks adaptation of the height of protection casing 2 and frame main part 1 can be convenient for protect the top of frame main part 1, avoids the top of frame main part 1 to receive the friction.

As a technical optimization scheme of the present invention, the top of the package base 10 is provided with a package slot 11.

In this embodiment: through seting up encapsulation groove 11, can be convenient for install the chip of semiconductor fast to fix a position the chip, increased the installation effectiveness of chip.

During the use, bottom guard plate 8 and protection casing 2 protect the surface and the bottom of frame main part 1, prevent that frame main part 1 from damaging, when needs use encapsulation component 4 to encapsulate the chip, take out the inner chamber of protection casing 2 to frame main part 1, place frame main part 1 in encapsulation equipment, encapsulation equipment carries on spacingly through draw-in groove 3 to the left end of frame main part 1, encapsulation equipment installs the chip in encapsulation groove 11, and through pin connection chip and welding pin 9, carry out subsequent plastics encapsulation after the connection is accomplished, after plastics are accomplished, cut connecting piece 12 through cutting device, take out the semiconductor element after the encapsulation.

In conclusion: the SOT23 high-power packaging frame solves the problems that a plurality of SOT23 semiconductor elements are inconvenient to be packaged simultaneously in the packaging process of an SOT23 semiconductor element, the packaging efficiency of the SOT23 semiconductor elements is reduced, and the production cost of the SOT23 semiconductor elements is increased by matching the frame body 1, the protective cover 2, the packaging element 4, the bottom protective plate 8, the welding pins 9, the packaging base 10 and the connecting piece 12.

Claims

1. SOT23 high-power package frame, comprising a frame body (1), characterized in that: draw-in groove (3) have been seted up in the left side of frame main part (1), locating hole (5) and cut groove (6) have been seted up respectively at the top of frame main part (1), the inner wall fixedly connected with encapsulation component (4) of cut groove (6), the bottom swing joint of frame main part (1) has bottom guard plate (8), top fixedly connected with protection casing (2) of bottom guard plate (8), encapsulation component (4) are including encapsulation base (10), the top welding of encapsulation base (10) has welding pin (9), both sides and the left and right sides all are provided with connecting piece (12) around encapsulation base (10).

2. The SOT23 high power package frame of claim 1, wherein: the number of the positioning holes (5) is a plurality of, and the positioning holes are respectively distributed on the front side and the rear side of the top of the frame main body (1).

3. The SOT23 high power package frame of claim 1, wherein: the inner surface of protection casing (2) and the surface swing joint of frame main part (1), groove (7) of taking have all been seted up to both sides around frame main part (1) and bottom guard plate (8).

4. The SOT23 high power package frame of claim 1, wherein: the welding pins (9) are positioned on the left side and the right side of the packaging groove (11), and the number of the connecting pieces (12) is a plurality.

5. The SOT23 high power package frame of claim 1, wherein: the bottom protection plate (8) is made of polytetrafluoroethylene, and the height of the protection cover (2) is matched with that of the frame main body (1).

6. The SOT23 high power package frame of claim 1, wherein: the top of the packaging base (10) is provided with a packaging groove (11).