CN216786246U - Magnetron sputtering device - Google Patents
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- CN216786246U CN216786246U CN202123382341.4U CN202123382341U CN216786246U CN 216786246 U CN216786246 U CN 216786246U CN 202123382341 U CN202123382341 U CN 202123382341U CN 216786246 U CN216786246 U CN 216786246U
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Abstract
The utility model discloses a magnetron sputtering device, which is used for coating a film, and comprises: unwinding mechanism, winding mechanism and coating film unit, the coating film unit includes a plurality ofly, and is a plurality of the coating film unit is followed the direction of delivery of film is arranged in proper order unwinding mechanism with between the winding mechanism, the coating film unit includes: the film sputtering device comprises a main roller and a plurality of sputtering sources, wherein the plurality of sputtering sources are arranged at intervals in the circumferential direction of the main roller and are positioned in the wrapping angle range of the main roller and the film, and the plurality of sputtering sources and the main roller are spaced in the radial direction of the main roller. According to the magnetron sputtering device, the plurality of coating units are arranged, and each coating unit comprises the main roller and the plurality of sputtering sources, so that the heat of the film surface during coating can be reduced, the capacity of unit device space is improved, and the coating deposition efficiency is improved.
Description
Technical Field
The utility model relates to the field of coating equipment, in particular to magnetron sputtering equipment.
Background
Magnetron sputtering is one of the important methods for vacuum coating, and has the advantages of high control precision of film thickness, good coating uniformity and the like. In recent years, with the ever-expanding market demand of flexible photoelectric products, the demand of film-coated products becomes an ever-expanding trend especially for products with complex film system structures.
Related technologies indicate that most magnetron sputtering devices for film coating are single main rollers, the number of targets set according to the cooling effect of the single main roller is limited, the product requirements cannot be met, and the increase of the number of the targets can cause the temperature of the film surface to be too high during film coating, so that the deformation of the film is caused, and the product quality is influenced.
SUMMERY OF THE UTILITY MODEL
The present invention is directed to solving at least one of the problems of the prior art. Therefore, the utility model provides magnetron sputtering equipment which can reduce the heat of the film surface during film coating, and the plurality of main rollers can improve the cooling effect of the main rollers on the film surface, reduce the influence of the heat on the film surface during metal deposition, improve the capacity of unit equipment space and improve the film coating deposition efficiency.
According to the magnetron sputtering device of the present invention, the magnetron sputtering device is used for coating a film, and the magnetron sputtering device includes: the unwinding mechanism and the winding mechanism; the coating film unit, the coating film unit includes a plurality ofly, and is a plurality of the coating film unit is followed the direction of delivery of film is arranged in proper order the unwinding mechanism with between the winding mechanism, the coating film unit includes: the film forming device comprises a main roller and a plurality of sputtering sources, wherein the plurality of sputtering sources are arranged at intervals in the circumferential direction of the main roller and are positioned in the wrapping angle range of the main roller and the film, and the plurality of sputtering sources and the main roller are spaced in the radial direction of the main roller.
According to the magnetron sputtering equipment, the plurality of coating units are arranged, each coating unit comprises the main roller and the plurality of sputtering sources, so that the heat of the film surface during coating can be reduced, the cooling effect of the main rollers on the film surface can be improved by the plurality of main rollers, the influence of the heat on the film surface during metal deposition is reduced, the capacity of unit equipment space is improved, and the coating deposition efficiency is improved.
In some embodiments, the main rollers of the plurality of coating units each rotate in a clockwise direction or each rotate in a counterclockwise direction.
In some embodiments, when the thin film coating is conveyed, one part of the main rollers of the coating units rotates in a clockwise direction and the other part rotates in a counterclockwise direction.
In some embodiments, the coating unit in which the main roller rotates in the clockwise direction is a first coating unit, the coating unit in which the main roller rotates in the counterclockwise direction is a second coating unit, the first coating unit includes a plurality of coating units, and the second coating unit includes a plurality of coating units.
In some embodiments, a plurality of the first coating units are arranged upstream or downstream of a plurality of the second coating units in a film conveying direction.
In some embodiments, the unwinding mechanism and the winding mechanism are arranged at intervals in a first direction, the first coating units are arranged at intervals in a second direction perpendicular to the first direction, the second coating units are arranged at intervals in the second direction, and the first coating units and the second coating units are arranged at intervals in the first direction.
In some embodiments, the filming unit further includes: the film-passing device comprises a first roller and a second roller, wherein the first roller, the main roller and the second roller are sequentially arranged in the conveying direction of the film, and the wrap angle of the film on the main roller is more than or equal to 200 degrees.
In some embodiments, the number of coating units is in the range of 2-30.
In some embodiments, the diameter of the main roller ranges from 300mm to 1200 mm.
In some embodiments, the number of the plurality of sputtering sources in each coating unit is 2 to 10.
In some embodiments, the sputtering source is a coating target, and a plurality of coating targets are uniformly spaced within the wrap angle range.
In some embodiments, further comprising: the film coating device comprises a plurality of flattening rollers, wherein the flattening rollers are arranged among the film coating units, between the film coating units and the unwinding mechanism and between the film coating units and the winding mechanism.
In some embodiments, further comprising: the film coating device comprises a shell, wherein a film coating space is defined in the shell, and the unwinding mechanism, the winding mechanism and the plurality of film coating units are all arranged in the film coating space; and the vacuum mechanism is arranged on the shell and is used for vacuumizing the coating space.
In some embodiments, the vacuum mechanism comprises: mechanical pumps, roots pumps and molecular pumps.
Additional aspects and advantages of the utility model will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the utility model.
Drawings
FIG. 1 is a schematic view of a magnetron sputtering apparatus according to an embodiment of the utility model;
FIG. 2 is a schematic view of a magnetron sputtering apparatus according to yet another embodiment of the utility model.
Reference numerals:
100. a magnetron sputtering apparatus;
110. an unwinding mechanism;
120. a winding mechanism;
130. a film coating unit; 131. a main roller; 132. a sputtering source; 133. a first roller; 134. a second roller;
140. flattening rollers;
150. a housing; 151. coating space;
161. a mechanical pump; 162. a roots pump; 163. a molecular pump.
Detailed Description
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are illustrative and intended to be illustrative of the utility model and are not to be construed as limiting the utility model.
A magnetron sputtering apparatus 100 according to an embodiment of the present invention is described below with reference to fig. 1.
As shown in fig. 1, a magnetron sputtering apparatus 100 according to an embodiment of the present invention includes: the unwinding mechanism 110, the winding mechanism 120 and the coating unit 130.
Specifically, the unwinding mechanism 110 is configured to pay out a film and enter the coating unit 130, and the winding mechanism 120 is configured to collect the film coated from the coating unit 130, where the coating unit 130 may include a plurality of coating units 130, and the plurality of coating units 130 are sequentially arranged between the unwinding mechanism 110 and the winding mechanism 120 along a conveying direction of the film, and the coating unit 130 may include: the main roll 131 and the multiple sputtering sources 132, the multiple sputtering sources 132 are arranged in the circumferential direction of the main roll 131 at intervals and are located in the wrap angle range of the main roll 131 and the film, and the multiple sputtering sources 132 and the main roll 131 are spaced in the radial direction of the main roll 131, so that the multiple coating units 130 are arranged, the heat of the film surface during coating can be reduced, and the film is prevented from deforming in the coating process and affecting the quality of the product.
In the case that the number of sputtering sources 132 required for coating is the same, the plurality of main rollers 131 can reduce the heat of the film surface during coating, and the plurality of main rollers 131 can improve the cooling effect of the main rollers 131 on the film surface, thereby preventing the film from deforming due to an excessive temperature and affecting the quality of the product.
For example, as shown in fig. 1, the magnetron sputtering apparatus 100 includes an unwinding mechanism 110, a winding mechanism 120, and a coating unit 130, where the coating unit 130 includes twelve, the coating unit 130 is sequentially disposed between the unwinding mechanism 110 and the winding mechanism 120 along a conveying direction of a film, each coating unit 130 includes a main roller 131 and four sputtering sources 132, the four sputtering sources 132 are disposed at intervals in a circumferential direction of the main roller 131 and are located in a wrap angle range between the main roller 131 and the film, and the four sputtering sources 132 are spaced from the main roller 131 in a radial direction of the main roller 131, so that the film can be coated forty-eight times after passing through a coating process of the magnetron sputtering apparatus 100, quality of the coating is ensured, deposition efficiency of the coating is improved, and the coating apparatus is relatively similar to a coating apparatus with a single large main roller.
According to the magnetron sputtering device 100 of the utility model, by arranging the plurality of coating units 130, each coating unit 130 comprises the main roller 131 and the plurality of sputtering sources 132, the heat of the film surface during coating can be reduced, the plurality of main rollers 131 can improve the cooling effect of the main rollers 131 on the film surface, reduce the influence of the heat on the film surface during metal deposition, improve the capacity of unit device space and improve the coating deposition efficiency.
In an embodiment of the present invention, as shown in fig. 1, the plurality of main rollers 131 in the plurality of coating units 130 rotate clockwise or counterclockwise, that is, the rotation directions of the plurality of main rollers 131 in the plurality of coating units 130 are the same, which may satisfy the requirement of transferring a film, so that the film may pass through the plurality of coating units 130 from the unwinding mechanism 110 to the winding mechanism 120 in sequence to complete coating.
For example, as shown in fig. 1, the plurality of main rollers 131 in the plurality of coating units 130 rotate counterclockwise, so that the film discharged from the unwinding mechanism 110 can sequentially pass through the plurality of coating units 130 to reach the winding mechanism 120 to be wound, wherein because the plurality of main rollers 131 rotate counterclockwise, the number of the films passing through the sputtering sources 132 can be ensured to be the same, and further, the thickness of the films coated by the plurality of coating units 130 to reach the winding mechanism 120 is ensured to be the same, thereby ensuring the coating quality.
For another example, referring to fig. 1, the unwinding mechanism 110 and the winding mechanism 120 are spaced in the vertical direction, the number of the coating units 130 is 12, a plurality of main rollers 131 in the 12 coating units 130 rotate counterclockwise, the 12 coating units 130 are equally divided into two groups, each group includes 6 coating units 130, the 6 coating units 130 in each group are sequentially spaced in the left-right direction, the two groups of coating units 130 are spaced in the vertical direction, the unwinding mechanism 110 is connected to the lower group of coating units 130, and the winding mechanism 120 is connected to the upper group of coating units 130, so that after a film enters the lower group of coating units 130 through the unwinding mechanism 110, one surface of the film is coated, and then after the film passes through the upper group of coating units 130, one surface of the film is coated continuously, and under the condition that the same number of coating times is ensured, the length of the magnetron sputtering device 100 in the second direction is reduced.
In an embodiment of the present invention, as shown in fig. 2, when the film is conveyed for film coating, one part of the plurality of main rollers 131 of the plurality of film coating units 130 rotates clockwise and the other part rotates counterclockwise, so that the plurality of main rollers 131 can improve the cooling effect of the main rollers 131 on the film surface, reduce the influence of heat on the film surface during metal deposition, avoid the deformation of the film due to the excessively high temperature of the film surface, and influence the quality of the product, and simultaneously satisfy the requirement of completing the double-sided film coating in one film coating cycle.
For example, as shown in fig. 2, the magnetron sputtering apparatus 100 includes an unwinding mechanism 110, a winding mechanism 120, and two coating units 130, where the coating units 130 include twelve coating units 130, and the twelve coating units 130 are sequentially arranged between the unwinding mechanism 110 and the winding mechanism 120 along a conveying manner of a film, and each coating unit 130 includes: the film coating device comprises a main roller 131 and five sputtering sources 132, wherein the five sputtering sources 132 are arranged at intervals in the circumferential direction of the main roller 131 and are positioned in the wrap angle range of the main roller 131 and a film, the five sputtering sources 132 and the main roller 131 are spaced in the radial direction of the main roller 131, when the film is conveyed for coating, six of the twelve coating units 130 close to the unwinding mechanism 110 in the conveying direction of the film rotate anticlockwise, six of the twelve coating units 130 close to the winding mechanism 120 in the conveying direction of the film rotate clockwise, so that one surface of the film is coated by the six main rollers 131 close to the unwinding mechanism 110 rotating anticlockwise in the conveying direction of the film, and the other surface of the film is coated by the six main rollers 131 close to the winding mechanism 120 rotating clockwise, so that double-sided coating is completed in one coating period.
In an embodiment of the present invention, as shown in fig. 2, the coating unit 130 in which the main roller 131 rotates clockwise is a first coating unit 130, the coating unit 130 in which the main roller 131 rotates counterclockwise is a second coating unit 130, the first coating unit 130 includes a plurality of coating units, and the second coating unit 130 includes a plurality of coating units, such that the plurality of first coating units 130 coat one side of the film, and the plurality of second coating units 130 coat the other side of the film, thereby completing the double-sided coating in one coating cycle.
In one embodiment of the present invention, as shown in fig. 2, the plurality of first plating units 130 are disposed upstream or downstream of the plurality of second plating units 130 in the film conveying direction, and when the plurality of first plating units 130 are disposed upstream of the plurality of second plating units 130 in the film conveying direction, the plurality of first plating units 130 plate the other side of the film, and the plurality of second plating units 130 plate the one side of the film; when the plurality of first coating units 130 are arranged at the downstream of the plurality of second coating units 130 along the film conveying direction, the plurality of first coating units 130 coat one surface of the film, and the plurality of second coating units 130 coat the other surface of the film, so that the coating of the two surfaces of the film can be realized in one coating period.
In an embodiment of the present invention, as shown in fig. 2, the unwinding mechanism 110 and the winding mechanism 120 are arranged at intervals in a first direction (e.g., an up-down direction shown in fig. 2), the plurality of first coating units 130 are arranged at intervals in a second direction (e.g., a left-right direction shown in fig. 2) perpendicular to the first direction, the plurality of second coating units 130 are arranged at intervals in the second direction, and the plurality of first coating units 130 and the plurality of second coating units 130 are arranged at intervals in the first direction, wherein the unwinding mechanism 110 and the winding mechanism 120 are arranged at intervals in the first direction, the plurality of first coating units 130 and the plurality of second coating units 130 are arranged at intervals in the first direction, so that the length of the magnetron sputtering apparatus 100 in the second direction is reduced, so that one side of the film is coated after the film enters the first coating unit 130 through the unwinding mechanism 110, then, after the film passes through the second film coating unit 130, the other side of the film is coated, and then the film is wound by the winding mechanism 120, so that double-side coating is completed, and meanwhile, the length of the magnetron sputtering device 100 in the second direction is reduced.
In an embodiment of the present invention, as shown in fig. 1, the plating unit 130 may further include: the first roller 133 and the second roller 134 are arranged in sequence in the conveying direction of the film, the wrap angle of the film on the main roller 131 is greater than or equal to 200 degrees, that is, if the wrap angle of the film on the main roller 131 is a, the value range of a is greater than or equal to 200 degrees, so that the film accumulation on the main roller 131 can be increased, the sputtering area of the sputtering source 132 is increased, and the cooling efficiency of the main roller 131 is improved.
In a specific implementation process, the wrap angles of the films on the main roller 131 can be set to 200 °, 210 °, 220 °, 230 °, 240 ° and 250 ° according to actual conditions, and in a specific implementation process, the wrap angle of the films on the main roller 131 is set to 220 °, so that the area of the films on the main roller 131 can be increased, the area receiving the sputtering of the sputtering source 132 is increased, and the cooling efficiency of the main roller 131 is improved.
In an embodiment of the present invention, as shown in fig. 1, the number of the film plating units 130 is in the range of 2-30, that is, if the number of the film plating units 130 is b, the value of b is in the range of 2-30, and in a specific implementation process, the number of the film plating units 130 can be set to be 2, 4, 6, 8, 10, 12, 14, 16, 18, and 20 according to actual situations, so that different numbers of the film plating units 130 can be set according to the required capacity of the magnetron sputtering apparatus 100 to increase the production speed of the magnetron sputtering apparatus 100.
It should be noted that if the number of the main rollers 131 is less than 2, the diameter of the main roller 131 is too large, the processing difficulty of the main roller 131 is great, the space occupied by the main roller 131 is too large, and the space occupied by the equipment is too large, and if the number of the main rollers 131 is more than 20, the control procedure of the entire magnetron sputtering apparatus 100 is too complicated, which is not favorable for maintenance and operation in the production process.
In an embodiment of the present invention, as shown in fig. 1, the diameter of the main roller 131 is in a range of 300mm to 1200mm, that is, if the diameter of the main roller 131 is c, the value of c is in a range of 300mm to 1200mm, in a specific implementation process, the diameter of the main roller 131 may be set to 300mm, 400mm, 500mm, 600mm, 700mm, 800mm, 900mm, 1000mm, 1100mm and 1200mm according to practical situations, and in a specific embodiment, the diameter of the main roller 131 may be set to 500mm, so that on one hand, the main roller 131 can be ensured to have a sufficient cooling amount to cool the film, and on the other hand, the processing difficulty of the main roller 131 is not great.
It should be noted that when the diameter of the main roller 131 is smaller than 300mm, the circumference of the main roller 131 is not large enough, and there is not enough cooling amount to cool the film, and when the diameter of the main roller 131 is larger than 1200mm, the processing difficulty of the main roller 131 is too large because the diameter of the main roller 131 is too large.
Compared with the magnetron sputtering equipment with a single large-diameter main roller in the prior art, under the condition that the film coating length of the film is the same, the number of the sputtering sources which can be borne by the cooling capacity of the single large-diameter main roller is smaller than that of the sputtering sources which can be borne by the cooling capacities of the plurality of small-diameter main rollers, and meanwhile, under the condition that the film coating length is the same, the space occupied by the single large-diameter main roller is larger than that occupied by the plurality of small-diameter main rollers.
In one embodiment of the present invention, as shown in fig. 1, the number of the plurality of sputtering sources 132 in each coating unit 130 is 2-10, that is, if the number of the sputtering sources 132 in each coating unit 130 is d, the value of d ranges from 2-10, and in a specific implementation, the number of the sputtering sources 132 can be set to 2, 4, 6, 8 and 10 according to the diameter of the main roller 131.
In a specific implementation process, the number of the sputtering sources 132 in each coating unit 130 can be set to 4, so that the cooling amount of the main roller 131 can be utilized to the maximum extent, and the deposition efficiency of the coating unit 130 can be improved.
In an embodiment of the present invention, as shown in fig. 1, the sputtering sources 132 are coating targets, and a plurality of coating targets are uniformly spaced within the wrap angle range, it should be noted that the sputtering range of each sputtering source 132 is fixed, and the sputtering sources 132 are uniformly spaced within the wrap angle range, so that the sputtering range of the sputtering sources 132 can be fully utilized, and the condition of uneven coating thickness is avoided.
In an embodiment of the present invention, as shown in fig. 1, the magnetron sputtering apparatus 100 may further include a plurality of flattening rollers 140, and the flattening rollers 140 are disposed between the plurality of coating units 130, between the coating unit 130 and the unwinding mechanism 110, and between the coating unit 130 and the winding mechanism 120, so that the tensions of the films between the plurality of coating units 130, between the coating unit 130 and the unwinding mechanism 110, and between the coating unit 130 and the winding mechanism 120 may be increased, and the flatness of the film during the coating process may be improved.
In an embodiment of the present invention, as shown in fig. 1, the magnetron sputtering apparatus 100 may further include: a housing 150 and a vacuum mechanism.
Specifically, a coating space 151 is defined in the housing 150, the unwinding mechanism 110, the winding mechanism 120 and the plurality of coating units 130 are all disposed in the coating space 151, and the vacuum mechanism is disposed in the housing 150 and is used for vacuumizing the coating space 151, where it should be noted that, in the coating process of the magnetron sputtering apparatus 100, the coating space 151 needs to be kept in a vacuum state.
In an embodiment of the present invention, as shown in fig. 1, the vacuum mechanism may include a mechanical pump 161, a roots pump 162 and a molecular pump 163, wherein during the vacuum pumping process of the magnetron sputtering apparatus 100, the mechanical pump 161 is started to pump vacuum to the coating space 151, when the air pressure in the coating space 151 reaches the working limit of the mechanical pump 161, the roots pump 162 is started to pump vacuum to the coating space 151, and when the air pressure in the coating space 151 reaches the working limit of the roots pump 162, the molecular pump 163 is started to pump vacuum to the coating space 151 until the required air pressure for a specific coating operation is met, so that the requirement of coating on the air pressure of the coating space 151 can be met by three times of vacuum pumping.
First embodiment, referring to fig. 1, a magnetron sputtering apparatus 100 according to an embodiment of the present invention may include: the device comprises an unwinding mechanism 110, a winding mechanism 120, a coating unit 130, a flattening roller 140, a shell 150 and a vacuum mechanism.
The unwinding mechanism 110 and the winding mechanism 120 are arranged at intervals in the up-down direction, and the unwinding mechanism 110 is located below the winding mechanism 120.
The coating units 130 include twelve, twelve coating units 130 are sequentially arranged between the unwinding mechanism 110 and the winding mechanism 120 along the film conveying direction.
The coating unit 130 includes a main roll 131, five sputtering sources 132, a first pass roll 133, and a second pass roll 134.
The main rollers 131 in the coating unit 130 all rotate along the counterclockwise direction, the diameter of the main roller 131 is 600mm, five sputtering sources 132 are arranged at intervals in the circumferential direction of the main roller 131 and are positioned in the wrap angle range of the main roller 131 and the film, the sputtering sources 132 are spaced from the main roller 131 in the radial direction of the main roller 131, the first roller 133 and the second roller 134 are sequentially arranged in the conveying direction of the film, and the wrap angle of the film on the main roller 131 is 220 °.
The nip roll 140 is disposed between the plurality of coating units 130, between the coating unit 130 and the unwinding mechanism 110, and between the coating unit 130 and the winding mechanism 120.
A coating space 151 is defined in the housing 150, and the unwinding mechanism 110, the winding mechanism 120 and the plurality of coating units 130 are all disposed in the coating space 151.
A vacuum mechanism is provided in the housing 150 for evacuating the coating space 151, and may include a mechanical pump 161, a roots pump 162, and a molecular pump 163.
Specifically, as shown in fig. 1, before the magnetron sputtering apparatus 100 performs the coating operation, the coating space 151 inside the casing 150 is first evacuated, specifically, first evacuated by the mechanical pump 161, then, the film is vacuumized for the second time by the roots pump 162, and finally, vacuumized for the third time by the molecular pump 163, and the film comes to the film coating unit 130 through the unwinding mechanism 110 and the flattening roller 140, coming to the main roller 131 of the coating unit 130 through the first passing roller 133 of the coating unit 130, the sputtering source 132 around the main roller 131 coats the film five times, then the film leaves one film coating unit 130 through the second passing roller 134, then comes to the second film coating unit 130 through the flattening roller 140, passes through twelve film coating units 130 in sequence, leaves from the last film coating unit 130, and enters the winding mechanism 120 through the flattening roller 140, and a film coating process is completed.
According to the magnetron sputtering device 100 of the utility model, by arranging the plurality of coating units 130, each coating unit 130 comprises the main roller 131 and the plurality of sputtering sources 132, the heat of the film surface during coating can be reduced, the plurality of main rollers 131 can improve the cooling effect of the main rollers 131 on the film surface, reduce the influence of the heat on the film surface during metal deposition, improve the capacity of unit device space and improve the coating deposition efficiency.
Second embodiment, as shown in fig. 2, the structure of the present embodiment is substantially the same as that of the first embodiment, wherein the same reference numerals are used for the same components, and the difference is only that: among the twelve coating units 130, in the conveying direction of the film, six coating units 130 close to the unwinding mechanism 110 are first coating units 130, the main roller 131 of the first coating units 130 rotates counterclockwise, in the conveying direction of the film, six coating units 130 close to the winding mechanism 120 are second coating units 130, the main roller 131 of the second coating units 130 rotates clockwise, the first coating units 130 and the second coating units 130 are arranged at intervals in the up-down direction, and the six first coating units 130 and the six second coating units 130 are respectively arranged at equal intervals in the left-right direction; five sputtering sources 132 are provided at intervals in the circumferential direction of the main roll 131 and within the wrap angle of the main roll 131 and the film, and the five sputtering sources 132 are spaced apart from the main roll 131 in the radial direction of the main roll 131.
Specifically, as shown in fig. 1, before the magnetron sputtering apparatus 100 performs the coating operation, the coating space 151 inside the housing 150 is first vacuumized, specifically, first vacuumized by the mechanical pump 161, then second vacuumized by the roots pump 162, and finally third vacuumized by the molecular pump 163, the film goes to the first coating unit 130 through the unwinding mechanism 110 and the flattening roller 140, goes to the main roller 131 of the first coating unit 130 through the first passing roller 133 of the first coating unit 130, the sputtering source 132 around the main roller 131 performs five times coating on the film, then leaves one first coating unit 130 through the second passing roller 134, goes to the second first coating unit 130 through the flattening roller 140, passes through six first coating units 130 in sequence, goes from the last first coating unit 130 through the flattening roller 140, and enters the second coating unit 130 through the flattening roller 140 to perform coating on the other side of the film, then, after passing through six second film coating units, the film passes through the winding mechanism 120, and a double-sided film coating process is completed.
According to the magnetron sputtering device 100 of the utility model, by arranging the plurality of coating units 130, each coating unit 130 comprises one main roller 131 and the plurality of sputtering sources 132, one part of the plurality of main rollers 131 rotates clockwise, and the other part rotates anticlockwise, so that the heat of the film surface during coating can be reduced, the plurality of main rollers 131 can improve the cooling effect of the main rollers 131 on the film surface, reduce the influence of the heat on the film surface during metal deposition, improve the capacity of unit device space, improve the coating deposition efficiency, and realize the completion of double-sided coating in one coating period.
In the description of the present invention, it is to be understood that the terms "central," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the utility model and to simplify the description, and are not intended to indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and are not to be considered limiting of the utility model.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically defined otherwise.
In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can, for example, be fixedly connected, detachably connected, or integrally formed; the connection can be mechanical connection, electrical connection or communication; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
In the description herein, references to the description of the term "one embodiment," "some embodiments," "an example," "a specific example," or "some examples," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the utility model. In this specification, the schematic representations of the terms used above are not necessarily intended to refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, various embodiments or examples and features of different embodiments or examples described in this specification can be combined and combined by one skilled in the art without contradiction.
While embodiments of the utility model have been shown and described, it will be understood by those of ordinary skill in the art that: various changes, modifications, substitutions and alterations can be made to the embodiments without departing from the principles and spirit of the utility model, the scope of which is defined by the claims and their equivalents.
Claims (14)
1. A magnetron sputtering device, characterized in that the magnetron sputtering device is used for coating a film, the magnetron sputtering device comprises:
the unwinding mechanism and the winding mechanism;
the coating film unit, the coating film unit includes a plurality ofly, and is a plurality of the coating film unit is followed the direction of delivery of film is arranged in proper order the unwinding mechanism with between the winding mechanism, the coating film unit includes: the film forming device comprises a main roller and a plurality of sputtering sources, wherein the plurality of sputtering sources are arranged at intervals in the circumferential direction of the main roller and are positioned in the wrapping angle range of the main roller and the film, and the plurality of sputtering sources and the main roller are spaced in the radial direction of the main roller.
2. The magnetron sputtering apparatus according to claim 1, wherein the plurality of main rollers in the plurality of coating units each rotate in a clockwise direction or each rotate in a counterclockwise direction.
3. The magnetron sputtering apparatus according to claim 1, wherein when the thin film is transported for coating, one of the main rollers of the coating units rotates in a clockwise direction and the other rotates in a counterclockwise direction.
4. The magnetron sputtering apparatus according to claim 3, wherein the coating unit in which the main roller rotates in the clockwise direction is a first coating unit, the coating unit in which the main roller rotates in the counterclockwise direction is a second coating unit, the first coating unit includes a plurality of coating units, and the second coating unit includes a plurality of coating units.
5. The magnetron sputtering apparatus according to claim 4, wherein a plurality of the first coating units are arranged upstream or downstream of a plurality of the second coating units in a film conveying direction.
6. The magnetron sputtering apparatus according to claim 5, wherein the unwinding mechanism and the winding mechanism are arranged at intervals in a first direction, a plurality of the first coating units are arranged at intervals in a second direction perpendicular to the first direction, a plurality of the second coating units are arranged at intervals in the second direction, and a plurality of the first coating units and a plurality of the second coating units are arranged at intervals in the first direction.
7. The magnetron sputtering apparatus according to any one of claims 1 to 6, wherein the coating unit further comprises: the film roll comprises a first roll and a second roll, wherein the first roll, the main roll and the second roll are sequentially arranged in the conveying direction of the film, and the wrap angle of the film on the main roll is greater than or equal to 200 degrees.
8. The magnetron sputtering device according to any one of claims 1 to 7, wherein the number of the coating units is in the range of 2 to 30.
9. The magnetron sputtering apparatus of any one of claims 1 to 7 wherein the diameter of the main roller is in the range of 300mm to 1200 mm.
10. The magnetron sputtering apparatus according to any one of claims 1 to 7, wherein the number of the plurality of sputtering sources in each of the coating units is 2 to 10.
11. The magnetron sputtering apparatus according to any one of claims 1 to 7, wherein the sputtering source is a coating target, and a plurality of the coating targets are uniformly spaced within the wrap angle range.
12. The magnetron sputtering apparatus according to any one of claims 1 to 7, further comprising: the film coating device comprises a plurality of flattening rollers, wherein the flattening rollers are arranged among the film coating units, between the film coating units and the unwinding mechanism and between the film coating units and the winding mechanism.
13. The magnetron sputtering apparatus according to any one of claims 1 to 7, further comprising:
the film coating device comprises a shell, wherein a film coating space is defined in the shell, and the unwinding mechanism, the winding mechanism and the plurality of film coating units are all arranged in the film coating space;
and the vacuum mechanism is arranged on the shell and is used for vacuumizing the coating space.
14. The magnetron sputtering apparatus of claim 13 wherein the vacuum mechanism comprises: mechanical pumps, roots pumps and molecular pumps.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123382341.4U CN216786246U (en) | 2021-12-29 | 2021-12-29 | Magnetron sputtering device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123382341.4U CN216786246U (en) | 2021-12-29 | 2021-12-29 | Magnetron sputtering device |
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| CN216786246U true CN216786246U (en) | 2022-06-21 |
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