CN216782439U

CN216782439U - Automatic change integrated circuit packaging system mechanism of moulding plastics

Info

Publication number: CN216782439U
Application number: CN202220052530.0U
Authority: CN
Inventors: 朱倢; 易鹏; 陈建宝
Original assignee: Yancheng Jiahong Microelectronics Co ltd
Current assignee: Yancheng Jiahong Microelectronics Co ltd
Priority date: 2022-01-10
Filing date: 2022-01-10
Publication date: 2022-06-21
Anticipated expiration: 2032-01-10

Abstract

The utility model relates to an injection molding mechanism of an automatic integrated circuit packaging system in the technical field of injection molding mechanisms, which comprises a supporting table, wherein the top of the supporting table is fixedly connected with a supporting frame, the top of the supporting frame is provided with a driving cylinder, the output end of a prime number driving cylinder is connected with a mounting plate, the bottom of the mounting plate is connected with an upper mold, and the top of the upper mold is communicated with an injection molding pipe. The device is when using, can be through electric putter, the push pedal, cooperate between liftout pole and the circular port, can carry out ejecting with the processing product after the encapsulation injection moulding, avoid the inconvenient problem that leads to the damage of taking out of product, through servo motor, the driving gear, cooperation between driven gear and the bull stick is rotated, can drive two bed dies of circular disk surface symmetry, can correspond under last mould when rotating each time, just so can circulate in proper order the product that has processed and the product of treating processing, just so improved the device efficiency to product processing.

Description

Automatic change integrated circuit packaging system mechanism of moulding plastics

Technical Field

The utility model relates to the technical field of injection molding mechanisms, in particular to an injection molding mechanism of an automatic integrated circuit packaging system.

Background

An integrated circuit is a miniature electronic device or component. The transistor, resistor, capacitor and inductor elements and wiring required in a circuit are interconnected together by a certain process, and are manufactured on a small semiconductor wafer or a plurality of small semiconductor wafers or medium substrates, and then are packaged in a package to form the micro-structure with the required circuit function.

When the existing injection molding mechanism is used for packaging and injection molding a product, the product after packaging and injection molding is difficult to eject, so that the processed product is basically taken out manually by means of tools, the processed product is inconvenient to take out, and the product is easy to damage, so that the processing efficiency of the device is reduced;

to this end, we propose an automated IC packaging system injection molding mechanism.

Disclosure of Invention

Aiming at the problems, the utility model provides an injection molding mechanism of an automatic integrated circuit packaging system, which solves the problem that the existing injection molding mechanism is difficult to eject a product after packaging injection molding when the product is packaged and injected.

The technical scheme of the utility model is as follows:

an injection molding mechanism of an automatic integrated circuit packaging system comprises a supporting table, wherein a supporting frame is fixedly connected to the top of the supporting table, a driving cylinder is installed at the top of the supporting frame, the output end of a prime number driving cylinder is connected with a mounting plate, the bottom of the mounting plate is connected with an upper mold, an injection molding pipe communicated with the top of the upper mold is provided, the top end of the injection molding pipe extends to the top of the mounting plate, a round disc rotating above the top of the supporting table is arranged below the upper mold, an auxiliary mechanism is installed at the bottom of the round disc, the top of the round disc is connected with two symmetrical lower molds, one of the two lower molds corresponds to the position under the upper mold, the corresponding position of the top wall of the round disc in the lower mold is connected with an electric push rod, the output end of the electric push rod is connected with a push plate, the top of the push plate is connected with two symmetrical ejector rods, the inner bottom wall of the lower die is provided with two symmetrical circular holes at the corresponding positions of the ejector rods.

The working principle of the technical scheme is as follows:

the device is when using, can be with the product after the shaping, at electric putter, the push pedal, ejecting pole and circular port use down ejecting, the product after the processing is conveniently taken, through servo motor, the driving gear, rotation between driven gear and the bull stick is used, can guarantee two bed dies at circular dish top, when rotating each time, can both correspond under last mould, just so can circulate in proper order the product that has processed and the product of treating processing, just so improved the efficiency of the device to product processing.

In a further technical scheme, complementary unit includes servo motor, servo motor installs the interior roof at a supporting bench, servo motor's output is connected with the driving gear, the surface engagement of driving gear is connected with driven gear, driven gear's internal connection has the bull stick, the top at a supporting bench is passed through the bearing to the one end of bull stick, the bottom at circular disk is connected to the other end of bull stick.

Through the meshing between driving gear and the driven gear, then under servo motor's use, can guarantee that the bull stick can drive circular disk and be circular linear motion at the top center of a supporting bench, and then cooperate two bed dies to encapsulate injection moulding to the mould on the product cooperation.

In a further technical scheme, the rotating rod is respectively arranged at the center of the surfaces of the supporting platform and the circular disc, and the surface diameter of the circular disc is smaller than that of the supporting platform.

Through the bull stick setting at the surperficial center of brace table and circular disk, can cooperate two bed dies on the circular disk to guarantee when rotating each time, can both correspond under last mould, guaranteed the device efficiency to product processing.

In a further technical scheme, a guide rod is connected between the support platform and the support frame, a spring is sleeved on the surface of the guide rod, and the surface of the guide rod is in sliding connection with the inside of the mounting plate.

In a further technical scheme, the supporting platform is of a concave shape with a downward opening, and the supporting frame is of an L shape.

Through the use of a supporting table and a supporting frame, the lower die and the upper die are mainly supported, so that the upper die and the lower die are guaranteed to be packaged and injected, and certain stability can be improved.

In a further technical scheme, the aperture of the circular hole is equal to the diameter of the end part of the ejector rod, and the inner wall of the circular hole is connected with the surface of the ejector rod in a sliding mode.

Through the circular port mainly used cooperation ejector pin, can conveniently ejecting with the product in the bed die behind processing encapsulation injection moulding.

The utility model has the beneficial effects that:

1. when the device is used, a processed product after encapsulation and injection molding can be ejected through the matching of the electric push rod, the push plate, the ejector rod and the circular hole, the problem that the product is damaged due to inconvenient taking out is solved, two lower dies with symmetrical circular disc surfaces can be driven through the matching rotation among the servo motor, the driving gear, the driven gear and the rotating rod, and the two lower dies can correspond to the positions under the upper die during each rotation, so that the processed product and the product to be processed can be sequentially circulated, and the product processing efficiency of the device is improved;

2. through the meshing between the driving gear and the driven gear, the rotating rod can drive the circular disc to do circular linear motion at the center of the top of the supporting table under the use of the servo motor, and then the product is matched with the two lower dies to carry out encapsulation injection molding processing on the product matched with the upper die;

3. the rotating rod is arranged in the center of the surfaces of the supporting table and the circular disc, and can be matched with two lower dies on the circular disc to ensure that the lower dies can correspond to the positions right below the upper dies during each rotation, so that the product processing efficiency of the device is ensured;

4. through the use of the guide rod and the spring, on one hand, the upper die and the lower die can be matched for accurate positioning, and on the other hand, a certain buffering force is ensured between the upper die and the lower die during packaging, so that the long-term abrasion between the upper die and the lower die can be reduced;

5. through the use of the supporting table and the supporting frame, the lower die and the upper die are mainly supported, and certain stability can be improved when the upper die and the lower die are packaged and injected;

6. through circular port mainly used cooperation ejector pin, can conveniently be ejecting with the product in the bed die behind processing encapsulation injection moulding.

Drawings

FIG. 1 is a schematic view of the overall structure of the present invention;

FIG. 2 is a schematic view of the structure of the assist mechanism of the present invention;

fig. 3 is a schematic view of the structure of the circular disk of the present invention.

Description of reference numerals:

1. a support table; 2. a support frame; 3. a driving cylinder; 4. mounting a plate; 5. an upper die; 6. injection molding a tube; 7. a circular disc; 8. an auxiliary mechanism; 801. a servo motor; 802. a driving gear; 803. a driven gear; 804. a rotating rod; 9. a lower die; 10. an electric push rod; 11. pushing the plate; 12. a lifter bar; 13. a circular hole; 14. a guide bar; 15. a spring.

Detailed Description

The embodiments of the present invention will be further described with reference to the accompanying drawings.

Example (b):

as shown in fig. 1-3, an injection molding mechanism of an automatic integrated circuit packaging system comprises a supporting table 1, a supporting frame 2 is fixedly connected to the top of the supporting table 1, a driving cylinder 3 is installed at the top of the supporting frame 2, an output end of the prime number driving cylinder 3 is connected with a mounting plate 4, the bottom of the mounting plate 4 is connected with an upper mold 5, an injection molding pipe 6 communicated with the top of the upper mold 5, the top end of the injection molding pipe 6 extends to the top of the mounting plate 4, a circular disc 7 rotating above the top of the supporting table 1 is arranged below the upper mold 5, an auxiliary mechanism 8 is installed at the bottom of the circular disc 7, two symmetrical lower molds 9 are connected to the top of the circular disc 7, one of the two lower molds 9 is corresponding to the upper mold 5, an electric push rod 10 is connected to a corresponding position of the top of the circular disc 7, which is located on the inner top wall of the lower mold 9, and an output end of the electric push rod 11 is connected to the electric push plate 10, the top of the push plate 11 is connected with two symmetrical ejector rods 12, and two symmetrical circular holes 13 are arranged at the corresponding positions of the ejector rods 12 on the inner bottom wall of the lower die 9.

The working principle of the technical scheme is as follows:

the device is when using, place the product of processing in the mould groove of bed die 9, then correspond the encapsulation with bed die 9 through driving the last mould 5 that actuating cylinder 3 promoted 4 bottoms of mounting panel, under the use of injection molding pipe 6, can be with the raw materials shaping after melting on the surface of product, when needs take out the product, accessible electric putter 10 drives ejector beam 12 at push pedal 11 top, the product in with bed die 9 is ejecting along the inner wall of circular port 13, the product after having guaranteed so that processing is convenient for take.

In another embodiment, as shown in fig. 1-3, the auxiliary mechanism 8 includes a servo motor 801, the servo motor 801 is mounted on the inner top wall of the supporting table 1, a driving gear 802 is connected to an output end of the servo motor 801, a driven gear 803 is engaged with a surface of the driving gear 802, a rotating rod 804 is connected to an inner portion of the driven gear 803, one end of the rotating rod 804 is connected to the top of the supporting table 1 through a bearing, and the other end of the rotating rod 804 is connected to the bottom of the circular plate 7.

Through the meshing between driving gear 802 and the driven gear 803, then under servo motor 801's use, can guarantee that bull stick 804 can drive circular dish 7 and be circular linear motion at the top center of a supporting bench 1, and then cooperate two bed dies 9 to encapsulate injection moulding to mould 5 on the product cooperation.

In another embodiment, as shown in fig. 1-3, the rotating rod 804 is disposed at the center of the surface of the support table 1 and the circular disk 7, respectively, and the diameter of the surface of the circular disk 7 is smaller than that of the support table 1.

Through the setting of bull stick 804 in the surperficial center of brace table 1 and circular disk 7, can cooperate two bed dies 9 on the circular disk 7 to guarantee each time when rotating, can both correspond under last mould 5, guaranteed the device efficiency to product processing.

In another embodiment, as shown in fig. 1-3, a guide bar 14 is connected between the support table 1 and the support frame 2, a spring 15 is sleeved on the surface of the guide bar 14, and the surface of the guide bar 14 is slidably connected with the inside of the mounting plate 4.

Through the use of the guide rod 14 and the spring 15, on one hand, the precise positioning between the upper die 5 and the lower die 9 can be matched, on the other hand, certain buffering force is ensured between the upper die 5 and the lower die 9 during packaging, and the long-term abrasion between the upper die 5 and the lower die 9 can be reduced.

In another embodiment, as shown in fig. 1-3, the support platform 1 has a concave shape with a downward opening, and the support frame 2 has an L-shape.

Through the use of supporting bench 1 and support frame 2, mainly be in order to support lower mould 9 and last mould 5, guaranteed that last mould 5 and lower mould 9 can improve certain stability when the encapsulation is moulded plastics.

In another embodiment, as shown in fig. 1-3, the diameter of the circular hole 13 is equal to the diameter of the end of the ejector pin 12, and the inner wall of the circular hole 13 is slidably connected with the surface of the ejector pin 12.

Through circular port 13 mainly used cooperation ejector beam 12, can conveniently ejecting with the product in the bed die 9 after processing encapsulation injection moulding.

The above embodiments only express the specific embodiments of the present invention, and the description thereof is specific and detailed, but not to be construed as limiting the scope of the present invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention.

Claims

1. The utility model provides an automatic change integrated circuit packaging system mechanism of moulding plastics, includes brace table (1), its characterized in that: the top of the supporting table (1) is fixedly connected with a supporting frame (2), a driving cylinder (3) is installed at the top of the supporting frame (2), the output end of the prime number driving cylinder (3) is connected with a mounting plate (4), the bottom of the mounting plate (4) is connected with an upper die (5), an injection molding pipe (6) communicated with the top of the upper die (5) is arranged, the top end of the injection molding pipe (6) extends to the top of the mounting plate (4), a circular disc (7) rotating above the top of the supporting table (1) is arranged below the upper die (5), an auxiliary mechanism (8) is installed at the bottom of the circular disc (7), the top of the circular disc (7) is connected with two symmetrical lower dies (9), one of the two lower dies (9) corresponds to the position under the upper die (5), and the corresponding position, located on the inner top wall of the lower die (9), of the top of the circular disc (7) is connected with an electric push rod (10), the output of electric putter (10) is connected with push pedal (11), the top of push pedal (11) is connected with ejector beam (12) of two symmetries, the corresponding department that the inner bottom wall of bed die (9) is located ejector beam (12) is equipped with circular port (13) of two symmetries.

2. The automated integrated circuit packaging system injection molding machine of claim 1, wherein: complementary unit (8) include servo motor (801), install the interior roof at brace table (1) servo motor (801), the output of servo motor (801) is connected with driving gear (802), the surface engagement of driving gear (802) is connected with driven gear (803), the internal connection of driven gear (803) has bull stick (804), the top at brace table (1) is passed through the bearing to the one end of bull stick (804), the bottom at circular dish (7) is connected to the other end of bull stick (804).

3. The automated integrated circuit packaging system injection molding machine of claim 2, wherein: the rotating rod (804) is respectively arranged at the center of the surface of the supporting platform (1) and the surface of the circular disc (7), and the diameter of the surface of the circular disc (7) is smaller than that of the supporting platform (1).

4. The automated integrated circuit packaging system injection molding machine of claim 1, wherein: a guide rod (14) is connected between the support table (1) and the support frame (2), a spring (15) is sleeved on the surface of the guide rod (14), and the surface of the guide rod (14) is connected with the inner portion of the mounting plate (4) in a sliding mode.

5. The automated integrated circuit packaging system injection molding machine of claim 1, wherein: the supporting platform (1) is of a concave shape with a downward opening, and the supporting frame (2) is of an L shape.

6. The automated integrated circuit packaging system injection molding machine of claim 1, wherein: the aperture of circular port (13) and the tip diameter of liftout pole (12) all equal, the inner wall of circular port (13) and the surperficial sliding connection of liftout pole (12).