CN216773798U

CN216773798U - Superspeed semiconductor laser shell

Info

Publication number: CN216773798U
Application number: CN202220038063.6U
Authority: CN
Inventors: 梁畅
Original assignee: Wuhan Jiamingchuang Technology Co ltd
Current assignee: Wuhan Jiamingchuang Technology Co ltd
Priority date: 2022-01-09
Filing date: 2022-01-09
Publication date: 2022-06-17
Anticipated expiration: 2032-01-09

Abstract

The utility model discloses an ultrahigh-speed semiconductor laser shell, and relates to the technical field of semiconductor laser shells. The laser comprises a laser shell body, a fixing column, a micro motor and a fan blade, wherein an inner groove is formed in the inner side wall of the laser shell body, a plurality of arc-shaped plates are fixedly arranged in the inner groove, a plurality of heat conduction pipes are fixedly arranged on the surfaces of the arc-shaped plates, radiating fins are fixedly arranged on the peripheral sides of the heat conduction pipes, connecting sheets are fixedly arranged among the radiating fins, a hollow groove is formed in the surface of the fixing column, the output end of the micro motor and the fan blade are fixedly arranged, a mounting ring is fixedly arranged at the edge of the hollow groove, a plurality of air outlet holes are formed in the side face of the mounting ring, a reinforcing rod is fixedly arranged at one end of the laser shell body, and the laser shell body is fixedly arranged through the reinforcing rod, the mounting ring and the fixing column. The utility model can radiate heat by transferring heat conduction, thereby avoiding the problem that the laser module is easy to break down when dust enters the interior.

Description

Superspeed semiconductor laser shell

Technical Field

The utility model belongs to the technical field of semiconductor laser shells, and particularly relates to an ultra-high-speed semiconductor laser shell.

Background

The semiconductor laser is a device which generates laser by using a certain semiconductor material as a working substance, and the working principle is that the population inversion of an unbalanced carrier is realized between the energy bands (a conduction band and a valence band) of the semiconductor substance or between the energy bands of the semiconductor substance and the energy level of impurities (an acceptor or a donor), and when a large number of electrons in the population inversion state are compounded with holes, the stimulated emission effect is generated. When some current hypervelocity semiconductor laser dispels the heat, adopt the means of heat transfer to dispel the heat usually, because the setting up of thermovent lets the dust have the inside possibility of getting into semiconductor laser to probably lead to the laser module to receive the erosion of dust, and then easily cause the laser module to break down, consequently, provide a hypervelocity semiconductor laser shell, solve above-mentioned problem.

SUMMERY OF THE UTILITY MODEL

The utility model aims to provide a super-high-speed semiconductor laser shell, which solves the problems that the conventional super-high-speed semiconductor laser generally adopts a heat exchange means for heat dissipation, and due to the arrangement of a heat dissipation port, dust can enter the interior of the semiconductor laser, so that a laser module can be corroded by the dust, and further the laser module is easy to break down.

In order to solve the technical problems, the utility model is realized by the following technical scheme:

the utility model relates to an ultrahigh-speed semiconductor laser shell which comprises a laser shell body, a fixed column, a micro motor and fan blades, wherein an inner groove is formed in the inner side wall of the laser shell body, a plurality of arc-shaped plates are fixedly arranged in the inner groove, a plurality of heat conduction pipes are fixedly arranged on one surface of each of the arc-shaped plates, radiating fins are fixedly arranged on the peripheral side surfaces of the heat conduction pipes, a connecting sheet is fixedly arranged among the radiating fins, a hollow groove is formed in one surface of the fixed column, and the output end of the micro motor and the fan blades are fixedly arranged.

The hollow groove is fixedly provided with an installation ring along the opening, and the side surface of the installation ring is provided with a plurality of air outlet holes.

The laser shell body is fixedly provided with a reinforcing rod at one end and fixedly arranged through the reinforcing rod, a mounting ring and a fixing column.

The air outlet is communicated with the inside of the hollow groove, the air outlet is aligned with the surface of the radiating fin, and air flow can pass through the air outlet and be blown to the surface of the radiating fin through the alignment of the air outlet and the radiating fin.

And the plurality of radiating fins are fixedly arranged through connecting sheets.

Heat pipe one end and arc fixed mounting, the heat pipe other end run through laser instrument shell body and outwards extend and with arc fixed mounting, but arc, heat pipe, fin and connection piece copper or other good materials of heat conductivity to do benefit to the transmission heat.

The micro motor and the fan blades are both positioned in the hollow groove.

The utility model has the following beneficial effects:

according to the utility model, the laser generates heat and transmits the heat to the arc-shaped plate, the arc-shaped plate transmits the heat to the heat conduction pipe, the heat conduction pipe transmits the heat to the external radiating fins for heat radiation, the airflow is blown out outwards through the air outlet holes and is blown to the surfaces of the radiating fins, so that the heat radiation is further enhanced, and the problems that the laser module is corroded by dust and is easy to cause the fault of the laser module due to the fact that dust enters the laser module in some heat radiation modes by adopting heat exchange are avoided.

Of course, it is not necessary for any product in which the utility model is practiced to achieve all of the above-described advantages at the same time.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to the drawings without creative efforts.

FIG. 1 is a general schematic diagram of a housing for an ultra-high speed semiconductor laser of the present invention;

FIG. 2 is a schematic side view of a super-high speed semiconductor laser package of the present invention;

FIG. 3 is a schematic sectional view taken along line A-A of FIG. 2;

FIG. 4 is an enlarged view of a portion A of FIG. 1;

fig. 5 is a partially enlarged view of a portion B of fig. 3.

In the drawings, the components represented by the respective reference numerals are listed below:

1. a laser housing body; 2. fixing a column; 3. a hollow groove; 4. a micro motor; 5. a fan blade; 6. a reinforcing rod; 7. an inner groove; 8. an arc-shaped plate; 9. a heat conducting pipe; 10. a heat sink; 11. connecting sheets; 12. installing a ring; 13. and (4) an air outlet.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

In the description of the present invention, it is to be understood that the terms "upper", "middle", "outer", "inner", and the like, indicate orientations or positional relationships, are used for convenience in describing the present invention and simplifying the description, but do not indicate or imply that the referenced components or elements must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention.

Referring to fig. 1-5, the utility model is an ultra-high speed semiconductor laser housing, including a laser housing body 1, a fixing column 2, a micro motor 4, and a fan blade 5, wherein an inner groove 7 is formed on an inner side wall of the laser housing body 1, a plurality of arc plates 8 are fixedly installed in the inner groove 7, a plurality of heat conduction pipes 9 are fixedly installed on surfaces of the plurality of arc plates 8, heat dissipation fins 10 are fixedly installed on peripheral side surfaces of the plurality of heat conduction pipes 9, a connection sheet 11 is fixedly installed between the plurality of heat dissipation fins 10, a hollow groove 3 is formed on a surface of the fixing column 2, an output end of the micro motor 4 and the fan blade 5 are fixedly installed, and the micro motor 4 and the fan blade 5 are both located in the hollow groove 3.

The fixed installation ring 12 of having installed in 3 bead departments in hollow groove, a plurality of exhaust vents 13 have been seted up to installation ring 12 side, and the fixed anchor strut 6 of having installed in 1 one end of laser housing body, laser housing body 1 are through anchor strut 6, installation ring 12 and fixed column 2 fixed mounting.

The air outlet 13 is communicated with the inside of the hollow groove 3, the air outlet 13 is aligned with the surface of the heat sink 10, and the air flow can be blown to the surface of the heat sink 10 through the air outlet 13 by aligning the air outlet 13 with the heat sink 10.

Through connection piece 11 fixed mounting, 9 one ends of heat pipes and 8 fixed mounting of arc between a plurality of fin 10, the 9 other ends of heat pipes run through laser instrument shell body 1 and outwards extend and with 8 fixed mounting of arc, but arc 8, heat pipes 9, fin 10 and connection piece 11 copper or the good material of other heat conductivities to do benefit to the transmission heat.

As shown in fig. 1 to 5, this embodiment is a method for using a super-high speed semiconductor laser housing: micro motor 4 selects the power model according to the actual demand, the inside laser instrument of laser instrument housing body 1 generates heat, and give arc 8 with heat transfer, arc 8 gives heat pipe 9 with heat transfer, heat pipe 9 is with heat transfer for outside fin 10 heat dissipation again, micro motor 4 starts and drives flabellum 5 and rotate and blow simultaneously, the air current outwards blows off through a plurality of exhaust vents 13, the air current blows to a plurality of fin 10 surfaces, thereby further strengthen the heat dissipation.

In the description herein, references to the description of "one embodiment," "an example," "a specific example" or the like are intended to mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the utility model. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

The preferred embodiments of the utility model disclosed above are intended to be illustrative only. The preferred embodiments are not intended to be exhaustive or to limit the utility model to the precise embodiments disclosed. Obviously, many modifications and variations are possible in light of the above teaching. The embodiments were chosen and described in order to best explain the principles of the utility model and the practical application, to thereby enable others skilled in the art to best utilize the utility model. The utility model is limited only by the claims and their full scope and equivalents.

Claims

1. The utility model provides an hypervelocity semiconductor laser shell, includes laser instrument shell body (1), fixed column (2), micro motor (4), flabellum (5), its characterized in that: inner groovy (7) have been seted up to laser instrument shell body (1) inside wall, inner groovy (7) internal fixed mounting has a plurality of arcs (8), and is a plurality of arc (8) a surface equal fixed mounting has a plurality of heat pipe (9), and is a plurality of heat pipe (9) week side equal fixed mounting has fin (10), and is a plurality of fixed mounting has connection piece (11) between fin (10), cavity groove (3) have been seted up on fixed column (2) a surface, micro motor (4) output and flabellum (5) fixed mounting.

2. The housing of an ultra-high speed semiconductor laser as claimed in claim 1, wherein a mounting ring (12) is fixed at the edge of the hollow groove (3), and a plurality of air outlets (13) are formed in the side surface of the mounting ring (12).

3. The housing of an ultra-high speed semiconductor laser as claimed in claim 1, wherein a reinforcing bar (6) is fixedly arranged at one end of the laser housing body (1), and the laser housing body (1) is fixedly arranged through the reinforcing bar (6), the mounting ring (12) and the fixing column (2).

4. A housing for an ultra-high speed semiconductor laser as claimed in claim 2, wherein the air outlet hole (13) communicates with the inside of the hollow groove (3), and the air outlet hole (13) is aligned with the surface of the heat sink (10).

5. A housing for an ultra high speed semiconductor laser as claimed in claim 1 wherein a plurality of said heat sinks (10) are fixedly mounted therebetween by means of bonding pads (11).

6. The housing of an ultra-high speed semiconductor laser as claimed in claim 1, wherein one end of the heat pipe (9) is fixedly mounted on the arc-shaped plate (8), and the other end of the heat pipe (9) extends outwards through the laser housing body (1) and is fixedly mounted on the arc-shaped plate (8).

7. A housing for a superspeed semiconductor laser as claimed in claim 1, characterized in that the micro-motor (4) and the fan blade (5) are both located in the hollow groove (3).