CN216773191U - Multifunctional semiconductor cleaning jig - Google Patents
Multifunctional semiconductor cleaning jig Download PDFInfo
- Publication number
- CN216773191U CN216773191U CN202123419580.2U CN202123419580U CN216773191U CN 216773191 U CN216773191 U CN 216773191U CN 202123419580 U CN202123419580 U CN 202123419580U CN 216773191 U CN216773191 U CN 216773191U
- Authority
- CN
- China
- Prior art keywords
- fixedly connected
- ultrasonic cleaning
- plate
- sleeve
- bevel gear
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 34
- 238000004140 cleaning Methods 0.000 title claims abstract description 29
- 238000004506 ultrasonic cleaning Methods 0.000 claims abstract description 38
- 238000010438 heat treatment Methods 0.000 claims abstract description 11
- 238000001035 drying Methods 0.000 claims abstract description 6
- 239000012459 cleaning agent Substances 0.000 abstract description 4
- 239000007788 liquid Substances 0.000 abstract description 3
- 230000009286 beneficial effect Effects 0.000 abstract description 2
- 238000005406 washing Methods 0.000 abstract 1
- 230000005540 biological transmission Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910021645 metal ion Inorganic materials 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000012188 paraffin wax Substances 0.000 description 1
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- Cleaning Or Drying Semiconductors (AREA)
Abstract
The utility model discloses a multifunctional semiconductor cleaning jig which comprises an ultrasonic cleaning box and a storage frame, wherein an end plate is fixedly connected to the inner wall of the upper end of the ultrasonic cleaning box, the storage frame is movably connected in the ultrasonic cleaning box, a side plate is fixedly connected to the outer side of the upper end of the storage frame, a drying mechanism is arranged above the inner part of the ultrasonic cleaning box, and a rotating plate is rotatably connected to the central position of the upper end of the side plate, so that the multifunctional semiconductor cleaning jig has the following beneficial effects: after taking out the cleaning agent of frame follow ultrasonic cleaning incasement will be deposited, utilize the heating of hot plate, can improve ultrasonic cleaning incasement portion air temperature to utilize the rotation of drive bevel gear, drive the sideboard and deposit the frame and rotate, can dry the washing liquid on semiconductor surface rapidly, need not to dry again after taking out the semiconductor from the ultrasonic cleaning incasement, improved and washd tool practicality.
Description
Technical Field
The utility model relates to a cleaning jig, in particular to a multifunctional semiconductor cleaning jig, and belongs to the technical field of semiconductor cleaning.
Background
Semiconductor cleaning is a processing process for removing paraffin, grease-like high molecular compounds attached to the surface of a semiconductor, metal atoms and metal ions stained on the surface of the semiconductor, and in order to ensure that the semiconductor is not damaged in the cleaning process, an ultrasonic cleaning tank is generally used for cleaning the semiconductor.
However, although the surface stains can be removed after the semiconductor is soaked and cleaned in the cleaning agent, the surface stains can inevitably adhere to cleaning liquid or water stains, and under the condition that a drying structure is not arranged in the cleaning box, the semiconductor can only be taken out and then dried, so that the operation is troublesome, and the semiconductor with the water stains on the surface is easily adhered to dust in the air after being taken out from the cleaning box.
SUMMERY OF THE UTILITY MODEL
The utility model aims to solve the defects in the prior art and provides a multifunctional semiconductor cleaning jig.
In order to achieve the purpose, the utility model adopts the following technical scheme:
the utility model provides a multi-functional semiconductor cleaning jig, includes the ultrasonic cleaning case and deposits the frame, end plate of ultrasonic cleaning incasement upper end inner wall fixedly connected with, deposit frame swing joint in the ultrasonic cleaning incasement, deposit frame upper end outside fixedly connected with sideboard, ultrasonic cleaning incasement portion top is provided with stoving mechanism, sideboard upper end central point puts to rotate and is connected with the rotor plate, the even fixedly connected with a set of threaded rod in rotor plate upper end, the end plate upper end just is located the threaded rod outside and rotates and be connected with the thread bush, the threaded rod upper end pass the thread bush and with thread bush threaded connection.
Preferably, the outer side of the threaded sleeve is fixedly connected with a linkage gear, the outer side of the upper end of the ultrasonic cleaning box is rotatably connected with a rotating sleeve, the inner side wall of the rotating sleeve is fixedly connected with an inner gear sleeve at a position corresponding to the linkage gear, the inner gear sleeve is meshed with the linkage gear and is connected with an outer gear sleeve, and the outer side of the rotating sleeve is fixedly connected with the outer gear sleeve.
Preferably, ultrasonic cleaning case outside upper end fixedly connected with servo motor, servo motor output fixedly connected with drive gear, drive gear is connected with outer gear sleeve meshing.
Preferably, stoving mechanism includes hot plate and bevel gear cover, hot plate fixed connection is in ultrasonic cleaning incasement lateral wall top, bevel gear cover fixed connection is at limit outside lower extreme, ultrasonic cleaning incasement lateral wall just with bevel gear cover corresponding position fixedly connected with driving motor, driving motor output fixedly connected with drive bevel gear, drive bevel gear and bevel gear cover meshing are connected.
Preferably, threaded rod lower extreme fixed connection just with sideboard sliding connection on changeing the board, the threaded rod upper end all passes the end plate and all with end plate sliding connection.
The multifunctional semiconductor cleaning jig provided by the utility model has the beneficial effects that: after the storage frame is taken out from the cleaning agent in the ultrasonic cleaning box, the air temperature in the ultrasonic cleaning box can be increased by heating the heating plate, the side plate is driven to rotate by the rotation of the driving bevel gear, the cleaning liquid on the surface of the semiconductor can be rapidly dried, the semiconductor does not need to be dried after being taken out from the ultrasonic cleaning box, and the practicability of the cleaning jig is improved.
Drawings
FIG. 1 is a front sectional view of a multifunctional semiconductor cleaning tool according to the present invention;
FIG. 2 is a schematic view of a top view of a multi-functional semiconductor cleaning tool according to the present invention;
FIG. 3 is an enlarged schematic view of a portion A of the multifunctional semiconductor cleaning tool of FIG. 1 according to the present invention;
fig. 4 is a schematic view of an upper end appearance structure of a multifunctional semiconductor cleaning tool storage frame according to the present invention.
In the figure: the ultrasonic cleaning machine comprises an ultrasonic cleaning box 1, an end plate 2, a storage frame 3, a drying mechanism 4, a heating plate 41, a bevel gear sleeve 42, a driving motor 43, a driving bevel gear 44, a side plate 5, a rotating plate 6, a threaded rod 7, a threaded sleeve 8, a linkage gear 9, a rotating sleeve 10, an inner gear sleeve 11, a servo motor 12, a driving gear 13 and an outer gear sleeve 14.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments.
Referring to fig. 1-4, a multifunctional semiconductor cleaning jig comprises an ultrasonic cleaning box 1 and a storage frame 3, wherein an end plate 2 is fixedly connected to the inner wall of the upper end of the ultrasonic cleaning box 1, the storage frame 3 is movably connected in the ultrasonic cleaning box 1, a side plate 5 is fixedly connected to the outer side of the upper end of the storage frame 3, a drying mechanism 4 is arranged above the inner part of the ultrasonic cleaning box 1, a rotating plate 6 is rotatably connected to the central position of the upper end of the side plate 5, a group of threaded rods 7 are uniformly and fixedly connected to the upper end of the rotating plate 6, a threaded sleeve 8 is rotatably connected to the upper end of the end plate 2 and positioned outside the threaded rods 7, the upper end of the threaded rod 7 penetrates through the threaded sleeve 8 and is in threaded connection with the threaded sleeve 8, a linkage gear 9 is fixedly connected to the outer side of the threaded sleeve 8, a rotating sleeve 10 is rotatably connected to the outer side of the upper end of the ultrasonic cleaning box 1, an inner gear sleeve 11 is fixedly connected to the inner side wall of the rotating sleeve 10 and corresponds to the linkage gear 9, internal gear cover 11 is connected with the meshing of linkage gear 9, rotate the outer gear cover 14 of cover 10 outside fixedly connected with, ultrasonic cleaning case 1 outside upper end fixedly connected with servo motor 12, servo motor 12 output end fixedly connected with drive gear 13, drive gear 13 is connected with the meshing of outer gear cover 14, 7 lower extreme fixed connection of threaded rod on changeing the board and with 5 sliding connection of sideboard, 7 upper ends of threaded rod all pass end plate 2 and all with 2 sliding connection of end plate.
The drying mechanism 4 comprises a heating plate 41 and a bevel gear sleeve 42, the heating plate 41 is fixedly connected above the inner side wall of the ultrasonic cleaning box 1, the bevel gear sleeve 42 is fixedly connected at the lower end of the outer side of the edge, a driving motor 43 is fixedly connected in the side wall of the ultrasonic cleaning box 1 and corresponds to the bevel gear sleeve 42, the output end of the driving motor 43 is fixedly connected with a driving bevel gear 44, the driving bevel gear 44 is meshed with the bevel gear sleeve 42 for connection, the heating plate 41 is utilized for heating, and the output end of the driving motor 43 drives the driving bevel gear 44 to rotate, so that the edge plate 5 and the storage frame 3 synchronously rotate, and the semiconductor in the storage frame 3 can be rapidly dried.
The working principle is as follows: when in use, the whole device is firstly connected with an external power supply, then the servo motor 12 is started, the servo motor 12 drives the driving gear 13 to rotate, the rotating sleeve 10 can be rotated by the transmission of the outer gear sleeve 14, the thread sleeve 8 can be simultaneously rotated by the transmission of the inner gear sleeve 11 and the linkage gear 9, finally the lower end of the threaded rod 7 can pull the side plate 5 to move upwards, the bevel gear sleeve 42 can be meshed with the driving bevel gear 44 after the storage frame 3 is pulled out from the cleaning agent, finally the heating plate 41 is utilized, the output end of the driving motor 43 drives the driving bevel gear 44 to rotate, so that the side plate 5 and the storage frame 3 synchronously rotate, the semiconductor in the storage frame 3 can be quickly dried, and the trouble that the semiconductor can be dried after being taken out from the ultrasonic cleaning box 1 can be avoided, the practicality of the cleaning jig is improved.
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be considered to be within the technical scope of the present invention, and equivalent alternatives or modifications according to the technical solution of the present invention and the inventive concept thereof should be covered by the scope of the present invention.
Claims (5)
1. The utility model provides a multi-functional semiconductor cleaning jig, its characterized in that includes ultrasonic cleaning case (1) and deposits frame (3), end plate (2) of inner wall fixedly connected with in ultrasonic cleaning case (1) upper end, deposit frame (3) swing joint in ultrasonic cleaning case (1), deposit frame (3) upper end outside fixedly connected with sideboard (5), ultrasonic cleaning case (1) inside top is provided with stoving mechanism (4), sideboard (5) upper end central point puts and rotates and is connected with rotor plate (6), the even fixedly connected with a set of threaded rod (7) in rotor plate (6) upper end, end plate (2) upper end just is located threaded rod (7) outside and rotates and is connected with thread bush (8), threaded rod (7) upper end is passed thread bush (8) and is connected with thread bush (8) threaded connection.
2. The multifunctional semiconductor cleaning jig according to claim 1, wherein a linkage gear (9) is fixedly connected to the outer side of each threaded sleeve (8), a rotating sleeve (10) is rotatably connected to the outer side of the upper end of the ultrasonic cleaning box (1), an inner gear sleeve (11) is fixedly connected to the inner side wall of each rotating sleeve (10) and corresponds to the linkage gear (9), the inner gear sleeve (11) is meshed with the linkage gear (9), and an outer gear sleeve (14) is fixedly connected to the outer side of each rotating sleeve (10).
3. The multifunctional semiconductor cleaning jig according to claim 1, characterized in that a servo motor (12) is fixedly connected to the upper end of the outer side of the ultrasonic cleaning box (1), a driving gear (13) is fixedly connected to the output end of the servo motor (12), and the driving gear (13) is meshed with an outer gear sleeve (14).
4. The multifunctional semiconductor cleaning jig is characterized in that the drying mechanism (4) comprises a heating plate (41) and a bevel gear sleeve (42), the heating plate (41) is fixedly connected above the inner side wall of the ultrasonic cleaning box (1), the bevel gear sleeve (42) is fixedly connected at the lower end of the outer side of the edge, a driving motor (43) is fixedly connected in the side wall of the ultrasonic cleaning box (1) and corresponds to the bevel gear sleeve (42), a driving bevel gear (44) is fixedly connected at the output end of the driving motor (43), and the driving bevel gear (44) is meshed with the bevel gear sleeve (42).
5. The jig for cleaning semiconductors of claim 1, wherein the lower end of the threaded rod (7) is fixedly connected to the rotating plate and slidably connected to the side plate (5), and the upper end of the threaded rod (7) passes through the end plate (2) and slidably connected to the end plate (2).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123419580.2U CN216773191U (en) | 2021-12-31 | 2021-12-31 | Multifunctional semiconductor cleaning jig |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123419580.2U CN216773191U (en) | 2021-12-31 | 2021-12-31 | Multifunctional semiconductor cleaning jig |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216773191U true CN216773191U (en) | 2022-06-17 |
Family
ID=81971376
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202123419580.2U Expired - Fee Related CN216773191U (en) | 2021-12-31 | 2021-12-31 | Multifunctional semiconductor cleaning jig |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216773191U (en) |
-
2021
- 2021-12-31 CN CN202123419580.2U patent/CN216773191U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20220617 |