CN216752203U - PCB circuit board that heat dissipation degree of consistency is high - Google Patents
PCB circuit board that heat dissipation degree of consistency is high Download PDFInfo
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- CN216752203U CN216752203U CN202122788093.7U CN202122788093U CN216752203U CN 216752203 U CN216752203 U CN 216752203U CN 202122788093 U CN202122788093 U CN 202122788093U CN 216752203 U CN216752203 U CN 216752203U
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Abstract
The utility model discloses a PCB circuit board with high heat dissipation uniformity, which belongs to the technical field of circuit boards and comprises a circuit board body, wherein a plurality of grooves are formed in two ends of the circuit board body, a clamping iron is fixedly arranged on the circuit board body and on the inner side of each groove, a second heat dissipation assembly is arranged on one side of the circuit board body, first heat dissipation assemblies are arranged on two sides of each second heat dissipation assembly, a heat monitoring assembly is fixedly arranged between the two first heat dissipation assemblies and the second heat dissipation assembly, and the two first heat dissipation assemblies are respectively and fixedly connected with the clamping irons on two sides of the circuit board body. Through setting up first radiator unit, the heat conduction of circuit board body itself gives the card iron, and the card iron gives the heat conduction piece with the heat conduction through the heat conduction post, and the heat conduction of heat conduction piece gives the inboard coolant liquid in one-level heat conduction cabin for the card iron keeps lower self temperature, thereby makes the card iron can keep better radiating state for a long time.
Description
Technical Field
The utility model relates to the technical field of circuit boards, in particular to a PCB circuit board with high heat dissipation uniformity.
Background
The PCB is called a printed circuit board, also called a printed circuit board, is an important electronic component, is a support for electronic components, is a carrier for electrical interconnection of electronic components, and is called a "printed" circuit board because it is manufactured by electronic printing.
However, the existing circuit board still has certain problems, for example, when the circuit board is used, the circuit board is stably raised due to long-time work, the existing circuit board often leads out high heat of the circuit board through the heat conducting sheet, but when the circuit board is used for a long time, the temperature of the heat conducting sheet is also raised, and the heat dissipation performance of the circuit board is reduced.
Disclosure of Invention
Aiming at the defects in the prior art, the utility model aims to provide the PCB with high heat dissipation uniformity, which has the characteristic of being capable of controlling the temperature of a heat dissipation structure for a long time.
In order to achieve the purpose, the utility model provides the following technical scheme:
a PCB circuit board with high heat dissipation uniformity comprises a circuit board body, wherein a plurality of grooves are formed in two ends of the circuit board body, a clamping iron is fixedly mounted on the circuit board body and on the inner side of each groove, a second heat dissipation assembly is arranged on one side of the circuit board body, first heat dissipation assemblies are arranged on two sides of each second heat dissipation assembly, a heat monitoring assembly is fixedly mounted between each first heat dissipation assembly and each second heat dissipation assembly, the two first heat dissipation assemblies are respectively and fixedly connected with the clamping irons on two sides of the circuit board body, each first heat dissipation assembly comprises a primary heat conduction cabin and a plurality of heat conduction blocks, the plurality of heat conduction blocks are fixedly mounted on the inner bottom surface of the primary heat conduction cabin, heat conduction columns are fixedly mounted on the upper surfaces of the heat conduction blocks, the top ends of the heat conduction columns extend to the outer sides of the primary heat conduction cabins, and the bottom ends of the heat conduction columns are fixedly connected with the lower surfaces of the clamping irons, the heat conducting column, the heat conducting block and the clamping iron are all made of heat conducting metal.
Through adopting above-mentioned technical scheme, first radiator unit can reduce the temperature of card iron, heat conduction post and heat conduction piece for card iron, heat conduction post and heat conduction piece can be long-time carry out the heat conduction heat dissipation to the circuit board body, and second radiator unit and heat monitoring subassembly can reduce the temperature of one-level heat conduction cabin and the inside coolant liquid of second grade heat conduction cabin, thereby promote the radiating time of coolant liquid to heat conduction piece, heat conduction post and card iron.
Further, the second radiating assembly comprises a third-level heat conduction cabin and heat insulation columns, the heat insulation columns are fixedly installed on one side of the circuit board body, the third-level heat conduction cabin is fixedly installed at one end, far away from the circuit board body, of the heat insulation columns, and second connecting pipes are fixedly installed on two sides of the third-level heat conduction cabin.
By adopting the technical scheme, the heat-insulating column does not conduct heat, so that the cooling liquid on the inner side of the three-stage heat-conducting cabin can keep a lower temperature.
Further, the inner sides of the third-stage heat conduction cabin and the first-stage heat conduction cabin are loaded with cooling liquid.
Through adopting above-mentioned technical scheme, the coolant liquid mainly plays the radiating action to heat conduction post, heat conduction piece and card iron.
Further, the heat monitoring assembly comprises a second-stage heat conduction cabin, one end of the second connecting pipe, which is far away from the third-stage heat conduction cabin, is fixedly connected with one side of the second-stage heat conduction cabin, a first connecting pipe is fixedly mounted on one side of the second-stage heat conduction cabin, one end of the first connecting pipe, which is far away from the second-stage heat conduction cabin, is fixedly connected with the first-stage heat conduction cabin, an extension pipe is fixedly mounted on the inner side of the first-stage heat conduction cabin and at a position corresponding to the second-stage heat conduction cabin, springs are fixedly mounted at both ends of the inner side of the first-stage heat conduction cabin, pulling rods are fixedly mounted at one ends, which are close to each other, of the two pulling rods, an isolation sheet is fixedly mounted between the two pulling rods, limiting rods are fixedly mounted on the inner side of the second-stage heat conduction cabin and at both sides of the extension pipe, sliding grooves are arranged on one side, which is close to each other, and at a position corresponding to an opening of the extension pipe, the isolating sheet is movably clamped between the two sliding grooves.
By adopting the technical scheme, one end of the spring with the large thermal expansion coefficient moves towards the spring with the small thermal expansion coefficient, so that the positions of the isolation sheet and the extension pipe are staggered, the cooling liquid with large heat quantity in the first-stage heat conduction cabin and the second-stage heat conduction cabin can enter the inner side of the third-stage heat conduction cabin through the second connecting pipe, the cooling liquid with low temperature in the third-stage heat conduction cabin can enter the inner sides of the second-stage heat conduction cabin and the first-stage heat conduction cabin through the second connecting pipe, and the temperature of the cooling liquid is reduced.
Further, the two springs in the same thermal monitoring assembly are made of two metal materials with different thermal expansion coefficients.
By adopting the technical scheme, the two springs have different thermal expansion coefficients, so that one end of the spring with the large thermal expansion coefficient moves towards the spring with the small thermal expansion coefficient.
In conclusion, the utility model has the following beneficial effects:
1. through setting up first radiator unit, the heat conduction of circuit board body itself gives the card iron, and the card iron gives the heat conduction piece with the heat conduction through the heat conduction post, and the heat conduction of heat conduction piece gives the inboard coolant liquid in one-level heat conduction cabin for the card iron keeps lower self temperature, thereby makes the card iron can keep better radiating state for a long time.
2. Through setting up second radiator unit and heat monitoring subassembly, the coolant temperature of second grade heat conduction cabin inboard risees, can give two springs with the heat conduction, the thermal expansion coefficient of two springs is different, make the one end of the big spring of thermal expansion coefficient to the little spring direction of thermal expansion coefficient remove, thereby make the position of isolated piece and extension tube stagger, make the great coolant liquid of one-level heat conduction cabin and second grade heat conduction cabin inboard heat capacity can enter into the inboard of tertiary heat conduction cabin through the second connecting pipe, the lower coolant liquid of tertiary heat conduction cabin inboard temperature can enter into the inboard of second grade heat conduction cabin and one-level heat conduction cabin through the second connecting pipe, thereby reduce the temperature of coolant liquid, make the coolant liquid can be to the heat conduction piece, heat conduction post and card iron continue to cool down, reach the effect that promotes heat dispersion.
Drawings
FIG. 1 is a schematic view of the overall structure of the present invention;
FIG. 2 is a cross-sectional view of the overall construction of the present invention;
FIG. 3 is a cross-sectional view of a thermal monitoring assembly according to the present invention;
FIG. 4 is an enlarged view of the utility model at A in FIG. 2.
In the figure:
1. a circuit board body; 2. a clamp; 3. a heat-conducting column; 4. a heat conducting block; 5. a first-stage heat conduction cabin; 6. a secondary heat conduction cabin; 7. a first communication pipe; 8. a second connecting pipe; 9. a third-stage heat conduction cabin; 10. a heat-insulating column; 11. pulling a rod; 12. an insulating sheet; 13. an extension pipe; 14. a limiting rod; 15. a spring.
Detailed Description
Example (b):
the utility model is described in further detail below with reference to figures 1-4.
Referring to fig. 1-4, the present invention provides a technical solution: a PCB circuit board with high heat dissipation uniformity is disclosed, as shown in figures 1-4, comprising a circuit board body 1, wherein a plurality of grooves are arranged at both ends of the circuit board body 1, a clamping iron 2 is fixedly arranged on the circuit board body 1 and at the inner side of each groove, a second heat dissipation assembly is arranged at one side of the circuit board body 1, first heat dissipation assemblies are arranged at both sides of the second heat dissipation assembly, a heat monitoring assembly is fixedly arranged between the two first heat dissipation assemblies and the second heat dissipation assembly, the two first heat dissipation assemblies are respectively and fixedly connected with the clamping irons 2 at both sides of the circuit board body 1, each first heat dissipation assembly comprises a primary heat conduction cabin 5 and a plurality of heat conduction blocks 4, the plurality of heat conduction blocks 4 are fixedly arranged at the inner bottom surface of the primary heat conduction cabin 5, heat conduction columns 3 are fixedly arranged on the upper surfaces of the heat conduction blocks 4, the top ends of the heat conduction columns 3 extend to the outer side of the primary heat conduction cabin 5, bottom and the lower fixed surface of card iron 2 of heat conduction post 3 are connected, heat conduction post 3, heat conduction block 4 and card iron 2 are made by heat conduction metal, the second radiator unit includes tertiary heat conduction cabin 9 and adiabatic post 10, adiabatic post 10 fixed mounting is in one side of circuit board body 1, there is not tertiary heat conduction cabin 9 fixed mounting in the one end that circuit board body 1 was kept away from to adiabatic post 10, the equal fixed mounting in both sides of tertiary heat conduction cabin 9 has second connecting pipe 8, the inboard of tertiary heat conduction cabin 9 and one-level heat conduction cabin 5 all loads the coolant liquid.
In this embodiment, circuit board body 1 during operation itself can produce higher heat, and the heat conduction of circuit board body 1 itself gives the gib 2, and the gib 2 gives the heat conduction with the heat conduction through heat conduction post 3 for heat conduction 4, and the heat conduction of heat conduction 4 gives the coolant liquid of one-level heat conduction cabin 5 inboards for the gib 2 keeps lower self temperature.
As shown in fig. 1-4, the heat monitoring assembly includes a second-stage heat conduction compartment 6, one end of a second connection pipe 8 far from a third-stage heat conduction compartment 9 is fixedly connected with one side of the second-stage heat conduction compartment 6, one side of the second-stage heat conduction compartment 6 far from the second connection pipe 8 is fixedly provided with a first connection pipe 7, one end of the first connection pipe 7 far from the second-stage heat conduction compartment 6 is fixedly connected with a first-stage heat conduction compartment 5, the inner side of the first-stage heat conduction compartment 5 is fixedly provided with an extension pipe 13 at a corresponding position of the second-stage heat conduction compartment 6, both ends of the inner side of the first-stage heat conduction compartment 5 are fixedly provided with springs 15, one ends of the two springs 15 close to each other are fixedly provided with pulling rods 11, an isolation sheet 12 is fixedly provided between the two pulling rods 11, both sides of the inner side of the second-stage heat conduction compartment 6 and the extension pipe 13 are fixedly provided with limit rods 14, one side of the two limit rods 14 close to each other and a sliding groove is provided at a corresponding position of an opening of the extension pipe 13, the isolating sheet 12 is movably clamped between the two chutes, and the two springs 15 in the same heat monitoring assembly are made of two metal materials with different thermal expansion coefficients.
In this embodiment, in the continuous heat dissipation process, the temperature of the cooling liquid inside the first-level heat conduction compartment 5 and the second-level heat conduction compartment 6 rises, the temperature of the cooling liquid inside the second-level heat conduction compartment 6 rises, the heat can be conducted to the two springs 15, the thermal expansion coefficients of the two springs 15 are different, one end of the spring 15 with a large thermal expansion coefficient moves towards the spring 15 with a small thermal expansion coefficient, so that the positions of the isolation sheet 12 and the extension pipe 13 are staggered, the cooling liquid with a large heat inside the first-level heat conduction compartment 5 and the second-level heat conduction compartment 6 can enter the inside of the third-level heat conduction compartment 9 through the second connecting pipe 8, the cooling liquid with a low temperature inside the third-level heat conduction compartment 9 can enter the inside of the second-level heat conduction compartment 6 and the first-level heat conduction compartment 5 through the second connecting pipe 8, and the temperature of the cooling liquid is reduced.
The working principle is as follows: when the circuit board heat dissipation device is used, the heat of the circuit board body 1 is conducted to the clamping iron 2, the clamping iron 2 conducts the heat to the heat conduction block 4 through the heat conduction column 3, the heat of the heat conduction block 4 is conducted to the cooling liquid on the inner side of the first-stage heat conduction cabin 5, the clamping iron 2 is kept at a lower temperature, and therefore the clamping iron 2 can be kept in a better heat dissipation state for a long time.
In the process of heat dissipation, the temperature of the cooling liquid inside the first-stage heat conduction cabin 5 and the second-stage heat conduction cabin 6 rises, the temperature of the cooling liquid inside the second-stage heat conduction cabin 6 rises, heat is conducted to the two springs 15, the thermal expansion coefficients of the two springs 15 are different, so that one end of the spring 15 having a large thermal expansion coefficient is moved toward the spring 15 having a small thermal expansion coefficient, thereby the positions of the isolation sheets 12 and the extension pipes 13 are staggered, so that the cooling liquid with larger heat inside the first-stage heat conduction cabin 5 and the second-stage heat conduction cabin 6 can enter the inner side of the third-stage heat conduction cabin 9 through the second connecting pipe 8, the cooling liquid with lower temperature inside the third-stage heat conduction cabin 9 can enter the inner sides of the second-stage heat conduction cabin 6 and the first-stage heat conduction cabin 5 through the second connecting pipe 8, thereby reduce the temperature of coolant liquid for the coolant liquid can be carried out continuously the cooling to heat conduction piece 4, heat conduction post 3 and card iron 2.
The present embodiment is only for explaining the present invention, and it is not limited to the present invention, and those skilled in the art can make modifications of the present embodiment without inventive contribution as needed after reading the present specification, but all of them are protected by patent law within the scope of the claims of the present invention.
Claims (6)
1. The utility model provides a PCB circuit board that heat dissipation degree of consistency is high, includes circuit board body (1), its characterized in that: a plurality of recess has all been seted up at the both ends of circuit board body (1), on circuit board body (1) and in the equal fixed mounting in the inboard of every recess have a gib (2), one side of circuit board body (1) is provided with the second radiator unit, the both sides of second radiator unit all are provided with first radiator unit, two equal fixed mounting has a heat monitoring subassembly, two between first radiator unit and the second radiator unit first radiator unit respectively with the gib (2) fixed connection of circuit board body (1) both sides.
2. The PCB with high heat dissipation uniformity as recited in claim 1, wherein: first radiator unit includes one-level heat conduction cabin (5) and a plurality of heat conduction piece (4), a plurality of heat conduction piece (4) fixed mounting is in the inboard bottom surface of one-level heat conduction cabin (5), the last fixed surface of heat conduction piece (4) installs heat conduction post (3), the top of heat conduction post (3) extends to the outside of one-level heat conduction cabin (5), the bottom of heat conduction post (3) and the lower fixed surface of clamp (2) are connected, heat conduction post (3), heat conduction piece (4) and clamp (2) are made by heat conduction metal.
3. The PCB with high heat dissipation uniformity as recited in claim 1, wherein: the second radiating assembly comprises a three-stage heat conduction cabin (9) and heat insulation columns (10), the heat insulation columns (10) are fixedly installed on one side of the circuit board body (1), the three-stage heat conduction cabin (9) is fixedly installed at one end, far away from the circuit board body (1), of the heat insulation columns (10), and second connecting pipes (8) are fixedly installed on two sides of the three-stage heat conduction cabin (9).
4. The PCB with high heat dissipation uniformity as recited in claim 3, wherein: and cooling liquid is loaded on the inner sides of the third-stage heat conduction cabin (9) and the first-stage heat conduction cabin (5).
5. The PCB with high heat dissipation uniformity as recited in claim 3, wherein: the heat monitoring subassembly includes second grade heat conduction cabin (6), one end of tertiary heat conduction cabin (9) and one side fixed connection of second grade heat conduction cabin (6) are kept away from in second connecting pipe (8), one side fixed mounting that second connecting pipe (8) were kept away from in second grade heat conduction cabin (6) has first communicating pipe (7), the one end and one-level heat conduction cabin (5) fixed connection of second grade heat conduction cabin (6) are kept away from in first communicating pipe (7), the inboard of one-level heat conduction cabin (5) and in the corresponding position fixed mounting of second grade heat conduction cabin (6) have extension pipe (13), the inboard both ends of one-level heat conduction cabin (5) equal fixed mounting of spring (15), two the equal fixed mounting of one end that spring (15) are close to each other has pull rod (11), two fixed mounting has isolated piece (12) between pull rod (11), inboard of second grade heat conduction cabin (6) and in the both sides of extension pipe (13) equal fixed mounting have gag lever (14) all ) And two sides, one side of the limiting rod (14) which is close to each other is provided with a sliding groove at the corresponding position of the opening of the extension pipe (13), and the isolation sheet (12) is movably clamped between the two sliding grooves.
6. The PCB circuit board with high heat dissipation uniformity of claim 5, wherein: the two springs (15) in the same thermal monitoring assembly are made of two metal materials with different thermal expansion coefficients.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122788093.7U CN216752203U (en) | 2021-11-15 | 2021-11-15 | PCB circuit board that heat dissipation degree of consistency is high |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122788093.7U CN216752203U (en) | 2021-11-15 | 2021-11-15 | PCB circuit board that heat dissipation degree of consistency is high |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216752203U true CN216752203U (en) | 2022-06-14 |
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ID=81924029
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122788093.7U Active CN216752203U (en) | 2021-11-15 | 2021-11-15 | PCB circuit board that heat dissipation degree of consistency is high |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216752203U (en) |
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2021
- 2021-11-15 CN CN202122788093.7U patent/CN216752203U/en active Active
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