CN216749827U - Glass-sealed surface-mounted diode sintering gravity device - Google Patents
Glass-sealed surface-mounted diode sintering gravity device Download PDFInfo
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- CN216749827U CN216749827U CN202220169297.4U CN202220169297U CN216749827U CN 216749827 U CN216749827 U CN 216749827U CN 202220169297 U CN202220169297 U CN 202220169297U CN 216749827 U CN216749827 U CN 216749827U
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Abstract
The utility model discloses a glass-sealed surface-mounted diode sintering gravity device, which comprises a gravity rod, a protection support plate, a positioning bolt, a nut, an upper guide plate and a lower guide plate, wherein the gravity rod is a coaxial reducing metal rod, the diameter of the end part of the gravity rod contacting with a diode pin is smaller than that of the other end of the gravity rod, the protection support plate, the upper guide plate and the lower guide plate are sequentially arranged in sequence from top to bottom and are connected together through the positioning bolt and the nut, a plurality of guide holes with the same quantity and arrangement mode as those of sintering mold holes are formed in the upper guide plate and the lower guide plate, and the end part of the gravity rod contacting with the diode pin penetrates through the guide holes of the upper guide plate and the lower guide plate and is then pressed on a semiconductor lead wire; the other end of the gravity rod is positioned below the protective supporting plate. The utility model can solve the problem of poor compression joint of the pins and the chip in the sintering process of the glass-sealed surface-mounted diode and improve the production yield and the application reliability of the glass-sealed surface-mounted diode.
Description
Technical Field
The utility model relates to the field of semiconductor sintering, in particular to a glass-sealed surface-mounted diode sintering gravity device.
Background
The glass-sealed surface-mounted diode consists of two pins, a glass shell and a chip, and the production process comprises the following steps:
1. assembling the glass-sealed surface-mounted diode assembly into a diode, and filling the diode into a graphite mold;
2. placing the graphite mold provided with the glass sealing surface-mounted diode to be sintered into a sintering furnace for sintering;
3. electroplating;
4. testing and packaging;
in the sintering process of the glass-sealed surface-mounted diode, the glass shell is heated and softened firstly, then is cooled and solidified, and the two pins and the chip are fastened together through the high-temperature deformation of the glass shell. There is no soft material between the pin of the glass-sealed surface-mounted diode and the chip, and the contact mode is compression joint. At present, the glass-sealed surface-mounted diode is mainly sintered by the following two ways:
1. chain type sintering furnace
The chain type sintering furnace drives the graphite die provided with the glass sealed surface-mounted diode to be sintered to continuously pass through the preheating, heating, cooling and solidifying areas through a special chain to complete the sintering process. During the operation of the chain type sintering furnace, vibration is inevitably generated, the pin of the glass sealing surface-mounted diode is small in size and light in weight, the pin can jump up and down by the aid of the vibration in the curing process and the gravity of the pin, fastening quality of the glass shell and the pin and crimping quality of the pin and a chip are affected, acid feeding degree of a subsequent electroplating process is increased, yield of a test packaging process is reduced, and reliability of electric property in application is reduced.
2. Vacuum sintering furnace
The vacuum sintering furnace is characterized in that a certain amount of graphite molds filled with glass-sealed surface-mounted diodes to be sintered are loaded into a sintering boat, then the sintering boat is pushed into a sintering working chamber, and the processes of heating, cooling, solidifying and sintering are completed in the sintering working chamber. The temperature rise process of the vacuum sintering furnace is in a vacuum state, and high-pressure protective gas is filled in the temperature reduction and solidification process to increase the combination fastening force of the glass shell and the pins. The softened glass shell can be filled into a gap between the two pins when being in close contact with the pins under the action of high-pressure gas, and the pins inevitably move upwards only by the gravity of the pins, so that the crimping quality of the pins and a chip is affected, the yield of a test packaging process is reduced, and the reliability of the electrical property in application is reduced.
At present, the contact quality of pins and chips cannot be ensured in the sintering process of glass-sealed surface-mounted diodes without adding a gravity device, so that the production yield and the reliability in application are reduced. The existing glass-sealed surface-mounted diode sintering gravity device has the defects of uneven structure, poor adaptability, inconvenient operation, easy damage and low labor efficiency, and can not solve the problem in the sintering process of the glass-sealed surface-mounted diode.
Disclosure of Invention
The utility model provides a sintering gravity device for a glass-sealed surface-mounted diode, which aims to solve the problem of poor compression joint of pins and chips in the sintering process of the glass-sealed surface-mounted diode and improve the production yield and the application reliability of the glass-sealed surface-mounted diode.
In order to solve the technical problem, the technical scheme adopted by the utility model is as follows: a glass-sealed surface-mounted diode sintering gravity device comprises a gravity rod, a protective support plate, a positioning bolt, a nut, an upper guide plate and a lower guide plate, wherein the gravity rod is a coaxial reducing metal rod, the diameter of the end part of the gravity rod contacting with a diode pin is smaller than that of the other end of the gravity rod, the protective support plate, the upper guide plate and the lower guide plate are sequentially arranged from top to bottom and are connected together through the positioning bolt and the nut, a plurality of guide holes with the same quantity and arrangement mode as those of sintering mold holes are formed in the upper guide plate and the lower guide plate, and the end part of the gravity rod contacting with the diode pin penetrates through the guide holes of the upper guide plate and the lower guide plate and then is pressed on a semiconductor lead wire; the other end of the gravity rod is positioned below the protective supporting plate.
Furthermore, the protection backup pad is several protruding style of calligraphy boards in both sides parallel and level, centre, and the location bolt and the nut are installed to the both sides of protection backup pad, and the centre protruding position of protection backup pad is in the top of gravity stick and reserves certain distance with the top of gravity stick.
Furthermore, one end of a positioning bolt is a positioning pin, the other end of the positioning bolt is a bolt, a section of cylinder is arranged between the positioning pin and the bolt, the bolt sequentially penetrates through the lower guide plate, the upper guide plate and the protection support plate and then is fastened by a nut in the protection support plate, the cylinder and the positioning pin are located below the lower guide plate, the positioning pin is matched with a positioning hole of a sintering mold, and the diameter of the cylinder is larger than that of the positioning hole of the sintering mold.
Further, the height of the cylinder is less than the length of the gravity bar leaking out of the lower guide plate.
Furthermore, a part of the positioning bolt between the upper guide plate and the lower guide plate is sleeved with a height limiting sleeve.
Furthermore, a guide hole on the upper guide plate is matched with the large-diameter end part of the gravity rod; the diameter of the guide hole on the lower guide plate is matched with the small-diameter end part of the gravity rod.
The utility model has the beneficial effects that: the glass-sealed surface-mounted diode sintering gravity device is arranged on a sintering die, a positioning bolt is matched with a positioning hole of the sintering die, a gravity rod is matched with a hole of the sintering die, the gravity rod naturally rises, the gravity of the gravity rod vertically presses on a pin of a glass-sealed surface-mounted diode to be sintered, the gravity is stable and unchanged in the sintering process, and the device is taken down for recycling after the sintering process is finished.
The glass-sealed surface-mounted diode sintering gravity device is reasonable in design, simple in structure, capable of being recycled, safe and reliable in operation and high in practicability.
Drawings
FIG. 1 is a schematic front view of the present invention;
FIG. 2 is a left side view of the present invention;
FIG. 3 is a schematic top view of the present invention;
FIG. 4 is a schematic view of a structure of a glass-sealed surface-mounted diode;
fig. 5 is a schematic structural view of a gravity bar;
FIG. 6 is a schematic structural view of a positioning bolt;
FIG. 7 is a schematic cross-sectional view of a sintering die;
FIG. 8 is a schematic view of a sintering mold;
in the figure: 1. the gravity rod comprises a gravity rod body 2, a protective supporting plate 3, a positioning bolt body 4, a nut 5, an upper guide plate 6, a height limiting sleeve 7, a lower guide plate 8, a glass sealed surface-mounted diode 9, a sintering mold 10, a sintering mold positioning hole 11, a sintering mold hole 12, a bolt 13, a positioning pin 14 and a cylinder.
Detailed Description
The utility model is further described with reference to the following figures and specific embodiments.
Example 1
The utility model discloses a glass-sealed surface-mounted diode sintering gravity device which comprises a gravity rod 1, a protective supporting plate 2, a positioning bolt 3, a nut 4, an upper guide plate 5 and a lower guide plate 7 as shown in figures 1, 2 and 3.
As shown in fig. 5, the gravity bar 1 is a coaxial reducing metal bar, and the diameter of the end of the gravity bar 1 contacting the diode pin is smaller than that of the other end. The gravity bar 1 provides the required gravity for sintering the glass-sealed surface-mounted diode.
The protective supporting plate 2, the upper guide plate 5 and the lower guide plate 7 are sequentially arranged from top to bottom and are connected together through a positioning bolt 3 and a nut 4, a plurality of guide holes with the same number and arrangement mode as the sintering die holes 11 are formed in the upper guide plate 5 and the lower guide plate 7, and the end part of the gravity rod 1 contacting with the diode pin penetrates through the guide holes of the upper guide plate 5 and the lower guide plate 7 and then is pressed on a semiconductor lead wire; the other end of the gravity bar 1 is located below the protective support plate 2.
In this embodiment, the protection support plate 2 is a few-shaped plate with parallel and level sides and a convex middle, the positioning bolt 3 and the nut 4 are installed on two sides of the protection support plate 2, and the convex middle of the protection support plate 2 is located above the gravity rod 1 and is reserved with a certain distance from the top end of the gravity rod 1. When the protective supporting plate 2 provides an upward moving space for the gravity rod 1, the gravity rod 1 can be prevented from falling off from the guide plate, foreign matters can be prevented from falling into the area of the upper guide plate 5, and the integrity and the flexibility of up-and-down movement of the gravity rod 1 are protected. The protective supporting plate 2 can also provide powerful strength support for the upper and lower guide plates which are made of porous graphite and easy to break and damage, and the overall strength is increased.
As shown in fig. 6, one end of the positioning bolt 3 is a positioning pin 13, the other end is a bolt 12, a section of cylinder 14 is arranged between the positioning pin 13 and the bolt 12, the bolt 12 partially penetrates through the lower guide plate 7, the upper guide plate 5 and the protective support plate 2 in sequence and then is fastened on the protective support plate 2 by the nut 4, the cylinder 14 and the positioning pin 13 are located below the lower guide plate 7, the positioning pin 13 is matched with the positioning hole 10 of the sintering mold, and the diameter of the cylinder 14 is larger than that of the positioning hole 10 of the sintering mold. The height of the cylindrical body 14 is less than the length of the gravity bar 1 that leaks out of the lower guide plate 7.
The locating pin 13 and the cooperation of sintering mould locating hole 10 of 3 one ends of positioning bolt play the guiding orientation effect in the sintering process, and one end bolt 12 and the cooperation of nut 4 will protect backup pad 2, go up deflector 5, limit for height cover 6, lower deflector 7 and be connected fixedly, and the cylinder 24 diameter of coupling part is greater than locating pin 13 diameter, plays limiting displacement, highly is less than the length that the deflector was leaked down to gravity stick 2.
The part of the positioning bolt 3 between the upper guide plate 5 and the lower guide plate 7 is sleeved with a height limiting sleeve 6. The inner diameter of the height-limiting sleeve 6 is larger than the outer diameter of the positioning bolt 3, and the height of the height-limiting sleeve is slightly smaller than the difference between the length of the large-diameter section of the gravity rod 1 and the thickness of the upper guide plate 5. The height-limiting sleeve 6 serves to limit the distance between the upper and lower guide plates.
In the embodiment, the guide hole on the upper guide plate 5 is matched with the large-diameter end part of the gravity rod 1; the diameter of the guide hole on the lower guide plate 7 is matched with the small-diameter end part of the gravity bar 1.
The assembly sequence of the sintering gravity device in this embodiment is as follows:
1. the positioning bolt 3 penetrates into the positioning hole of the lower guide plate 7;
2. sleeving the height-limiting sleeve 6 into the positioning bolt 3;
3. the positioning hole of the upper guide plate 5 is penetrated into the positioning bolt 3, and the upper guide plate 5 is stably arranged on the height limiting sleeve 6;
4. the small-diameter end of the gravity rod 1 is downwards penetrated into the guide holes of the upper guide plate 5 and the lower guide plate 7 in sequence;
5. penetrating the positioning hole of the protective supporting plate 2 into the positioning bolt 3;
6. and (5) screwing the nut 4 and the positioning bolt 3, and finishing the assembly.
The process of applying the glass-sealed surface-mounted diode sintering gravity device to sintering of a chain type sintering furnace comprises the following steps:
1. the glass to be sintered shown in figure 4 is sealed and pasted with a diode 8, and is filled into a sintering mould 9 shown in figures 7 and 8;
2. lightly placing the glass-sealed surface-mounted diode sintering gravity device on a sintering mold 9, and vertically pressing the gravity of a gravity rod 1 on pins of glass-sealed surface-mounted diodes 8;
3. placing the combined sintering mold on a chain of a chain type sintering furnace, driving the chain, and enabling the glass-sealed surface-mounted diode 8 to be under the pressure of a gravity rod 1, wherein the vibration caused by the chain driving can not cause the pin of the glass-sealed surface-mounted diode to jump, the pin is well in compression joint with a chip, and the pin is well fastened with a glass shell, so that the sintering process is completed;
4. the glass-sealed surface-mounted diode sintering gravity device is separated from the sintering mold, and the glass-sealed surface-mounted diode sintering gravity device is recycled.
The process of applying the glass-sealed surface-mounted diode sintering gravity device to sintering of a vacuum sintering furnace comprises the following steps:
1. filling the glass to be sintered shown in FIG. 4 with a surface-mounted diode 8 into the sintering mold 9 shown in FIGS. 7 and 8;
2. the glass-sealed surface-mounted diode sintering gravity device shown in the figure 1 is lightly placed on a sintering mold 9 shown in the figure 8, and the gravity of a gravity rod 1 is vertically pressed on pins of the glass-sealed surface-mounted diode;
3. the combined sintering dies are sequentially placed into a sintering boat according to the specified quantity, the sintering boat is pushed into a sintering working chamber, the glass-sealed surface-mounted diode 8 does not cause the pin of the glass-sealed surface-mounted diode to move in the filling process of the glass shell softened at high temperature under the pressure of the gravity rod 1 and under the action of high-pressure protective gas, the pin and the chip are well pressed and well fastened, and the sintering process is completed;
4. the glass-sealed surface-mounted diode sintering gravity device is separated from the sintering mold, and the glass-sealed surface-mounted diode sintering gravity device is recycled.
The glass-sealed surface-mounted diode sintering gravity device is suitable for the current general glass-sealed surface-mounted diode sintering mode, and the glass-sealed surface-mounted diode sintered by the glass-sealed surface-mounted diode sintering gravity device has no acid feeding in electroplating, the yield is improved by more than 5 percent, and no quality feedback exists in customers.
The glass-sealed surface-mounted diode sintering gravity device has the advantages that in the cyclic use process, the protective supporting plate 2 is arranged, the gravity rod 1 does not fall off, the movement flexibility and the gravity value stabilization are always kept, the guide plate is not easy to damage, and the whole device is firm and durable.
The foregoing description is only for the basic principle and the preferred embodiments of the present invention, and modifications and substitutions by those skilled in the art are included in the scope of the present invention.
Claims (6)
1. The utility model provides a glass seals table and pastes diode sintering gravity device which characterized in that: the gravity rod is a coaxial reducing metal rod, the diameter of the end part of the gravity rod contacting with a diode pin is smaller than that of the other end of the gravity rod, the protection support plate, the upper guide plate and the lower guide plate are sequentially arranged from top to bottom and are connected together through the positioning bolt and the nut, a plurality of guide holes with the same number and arrangement mode as sintering mold holes are formed in the upper guide plate and the lower guide plate, and the end part of the gravity rod contacting with the diode pin penetrates through the guide holes of the upper guide plate and the lower guide plate and then is pressed on a semiconductor lead wire; the other end of the gravity rod is positioned below the protective supporting plate.
2. The glass-sealed surface-mounted diode sintering gravity device according to claim 1, characterized in that: the protection backup pad is several word shaped plates of both sides parallel and level, middle bellied, and positioning bolt and nut are installed to the both sides of protection backup pad, and the middle bellied position of protection backup pad is in the top of gravity stick and reserves certain distance with the top of gravity stick.
3. The glass-sealed surface-mounted diode sintering gravity device according to claim 1, characterized in that: the positioning bolt is characterized in that one end of the positioning bolt is a positioning pin, the other end of the positioning bolt is a bolt, a section of cylinder is arranged between the positioning pin and the bolt, the bolt part sequentially penetrates through the lower guide plate, the upper guide plate and the protection support plate and then is fastened by a nut in the protection support plate, the cylinder and the positioning pin are located below the lower guide plate, the positioning pin is matched with the positioning hole of the sintering mold, and the diameter of the cylinder is larger than that of the positioning hole of the sintering mold.
4. The glass-sealed surface-mounted diode sintering gravity device according to claim 3, characterized in that: the height of the cylinder is less than the length of the gravity rod exposed out of the lower guide plate.
5. The glass-sealed surface-mounted diode sintering gravity device according to claim 1, characterized in that: the part of the positioning bolt between the upper guide plate and the lower guide plate is sleeved with a height limiting sleeve.
6. The glass-sealed surface-mounted diode sintering gravity device according to claim 1, characterized in that: the upper guide hole of the upper guide plate is matched with the large-diameter end part of the gravity rod; the diameter of the guide hole on the lower guide plate is matched with the small-diameter end part of the gravity rod.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220169297.4U CN216749827U (en) | 2022-01-21 | 2022-01-21 | Glass-sealed surface-mounted diode sintering gravity device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220169297.4U CN216749827U (en) | 2022-01-21 | 2022-01-21 | Glass-sealed surface-mounted diode sintering gravity device |
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| Publication Number | Publication Date |
|---|---|
| CN216749827U true CN216749827U (en) | 2022-06-14 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202220169297.4U Active CN216749827U (en) | 2022-01-21 | 2022-01-21 | Glass-sealed surface-mounted diode sintering gravity device |
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|---|---|
| CN (1) | CN216749827U (en) |
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- 2022-01-21 CN CN202220169297.4U patent/CN216749827U/en active Active
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