CN216738523U - Reaction chamber and chemical vapor deposition equipment - Google Patents

Abstract

The application provides a reaction chamber and chemical vapor deposition equipment, and relates to the field of semiconductor production equipment. The reaction chamber comprises a top cover, a base and a fixed baffle, wherein a groove is formed in the base, a corresponding convex block is arranged on the fixed baffle, the groove is matched with the convex block to enable the fixed baffle to be fixedly connected with the base, the fixed baffle is used for shielding the surface of the base, and the length and the width of the convex block are both larger than the depth of the groove, which is inserted into the convex block. The chemical vapor deposition equipment comprises the reaction chamber. When the lug is inserted into the groove or taken out of the groove, the lug is not easy to break off; the lug is not easy to break when the lug is subjected to thermal expansion and cold contraction, so that the baffle is prevented from accidentally sliding; the lug is easy to align when inserted into the groove, and the fixed baffle is convenient to install in the reaction chamber.

Description

Reaction chamber and chemical vapor deposition equipment

Technical Field

The application relates to the field of semiconductor production equipment, in particular to a reaction chamber and chemical vapor deposition equipment.

Background

CVD (Chemical vapor deposition) refers to a method in which Chemical gas or vapor reacts on the surface of a substrate to synthesize a coating or a nano-material, and is the most widely used technique for depositing various materials in the semiconductor industry. When the gas is deposited, the deposited coating can be attached to the cavity of the reaction chamber, so that the cavity of the reaction chamber is polluted, and the subsequent production is influenced. Because the reaction chamber is difficult to clean, the prior art usually arranges a baffle plate on the cavity of the reaction chamber so as to shield the cavity of the reaction chamber.

In the prior art, a pin is usually arranged on a baffle plate, a corresponding pin hole is arranged on a reaction chamber, and the pin is matched with the pin hole to prevent the stop plate from sliding. In the practical use process, the pin structure is fixedly connected with the defects in the following aspects, 1, the pin is easy to break in the cleaning process due to mistaken collision or the growth of a deposited coating on the pin, the reuse rate of the baffle is low, the baffle needs to be frequently replaced, and the use cost is increased. 2. The pin can lead to the fracture because of expend with heat and contract with cold in the reaction chamber, and the unable fixed stop that continues of pin after the fracture can make the baffle take place to slide under a large amount of reaction gas's effect, and the baffle exists the risk of bumping with the processing work piece in the slip process, leads to the technological data of work piece can't reach the requirement, and the yields of work piece descends. 3. The pin and the pin hole are not easy to align, so that the baffle is inconvenient to install on the cavity of the reaction chamber.

SUMMERY OF THE UTILITY MODEL

In order to overcome the defects in the prior art, the application provides a reaction chamber and chemical vapor deposition equipment.

The application provides the following technical scheme:

the utility model provides a reaction chamber, the reaction chamber includes top cap, base and fixed stop, be equipped with the recess on the base, the last lug that is equipped with of fixed stop corresponds, the recess with the lug cooperation makes fixed stop with base fixed connection, fixed stop is used for sheltering from the surface of base, the length and the width of lug all are greater than the lug inserts the degree of depth of recess.

In a possible implementation manner, a bearing device is arranged on the base, a matching portion is arranged on the fixed baffle, and the shape of the matching portion is matched with that of the bearing device, so that the fixed baffle shields an area of the base except for the coverage area of the bearing device.

In a possible embodiment, the base is provided with at least two fixing baffles, and the engaging portions of the at least two fixing baffles engage with the carrying device to enclose the carrying device in an area surrounded by the at least two engaging portions.

In a possible embodiment, two of the protrusions are provided on the fixed baffle.

In a possible embodiment, two of the projections are symmetrically arranged on the fixed stop.

In a possible embodiment, the length direction of the two projections is parallel to the length direction of the fixed baffle.

In one possible embodiment, the length of the projection is seventy-five percent of the length of the fixed stop.

In a possible embodiment, the length direction of the two projections is parallel to the width direction of the fixed baffle.

In one possible embodiment, the length of the projection is fifty percent of the width of the retainer tab.

In a second aspect, the present application also provides a chemical vapor deposition apparatus comprising the reaction chamber described above.

Compared with the prior art, the beneficial effects of the application are that:

the reaction chamber that this embodiment provided, through set up in the reaction chamber fixed stop, fixed stop is last the lug with on the reaction chamber inner wall the recess cooperation makes fixed stop is fixed in on the inner wall of reaction chamber. Compare in pin and pin hole fixed connection's mode, this application the length and the width of lug all are greater than the lug inserts the degree of depth of recess makes the lug is inserting in the recess or follow when taking out in the recess, the difficult rupture of lug makes retaining plate's rate of reuse is high, has effectively saved manufacturing cost. The bump is not easy to break when being subjected to expansion with heat and contraction with cold, the baffle is prevented from accidentally sliding, the safety of the workpiece in the production process is effectively improved, and the yield of the workpiece is improved. The lug is easy to align when inserted into the groove, and the fixed baffle is convenient to install in the reaction chamber.

In order to make the aforementioned objects, features and advantages of the present application more apparent and understandable, preferred embodiments are described below in detail with reference to the accompanying drawings.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are required to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.

FIG. 1 shows a top view of a reaction chamber according to an embodiment of the present disclosure;

FIG. 2 illustrates a front view of a reaction chamber according to an embodiment of the present application;

FIG. 3 shows a top view of a reaction chamber according to another embodiment of the present application;

FIG. 4 is a schematic structural diagram of a retainer plate according to an embodiment of the present application;

FIG. 5 illustrates a side view of a retainer plate according to an embodiment of the present application;

FIG. 6 is a schematic view of two stationary baffles of the present application;

fig. 7 shows another structure diagram of two fixed baffles of the present application.

Description of the main element symbols:

100-a reaction chamber; 110-a top cover; 120-a base; 121-grooves; 200-a fixed baffle; 210-a bump; 220-a mating portion; 300-a carrier; 310-a rotating base; 320-tray.

Detailed Description

Reference will now be made in detail to embodiments of the present application, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are exemplary only for the purpose of explaining the present application and are not to be construed as limiting the present application.

In the description of the present application, it is to be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the present application and for simplicity in description, and are not intended to indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and are therefore not to be considered limiting of the present application.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present application, "a plurality" means two or more unless specifically limited otherwise.

In this application, unless expressly stated or limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can include, for example, fixed connections, removable connections, or integral parts; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or may be connected through the use of two elements or the interaction of two elements. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.

In this application, unless expressly stated or limited otherwise, a first feature is "on" or "under" a second feature such that the first and second features are in direct contact, or the first and second features are in indirect contact via an intermediary. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.

Example one

Referring to fig. 1 to 7, a reaction chamber 100 is provided according to an embodiment of the present disclosure. The reaction chamber 100 is used for providing a reaction site for a workpiece when the workpiece is coated by using a chemical vapor deposition method. The workpiece is a wafer or other workpieces needing film coating.

As shown in fig. 1 and 2, the reaction chamber 100 includes a top cover 110 and a base 120, a fixed baffle 200 is disposed in the reaction chamber 100, a groove 121 is disposed on an upper surface of the base 120, a corresponding protrusion 210 is disposed on the fixed baffle 200, the groove 121 is matched with the protrusion 210 to fixedly connect the fixed baffle 200 and the base 120, and the fixed baffle 200 is used for shielding the upper surface of the base 120 to prevent a coating from contaminating the upper surface of the base 120 when a workpiece is coated in the reaction chamber 100.

In some embodiments, the top cover 110 and the base 120 are the upper and lower inner walls of the reaction chamber 100, respectively.

In some embodiments, a carrying device 300 is further disposed in the reaction chamber 100, the carrying device 300 is disposed on the base 120, and the carrying device 300 is used for carrying a workpiece to be processed.

Referring to fig. 3 and 4, in some embodiments, the fixing baffle 200 is provided with a matching portion 220, and the shape of the matching portion 220 matches with the shape of the carrying device 300, so that the baffle can block the area of the base 120 except the area covered by the carrying device 300.

In some embodiments, two fixing baffles 200 are disposed in the reaction chamber 100, the two sides of the supporting device 300 are respectively provided with the symmetrical grooves 121, and the protrusions 210 on the two fixing baffles 200 are respectively matched with the grooves 121 on the two sides, so that the two fixing baffles 200 are respectively fixed on the two sides of the supporting device 300.

When the two fixing baffles 200 are fixed on the base 120, the matching portions 220 of the two fixing baffles 200 are oppositely arranged to surround the bearing device 300 in an area surrounded by the two matching portions 220, so that the fixing baffles 200 shield the area of the base 120 except for the coverage area of the bearing device 300.

In other embodiments, as shown in fig. 3, four fixed baffles 200 may be disposed in the reaction chamber 100, and two symmetrical fixed baffles 200 may be disposed on two sides of the supporting device 300. The groove 121 is formed in the base 120 in the fixing area of each fixing baffle 200, and the groove 121 is matched with the projection 210 of the fixing baffle 200 to fix the four fixing baffles 200 on the base 120. When four fixing baffles 200 are combined together, the shape of the four engaging portions 220 matches with the shape of the carrying device 300, so that the loading device is enclosed in the area enclosed by the four engaging portions 220.

In some embodiments, the horizontal cross section of the bearing device 300 is circular, the area enclosed by the engaging portions 220 of at least two of the fixing baffles 200 is also circular, and the engaging portions 220 are spaced from the bearing device 300 by a certain distance. Without limitation, it is understood that in other embodiments, the horizontal cross section of the carrying device 300 may also be rectangular, and the area enclosed by the matching portions 220 of at least two fixing baffles 200 is also rectangular.

As shown in fig. 5, in some implementations, one of the bumps 210 is disposed on the fixing baffle 200, the bump 210 is a rectangular bump 210, the bump 210 protrudes outward from the fixing baffle 200 along the thickness direction of the fixing baffle 200, the length direction of the bump 210 is parallel to the length direction of the fixing baffle 200, and the length of the bump 210 is much greater than the depth of the bump 210 inserted into the groove 121.

As shown in fig. 6, in other embodiments, the fixing baffle 200 may further include two protrusions 210, the length direction of the two protrusions 210 is parallel to the length direction of the fixing baffle 200, the base 120 is provided with two grooves 121 corresponding to the two protrusions 210, the two protrusions 210 are respectively matched with the two grooves 121, so that the fixing baffle 200 is more stably connected to the base 120, and the two protrusions 210 may enable the fixing baffle 200 to be fixed to the base 120 when one of the protrusions 210 is accidentally broken, so as to prevent an accident.

In fig. 6, the ratio of the length of the bump 210 to the length of the fixed baffle 200 is sixty percent to eighty percent, and after many experiments, when the length of the bump 210 is seventy-five percent of the length of the fixed baffle 200, the bump 210 and the groove 121 are best matched, so that the fixed baffle 200 is tightly connected with the base 120, and the fixed baffle 200 is easily mounted on the base 120.

As shown in fig. 7, in other embodiments, the length directions of the two protrusions 210 on the fixed baffle 200 are both parallel to the width direction of the fixed baffle 200, which can also make the connection between the fixed baffle 200 and the base 120 more stable.

In fig. 7, the ratio of the length of the bump 210 to the width of the fixed baffle 200 is forty percent to sixty percent, and after many experiments, when the length of the bump 210 is fifty percent of the width of the fixed baffle 200, the bump 210 and the groove 121 are best matched, so that the fixed baffle 200 is tightly connected with the base 120, and the fixed baffle 200 is easily mounted on the base 120.

In some embodiments, the bump 210 may also be an arc bump 210. The operator can set different shapes and different numbers of the protrusions 210 on the fixed baffle 200 according to actual needs. The length of the bump 210 is much greater than the thickness of the bump 210, so that the bump 210 is not easily broken when the bump 210 is inserted into the groove 121 or removed from the groove 121.

In the reaction chamber 100 provided in this embodiment, the fixed baffle 200 is disposed in the reaction chamber 100, and the protrusion 210 on the fixed baffle 200 is matched with the groove 121 on the inner wall of the reaction chamber 100, so that the fixed baffle 200 is fixed on the inner wall of the reaction chamber 100. Compared with the mode of fixedly connecting the pin and the pin hole, the length and the width of the bump 210 are both larger than the depth of the bump 210 inserted into the groove 121, so that the bump 210 is inserted into the groove 121 or taken out of the groove 121, the bump 210 is not easy to break, the reuse rate of the fixed baffle 200 is high, and the production cost is effectively saved. The bump 210 is not easy to break when being subjected to expansion with heat and contraction with cold, the baffle is prevented from accidentally sliding, the safety of the workpiece in the production process is effectively improved, and the yield of the workpiece is improved. The protrusions 210 are easily aligned when being inserted into the grooves 121, thereby facilitating the installation of the fixed baffle 200 in the reaction chamber 100.

Example two

Referring to fig. 1 to 2, the present embodiment provides a reaction chamber 100, wherein the reaction chamber 100 is used for providing a reaction site for a workpiece during a chemical vapor deposition process. The present embodiment is an improvement on the technology of the first embodiment, and compared with the first embodiment, the difference is that:

as shown in fig. 1, the carrying device 300 includes a rotating base 310 and a tray 320, the rotating base 310 is rotatably disposed on the base 120, the tray 320 is disposed above the rotating base 310, the tray 320 is used for placing a workpiece, and the rotating base 310 can drive the workpiece to rotate through the tray 320, so that a uniform coating film is generated on the surface of the workpiece.

As shown in fig. 2, the protrusion 210 on the fixing baffle 200 is matched with the groove 121 on the base 120, so that the fixing baffle 200 is fixedly connected to the base 120. The shape of the fitting portion 220 is fitted to the side surface of the rotating base 310 in the circumferential direction, and at least two fixed baffles 200 are arranged along the circumferential direction of the rotating base 310 to surround the rotating base 310 in an area surrounded by the plurality of fixed baffles 200.

The fixed baffle 200 can shield other areas of the base 120 except for the rotating base 310, so that a coating cannot be deposited on the base 120 when a workpiece is coated, and the base 120 is prevented from being polluted. The fitting portion 220 is spaced apart from a side surface of the rotary base 310 by a certain distance so that the rotary base 310 rotates.

In some embodiments, the base 120 and the top cover 110 may be made of graphite materials, and a heater (not shown) is disposed below the base 120 or above the top cover 110, and is used for heating the base 120 or the top cover 110 to provide a reaction gas with a temperature required for the reaction. It is understood, however, that in other embodiments, the base 120 and the top cover 110 may be made of quartz material, and good heat conduction may also be achieved.

When the reaction chamber 100 is used, the heater heats the base 120 or the top cover 110, and after the temperature reaches the reaction temperature, the reaction gas flows through the gas flow channel between the top cover 110 and the base 120, and the rotary base 310 drives the tray 320 to rotate, so that the workpiece is fully contacted with the reaction gas, and the surface of the workpiece forms a required coating film.

The fixed baffle 200 may shield other regions of the base 120 except for the rotary base 310 during the reaction to prevent the deposition of the coating on the base 120. The protrusions 210 of the fixed baffle 200 are engaged with the grooves 121 of the base 120 to fasten the fixed baffle 200 to the base 120, so as to prevent the fixed baffle 200 from moving when a large amount of reaction gas is injected.

EXAMPLE III

The present application also provides a chemical vapor deposition apparatus including the reaction chamber 100 described above. The chemical vapor deposition apparatus may perform a chemical reaction on the surface of the workpiece to form a coating using one or more vapor compounds or elements in the reaction chamber 100.

In the description herein, reference to the description of the term "one embodiment," "some embodiments," "an example," "a specific example," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the application. In this specification, the schematic representations of the terms used above are not necessarily intended to refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, various embodiments or examples and features of different embodiments or examples described in this specification can be combined and combined by one skilled in the art without contradiction.

Although embodiments of the present application have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present application, and that variations, modifications, substitutions and alterations may be made to the above embodiments by those of ordinary skill in the art within the scope of the present application.

Claims (10)

1. The utility model provides a reaction chamber, its characterized in that includes top cap, base and fixed stop, be equipped with the recess on the base, the last lug that is equipped with of fixed stop corresponds, the recess with the lug cooperation makes fixed stop with base fixed connection, fixed stop is used for sheltering from the surface of base, the length and the width of lug all are greater than the lug inserts the degree of depth of recess.

2. The reaction chamber of claim 1, wherein a carrying device is disposed on the base, and a matching portion is disposed on the fixed baffle, the matching portion having a shape matching the carrying device, so that the fixed baffle covers an area of the base except for a coverage area of the carrying device.

3. The reaction chamber of claim 2, wherein at least two of the fixed baffles are disposed on the base, and the engaging portions of at least two of the fixed baffles engage with the carrying device to enclose the carrying device in an area surrounded by at least two of the engaging portions.

4. The reaction chamber of claim 1, wherein two of said protrusions are disposed on said fixed baffle.

5. The reaction chamber of claim 4, wherein two of said protrusions are symmetrically disposed on said fixed baffle.

6. The reaction chamber of claim 4, wherein the length direction of the two protrusions is parallel to the length direction of the fixed baffle.

7. The reaction chamber of claim 6 wherein the length of the projection is seventy-five percent of the length of the fixed baffle plate.

8. The reaction chamber of claim 4, wherein the length direction of the two protrusions is parallel to the width direction of the fixed baffle.

9. The reaction chamber of claim 8 wherein the length of the projection is fifty percent of the width of the fixed stop.

10. A chemical vapor deposition apparatus comprising the reaction chamber of any one of claims 1 to 9.

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