CN216732477U - Semiconductor wafer step type cutting equipment - Google Patents
Semiconductor wafer step type cutting equipment Download PDFInfo
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- CN216732477U CN216732477U CN202122588142.2U CN202122588142U CN216732477U CN 216732477 U CN216732477 U CN 216732477U CN 202122588142 U CN202122588142 U CN 202122588142U CN 216732477 U CN216732477 U CN 216732477U
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Abstract
The utility model relates to a semiconductor wafer stepped cutting device, comprising: a frame; a bearing table; the first cutting assembly is arranged on the rack and corresponds to the bearing table, is provided with a first cutting knife, and cuts the wafer on the bearing table through the first cutting knife so as to form a cutting groove on the wafer; locate the frame and with the corresponding second cutting assembly of plummer, be equipped with the second cutting knife, the width of second cutting knife is less than the width of first cutting knife, through the tank bottom of the cutting groove of the first cutting knife of second cutting knife cutting formation with wafer cutting off. According to the utility model, the first cutting knife and the second cutting knife are used for carrying out secondary cutting on the wafer, and the thickness of the part of the wafer cut by the second cutting knife is smaller than the whole thickness of the wafer, so that the mechanical stress generated in the cutting process can be reduced, the possibility of occurrence of crack breakage is further reduced, and even if the crack breakage phenomenon occurs, the crack breakage part cannot extend to the front side of the chip due to the existence of the cutting groove, so that the quality of the product is ensured.
Description
Technical Field
The utility model relates to the technical field of semiconductor packaging, in particular to semiconductor wafer stepped cutting equipment.
Background
The existing wafer cutting mode comprises a diamond blade scribing mode and a laser scribing mode, and the existing diamond blade scribing mode still occupies a large share of the chip cutting market.
The diamond blade scribing mode is that a diamond blade is used as a cutter, a processed wafer is scribed under the driving of a high-speed rotating main shaft, in the diamond scribing process, stress concentration can be generated on the surface of the processed wafer, edge breakage and micro cracks occur on the cutting edge, sometimes, side face breakage can extend to the front face of a chip, test failure can be caused when the side face breakage is too large, and a product is failed to work, so that loss is caused.
SUMMERY OF THE UTILITY MODEL
The utility model aims to overcome the defects of the prior art and provides semiconductor wafer stepped cutting equipment which solves the problems that side face edge breakage is generated due to stress concentration in the existing diamond blade dividing mode, and the breakage can extend to the front face of a chip in serious conditions to cause test failure, product failure and the like.
The technical scheme for realizing the purpose is as follows:
the utility model provides a semiconductor wafer stepped cutting device, comprising:
a frame;
the bearing table is arranged close to the rack and used for containing the wafer to be cut;
the first cutting assembly is arranged on the rack and corresponds to the bearing table, a first cutting knife capable of being moved and adjusted vertically and longitudinally is arranged on the first cutting assembly, and the first cutting knife is used for cutting the wafer on the bearing table to form a cutting groove on the wafer;
the second cutting assembly is arranged on the rack and corresponds to the bearing table, the second cutting assembly is opposite to the first cutting assembly, a second cutting knife capable of moving and adjusting vertically and longitudinally is arranged on the second cutting assembly, the width of the second cutting knife is smaller than that of the first cutting knife, and the second cutting knife cuts the bottom of a cutting groove formed by the first cutting knife so as to cut off the wafer.
The cutting equipment provided by the utility model is provided with the two cutting knives, when the wafer is cut, the first cutting knife is used for cutting the wafer to form the cutting groove, the first cutting knife does not cut off the wafer, then the second cutting knife is used for cutting the groove bottom of the cutting groove to cut off the wafer, the stress concentration in the cutting process is generated at the broken part of the wafer, and the thickness of the part of the wafer cut by the second cutting knife is smaller than the whole thickness of the wafer, so that the mechanical stress generated in the cutting process can be reduced, the possibility of occurrence of crack is further reduced, even if the crack phenomenon is generated, the crack part cannot extend to the front surface of a chip due to the existence of the cutting groove, the quality of the product is ensured, and the yield of the product is improved.
The semiconductor wafer stepped cutting equipment is further improved in that the bearing table can be moved and adjusted along the transverse direction, and the wafer on the bearing table can be moved from the first cutting knife to the second cutting knife through the transverse movement and adjustment.
The semiconductor wafer stepped cutting equipment is further improved in that the first cutting assembly comprises a first vertical adjusting mechanism which can be adjusted in a lifting mode and is installed on the rack, a first longitudinal adjusting mechanism which can be adjusted in a longitudinal moving mode and is installed on the first vertical adjusting mechanism, and a first driving piece which is installed on the first longitudinal adjusting mechanism;
the first cutting knife is rotatably arranged on the first longitudinal adjusting mechanism;
the first driving piece is in driving connection with the first cutting knife so as to drive the first cutting knife to rotate;
the first longitudinal adjusting mechanism and the first cutting knife can be driven to carry out lifting adjustment together by lifting adjustment of the first vertical adjusting mechanism, so that the first cutting knife can move and adjust towards the direction close to or far away from the wafer on the bearing table;
the first longitudinal adjusting mechanism can be moved and adjusted along with the first cutting knife, so that the first cutting knife moves along the longitudinal direction of the wafer on the bearing table.
The semiconductor wafer stepped cutting equipment is further improved in that the second cutting assembly comprises a second vertical adjusting mechanism which can be adjusted in a lifting mode and is installed on the rack, a second longitudinal adjusting mechanism which can be adjusted in a longitudinal moving mode and is installed on the second vertical adjusting mechanism, and a second driving piece which is installed on the second longitudinal adjusting mechanism;
the second cutting knife is rotatably arranged on the second longitudinal adjusting mechanism;
the second driving piece is in driving connection with the second cutting knife so as to drive the second cutting knife to rotate;
the second vertical adjusting mechanism can be driven to lift and adjust the second longitudinal adjusting mechanism and the second cutting knife together by lifting and adjusting the second vertical adjusting mechanism, so that the second cutting knife moves and is adjusted towards the direction close to or far away from the wafer on the bearing table;
the second longitudinal adjusting mechanism can drive the second cutting knife to carry out longitudinal movement adjustment together through movement adjustment, so that the second cutting knife moves along the longitudinal direction of the wafer on the bearing table.
The stepped cutting equipment for the semiconductor wafer is further improved in that the depth of the cutting groove is 1/2-2/3 of the thickness of the wafer.
The stepped cutting equipment for the semiconductor wafer is further improved in that the width of the first cutting knife is 25um to 30 um.
The stepped cutting equipment for the semiconductor wafer is further improved in that the width of the second cutting knife is between 1/2 and 1/3 of the width of the first cutting knife.
The stepped cutting equipment for the semiconductor wafer is further improved in that the first cutting knife and the second cutting knife are circular cutting knives.
Drawings
Fig. 1 is a schematic structural diagram of a semiconductor wafer step-type cutting apparatus according to the present invention.
Fig. 2 to 4 are schematic views illustrating an exploded step of cutting a wafer by the semiconductor wafer step cutting apparatus according to the present invention.
Detailed Description
The utility model is further described with reference to the following figures and specific examples.
Referring to fig. 1, the present invention provides a semiconductor wafer step-type cutting apparatus for reducing the occurrence of edge chipping on the side surface during the process of cutting a wafer, preventing product failure and improving product quality. The cutting equipment provided by the utility model is provided with two cutting knives, the width of one cutting knife is smaller than that of the other cutting knife, when a wafer is cut, the first cutting knife is used for cutting to form a cutting groove, namely, the wafer is not cut, then the second cutting knife is used for cutting the wafer at the bottom of the cutting groove to cut the wafer, and the thickness of the part cut by the second cutting knife is smaller than the whole thickness of the wafer, so that the mechanical stress generated by the part cut by the second cutting knife is smaller, the product is less in crack breakage, and the crack can not extend to the front side of a chip even if the crack breakage is generated, so that the quality of the product is ensured, and the quality risk is reduced. The semiconductor wafer step-type cutting apparatus of the present invention will be described with reference to the accompanying drawings.
Referring to fig. 1, a schematic structural diagram of a semiconductor wafer step-type cutting apparatus according to the present invention is shown. The semiconductor wafer step-type cutting apparatus of the present invention will be described with reference to fig. 1.
As shown in fig. 1, the semiconductor wafer step-type cutting apparatus of the present invention includes a frame 21, a susceptor 22, a first cutting assembly 23 and a second cutting assembly 24, wherein the susceptor 22 is disposed adjacent to the frame 21, and the susceptor 22 is used for accommodating a wafer to be cut; a first cutting assembly 23 is disposed on the frame 21, the first cutting assembly 23 corresponds to the carrier table 22, a first cutting blade 231 which can be adjusted to move vertically and longitudinally is disposed on the first cutting assembly 23, and as shown in fig. 2 and 3, the wafer 10 on the carrier table 22 is cut by the first cutting blade 231 to form a cutting groove 12 on the wafer 10; the second cutting assembly 24 is disposed on the frame 21, the second cutting assembly 24 corresponds to the carrier 22, the second cutting assembly 24 is disposed opposite to the first cutting assembly 23, the second cutting assembly 24 is provided with a second cutting knife 241 capable of moving and adjusting vertically and longitudinally, the width of the second cutting knife 241 is smaller than that of the first cutting knife 231, and as shown in fig. 4, the second cutting knife 241 cuts the bottom of the cutting groove 12 formed by the first cutting knife 231 to cut off the wafer 10.
Thus, the cutting apparatus of the present invention performs the secondary cutting of the wafer 10 by using the first cutter and the second cutter, and the side surface of the wafer 10 after the secondary cutting is stepped. When the wafer is cut, the stress is concentrated when the wafer is cut off, and the crack is very easy to generate at the moment, but when the second cutting knife is used for cutting off the residual wafer part at the bottom of the cutting groove 12, the thickness of the part is smaller, so the stress is smaller, the possibility of crack generation can be reduced, even if the crack is generated, the generated crack cannot extend to the front surface of a chip because the side surface of the wafer is in a step shape, and the generated crack can be controlled within an allowable range by controlling the thickness of the cutting part of the second cutting knife, so that the product yield can be improved, and the quality risk can be reduced.
In one embodiment of the present invention, as shown in fig. 1 to 4, the susceptor 22 is laterally adjustable, and the wafer 10 on the susceptor 22 can be moved from the first cutting blade 231 to the second cutting blade 241 by the lateral movement adjustment.
Preferably, a base 221 is disposed on one side of the frame 21, a transverse rail 222 is disposed on the base 221, a moving slider 223 is slidably disposed on the transverse rail 222, the platform 22 is disposed on the moving slider 223, and the moving slider 223 can move and adjust along the transverse rail 222, and further, can bring the platform 22 to move and adjust transversely. The first cutting assembly 23 and the second cutting assembly 24 are disposed above the carrier table 22 and are spaced apart in the lateral direction. The top of the transverse guide 222 has two rail rods arranged oppositely, the bottom of the movable sliding block 223 is provided with a clamping groove corresponding to the rail rods, and the clamping groove is clamped on the corresponding rail rods, so that the movable sliding block can be moved and adjusted along the rail rods.
In a preferred embodiment, a rodless cylinder is disposed in the middle of the cross rail 222, and the rodless cylinder is connected to the movable slider 223, and the movable slider 223 is driven by the rodless cylinder to move and adjust along the cross rail 222.
In another preferred embodiment, the movable sliding block 223 is driven to move and adjust along the transverse guide rail 222 through the thread matching of the screw rod and the nut, the nut is connected to the screw rod in a threaded manner, then the nut is fixedly connected with the movable sliding block 223, two ends of the screw rod are rotatably supported in the middle of the transverse guide rail 222, one end of the screw rod which is connected with a motor in a driving manner is driven to rotate by the motor, and then the nut drives the movable sliding block 223 to move transversely along the screw rod,
in yet another preferred embodiment, the carrier 22 may be placed on a conveyor belt through which lateral movement adjustment is achieved.
In one embodiment of the present invention, as shown in fig. 1, the first cutting assembly 23 comprises a first vertical adjusting mechanism 232 which can be adjusted up and down and is installed on the frame, a first longitudinal adjusting mechanism 233 which can be adjusted by longitudinal movement and is installed on the ground vertical adjusting mechanism 232, and a first driving member which is installed on the first longitudinal adjusting mechanism; the first cutting knife 231 is rotatably mounted on the first longitudinal adjusting mechanism 233; the first driving member is in driving connection with the first cutting knife 231 to drive the first cutting knife 231 to rotate; the first vertical adjusting mechanism 232 can be driven by the lifting adjustment of the first vertical adjusting mechanism 232 to lift and adjust the first cutting knife 231 together, so that the first cutting knife 231 moves and adjusts towards the direction close to or far away from the wafer on the bearing table 22; the first longitudinal adjustment mechanism 233 is adjusted to move longitudinally along with the first cutter 231 so that the first cutter 231 moves in the longitudinal direction of the wafer on the susceptor 22.
The first cutting knife 231 cuts the wafer through rotation, when the bearing platform 22 moves to a position below the first cutting knife 231, the bearing platform 22 stops moving, at the moment, the first cutting knife 231 is located on one side of the wafer on the bearing platform 22, the height of the first vertical adjusting mechanism 232 is adjusted, the first cutting knife 231 is located at the bottom of a cutting groove to be cut and formed, corresponding to the elevation of the bottom edge of the first cutting knife 231, then the first driving piece is started to drive the first cutting knife 231 to rotate, then the first vertical adjusting mechanism 232 drives the first cutting knife 231 to move along the vertical direction, the first cutting knife 231 moves from one side of the wafer to the other side of the wafer, and the first cutting knife 231 cuts the wafer to form the cutting groove. After the first driving member is turned off, the first vertical adjustment mechanism 232 moves upward so that the first cutter 231 is located above the wafer, and then the first vertical adjustment mechanism 233 is reset.
Specifically, the first cutting assembly 23 further comprises a vertical rail fixedly arranged on the frame 21, the first vertical adjusting mechanism 232 is slidably arranged on the vertical rail, a rodless cylinder can be arranged between the vertical rails, the rodless cylinder is used for driving the first vertical adjusting mechanism 232 to perform lifting adjustment, and the first vertical adjusting mechanism 232 is used for achieving lifting adjustment of the first cutting knife 231.
Correspondingly, a longitudinal rail is arranged at the bottom of the first longitudinal adjusting mechanism 232, a longitudinal sliding block is arranged on the longitudinal rail in a sliding manner, and the longitudinal sliding block is connected with a rodless cylinder and is driven by the rodless cylinder to perform longitudinal movement adjustment. The first cutting blade 231 is rotatably mounted on the longitudinal slide, and the first driving member is also mounted on the longitudinal slide, so that the longitudinal slide carries the first cutting blade 231 for longitudinal movement adjustment.
Further, as shown in fig. 1, the second cutting assembly 24 includes a second vertical adjusting mechanism 242 capable of being adjusted in a lifting manner and mounted on the frame 21, a second longitudinal adjusting mechanism 243 capable of being adjusted in a longitudinal movement manner and mounted on the second vertical adjusting mechanism 242, and a second driving member mounted on the second longitudinal adjusting mechanism 243; the second cutting knife 241 is rotatably mounted on the second longitudinal adjusting mechanism 243; the second driving member is in driving connection with the second cutting knife 241 to drive the second cutting knife 241 to rotate; the second vertical adjusting mechanism 242 can drive the second longitudinal adjusting mechanism 243 and the second cutting blade 241 to perform lifting adjustment together through lifting adjustment, so that the second cutting blade 241 moves and adjusts towards the direction close to or far away from the wafer on the bearing table 22; the second longitudinal adjustment mechanism 243 is adjusted by moving to move longitudinally with the second cutting blade 241 so that the second cutting blade 241 moves in the longitudinal direction of the wafer on the susceptor 22.
When the elevation of the bottom of the second cutting knife 241 is adjusted, the elevation of the bottom of the second cutting knife 241 is adjusted to be lower than the elevation of the bottom surface of the wafer, so that the wafer can be cut off.
Specifically, the specific structure of the second vertical adjustment mechanism is the same as the specific structure of the first vertical adjustment mechanism, and the specific structure of the second longitudinal adjustment mechanism is the same as the specific structure of the first longitudinal adjustment mechanism, which can be referred to specifically for the description of the structures of the first vertical adjustment mechanism and the first longitudinal adjustment mechanism, and is not described herein again.
In an embodiment of the utility model, the bottom surface of the wafer 10 is attached with the film 11, and the second cutting blade 241 can cut part of the film 11 during cutting, so as to ensure that the wafer 10 is cut off.
In one embodiment of the present invention, as shown in fig. 3, the depth of the scribe line 12 is between 1/2 and 2/3 of the thickness of the wafer 10. Preferably, the depth of the scribe line 12 is designed to be 2/3 after the wafer 10, that is, the first scribe line 231 is used to scribe to 2/3 of the wafer thickness, and a part of 1/3 thickness is left uncut on the wafer corresponding to the bottom of the scribe line 12.
In one embodiment of the present invention, the width of the first cutting blade 231 is between 25um and 30 um.
Further, the width of the second cutting knife 241 is between 1/2 and 1/3 of the width of the first cutting knife 231.
In one embodiment of the present invention, the first and second cutting knives 231 and 241 are circular cutting knives.
The first cutting blade 231 and the second cutting blade 241 are diamond cutting blades.
When utilizing the second cutting knife to cut, remove the plummer and make the middle part in cut groove corresponding with the position of second cutting knife.
The frame 21 of the cutting equipment is a portal frame and has high stable supporting capacity. Because the processing requirement of the wafer is in a dust-free environment, when the cutting equipment is actually used, a shell can be covered on the outer side of the cutting equipment, and a closed and clean operation space is formed by the shell.
While the present invention has been described in detail and with reference to the embodiments thereof as illustrated in the accompanying drawings, it will be apparent to one skilled in the art that various changes and modifications can be made therein. Therefore, certain details of the embodiments are not to be interpreted as limiting, and the scope of the utility model is to be determined by the appended claims.
Claims (8)
1. A semiconductor wafer stepped cutting apparatus, comprising:
a frame;
the bearing table is arranged close to the rack and used for containing the wafer to be cut;
the first cutting assembly is arranged on the rack and corresponds to the bearing table, a first cutting knife which can move and adjust along the vertical direction and the longitudinal direction is arranged on the first cutting assembly, and the first cutting knife cuts the wafer on the bearing table to form a cutting groove on the wafer;
the second cutting assembly is arranged on the rack and corresponds to the bearing table, the second cutting assembly is opposite to the first cutting assembly, a second cutting knife capable of moving and adjusting vertically and longitudinally is arranged on the second cutting assembly, the width of the second cutting knife is smaller than that of the first cutting knife, and the second cutting knife cuts the bottom of a cutting groove formed by the first cutting knife so as to cut off the wafer.
2. The stepped semiconductor wafer cutting apparatus of claim 1, wherein the stage is laterally adjustable to move the wafer on the stage from the first cutting blade to the second cutting blade.
3. The stepped semiconductor wafer cutting apparatus of claim 1, wherein said first cutting assembly includes a first vertical adjustment mechanism mounted on said frame for adjustable elevation, a first longitudinal adjustment mechanism mounted on said first vertical adjustment mechanism for adjustable longitudinal movement, and a first drive member mounted on said first longitudinal adjustment mechanism;
the first cutting knife is rotatably arranged on the first longitudinal adjusting mechanism;
the first driving piece is in driving connection with the first cutting knife so as to drive the first cutting knife to rotate;
the first vertical adjusting mechanism can be driven to lift and adjust the first longitudinal adjusting mechanism and the first cutter together through lifting and adjusting the first vertical adjusting mechanism, so that the first cutter can move and adjust towards the direction close to or far away from the wafer on the bearing table;
the first longitudinal adjusting mechanism can be moved and adjusted along with the first cutting knife, so that the first cutting knife moves along the longitudinal direction of the wafer on the bearing table.
4. The stepped semiconductor wafer cutting apparatus of claim 1, wherein the second cutting assembly includes a second vertical adjustment mechanism mounted on the frame for elevation adjustment, a second longitudinal adjustment mechanism mounted on the second vertical adjustment mechanism for longitudinal movement adjustment, and a second driving member mounted on the second longitudinal adjustment mechanism;
the second cutting knife is rotatably arranged on the second longitudinal adjusting mechanism;
the second driving piece is in driving connection with the second cutting knife so as to drive the second cutting knife to rotate;
the second vertical adjusting mechanism can be driven to lift and adjust the second longitudinal adjusting mechanism and the second cutting knife together by lifting and adjusting the second vertical adjusting mechanism, so that the second cutting knife moves and is adjusted towards the direction close to or far away from the wafer on the bearing table;
the second longitudinal adjusting mechanism can drive the second cutting knife to carry out longitudinal movement adjustment together through movement adjustment, so that the second cutting knife moves along the longitudinal direction of the wafer on the bearing table.
5. The semiconductor wafer stepped cutting apparatus of claim 1, wherein a depth of the cut groove is between 1/2 and 2/3 of the wafer thickness.
6. The semiconductor wafer stepped cutting apparatus of claim 1, wherein the width of the first cutting blade is between 25um and 30 um.
7. The semiconductor wafer step dicing apparatus of claim 1, wherein the width of the second dicing blade is between 1/2 to 1/3 of the width of the first dicing blade.
8. Step type cutting equipment for semiconductor wafers according to claim 1, characterized in that the first cutting knife and the second cutting knife are circular cutting knives.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122588142.2U CN216732477U (en) | 2021-10-26 | 2021-10-26 | Semiconductor wafer step type cutting equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122588142.2U CN216732477U (en) | 2021-10-26 | 2021-10-26 | Semiconductor wafer step type cutting equipment |
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| Publication Number | Publication Date |
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| CN216732477U true CN216732477U (en) | 2022-06-14 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202122588142.2U Active CN216732477U (en) | 2021-10-26 | 2021-10-26 | Semiconductor wafer step type cutting equipment |
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| CN (1) | CN216732477U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115172142A (en) * | 2022-06-21 | 2022-10-11 | 武汉新芯集成电路制造有限公司 | Wafer trimming method and wafer trimming machine |
-
2021
- 2021-10-26 CN CN202122588142.2U patent/CN216732477U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115172142A (en) * | 2022-06-21 | 2022-10-11 | 武汉新芯集成电路制造有限公司 | Wafer trimming method and wafer trimming machine |
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