CN216719982U

CN216719982U - Bendable aluminum substrate

Info

Publication number: CN216719982U
Application number: CN202220390930.2U
Authority: CN
Inventors: 侯裂国; 周林展
Original assignee: Dongguan Haiwo Electronic Technology Co ltd
Current assignee: Dongguan Haiwo Electronic Technology Co ltd
Priority date: 2022-02-24
Filing date: 2022-02-24
Publication date: 2022-06-10
Anticipated expiration: 2032-02-24

Abstract

The utility model discloses a bendable aluminum substrate which comprises a bendable aluminum layer, an insulating adhesive layer, a bendable copper foil layer, a resistance welding white oil layer and a plurality of light-emitting chips, wherein the insulating adhesive layer is coated on the outer surface of the bendable aluminum layer, the inner surface of the bendable copper foil layer is bonded with the insulating adhesive layer in an adhering mode, the resistance welding white oil layer is coated on the outer surface of the bendable copper foil layer, the plurality of light-emitting chips are arranged and distributed on the outer surface of the resistance welding white oil layer, and the plurality of light-emitting chips are distributed in a uniform state. The aluminum substrate is simple in structure and convenient to use, can be bent into a required shape according to actual needs to form three or more faces to emit light, the practicability is improved, the use limit of the aluminum substrate is reduced, and the voltage resistance of the aluminum substrate product is effectively improved by the heat-conducting insulating ink, so that the aluminum substrate product can be secondarily insulated when being in contact with some metal radiators, a good voltage-resisting effect is achieved, and the overall practicability is high.

Description

Bendable aluminum substrate

Technical Field

The utility model relates to the field of aluminum-based circuit boards, in particular to a bendable aluminum substrate.

Background

The kind of circuit board has a lot, and aluminium base circuit board is exactly one of them, aluminium base board is a metal base copper-clad plate that has good heat dissipation function, general single-sided board comprises three layer construction, be the circuit layer respectively, insulating layer and metal base, it is common in the LED illumination product, there are two sides, white one side is welding LED pin, the another side presents aluminium true qualities, also there is the design for the double sided board for high-end use, the structure is the circuit layer, the insulating layer, aluminium base, the insulating layer, the circuit layer, the few applications are the multiply wood, can be by ordinary multiply wood and insulating layer, aluminium base laminating forms.

However, the existing aluminum-based circuit board has the following disadvantages:

1. the aluminum layer of the traditional aluminum-based circuit board is thicker, and is brittle and cannot be bent, as shown in fig. 2, the substrate can only be made into a light-emitting LED lamp with a square meter, only one surface can emit light, and the requirement of a plurality of light-emitting lamp products with multiple surfaces cannot be met.

2. The substrate has a simple structure, is usually only used for lamp panels with a simple structure, and cannot be secondarily insulated due to the fact that the back surface of the substrate is made of aluminum and is in contact with some metal radiators, and a good voltage-resistant effect cannot be achieved.

SUMMERY OF THE UTILITY MODEL

The utility model aims to provide a bendable aluminum substrate, which aims to solve the problems that the aluminum layer of the traditional aluminum substrate circuit board is thicker, is brittle and cannot be bent, as shown in figure 2, the substrate can only be made into a light-emitting LED lamp with a square meter, only can emit light on one surface and cannot meet the requirements of lamp products with a plurality of surfaces, meanwhile, the substrate is simple in structure, is usually only used for lamp plates with simple structures, cannot be secondarily insulated due to the fact that the back surface of the substrate is aluminum and is contacted with metal radiators, and cannot achieve a good pressure-resistant effect.

In order to achieve the purpose, the utility model provides the following technical scheme: a bendable aluminum substrate comprises a bendable aluminum layer, an insulating glue layer, a bendable copper foil layer, a resistance welding white oil layer and a plurality of light-emitting chips, wherein the insulating glue layer is coated on the outer surface of the bendable aluminum layer, the inner surface of the bendable copper foil layer is bonded with the insulating glue layer in an adhering mode, the resistance welding white oil layer is coated on the outer surface of the bendable copper foil layer, the plurality of light-emitting chips are arranged, and the plurality of light-emitting chips are distributed on the outer surface of the resistance welding white oil layer.

Preferably, the plurality of light emitting chips are distributed in a uniform state.

Preferably, the bendable aluminum layer and the bendable copper foil layer are both made of bendable materials, and the bending angles of the bendable aluminum layer and the bendable copper foil layer are both 0-170 degrees.

Preferably, a layer of heat conduction and insulation ink is coated on the inner surface of the bendable aluminum layer.

Preferably, the shapes of the bendable aluminum layer and the bendable copper foil layer include, but are not limited to, a shape of a falling Chinese character 'ao'.

The utility model provides a bendable aluminum substrate, which has the following beneficial effects:

(1) the utility model can bend the whole road base plate into a required shape by arranging the bendable aluminum layer, the insulating glue layer, the bendable copper foil layer, the solder resist white oil layer and the light-emitting chip, and the design can bend the product by 90 degrees or more to form a cylindrical LED lamp product, thereby achieving the light-emitting effect of three or more surfaces, forming multi-surface light emission, being not easy to break and improving the practicability of the road base plate.

(2) According to the utility model, the heat-conducting insulating ink is arranged, so that the voltage resistance of the aluminum substrate product is improved, and meanwhile, the circuit substrate has good heat-conducting capacity, so that the circuit substrate can be secondarily insulated when being in contact with some metal radiators, and a good voltage-resisting effect is achieved.

Drawings

FIG. 1 is a schematic view of the overall structure of the present invention;

fig. 2 is a schematic structural diagram of the conventional product of the present application.

In the figure: 1. the aluminum layer can be bent; 2. an insulating glue layer; 3. the copper foil layer can be bent; 4. a solder resist white oil layer; 5. a light emitting chip; 6. thermally conductive and electrically insulating ink.

Detailed Description

The technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention.

As shown in fig. 1-2, the present invention provides a technical solution: a bendable aluminum substrate comprises a bendable aluminum layer 1, an insulating glue layer 2, a bendable copper foil layer 3, a resistance welding white oil layer 4 and a plurality of light-emitting chips 5, wherein the insulating glue layer 2 is coated on the outer surface of the bendable aluminum layer 1, the inner surface of the bendable copper foil layer 3 is bonded with the insulating glue layer 2 in a bonding mode, the resistance welding white oil layer 4 is coated on the outer surface of the bendable copper foil layer 3, the plurality of light-emitting chips 5 are arranged, and the plurality of light-emitting chips 5 are distributed on the outer surface of the resistance welding white oil layer 4.

The plurality of light emitting chips 5 are distributed in a uniform state, so that the plurality of light emitting chips 5 can form a uniform light emitting effect;

the bendable aluminum layer 1 and the bendable copper foil layer 3 are both made of bendable materials, and the bending angle ranges of the bendable aluminum layer 1 and the bendable copper foil layer 3 are 0-170 degrees, so that the bendable aluminum layer 1 and the bendable copper foil layer 3 can be subjected to bending treatment and are not easy to break and damage;

the inner surface of the bendable aluminum layer 1 is coated with a layer of heat-conducting insulating ink 6, so that the road substrate has good heat-conducting capacity, and can be secondarily insulated when being contacted with some metal radiators, and a good pressure-resistant effect is achieved;

the shapes of the bendable aluminum layer 1 and the bendable copper foil layer 3 include but are not limited to a reversed concave shape, so that the whole aluminum substrate can be bent into a required shape according to actual needs, and the use limit of the aluminum substrate is reduced.

The working principle is as follows: when the utility model is used, the bendable aluminum layer 1 and the bendable copper foil layer 3 are both made of bendable materials, so that the aluminum substrate can be bent into a required shape according to actual needs, the use limit of the aluminum substrate is reduced, the product can be bent by 90 degrees or more by the design to form a cylindrical LED lamp product, the light-emitting effect of three or more surfaces is achieved, multi-surface light emission is formed, the aluminum substrate is not easy to break, the practicability of the circuit substrate is improved, the voltage resistance of the aluminum substrate product is improved due to the arrangement of the heat-conducting insulating ink 6, meanwhile, the circuit substrate has good heat-conducting capacity, secondary insulation can be realized when the circuit substrate is contacted with some metal radiators, a good voltage-resisting effect is achieved, and the integral practicability is high.

In the description of the present invention, it is to be understood that the indicated orientations or positional relationships are based on the orientations or positional relationships shown in the drawings and are only for convenience in describing the present invention and simplifying the description, but are not intended to indicate or imply that the indicated devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and are not to be construed as limiting the present invention.

In the present invention, unless otherwise explicitly specified or limited, for example, it may be fixedly attached, detachably attached, or integrated; can be mechanically or electrically connected; the terms may be directly connected or indirectly connected through an intermediate, and may be communication between two elements or interaction relationship between two elements, unless otherwise specifically limited, and the specific meaning of the terms in the present invention will be understood by those skilled in the art according to specific situations.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a aluminium base board can bend, includes aluminium lamination (1), insulating glue layer (2), can bend copper foil layer (3), hinders and welds white oil layer (4) and luminescent chip (5), its characterized in that: the insulation glue layer (2) is coated on the outer surface of the bendable aluminum layer (1), the inner surface of the bendable copper foil layer (3) is attached to the insulation glue layer (2) in a bonding mode, the solder resist white oil layer (4) is coated on the outer surface of the bendable copper foil layer (3), the number of the light-emitting chips (5) is multiple, and the light-emitting chips (5) are distributed on the outer surface of the solder resist white oil layer (4).

2. The bendable aluminum substrate of claim 1, wherein: the plurality of light emitting chips (5) are distributed in a uniform state.

3. The bendable aluminum substrate of claim 1, wherein: the bendable aluminum layer (1) and the bendable copper foil layer (3) are both made of bendable materials, and the bending angle ranges of the bendable aluminum layer (1) and the bendable copper foil layer (3) are 0-170 degrees.

4. The bendable aluminum substrate of claim 1, wherein: and a layer of heat-conducting insulating ink (6) is coated on the inner surface of the bendable aluminum layer (1).

5. The bendable aluminum substrate of claim 1, wherein: the shapes of the bendable aluminum layer (1) and the bendable copper foil layer (3) comprise but are not limited to a shape of a Chinese character 'ao' poured.