CN216719937U - Lead unit, lead frame and semiconductor package - Google Patents

Abstract

The present invention relates to a lead unit, a lead frame and a semiconductor package, wherein the lead unit includes: a unit main body; first and second die pads provided at intervals in a thickness direction of the unit body, respectively; a first pin coupled to the first die pad; a second pin coupled to a second die pad; a first support arm connected between the first die pad and the unit body; and the second supporting arm is connected between the second die pad and the unit main body. The first supporting arm and the second supporting arm are added, so that the first die pad and the second die pad can be more stably arranged on the unit main body, and therefore when the semiconductor chip is fixed to the first die pad and the second die pad and die bonding and wire bonding are carried out, the first die pad and the second die pad can be prevented from shaking, the die bonding and wire bonding process is more stable, and the welding quality of the semiconductor chip is improved.

Description

Lead unit, lead frame and semiconductor package

Technical Field

The present invention relates to the field of semiconductor package technologies, and in particular, to a lead unit, a lead frame, and a semiconductor package.

Background

With the development of science and technology, semiconductor chips are increasingly widely used in daily life. In practical application, the semiconductor chip is physically protected by the package of the lead frame, and is carried and fixed on the die pad of the lead frame, and the semiconductor chip is electrically connected with the PCB circuit through the pins on the lead frame.

With the increasing demand, the performance requirements of semiconductor chips are higher and higher. Based on the prior art, semiconductor chips are required to have higher integration and more complex functions. Therefore, the number of leads on the lead frame is also gradually increased, resulting in an increase in the length of the die pad. However, in order not to affect the creepage distance between the pins, the number of pins coupled to the die pad needs to be limited. Therefore, the die pad is unstable and shakes during die bonding and wire bonding, which affects the bonding quality of the semiconductor chip.

SUMMERY OF THE UTILITY MODEL

Accordingly, it is desirable to provide a lead unit, a lead frame and a semiconductor package for stabilizing a die pad during die bonding and wire bonding, in order to solve the problem that the die pad is shaken during die bonding and wire bonding to affect the bonding quality of a semiconductor chip.

In a first aspect, the present application provides a lead element comprising:

a unit main body;

a first die pad and a second die pad for carrying a chip, the first die pad and the second die pad being spaced apart from each other in a thickness direction of the unit body;

a first pin coupled to the first die pad;

a second pin coupled to the second die pad;

a first support arm supported and connected between the first die pad and the unit body;

and the second supporting arm is supported and connected between the second die pad and the unit main body.

The first supporting arm is matched with the first pin, the stability of the first die pad on the unit main body is improved, the second supporting arm is matched with the second pin, the stability of the second die pad on the unit main body is improved, and when the chip is fixed between the first die pad and the second die pad and die bonding and wire bonding are carried out, the first die pad and the second die pad can be prevented from shaking in the die bonding and wire bonding process, so that the welding quality of the chip is improved.

In some embodiments, one of the first die pad and the first support arm is provided with a first protrusion, and the other is provided with a first groove matched with the first protrusion; and/or

One of the second die pad and the second support arm is provided with a second bump, and the other one is provided with a second groove matched with the second bump.

The first lug is connected with the first groove in a matched mode, the second lug is connected with the second groove in a matched mode, and therefore the binding force between the first die pad and the first supporting arm and between the second die pad and the second supporting arm can be improved.

In some embodiments, the first bump is disposed on the first die pad, and the first groove is opened on the first support arm; the second bump is arranged on the second tube core pad, and the second groove is arranged on the second supporting arm.

When the first supporting arm is inserted into the first lug of the first die pad through the first groove and the second supporting arm is inserted into the second lug of the second die pad through the second groove, the connection stability between the first supporting arm and the first die pad and between the second supporting arm and the second die pad can be improved.

In some embodiments, the first and second support arms are both insulating support arms. Therefore, the first supporting arm and the second supporting arm only provide support for the first die pad and the second die pad, and the creepage distance between the pins cannot be influenced.

In some embodiments, the first support arm and the second support arm are the same material and are each one of plastic, organic polymer, inorganic polymer, polyester imide, elastomer, or glass fabric. The insulating material can ensure that the first supporting arm and the second supporting arm are not electrically connected with the first die pad and the second die pad, so that the arrangement of the first supporting arm and the second supporting arm can not influence the use performance of the lead unit.

In some embodiments, the first support arms include at least two spaced apart support arms, each of the first support arms being in supporting connection between the first die pad and the unit body; the second support arm includes at least two that set up at interval each other, each the second support arm all support connect in the second die pad with between the unit main part.

Set up a plurality of first support arms between first die pad and unit main part, set up a plurality of second support arms between second die pad and unit main part, can further improve the stability of first die pad and second die pad.

In some embodiments, each of the first support arms and each of the second support arms is an insulating support arm. All first support arms and all second support arms are made of the same materials and are made of insulating materials, so that the plurality of first support arms and the plurality of second support arms are ensured not to influence pins, and creepage distances between the first die pad and the second die pad are not changed.

In a second aspect, the present application provides a lead frame, which includes a plurality of lead units as described above, and the lead units are sequentially arranged.

In a third aspect, the present application provides a semiconductor package, including a plastic package body, a lead unit packaged in the plastic package body, and a chip soldered on the lead unit, where the lead unit is the lead unit described above.

In some embodiments, the first support arm comprises a first portion located inside the plastic package body and a second portion located outside the plastic package body, the second portion being separable from the plastic package body;

the second support arm comprises a third part and a fourth part, the third part is located inside the plastic-sealed body, the fourth part is located outside the plastic-sealed body, and the fourth part can be separated from the plastic-sealed body.

According to the lead unit, the lead frame and the semiconductor packaging body, the first supporting arm is additionally arranged between the first die pad and the unit main body so as to increase the connecting supporting points between the first die pad and the unit main body, so that the first die pad can be more stably arranged on the unit main body, and similarly, the second supporting arm is additionally arranged between the second die pad and the unit main body so as to increase the connecting supporting points between the second die pad and the unit main body, so that the second die pad can be more stably arranged on the unit main body.

Drawings

Fig. 1 is a schematic structural diagram of a lead unit according to an embodiment of the present application;

fig. 2 is a schematic structural view of a first die pad and a first support arm, a second die pad and a second support arm in the lead unit shown in fig. 1;

FIG. 3 is a schematic structural diagram of a lead element according to another embodiment of the present application;

FIG. 4 is a schematic structural diagram of a lead frame according to an embodiment of the present application;

FIG. 5 is a schematic view of a semiconductor package according to an embodiment of the present application;

in the figure: the package structure comprises a 100-lead unit, a 200-lead frame, a 300-semiconductor package body, a 301-plastic package body, a 10-unit body, a 11-third pin, a 12-fourth pin, a 20-first die pad, a 30-second die pad, a 40-first pin, a 50-second pin, a 60-first supporting arm, a 70-second supporting arm, a 21-first bump, a 31-second bump, a 61-first groove and a 71-second groove.

Detailed Description

In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in detail below. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein.

In the description of the present invention, it is to be understood that the terms "central," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the utility model and to simplify the description, and are not intended to indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and are not to be considered limiting of the utility model.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.

In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can, for example, be fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.

In the present invention, unless otherwise expressly stated or limited, the first feature "on" or "under" the second feature may be directly contacting the first and second features or indirectly contacting the first and second features through an intermediate. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.

It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and the like as used herein are for illustrative purposes only and do not denote a unique embodiment.

Referring to fig. 1, an embodiment of the present invention provides a lead unit 100, which includes a unit body 10, a first die pad 20, a second die pad 30, a first lead 40, a second lead 50, a first support arm 60, and a second support arm 70. The first die pad 20 and the second die pad 30 are used for carrying a chip (not shown), and are respectively disposed on the unit body 10. The first lead 40 is coupled to the first die pad 20 and the second lead 50 is coupled to the second die pad 30. The first support arm 60 is supportedly coupled between the first die pad 20 and the unit body 10, and the second support arm 70 is supportedly coupled between the second die pad 30 and the unit body 10.

Specifically, in the present embodiment, the first die pad 20 and the second die pad 30 are disposed on the unit body 10 at an interval, and the chip is disposed between the first die pad 20 and the second die pad 30 in a straddling manner. The first lead 40 is coupled to the first die pad 20 while providing a supporting force to the first die pad 20 to be supported on the unit body 10. Also, the second lead 50 is coupled to the second die pad 30 while providing a supporting force for the second die pad 30 to be supported on the unit body 10.

The unit body 10 is also provided with a plurality of third leads 11 and a plurality of fourth leads 12. The third pins 11 are arranged at intervals with the first pins 40, but the third pins 11 are separated from the first die pad 20, that is, the third pins 11 are only functional pins, and the functions of the third pins 11 are different. The fourth pins 12 are respectively arranged at intervals with the second pins 50, but the fourth pins 12 are all arranged separately from the second die pad 30, that is, the fourth pins 12 are only functional pins, and the functions of the fourth pins 12 are different from each other.

The chips on the first die pad 20 and the second die pad 30 are respectively connected to the first lead 40, the second lead 50, the third leads 11 and the fourth leads 12 through a plurality of bonding wires, so as to electrically connect the chips to the leads.

Further, coupling the first lead 40 to the first end of the first die pad 20 enables the first lead 40 to provide some support for the first die pad 20. However, since the length of the first die pad 20 is long, the stability of the first die pad 20 cannot be ensured only by the first leads 40 alone. When the chip is fixed on the first die pad 20 for die bonding and wire bonding, the chip still shakes, which affects the quality of the chip. Therefore, the first support arm 60 is connected to a second end of the first die pad 20 opposite to the first end, so that the first pin 40 and the first support arm 60 cooperate to support the first die pad 20, thereby improving the stability of the first die pad 20. Similarly, coupling the second lead 50 to the first end of the second die pad 30 enables the second lead 50 to provide some support for the second die pad 30. However, since the length of the second die pad 30 is long, the stability of the second die pad 30 cannot be ensured only by the second leads 50 alone. When the chip is fixed on the second die pad 30 for die bonding and wire bonding, the chip still shakes, which affects the quality of the chip. Therefore, the second support arm 70 is connected to a second end of the second die pad 30 opposite to the first end, so that the second pin 50 and the second support arm 70 cooperate to support the second die pad 30, thereby improving the stability of the second die pad 30.

Further, the first die pad 20 is configured as an elongated structure, the first leads 40 and the plurality of third leads 11 are spaced apart from each other along the longitudinal direction of the first die pad 20, and the first leads 40 are coupled to a first end of the first die pad 20 along the longitudinal direction thereof. The first supporting arm 60 is connected to a second end of the first die pad 20 opposite to the first end along the longitudinal direction thereof, and is disposed between two adjacent third pins 11. The first support arm 60 is not connected to two adjacent third pins 11 located at both sides thereof, and therefore, does not affect the third pins 11.

Likewise, the second die pad 30 is configured in the same elongated structure as the first die pad 20, the second leads 50 and the plurality of fourth leads 12 are spaced apart from each other along the longitudinal direction of the second die pad 30, and the second leads 50 are coupled to a first end of the second die pad 30 along the longitudinal direction thereof. The second support arm 70 is connected to a second end of the second die pad 30 opposite to the first end along the longitudinal direction thereof, and is disposed between two adjacent fourth pins 12. The second support arm 70 is not connected to two adjacent fourth pins 12 located on both sides thereof, and therefore, does not affect the fourth pins 12.

The first support arms 60 are engaged with the first leads 40 to realize multi-point connection of the first die pad 20 to the unit body 10, thereby improving stability of the first die pad 20 to the unit body 10. The second support arm 70 is fitted to the second pin 50, and multi-point connection of the second die pad 30 on the unit body 10 can be achieved, whereby stability of the second die pad 30 on the unit body 10 can be improved. Therefore, when the chip is fixed between the first die pad 20 and the second die pad 30 and die bonding is performed, the bonding quality of the chip can be improved.

Referring to fig. 2, in some embodiments, one of the first die pad 20 and the first support arm 60 is provided with a first protrusion 21, and the other is provided with a first groove 61 matched with the first protrusion 21. One of the second die pad 30 and the second support arm 70 is provided with a second protrusion 31, and the other is provided with a second groove 71 matched with the second protrusion 31.

Specifically, the first protrusion 21 and the first groove 61 are inserted into each other, so that the first die pad 20 and the first support arm 60 can be fixedly connected, and the bonding force therebetween is increased. Similarly, the second bump 31 and the second groove 71 are inserted into each other, so that the second die pad 30 and the second support arm 70 can be fixedly connected, and the bonding force therebetween can be increased. Accordingly, the connection between the first support arm 60 and the first die pad 20 and the connection between the second support arm 70 and the second die pad 30 can be more stably secured, and the first die pad 20 and the second die pad 30 can be more stably mounted on the unit body 10.

Further, the first bump 21 is disposed on the first die pad 20, and the first groove 61 is opened on the first supporting arm 60. The second bump 31 is disposed on the second die pad 30, and the second recess 71 is opened on the second support arm 70. Specifically, a first groove 61 is formed in an end surface of the first support arm 60 facing the first die pad 20, a first protrusion 21 is convexly formed on one side of the first die pad 20 facing the first support arm 60, and the first protrusion 21 is inserted into the first groove 61, so that the first support arm 60 is fixedly connected with the first die pad 20.

The end surface of the second support arm 70 facing the second die pad 30 is provided with a second groove 71, one side of the second die pad 30 facing the second support arm 70 is convexly provided with a second bump 31, and the second bump 31 is inserted into the second groove 71, so that the second support arm 70 is fixedly connected with the second die pad 30.

This can improve the connection stability between the first support arm 60 and the first die pad 20, and between the second support arm 70 and the second die pad 30.

In some embodiments, the first support arm 60 and the second support arm 70 are both insulating support arms. Specifically, the first supporting arm 60 and the second supporting arm 70 are both made of insulating material substrates, and thus the first supporting arm 60 and the second supporting arm 70 only provide support for the first die pad 20 and the second die pad 30, but are not electrically connected to the first die pad 20 and the second die pad 30, and therefore, the creepage distance between the pins is not affected.

Further, the first support arm 60 and the second support arm 70 are made of the same material, and are made of one of plastic, organic polymer, inorganic polymer, polyester-imide, elastomer or glass fabric. It is understood that other similar insulating materials can be used for the first support arm 60 and the second support arm 70 to achieve the same effects, which are not described herein.

Referring to fig. 2, in some embodiments, the first support arms 60 include at least two spaced apart first support arms 60, and each first support arm 60 is supported and connected between the first die pad 20 and the unit body 10. The second support arms 70 include at least two spaced apart second support arms 70, and each of the second support arms 70 is supported and connected between the second die pad 30 and the unit body 10.

Specifically, in the present embodiment, in order to further improve the stability of the first die pad 20 and the second die pad 30, a plurality of first supporting arms 60 and a plurality of second supporting arms 70 may be provided according to the actual situation of the first die pad 20 and the second die pad 30. The plurality of first support arms 60 may be disposed between two adjacent third pins 11 in a one-to-one correspondence, and the plurality of second support arms 70 may be disposed between two adjacent fourth pins 12 in a one-to-one correspondence. This can further increase the supporting points of the first and second die pads 20, 30 on the unit body 10, thereby further improving the stability of the first and second die pads 20, 30.

Further, each first support arm 60 and each second support arm 70 are insulating support arms. Each first support arm 60 and each second support arm 70 are made of the same insulating material, so that when each first support arm 60 is correspondingly disposed between two adjacent third pins 11 and each second support arm 70 is correspondingly disposed between two adjacent fourth pins 12, the corresponding third pins 11 or the corresponding fourth pins 12 on both sides of the first support arm will not be affected, i.e., the creepage distance between the first die pad 20 and the second die pad 30 will not be changed.

Referring to fig. 3, based on the same concept as the lead unit 100, the present application provides a lead frame 200 including a plurality of lead units 100 as described above, the plurality of lead units 100 being sequentially arranged.

Specifically, each lead unit 100 correspondingly carries one chip, and therefore, in order to improve the manufacturing efficiency of the chip, a plurality of lead units 100 are generally arranged in an array to form a large lead frame 200, so that die bonding, wire bonding and plastic encapsulation of a plurality of chips can be realized, and the manufacturing efficiency is improved.

Referring to fig. 4, based on the same concept as the lead element 100, the present application provides a semiconductor package 300, which includes a plastic package body 301, the lead element 100 packaged in the plastic package body 301, and a chip soldered on the lead element 100, wherein the lead element 100 is the lead element 100 as described above.

After the die bonding and wire bonding process of the chip on the lead unit 100 is completed, the lead unit 100 and the chip on the lead unit 100 need to be packaged to protect the chip and the bonding wires for connecting the chip and the leads.

In some embodiments, the first support arm 60 includes a first portion located inside the plastic package body 301 and a second portion located outside the plastic package body 301, and the second portion can be separated from the plastic package body 301. The second support arm 70 includes a third portion located inside the plastic sealed body 301 and a fourth portion located outside the plastic sealed body 301, and the fourth portion can be separated from the plastic sealed body 301.

Specifically, in the present embodiment, after the die bonding and wire bonding processes are performed on the chip on the first die pad 20 and the second die pad 30, the chip and the lead unit 100 are encapsulated by the encapsulant 301. The specific position of the plastic package is located on each pin, even though a part of each pin is located inside the plastic package body 301, and another part is exposed outside the plastic package body 301. Thus, the first support arm 60 is also divided into a first portion located inside and a second portion located outside by the mold body 301, and the second support arm 70 is divided into a third portion located inside and a fourth portion located outside by the mold body 301.

Further, the semiconductor package 300 after the plastic package is subjected to a punching and blanking process, that is, the semiconductor package 300 is punched by a punching die, and a part of the leads exposed to the outside of the plastic package 301 is punched from the lead unit 100. Meanwhile, the second portion of the first support arm 60 exposed to the outside of the plastic sealed body 301 will be cut off along the outer wall surface of the plastic sealed body 301, and the fourth portion of the second support arm 70 exposed to the outside of the plastic sealed body 301 will be cut off along the outer wall surface of the plastic sealed body 301. Thereby, the number of pins on the semiconductor package 300 is ensured to remain unchanged.

When the present application is used specifically, the first supporting arm 60 is fixedly connected to the first protrusion 21 on the first die pad 20 through the first groove 61, so as to provide a supporting point for the first die pad 20 except the first pin 40, thereby improving the stability of the first die pad 20 on the unit main body 10.

The second support arm 70 is fixedly connected to the second bump 31 of the second die pad 30 through the second groove 71 to provide a supporting point for the second die pad 30 except for the second lead 50, thereby improving the stability of the second die pad 30 on the unit body 10.

Further, the chip is spanned between the first die pad 20 and the second die pad 30, the chip is connected with each pin one by one through a plurality of bonding wires, and the chip is electrically connected with the PCB circuit through each pin. The lead unit 100 is clamped and fixed by the clamping fixture, and die bonding and wire bonding operations are performed on the chip.

After die bonding and wire bonding, the lead unit 100 and the chip thereon are subjected to plastic package, and the lead unit 100 and the chip are subjected to plastic package by the plastic package body 301, thereby forming the semiconductor package body 300. After the plastic package is completed, the semiconductor package 300 is punched and blanked by using a punching die, each pin is punched from the lead unit 100, and the second portion of the first support arm 60 exposed to the outside of the plastic package 301 and the fourth portion of the second support arm 70 exposed to the outside of the plastic package 301 are separated from the plastic package 301 along the outer wall surface of the plastic package 301.

After the stamping, the semiconductor package 300 is subjected to subsequent electroplating and testing. And finishing the whole packaging process flow of the chip.

The lead unit 100, the lead frame 200 and the semiconductor package 300 in the above embodiments have at least the following advantages:

1) the first support arm 60 and the first pin 40 respectively support the opposite ends of the first die pad 20 on the unit body 10, and the second support arm 70 and the second pin 50 respectively support the opposite ends of the second die pad 30 on the unit body 10, so that the arrangement of the first die pad 20 and the second die pad 30 on the unit body 10 can be more stable;

2) the first support arm 60 and the second support arm 70 are both made of insulating material substrates and are not electrically connected with the first die pad 20 and the second die pad 30, so that the creepage distance between the pins is not affected;

3) the first and second support arms 60 and 70 may be provided in plurality according to the conditions of the first and second die pads 20 and 30, respectively, so that the support points of the first and second die pads 20 and 30 on the unit body 10 may be further increased, and the stability of the first and second die pads 20 and 30 may be further improved.

It should be noted that, as a most preferred embodiment in the present application, there is one first supporting arm 60 and one second supporting arm 70, and the first supporting arm 60 and the first lead 40 are respectively connected to two ends of the first die pad 20 opposite to each other along the longitudinal direction thereof, so as to provide the supporting force for the first die pad 20. The second support arm 70 and the second lead 50 are respectively connected to two opposite ends of the second die pad 30 along the longitudinal direction thereof to provide a supporting force for the second die pad 30. Accordingly, the entire structure of the lead unit 100 can be simplified while ensuring the stability of the first and second die pads 20 and 30.

The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.

The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the utility model. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.

Claims (10)

1. A lead element, comprising:

a unit main body;

a first die pad and a second die pad for carrying a chip, which are respectively arranged on the unit main body at intervals along the thickness direction of the unit main body;

a first pin coupled to the first die pad;

a second pin coupled to the second die pad;

a first support arm supported and connected between the first die pad and the unit body;

and the second supporting arm is supported and connected between the second die pad and the unit main body.

2. The lead element of claim 1, wherein one of said first die pad and said first support arm is provided with a first protrusion, and the other is provided with a first recess that mates with said first protrusion; and/or

One of the second die pad and the second support arm is provided with a second bump, and the other one is provided with a second groove matched with the second bump.

3. The lead element of claim 2, wherein said first bump is disposed on said first die pad, and said first recess is disposed on said first support arm; the second bump is arranged on the second tube core pad, and the second groove is arranged on the second supporting arm.

4. The lead element of claim 1, wherein said first and second support arms are each insulative support arms.

5. The pigtail unit of claim 4, wherein the first support arm and the second support arm are the same material and are each one of plastic, organic polymer, inorganic polymer, polyester-imide, elastomer, or glass fabric.

6. The lead element of claim 1, wherein said first support arms include at least two spaced apart arms, each of said first support arms being supportingly connected between said first die pad and said element body; the second support arm includes at least two that set up at interval each other, each the second support arm all support connect in the second die pad with between the unit main part.

7. The lead element of claim 6, wherein each of said first support arms and each of said second support arms are insulative support arms.

8. A lead frame comprising a plurality of lead elements according to any one of claims 1 to 7, the plurality of lead elements being arranged in series.

9. A semiconductor package, comprising a plastic package body, a lead unit packaged in the plastic package body, and a chip soldered on the lead unit, wherein the lead unit is the lead unit according to any one of claims 1 to 7.

10. The semiconductor package according to claim 9, wherein the first support arm comprises a first portion located inside the mold body and a second portion located outside the mold body, the second portion being separable from the mold body;

the second supporting arm comprises a third part located inside the plastic package body and a fourth part located outside the plastic package body, and the fourth part can be separated from the plastic package body.

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