CN216719898U - Telescopic pitch-variable mechanism for bearing silicon wafer - Google Patents
Telescopic pitch-variable mechanism for bearing silicon wafer Download PDFInfo
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- CN216719898U CN216719898U CN202122731679.XU CN202122731679U CN216719898U CN 216719898 U CN216719898 U CN 216719898U CN 202122731679 U CN202122731679 U CN 202122731679U CN 216719898 U CN216719898 U CN 216719898U
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Abstract
The utility model discloses a telescopic pitch-variable mechanism for bearing a silicon wafer, which comprises a lifting unit and a bearing unit, wherein the lifting unit comprises a rack and lifting power equipment, and further comprises a telescopic unit, the telescopic unit comprises a horizontal connecting plate and telescopic power equipment arranged on the horizontal connecting plate, the lifting power equipment is connected with the telescopic unit and drives the telescopic unit to reciprocate along the vertical direction, the telescopic power equipment is connected with the bearing unit and drives the bearing unit to reciprocate along the horizontal direction parallel to a vertical side plate, the horizontal mounting plate is positioned right below the horizontal connecting plate in a first working state, and part of the horizontal mounting plate is moved out of the lower part of the horizontal connecting plate in a second working state. According to the utility model, the telescopic unit is arranged, and the bearing unit is telescopic along the direction of the inserting sheet, so that the distance between the graphite boat and the inserting sheet position of the bearing unit is shortened, and the problem of insufficient stroke of the manipulator is solved.
Description
Technical Field
The utility model belongs to the field of silicon wafer transportation, and particularly relates to a telescopic variable-pitch mechanism for bearing a silicon wafer.
Background
In the photovoltaic industry, when silicon wafers are subjected to automatic film coating, texturing and etching, different processes have different requirements on the distance between the silicon wafers, in the prior art, a plurality of silicon wafers in a graphite boat are grabbed at one time through a mechanical arm and then inserted into a first variable pitch mechanism, the first variable pitch mechanism transfers the silicon wafers one by one to a belt conveying device below the first variable pitch mechanism in a descending process, a second variable pitch mechanism sequentially receives the silicon wafers on the belt conveying device in an ascending process, and the first variable pitch mechanism and the second variable pitch mechanism have different distances between an upper layer and a lower layer of the silicon wafers. Thereby realizing the variable pitch of different silicon chips. In some cases, the distance between the graphite boat and the first variable-pitch mechanism is large, the stroke of the manipulator between the graphite boat and the first variable-pitch mechanism is insufficient, and because the first variable-pitch mechanism cannot move, the graphite boat is usually moved in the prior art to solve the problem of insufficient stroke of the manipulator, so that the cost is high.
SUMMERY OF THE UTILITY MODEL
The utility model aims to provide a telescopic pitch-variable mechanism for bearing a silicon wafer, which can solve the problem of insufficient stroke of a manipulator by arranging a telescopic unit.
In order to achieve the above purpose, the present invention provides the following technical solutions: a telescopic pitch-variable mechanism for bearing silicon wafers comprises a lifting unit and a bearing unit, wherein the lifting unit comprises a rack and lifting power equipment arranged on the rack, the bearing unit comprises a horizontal mounting plate and two vertical side plates, the two vertical side plates are oppositely and parallelly arranged and connected to the horizontal mounting plate, the inner side surfaces of the vertical side plates are convexly provided with a plurality of layers of silicon wafer supporting structures which are sequentially arranged at intervals in the vertical direction,
still include flexible unit, flexible unit include the horizontal connecting plate with install in flexible power equipment on the horizontal connecting plate, lift power equipment connects flexible unit and drive flexible unit is along vertical direction reciprocating motion, flexible power equipment connects bearing unit and drive bearing unit is along being on a parallel with erect the horizontal direction reciprocating motion of curb plate, under the first operating condition, the horizontal mounting board is located under the horizontal connecting plate, under the second operating condition, the part of horizontal mounting board shifts out the below of horizontal connecting plate.
As a further improvement, the telescopic power equipment is a pen-shaped air cylinder, the horizontal mounting plate is provided with a slide rail, the horizontal connecting plate is provided with a slide block, and the slide rail and the slide block are matched with each other.
As a further improvement, each layer of the silicon wafer support structure comprises two support columns which are arranged at intervals along the horizontal direction parallel to the vertical side plate, and the support columns are vertically connected to the vertical side plate.
As a further improvement, the supporting columns are ceramic columns.
As a further refinement, the support column has a cylindrical surface.
As a further improvement, the horizontal mounting plate is provided with a first limiting plate for limiting the horizontal mounting plate to continuously move after reaching the second state from the first state and a second limiting plate for limiting the horizontal mounting plate to continuously move when reaching the first state from the second state.
As a further improvement, a first hydraulic buffer for buffering the impact when the horizontal mounting plate reaches the second state from the first state and a second hydraulic buffer for buffering the impact when the horizontal mounting plate reaches the first state from the second state are arranged on the horizontal mounting plate.
As a further improvement, the lifting power equipment is a linear module.
As a further improvement, the device also comprises a translation power device which is arranged on the horizontal mounting plate and drives the vertical side plate to move along the horizontal direction vertical to the vertical side plate.
As a further improvement, the device also comprises an upright connecting plate, wherein the upright connecting plate and the horizontal connecting plate are mutually connected in an L shape and are reinforced and connected through a triangular frame-shaped reinforcing rib.
Due to the application of the technical scheme, compared with the prior art, the utility model has the following advantages:
1) according to the telescopic variable-pitch mechanism for bearing the silicon wafer, the telescopic unit is arranged, and the bearing unit is telescopic along the direction of the inserting piece, so that the distance between the graphite boat and the inserting piece position of the bearing unit is shortened, and the problem of insufficient stroke of a manipulator is solved;
2) according to the telescopic variable-pitch mechanism for bearing the silicon wafer, each layer of silicon wafer supporting structure comprises two supporting columns, so that the contact area between the silicon wafer and the silicon wafer supporting structure can be reduced, and the condition that the silicon wafer supporting structure scratches the silicon wafer is further reduced;
3) according to the telescopic variable-pitch mechanism for bearing the silicon wafer, the supporting columns are ceramic columns, the surfaces of the ceramic columns are smooth, and therefore the condition that the silicon wafer supporting structure scratches the silicon wafer is reduced;
4) according to the telescopic variable-pitch mechanism for bearing the silicon wafer, disclosed by the utility model, the contact size between the cylindrical surface and the silicon wafer is further reduced, so that the silicon wafer is prevented from being scratched;
5) the telescopic variable-pitch mechanism for bearing the silicon wafer, disclosed by the utility model, can prevent the bearing unit from being separated from the telescopic unit by arranging the first limiting plate and the second limiting plate;
6) the telescopic variable-pitch mechanism for bearing the silicon wafer, disclosed by the utility model, can ensure that the operation of the bearing unit is softer and severe impact cannot occur by arranging the hydraulic buffer;
7) according to the telescopic variable-pitch mechanism for bearing the silicon wafers, the translation driving device is arranged, so that the silicon wafers on the variable-pitch mechanism are aligned up and down on one hand, and the telescopic variable-pitch mechanism is suitable for transferring the silicon wafers with different sizes on the other hand.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this application, illustrate embodiments of the application and, together with the description, serve to explain the application and are not intended to limit the application.
FIG. 1 is a left side view of the retractable variable pitch mechanism for supporting a silicon wafer according to the present invention;
FIG. 2 is a right side view of the retractable variable pitch mechanism for supporting a silicon wafer according to the present invention;
FIG. 3 is a perspective view of the retractable variable pitch mechanism for supporting silicon wafers according to the present invention.
Wherein, 11, lifting power equipment; 12. erecting a connecting plate; 13. a triangular frame-shaped reinforcing rib; 21. a horizontal mounting plate; 211. a first limit plate; 212. a second limiting plate; 213. a hydraulic buffer; 22. erecting a side plate; 23. a silicon wafer support structure; 231. a support pillar; 24. a translation power device; 31. a horizontal connecting plate; 311. a slider; 32. provided is a telescopic power device.
Detailed Description
The following detailed description of embodiments of the present invention is provided in connection with the accompanying drawings and examples.
It should be noted that the following detailed description is exemplary and is intended to provide further explanation of the disclosure. Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. It is noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of example embodiments according to the present application. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, and it should be understood that when the terms "comprises" and/or "comprising" are used in this specification, they specify the presence of stated features, steps, operations, devices, components, and/or combinations thereof, unless the context clearly indicates otherwise. In the present disclosure, terms such as "upper", "lower", "left", "right", "front", "rear", "vertical", "horizontal", "side", "bottom", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only relational terms determined for convenience in describing structural relationships of the parts or elements of the present disclosure, and do not refer to any parts or elements of the present disclosure, and are not to be construed as limiting the present disclosure. In the present disclosure, terms such as "fixedly connected", "connected", and the like are to be understood in a broad sense, and mean either a fixed connection or an integrally connected or detachable connection; may be directly connected or indirectly connected through an intermediate. The specific meanings of the above terms in the present disclosure can be determined on a case-by-case basis by persons skilled in the relevant art or technicians, and are not to be construed as limitations of the present disclosure.
The following is a preferred embodiment of the present invention, but is not intended to limit the scope of the present invention.
Example one
Referring to fig. 1 to 3, as shown in the drawings, a scalable pitch-variable mechanism for supporting silicon wafers comprises a lifting unit and a supporting unit, wherein the lifting unit comprises a frame (not shown in the drawings) and a lifting power device 11 mounted on the frame, the supporting unit comprises a horizontal mounting plate 21 and two vertical side plates 22, the two vertical side plates 22 are arranged oppositely and in parallel and connected to the horizontal mounting plate 21, the inner side surfaces of the vertical side plates 22 are convexly provided with a plurality of layers of silicon wafer supporting structures 23 which are sequentially arranged at intervals in the vertical direction, the scalable pitch-variable mechanism further comprises a scalable unit, the scalable unit comprises a horizontal connecting plate 31 and a scalable power device 32 mounted on the horizontal connecting plate 31, the lifting power device 11 is connected with the scalable unit and drives the scalable unit to reciprocate in the vertical direction, and the scalable power device 32 is connected with the supporting unit and drives the supporting unit to move parallel to the vertical direction The side plate 22 reciprocates in the horizontal direction, and in the first operation state, the horizontal mounting plate 21 is positioned directly below the horizontal connecting plate 31, and in the second operation state, a part of the horizontal mounting plate 21 is moved out of the position below the horizontal connecting plate 31.
Through setting up the telescoping unit among the above-mentioned technical scheme, the load cell is scalable along the inserted sheet direction to shorten the distance between graphite boat and the inserted sheet position of load cell, thereby solved the not enough problem of manipulator stroke. After the mechanical arm sucks a plurality of silicon wafers from the graphite boat at one time, the telescopic unit drives the bearing unit to extend out of the lower part of the horizontal connecting plate, the mechanical arm inserts the plurality of silicon wafers into the bearing unit, and the bearing unit retracts to the lower part of the horizontal connecting plate.
In a preferred embodiment of the present invention, the telescopic power device 32 is a pen-shaped cylinder, the horizontal mounting plate 21 is provided with a slide rail (not shown), the horizontal connecting plate 31 is provided with a slide block 311, and the slide rail and the slide block 311 are engaged with each other. The pen-shaped air cylinder occupies less space and has long stroke, and the whole size of the variable-pitch mechanism cannot be obviously increased.
In a preferred embodiment of the present invention, each layer of the silicon wafer support structure 23 includes two support columns 231 spaced apart from each other in a horizontal direction parallel to the upright side plates, and the support columns 231 are vertically connected to the upright side plates 22. In the technical scheme, each layer of silicon wafer supporting structure comprises two supporting columns, so that the contact area between the silicon wafer and the silicon wafer supporting structure can be reduced, and the condition that the silicon wafer supporting structure scratches the silicon wafer is further reduced.
In a preferred embodiment of the present invention, the supporting posts 231 are ceramic posts. Among the above-mentioned technical scheme, the support column is the ceramic post, and ceramic post surface is smooth, and then reduces the condition of silicon chip bearing structure fish tail silicon chip.
In a preferred embodiment of the present embodiment, the supporting column 231 has a cylindrical surface. The contact size of the surface of the cylinder and the silicon wafer is further reduced, and the silicon wafer is prevented from being scratched.
In a preferred embodiment of the present embodiment, the horizontal mounting plate 21 is provided with a first stopper plate 211 for restricting the horizontal mounting plate 21 from continuing to move after the horizontal mounting plate 21 reaches the second state from the first state, and a second stopper plate 212 for restricting the horizontal mounting plate 21 from continuing to move when the horizontal mounting plate 21 reaches the first state from the second state. In the above scheme, the first limiting plate and the second limiting plate are arranged, so that the bearing unit can be prevented from being separated from the telescopic unit. The horizontal mounting plate 21 is restricted from further moving after the first limiting plate 211 contacts the slider 311, and the horizontal mounting plate 21 is left idle after the second limiting plate 212 contacts the horizontal connecting plate 31.
In a preferred embodiment of the present embodiment, the horizontal mounting plate 21 is provided with a first hydraulic shock absorber 213 for absorbing a shock when the horizontal mounting plate reaches the second state from the first state, and a second hydraulic shock absorber 214 for absorbing a shock when the horizontal mounting plate reaches the first state from the second state. Among the above-mentioned technical scheme, through setting up hydraulic buffer, can guarantee to bear the weight of the operation of unit gentler, can not appear acutely striking.
In a preferred embodiment of the present invention, the lifting power device 11 is a linear module. The linear module runs stably, has large bearing capacity and is suitable for lifting of the variable pitch mechanism.
The preferred embodiment of the present invention further includes a translation power device 24 mounted on the horizontal mounting plate 21 and driving the vertical side plate 22 to move in a horizontal direction perpendicular to the vertical side plate 22. In the technical scheme, the translation driving device is arranged, so that the silicon wafers on the pitch-variable mechanism are aligned up and down on one hand, and the silicon wafer transfer mechanism is suitable for transferring the silicon wafers with different sizes on the other hand. The translation driving device is an air cylinder.
The preferred embodiment of the present embodiment further comprises an upright connecting plate 12, wherein the upright connecting plate 12 and the horizontal connecting plate 31 are connected to each other in an L-shape and are reinforced and connected by a triangular frame-shaped reinforcing rib 13.
The telescopic variable-pitch mechanism is arranged above the conveying belt, and the working process of the utility model is described as follows, which comprises the following steps:
(1) the bearing unit is positioned at a high position, and the manipulator grabs 20 silicon wafers in the graphite boat once and then inserts the silicon wafers into the bearing unit of the first variable-pitch mechanism once;
(2) the translation driving equipment of the first variable pitch mechanism drives the vertical side plates to approach, so that the silicon wafers on all layers are aligned;
(3) the lifting unit of the first pitch-changing mechanism drives the bearing unit to descend, the silicon wafer on the lowest layer firstly falls onto the conveying belt, and the lifting unit of the first pitch-changing mechanism continuously descends to sequentially fall the silicon wafers on the conveying belt;
(4) the lifting unit of the second pitch-changing mechanism drives the bearing unit to ascend, the silicon wafers on the conveying belt are conveyed to the silicon wafer supporting structure on the uppermost layer, the lifting unit of the second pitch-changing mechanism continues to ascend, and the silicon wafers on the conveying belt are sequentially transferred to the second pitch-changing mechanism.
The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention, including any reference to the above-mentioned embodiments. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the utility model. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (10)
1. A telescopic pitch-variable mechanism for bearing silicon wafers comprises a lifting unit and a bearing unit, wherein the lifting unit comprises a rack and lifting power equipment arranged on the rack, the bearing unit comprises a horizontal mounting plate and two vertical side plates, the two vertical side plates are oppositely and parallelly arranged and connected to the horizontal mounting plate, the inner side surfaces of the vertical side plates are convexly provided with a plurality of layers of silicon wafer supporting structures which are sequentially arranged at intervals in the vertical direction,
its characterized in that still includes flexible unit, flexible unit include the horizontal connecting plate with install in flexible power equipment on the horizontal connecting plate, lift power equipment connects flexible unit and drive flexible unit is along vertical direction reciprocating motion, flexible power equipment connects bearing unit and drive bearing unit is along being on a parallel with erect the horizontal direction reciprocating motion of curb plate, under the first operating condition, horizontal installation board is located under the horizontal connecting plate, under the second operating condition, horizontal installation board's part shifts out the below of horizontal connecting plate.
2. The retractable variable-pitch mechanism for bearing silicon wafers as claimed in claim 1, wherein the retractable power device is a pen-shaped cylinder, the horizontal mounting plate is provided with a slide rail, the horizontal connecting plate is provided with a slide block, and the slide rail and the slide block are matched with each other.
3. The retractable variable pitch mechanism for carrying silicon wafers of claim 1 wherein each layer of said silicon wafer support structure comprises two support columns spaced apart in a horizontal direction parallel to said upright side plates, said support columns being attached perpendicularly to said upright side plates.
4. The retractable variable pitch mechanism for carrying silicon wafers as claimed in claim 3, wherein said support posts are ceramic posts.
5. The retractable variable pitch mechanism for carrying silicon wafers as set forth in claim 3, wherein said support posts have cylindrical surfaces.
6. The retractable variable-pitch mechanism for supporting silicon wafers as claimed in claim 1, wherein the horizontal mounting plate is provided with a first limiting plate for limiting the horizontal mounting plate to move continuously after reaching the second state from the first state and a second limiting plate for limiting the horizontal mounting plate to move continuously when reaching the first state from the second state.
7. The retractable variable pitch mechanism for supporting silicon wafers as claimed in claim 1, wherein the horizontal mounting plate is provided with a first hydraulic buffer for buffering the impact of the horizontal mounting plate when the horizontal mounting plate reaches the second state from the first state and a second hydraulic buffer for buffering the impact of the horizontal mounting plate when the horizontal mounting plate reaches the first state from the second state.
8. The retractable variable pitch mechanism for supporting silicon wafers as recited in claim 1, wherein said lifting power device is a linear module.
9. The retractable variable pitch mechanism for supporting silicon wafers as claimed in claim 1, further comprising a translational power device mounted on said horizontal mounting plate and driving said vertical side plates to move in a horizontal direction perpendicular to said vertical side plates.
10. The retractable variable pitch mechanism for silicon wafer bearing according to claim 1, further comprising an upright connecting plate and a horizontal connecting plate, wherein the upright connecting plate and the horizontal connecting plate are connected with each other in an L shape and are reinforced and connected by a triangular frame-shaped reinforcing rib.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122731679.XU CN216719898U (en) | 2021-11-09 | 2021-11-09 | Telescopic pitch-variable mechanism for bearing silicon wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122731679.XU CN216719898U (en) | 2021-11-09 | 2021-11-09 | Telescopic pitch-variable mechanism for bearing silicon wafer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216719898U true CN216719898U (en) | 2022-06-10 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122731679.XU Active CN216719898U (en) | 2021-11-09 | 2021-11-09 | Telescopic pitch-variable mechanism for bearing silicon wafer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216719898U (en) |
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2021
- 2021-11-09 CN CN202122731679.XU patent/CN216719898U/en active Active
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