CN216718194U - Resolution ratio check test block device based on infrared detection system for defect detection - Google Patents
Resolution ratio check test block device based on infrared detection system for defect detection Download PDFInfo
- Publication number
- CN216718194U CN216718194U CN202122898923.1U CN202122898923U CN216718194U CN 216718194 U CN216718194 U CN 216718194U CN 202122898923 U CN202122898923 U CN 202122898923U CN 216718194 U CN216718194 U CN 216718194U
- Authority
- CN
- China
- Prior art keywords
- resolution
- test
- thickness
- test block
- detection system
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Photometry And Measurement Of Optical Pulse Characteristics (AREA)
Abstract
The utility model relates to the technical field of infrared detection, and discloses a resolution ratio checking test block device based on an infrared detection system for defect detection, which comprises a test block bottom plate, a spatial resolution ratio test card and a thickness resolution ratio test card; one side of the top of the test block bottom plate is a spatial resolution test area, the other side of the top of the test block bottom plate is a thickness resolution test area, and the height of the thickness resolution test area is higher than that of the thickness resolution test area; the spatial resolution test card is arranged on the spatial resolution test area, and the thickness resolution test card is arranged on the thickness resolution test area; the space resolution test card is divided into a plurality of identification areas, a stripe layer with different line pair density values is arranged in each area, and space character identifications corresponding to the line values are arranged on the stripe layer; the thickness resolution test card is divided into a plurality of identification areas, thin plates with different thicknesses are arranged, and thickness character identifications with corresponding thicknesses are arranged on the thin plates and used for verifying the work of the resolution verification of the infrared detection system.
Description
Technical Field
The utility model relates to the technical field of infrared detection, in particular to a resolution verification test block device of an infrared detection system for defect detection, which is used for verifying the resolution verification work of the infrared detection system.
Background
As a nondestructive testing technique, in order to verify the effectiveness of defect detection, a non-destructive testing technique usually needs to make a verification test block with the same or similar properties as natural defects for verifying the testing process, testing system and testing process, so as to ensure that the used testing technique, testing process parameters, testing equipment and process control can find the defects to be found, and the existing infrared testing technique is gradually used for detecting the defects of thin-layer materials such as thin-wall metal materials, composite materials and the like.
The infrared detection technology for detecting the defects is a detection technology which utilizes a thermal infrared imager to continuously and high-definition acquire video signals of infrared temperature information and obtain internal defect information of a detected object after image processing.
However, at present, there is no resolution verification test block of an infrared detection system for defect detection in China to perform system performance verification, and particularly if an infrared thermal imager is adopted for an infrared detection system for defect detection of composite materials and coatings with high quality requirements to measure temperature accuracy and temperature uniformity in a field of view accurately, the system is not suitable for the infrared detection system for defect detection.
Therefore, a device capable of verifying the resolution verification of the infrared detection system is needed to verify the image resolution and the minimum thickness resolution of the infrared detection system.
SUMMERY OF THE UTILITY MODEL
The utility model aims to provide a resolution ratio checking test block device based on an infrared detection system for defect detection, which is used for checking the resolution ratio checking work of the infrared detection system.
The utility model is realized by the following technical scheme: a resolution ratio check test block device based on an infrared detection system for defect detection comprises a test block bottom plate, a spatial resolution ratio test card and a thickness resolution ratio test card;
one side of the top of the test block bottom plate is a spatial resolution test area, the other side of the top of the test block bottom plate is a thickness resolution test area, and the height of the thickness resolution test area is higher than that of the thickness resolution test area;
the spatial resolution test card is arranged on the spatial resolution test area, and the thickness resolution test card is arranged on the thickness resolution test area;
the space resolution test card is divided into a plurality of identification areas, a stripe layer with different line pair density values is arranged in each area, and space character identifications with corresponding linear values are arranged on the stripe layer;
the thickness resolution test card is divided into a plurality of identification areas, thin plates with different thicknesses are arranged in each area, and thickness character identifications with corresponding thicknesses are arranged on the thin plates.
In the technical scheme, the spatial resolution test area is an infrared image definition spatial resolution area and is used for verifying infrared image definitions at different detection distances, and an infrared detection system is adopted in the spatial resolution test area to carry out shooting test on the definition verification test block at different distances to be detected. The thickness resolution verification area is used for verifying the thickness resolution difference of the detection system under different thicknesses, namely representing the temperature difference resolution of the infrared detection system, and a substrate is manufactured by adopting a typical detection object, namely the thickness resolution test area is higher than the spatial resolution test area and is used for mounting step test blocks with different thicknesses. The thickness resolution test area is tested and verified by adopting an infrared detection system, and the temperature resolution identification capability can be verified. According to the technical scheme, the same set of test block is adopted to verify different infrared detection systems and detection processes, so that the differences of the different detection systems and detection processes are determined, and the technical level of the infrared detection process is convenient to promote.
Further, the test block bottom plate is made of organic glass.
Further, the spatial resolution test card is divided into nine identification areas, and the nine identification areas are distributed in three rows and three columns.
Further, the thickness resolution test card is divided into nine identification areas, and the nine identification areas are distributed in three rows and three columns.
Further, the spatial resolution test card is made of lead foil.
Further, the stripe layer had an overall width of 10mm and an overall height of 6 mm.
Further, the stripe layer comprises 4 solid lines and 4 blank lines per millimeter, and the stripe density of the stripe layer (4) is 4LP/mm, 2LP/mm, 2.6LP/mm, 2LP/mm, 1.6LP/mm, 1.4LP/mm, 1.2LP/mm, 1LP/mm, and 0.8LP/mm, respectively.
In the technical scheme, a substrate is made of a typical detection object on a spatial resolution test card, and linear stripes with different heat conduction coefficients are reserved on the outer surface of the substrate in an external sticking, laser or other processing modes to form a stripe layer. The line pitch is equal to the line thickness, with the minimum line pair being 4.0LP/mm, representing 4 solid lines and 4 blank lines per mm, grouped in 9 groups. And (3) carrying out digital gray measurement on the line conditions with the unsharpness at different distances, and when the contrast curve between the adjacent lines is reduced to be less than 20% of the maximum and minimum of the adjacent gray, the line pair is unsharpness, namely the image recognition capability of the infrared detection system.
Further, the thickness resolution test card is made of an aluminum alloy.
In the technical scheme, the thickness resolution test card is made of 2024 aluminum alloy processing stepped test blocks.
Further, the thickness of the sheet is 1mm, 1.02mm, 1.05mm, 1.10mm, 1.16mm, 1.26mm, 1.42mm, 1.64mm and 2.00mm in order from thin to thick.
In the technical scheme, the thickness of the thin plate is optimally 1mm, the thickness of the intervertebral disc is increased in proportion to 1.02mm at the 2 nd position, the thickness is 2mm at the maximum, and the thickness is divided into 9 thickness differences; the step test block is put into the test block, and the back of the step needs to be exposed.
Further, a cavity is arranged below the thickness resolution test card.
In the technical scheme, a cavity is dug in the lower part of the thickness resolution test area, namely the center of the right side of the test block bottom plate, and is used for mounting stepped test blocks with different thicknesses.
Compared with the prior art, the utility model has the following advantages and beneficial effects:
(1) the utility model can ensure that the detection process method, the detection equipment and the detection parameter feasibility used by the infrared detection system for defect detection can be practically verified.
(2) The utility model adopts the same set of test block to verify different infrared detection systems and detection processes, determines the difference of the different detection systems and detection processes, and is convenient for improving the technical level of the infrared detection process.
Drawings
The utility model is further described with reference to the following figures and examples, all of which are intended to be covered by the present disclosure and the scope of the utility model.
Fig. 1 is a top view of a resolution verification test block device based on an infrared detection system for defect detection according to the present invention.
Fig. 2 is a cross-sectional view of a resolution verification test block device based on an infrared detection system for defect detection according to the present invention.
Wherein: 1. a test block base plate; 2. a spatial resolution test card; 2-1, a spatial resolution test area; 3. a thickness resolution test card; 3-1, a thickness resolution test area; 4. a striped layer; 5. a thin plate; 6. space character identification; 7. thickness character identification; 8. a cavity.
Detailed Description
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it should be understood that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments, and therefore should not be considered as a limitation to the scope of protection. All other embodiments, which can be obtained by a person skilled in the art without any inventive step based on the embodiments of the present invention, are within the scope of the present invention.
In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "disposed," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
Example 1:
the resolution ratio test block device based on the infrared detection system for defect detection in the embodiment is shown in fig. 1-2, 2 areas are distributed on a test block bottom plate 1, one side of the top of the test block bottom plate is a spatial resolution ratio test area 2-1, the other side of the top of the test block bottom plate is a thickness resolution ratio test area 3-1, a spatial resolution ratio test card 2 is arranged on the test block bottom plate 1, and the thickness resolution ratio test card 3 is mounted on the test block bottom plate 1 in a suspended mode. A spatial resolution test card 2 and a thickness resolution test card 3 which adopt high-precision machining are arranged on an organic glass plate. When the infrared detection system is used for testing, the spatial resolution and the thickness resolution under the corresponding detection conditions can be simultaneously identified, so that the spatial resolution and the thickness resolution of the infrared detection system can be tested, the verification and optimization of different detection process parameters can be met, different infrared detection systems and the like can be conveniently used, the spatial resolution and the thickness resolution of the infrared detection system for defect detection can be quickly carried out, the test effect can be conveniently and quickly compared, and the quick process parameter optimization and the capability comparison among different infrared detection systems are favorably carried out.
Example 2:
the embodiment is further optimized on the basis of the embodiment 1, the test block bottom plate 1 in the embodiment can be an organic glass plate, and can also be a bottom plate made of other materials, and the space resolution test card 2 and the thickness resolution test card 3 are processed or installed on the test block bottom plate 1.
Other parts of this embodiment are the same as embodiment 1, and thus are not described again.
Example 3:
the embodiment is further optimized on the basis of the embodiment 1, in the embodiment, the spatial resolution test card 2 is divided into a plurality of identification areas, which may be nine identification areas distributed in three rows and three columns, each of the nine identification areas of the spatial resolution test card 2 is provided with a stripe layer 4, each stripe layer 4 is provided with a plurality of spaced lines with different heat conduction coefficients, and the nine identification areas are divided into nine groups according to the density to the rarity of the lines in the stripe layer 4, and are used for distinguishing the spatial resolution and the image definition of the infrared detection system. As shown in fig. 1, the first row of the first column of the first stripe layer 4 in the first logo area of the spatial resolution test card 2 is processed with 4 solid lines per mm, i.e., 4LP/mm, the second row of the first column of the second logo area 4 is processed with 2LP/mm, the third row of the first column of the third logo area 4 is processed with 1.2LP/mm, the fourth row of the second column of the first row of the second logo area 4 is processed with 3.2LP/mm, the fifth row of the second column of the second logo area 4 is processed with 1.6LP/mm, the sixth row of the second column of the third logo area 4 is processed with 1LP/mm, the seventh row of the third column of the first row of the third stripe layer 4 is processed with 2.6LP/mm, the eighth row of the third column of the second row of the third stripe layer 4 is processed with 1.4LP/mm, the stripe layer 4 in the ninth logo area of the third row of the third column is processed according to 0.8LP/mm, which means that the spatial resolution is satisfied when each line in the stripe layer 4 pair is clearly recognized on the infrared image, for example, 4.0LP/mm when each line in the 4.0LP/mm pair is clearly recognized.
Other parts of this embodiment are the same as embodiment 1, and thus are not described again.
Example 4:
the embodiment is further optimized on the basis of the embodiment 1, in the embodiment, the thickness resolution test card 3 is divided into nine identification areas, and the thin plates 5 on the nine identification areas are divided into 9 layers from thin to thick, so as to test the thickness resolution and the thermal sensitivity of the infrared detection system. As shown in fig. 1, in the thickness resolution test card 3, the sheet 5 in the first logo area of the first row of the first column is processed to a thickness of 1mm, the sheet 5 in the second logo area of the second row of the first column is processed to a thickness of 1.02mm, the sheet 5 in the third logo area of the third row of the first column is processed to a thickness of 1.05mm, the sheet 5 in the fourth logo area of the first row of the second column is processed to a thickness of 1.10mm, the sheet 5 in the fifth logo area of the second row of the second column is processed to a thickness of 1.16mm, the sheet 5 in the sixth logo area of the third row of the second column is processed to a thickness of 1.26mm, the sheet 5 in the seventh logo area of the first row of the third column is processed to a thickness of 1.42mm, the sheet 5 in the bar in the eighth logo area of the second row of the third column is processed to a thickness of 1.64mm, the sheet 5 in the ninth identified area of the third row of the third column is processed to a thickness of 2.00 mm. When the aluminum alloy steps of 1.00mm and 1.02mm can be clearly distinguished on the infrared image, the aluminum alloy thickness difference of 0.02mm can be identified by the thickness resolution.
Other parts of this embodiment are the same as embodiment 1, and thus are not described again.
Example 5:
the embodiment is further optimized on the basis of the embodiment 1, in the embodiment, the spatial resolution test card 2 is manufactured by adopting lead foil processing, the lead foil processing is selected because of the soft and heavy characteristics of the lead foil, the manufacturing can be carried out more easily, and meanwhile, the heat conduction is slower.
Other parts of this embodiment are the same as embodiment 1, and thus are not described again.
Example 6:
in this embodiment, further optimization is performed on the basis of embodiment 1, as shown in fig. 1, in this embodiment, nine groups of stripe layers 4 in the identification area on the spatial resolution test card 2 correspond to nine groups of stripes with different line pair density values, respectively, the total width of the stripes is 10mm, the height of the stripes is 6mm, and a space character identification 6 with a corresponding line value is formed under each group of stripes by laser etching.
Other parts of this embodiment are the same as embodiment 1, and thus are not described again.
Example 7:
this example was further optimized on the basis of example 6, and there were nine different resolution test lines from 4LP/mm to 0.8LP/mm using ultrathin metal sheet processing, 4.0LP/mm, 3.2LP/mm, 2.6LP/mm, 2LP/mm, 1.6LP/mm, 1.4LP/mm, 1.2LP/mm, 1LP/mm, and 0.8LP/mm, respectively.
The other parts of this embodiment are the same as embodiment 6, and thus are not described again.
Example 8:
the embodiment is further optimized on the basis of embodiment 1, and in the embodiment, the thickness resolution test card is made of an aluminum thin plate, and the reason for selecting the aluminum thin plate is that the aluminum thin plate is fast in heat transfer and easy to process.
Other parts of this embodiment are the same as embodiment 1, and thus are not described again.
Example 9:
in this embodiment, nine thin plates 5 with different thicknesses are arranged in nine identification areas on the thickness resolution test card 3, the thin plates are processed according to the thinnest 1mm, each area is 15mm by 15mm, the thickness processing is subsequently performed according to the thicknesses of 1.02mm, 1.05mm, 1.10mm, 1.16mm, 1.26mm, 1.42mm, 1.64mm and 2.00mm, and the thickness character identification 7 with the corresponding thickness is etched by laser. Eight differences in thickness among the sheets 5 were found, 0.02mm, 0.03mm, 0.05mm, 0.07mm, 0.10mm, 0.15mm, 0.23mm and 0.34mm, respectively.
Other parts of this embodiment are the same as embodiment 1, and thus are not described again.
Example 10:
in this embodiment, as shown in fig. 2, a cavity 8 is provided on the right side of the top of the test block base plate 1 for mounting stepped test blocks with different thicknesses.
Other parts of this embodiment are the same as embodiment 1, and thus are not described again.
The above description is only a preferred embodiment of the present invention, and is not intended to limit the present invention in any way, and any simple modifications and equivalent variations of the above embodiment according to the technical spirit of the present invention are within the scope of the present invention.
Claims (10)
1. A resolution ratio check test block device based on an infrared detection system for defect detection is characterized by comprising a test block bottom plate (1), a spatial resolution ratio test card (2) and a thickness resolution ratio test card (3);
one side of the top of the test block bottom plate (1) is a spatial resolution test area (2-1), the other side of the top of the test block bottom plate is a thickness resolution test area (3-1), and the height of the thickness resolution test area (3-1) is higher than that of the spatial resolution test area (2-1); the spatial resolution test card (2) is arranged on the spatial resolution test area (2-1), and the thickness resolution test card (3) is arranged on the thickness resolution test area (3-1); the spatial resolution test card (2) is divided into a plurality of identification areas, a stripe layer (4) with different line pair density values is arranged in each area, and spatial character identifications (6) corresponding to the line values are arranged on the stripe layer (4); the thickness resolution test card (3) is divided into a plurality of identification areas, a thin plate (5) with different thicknesses is arranged in each area, and thickness character identifications (7) with corresponding thicknesses are arranged on the thin plate (5).
2. The device for checking the test block based on the resolution of the infrared detection system for detecting the defects is characterized in that the test block bottom plate (1) is made of organic glass.
3. The resolution verification test block device based on the infrared detection system for defect detection as claimed in claim 1, wherein the spatial resolution test card (2) is divided into nine identification areas, and the nine identification areas are distributed in three rows and three columns.
4. The resolution calibration test block device based on the infrared detection system for defect detection as claimed in claim 1, wherein the thickness resolution test card (3) is divided into nine identification areas, and the nine identification areas are distributed in three rows and three columns.
5. The resolution verification test block device based on the infrared detection system for defect detection as claimed in claim 1, wherein the spatial resolution test card (2) is made of lead foil.
6. The resolution verification test block device based on the infrared detection system for defect detection as claimed in claim 1, wherein the stripe layer (4) has an overall width of 10mm and an overall height of 6 mm.
7. The resolution proof test block device based on the infrared detection system for defect detection as claimed in claim 6, wherein the stripe layer (4) comprises 4 solid lines and 4 blank lines per millimeter, and the stripe density of the stripe layer (4) is 4LP/mm, 2LP/mm, 2.6LP/mm, 2LP/mm, 1.6LP/mm, 1.4LP/mm, 1.2LP/mm, 1LP/mm and 0.8LP/mm respectively.
8. The resolution proof test block device based on the infrared detection system for defect detection as claimed in claim 1, wherein the thickness resolution test card (3) is made of aluminum alloy.
9. The resolution proof test block device based on the infrared detection system for defect detection as claimed in claim 1, wherein the thickness of the thin plate (5) is 1mm, 1.02mm, 1.05mm, 1.10mm, 1.16mm, 1.26mm, 1.42mm, 1.64mm and 2.00mm in order from thin to thick.
10. The resolution proof test block device based on the infrared detection system for defect detection as claimed in claim 1, wherein the thickness resolution test area (3-1) is provided with a cavity (8) below.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122898923.1U CN216718194U (en) | 2021-11-24 | 2021-11-24 | Resolution ratio check test block device based on infrared detection system for defect detection |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122898923.1U CN216718194U (en) | 2021-11-24 | 2021-11-24 | Resolution ratio check test block device based on infrared detection system for defect detection |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216718194U true CN216718194U (en) | 2022-06-10 |
Family
ID=81881625
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122898923.1U Active CN216718194U (en) | 2021-11-24 | 2021-11-24 | Resolution ratio check test block device based on infrared detection system for defect detection |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216718194U (en) |
-
2021
- 2021-11-24 CN CN202122898923.1U patent/CN216718194U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US9879971B2 (en) | Device for film thickness measurement and method for film thickness measurement | |
| CN110118525B (en) | Method for detecting metal flatness by using multipoint matrix type eddy current sensor | |
| CN112763486B (en) | Composite material wall plate array hole detection method based on line laser scanning | |
| CN112381781B (en) | Glue road defect detection method based on 3D point cloud | |
| CN106643965B (en) | Method for accurately identifying liquid level by utilizing template matching | |
| CN108444921B (en) | Additive manufacturing component online detection method based on signal correlation analysis | |
| CN110232388B (en) | Method for identifying honeycomb edge from honeycomb core surface measurement data | |
| CN112634373B (en) | Visual measurement system dynamic correction method based on zero-expansion ceramic calibration plate | |
| CN117288099B (en) | Machine vision-based aluminum-plastic composite board production quality detection and analysis method | |
| CN216718194U (en) | Resolution ratio check test block device based on infrared detection system for defect detection | |
| CN112361977B (en) | Linear distance measuring method based on weight distribution | |
| CN106017352B (en) | A kind of measurement method of honeycomb core face shape | |
| CN103165492A (en) | Optical microscopic image detection method for TSV (through silicon vias) of wafer | |
| CN110220967B (en) | Automatic identification method for cluster crack surface profile by ACFM technology | |
| US11544837B2 (en) | Method for dynamically measuring deformation of rotating-body mold | |
| CN109269453B (en) | Method for determining number of single detection layers in high-frequency ultrasonic online detection in PBF additive manufacturing | |
| CN113721233A (en) | Three-dimensional optical measurement method for thermal barrier coating thickness of guide blade of multi-connected turbine | |
| CN220114246U (en) | Point pressure test system and laminator | |
| CN111721255A (en) | Flatness detection method and system | |
| CN113155648B (en) | Material micro-deformation measurement method and system based on impact test | |
| CN115272331A (en) | Corrugated paper quality detection method based on image processing | |
| CN111678928B (en) | Method and apparatus for analyzing semiconductor structure | |
| CN112508841B (en) | Dot matrix hollowed-out structure size deviation rapid characterization method based on industrial CT image | |
| CN218772231U (en) | Three-dimensional calibration plate and image measuring apparatus | |
| CN209820342U (en) | A examine utensil that is used for size distribution on dysmorphism variable thickness board |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |