CN113155648B - Material micro-deformation measurement method and system based on impact test - Google Patents
Material micro-deformation measurement method and system based on impact test Download PDFInfo
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- 238000012935 Averaging Methods 0.000 claims description 4
- 238000012360 testing method Methods 0.000 description 6
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- G01N3/00—Investigating strength properties of solid materials by application of mechanical stress
- G01N3/30—Investigating strength properties of solid materials by application of mechanical stress by applying a single impulsive force, e.g. by falling weight
- G01N3/303—Investigating strength properties of solid materials by application of mechanical stress by applying a single impulsive force, e.g. by falling weight generated only by free-falling weight
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/16—Measuring arrangements characterised by the use of optical techniques for measuring the deformation in a solid, e.g. optical strain gauge
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
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- G01N2203/0001—Type of application of the stress
- G01N2203/001—Impulsive
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- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2203/00—Investigating strength properties of solid materials by application of mechanical stress
- G01N2203/003—Generation of the force
- G01N2203/0032—Generation of the force using mechanical means
- G01N2203/0039—Hammer or pendulum
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2203/00—Investigating strength properties of solid materials by application of mechanical stress
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Abstract
The invention relates to a material microscopic deformation measuring method and system based on an impact test, wherein the method comprises the following steps: dotting the side surface of the sample to obtain a dot array surface; shooting a point array surface to obtain a first point array surface picture; shooting the point array surface of the sample after impact to obtain a second point array surface picture; processing the first lattice plane picture to obtain a first effective lattice map; calculating the first effective dot matrix graph to obtain a plurality of first dot matrix linear intervals; processing the second lattice plane picture to obtain a second effective lattice plane picture; calculating the second effective dot matrix diagram to obtain a plurality of second dot matrix straight line intervals; subtracting a second dot matrix linear distance corresponding to the first dot matrix linear distance from the first dot matrix linear distance to obtain a plurality of local deformation quantities; and accumulating the plurality of local deformation quantities to obtain a total deformation quantity. The invention replaces the existing manual measuring method of the microscopic deformation of the material, and improves the measuring precision of the local deformation.
Description
Technical Field
The invention relates to the technical field of material microscopic deformation quantity measurement, in particular to a material microscopic deformation quantity measuring method and system based on an impact test.
Background
The metal or composite material has wide application in the fields of automobile manufacture, material transportation, ocean engineering, aerospace and the like. The impact test is a test for researching the dynamic load resistance of the material, the dynamic load and the static load have different effects, the stress in the material is suddenly improved due to the high loading speed, and the deformation speed influences the mechanical property of the material, so that the material shows another reaction to the dynamic load effect. Materials that tend to be very plastic under static loads exhibit brittle behavior under dynamic loads. Therefore, the method has important practical significance in experimental research on the impact performance of the metal sample.
At present, most of the existing measuring methods for the deformation quantity of the cross section of a sample in a drop hammer impact test are manual measurement of the total deformation quantity before and after impact through tools such as a screw micrometer and the like after the impact is finished. However, this method cannot accurately measure the local deformation of the cross section in the impact process, has a large error, and cannot obtain the local deformation of the cross section and the relationship between the deformation and the impact frequency. Meanwhile, the existing measuring method for the deformation quantity of the cross section of the sample in the drop hammer impact test has higher requirement on the device for preventing secondary impact on the test bed, and the cost of the test bed is correspondingly improved.
Disclosure of Invention
The invention aims to provide a material micro-deformation measuring method and system based on an impact test, and aims to solve the problem that the error of the existing material micro-deformation measuring method for measuring the local deformation of a cross section is large.
In order to achieve the purpose, the invention provides the following scheme:
a method for measuring microscopic deformation of a material based on an impact test, comprising:
dotting the side surface of the sample to obtain a dot array surface;
shooting the point array surface to obtain a first point array surface picture;
shooting the point array surface of the sample after impact to obtain a second point array surface picture;
processing the first lattice plane picture to obtain a first effective lattice map;
calculating the first effective dot matrix diagram to obtain a plurality of first dot matrix linear intervals;
processing the second lattice plane picture to obtain a second effective lattice plane picture;
calculating the second effective dot matrix diagram to obtain a plurality of second dot matrix straight line intervals;
subtracting the second dot matrix linear distance corresponding to the first dot matrix linear distance from the first dot matrix linear distance to obtain a plurality of local deformation quantities;
and accumulating the local deformation quantities to obtain a total deformation quantity.
Optionally, dotting the side surface of the sample to obtain a point front, specifically including:
and marking a dot matrix with fixed transverse and longitudinal intervals on the side surface of the sample by using an ultraviolet marking machine to obtain a dot array surface.
Optionally, the processing the first lattice plane picture to obtain a first effective lattice map specifically includes:
filtering the first point array picture to obtain a first point array filtering picture;
carrying out binarization processing on the first point array surface filtering picture to obtain a first binarized picture;
screening the area and the roundness of the first binary picture, and taking the area obtained after screening as a first effective point;
and determining a first effective bitmap according to a plurality of first effective points.
Optionally, the calculating the first effective bitmap to obtain a plurality of first linear dot matrix spacings includes:
extracting a first effective point coordinate in the first effective bitmap;
performing linear fitting on the first effective point coordinates of each line by adopting a least square method to obtain a fitting straight line of each line;
and obtaining the distance between the adjacent fitting straight lines by using a distance formula between the two parallel straight lines to obtain a plurality of first lattice straight line distances.
Optionally, the screening of the area and the roundness of the first binarized picture is performed, and an area obtained after the screening is used as a first effective point, which specifically includes:
opening the first binary picture to obtain a first smooth picture;
and extracting the characteristics of a white area in the first smooth picture, and screening an area with the area of 1500-3500 pixels and the roundness of the area of more than 0.65 as a first effective point.
Optionally, the processing the second lattice plane picture to obtain a second effective lattice map specifically includes:
filtering the second point array surface picture to obtain a second point array surface filtering picture;
performing binarization processing on the second point array surface filtering picture to obtain a second binarization picture;
screening the area and the roundness of the second binary image, and taking the area obtained after screening as a second effective point;
and determining a second effective lattice diagram according to a plurality of second effective points.
Optionally, the calculating the second effective lattice diagram to obtain a plurality of second lattice straight line distances includes:
extracting a second effective point coordinate in the second effective bitmap;
performing linear fitting on the second effective point coordinates of each line by adopting a least square method to obtain a fitting straight line of each line;
calculating the slope of the fitting straight line of each line to obtain a plurality of slopes;
averaging a plurality of the slopes to obtain an average slope;
assigning the average slope to the fitting straight line of each row, and keeping the intercept unchanged to obtain the fitting straight lines with the same slope;
and calculating the distance between the adjacent fitting straight lines with the same slope by using a distance formula between the two parallel straight lines to obtain the distance between the second lattice straight lines.
Optionally, the screening of the area and the roundness of the second binarized picture is performed, and an area obtained after the screening is used as a second effective point, which specifically includes:
opening the second binary image to obtain a second smooth image;
and extracting the characteristics of the white area in the second smooth picture, and screening the area with the area of 1500-3500 pixels and the roundness of the area of 0.65 or more as a second effective point.
A material microscopic deformation quantity measuring system based on an impact test comprises:
the dotting module is used for dotting the side surface of the sample to obtain a dot array surface;
the shooting module is used for shooting the point array surface to acquire a first point array surface picture; the system is also used for shooting the point array surface of the sample after impact to obtain a second point array surface picture;
the image processing module is used for processing the first lattice plane image to obtain a first effective lattice diagram, and calculating the first effective lattice diagram to obtain a plurality of first lattice linear intervals; the second effective dot matrix image is calculated to obtain a plurality of second dot matrix linear intervals;
the local deformation quantity calculation module is used for subtracting the second lattice linear distance corresponding to the first lattice linear distance from the first lattice linear distance to obtain a plurality of local deformation quantities;
and the total deformation quantity calculating module is used for accumulating the local deformation quantities to obtain a total deformation quantity.
Optionally, the shooting module is a CCD camera.
According to the specific embodiment provided by the invention, the invention discloses the following technical effects:
the method comprises the steps of obtaining a first dot array picture and a second dot array picture, respectively processing the first dot array picture and the second dot array picture, obtaining a plurality of first dot array linear intervals and a plurality of second dot array linear intervals, subtracting the corresponding second dot array linear intervals from the first dot array linear intervals, obtaining deformation quantity among each row of dot arrays, and obtaining a plurality of local deformation quantities; and accumulating the plurality of local deformation quantities to obtain a total deformation quantity. The local deformation of the sample is obtained by processing the picture, the existing method for manually measuring the microscopic deformation of the material is replaced, and the measurement precision of the local deformation is improved.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to these drawings without creative efforts.
FIG. 1 is a flow chart of a method for measuring microscopic deformation of a material based on an impact test according to the present invention;
FIG. 2 is a diagram showing the dimensions of the side surface of the sample and the dot matrix after dotting;
FIG. 3 is a first wavefront picture;
FIG. 4 is a first wavefront filtered picture;
FIG. 5 is a first effective bitmap;
FIG. 6 is a linear fit straight line graph of the first effective bitmap;
fig. 7 is a system block diagram of a material micro deformation quantity measuring system based on an impact test.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be obtained by a person skilled in the art without making any creative effort based on the embodiments in the present invention, belong to the protection scope of the present invention.
The invention aims to provide a material micro deformation measuring method and system based on an impact test, and aims to solve the problem that the existing material micro deformation measuring method is large in error in measuring local deformation of a cross section.
In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in further detail below.
The embodiment provides a material microscopic deformation measuring method based on an impact test, which measures the cross-sectional deformation of a sample in a drop hammer impact test through image processing.
Fig. 1 is a flow chart of a method for measuring microscopic deformation of a material based on an impact test, as shown in fig. 1, including: the test material used was first cut into a plurality of samples having the same shape and size. The utility model provides a drop hammer impact test detection device, the rigidity of sample is guaranteed through anchor clamps, with the high accuracy CCD camera of drop hammer impact test detection device separately-installed, the environment of shooing the same around having guaranteed to strike. The deformation measurement was performed on the sample by the following method.
Step 101: and dotting the side surface of the sample to obtain a dot array surface.
The dotting of the side surface of the sample to obtain a point array surface specifically comprises the following steps:
and marking a dot matrix with fixed transverse and longitudinal intervals on the side surface of the sample by using an ultraviolet marking machine to obtain a dot array surface, namely completing the preparation of the sample, wherein the transverse intervals of the dot matrix are 0.4cm, the longitudinal intervals of the dot matrix are 0.25cm, and the height of the sample is 10cm, as shown in figure 2.
Step 102: the wavefront is photographed to obtain a first wavefront picture, as shown in fig. 3.
Step 103: and shooting the point array surface of the sample after impact to obtain a second point array surface picture.
Specifically, a sample is placed under an impact tester and photographed by a high-precision CCD camera which has been fixed in position relatively, and then the sample is impacted and stopped at an appropriate time according to the purpose of the test. And after stopping, the sample is photographed by using the high-precision CCD camera under the condition that the foreground depth is kept basically unchanged. The samples were photographed under the same conditions to obtain the point front pictures before and after the impact. If deformation data under different impact times are needed, the sample needs to be photographed according to the requirements when the machine is stopped every time.
Step 104: and processing the first lattice plane picture to obtain a first effective lattice map.
Preprocessing the first effective bitmap, removing noise points by adopting a Gaussian filtering or median filtering mode, wherein the median filtering is adopted in the invention, the size of the scale is about 20, as shown in figure 4, and then, continuously performing self-adaptive binarization processing on the processed picture. Because various plaques often exist in an actual sample, and the plaques are difficult to be completely removed through filtering, binaryzation processing needs to be performed on the picture after noise points are removed, and area and roundness screening needs to be performed after the binaryzation processing, so that an effective dot matrix image can be finally obtained.
The processing the first lattice plane picture to obtain a first effective lattice plane picture specifically includes:
filtering the first point array picture to obtain a first point array filtering picture; carrying out binarization processing on the first point array surface filtering picture to obtain a first binarized picture; screening the area and the roundness of the first binarized picture, and taking the area obtained after screening as a first effective point; a first effective bitmap is determined from a plurality of said first effective points, as shown in fig. 5.
The area and the roundness of the first binary image are screened, and an area obtained after screening is used as a first effective point, and the method specifically comprises the following steps:
opening the first binary picture to obtain a first smooth picture; and extracting the characteristics of a white area in the first smooth picture, and screening an area with the area of 1500-3500 pixels and the roundness of the area of 0.65 or more as a first effective point.
The opening operation is performed first, then the characteristics of the white area in the picture are extracted, and the areas with too large area, too small area and too small roundness are deleted, that is, the area with the area of 1500 to 3500 pixels and the roundness of 0.65 or more is generally regarded as the valid point. The centroid coordinates are extracted from the reserved white area, the positions of points corresponding to the centroid coordinates in the dot matrix can be well arranged by adopting a twice bubbling sorting method, and in the embodiment, the extracted horizontal and vertical coordinates are respectively stored in two matrixes, so that the following straight line fitting and distance calculation are facilitated.
Step 105: and calculating the first effective dot matrix chart to obtain a plurality of first dot matrix linear intervals.
The calculating the first effective dot matrix map to obtain a plurality of first dot matrix linear intervals specifically includes:
extracting a first effective point coordinate in the first effective bitmap; performing linear fitting on the first effective point coordinates of each line by using a least square method to obtain a fitted straight line of each line, as shown in fig. 6; and obtaining the distance between the adjacent fitting straight lines by using a distance formula between the two parallel straight lines to obtain a plurality of first lattice straight line distances.
Step 106: and processing the second lattice plane picture to obtain a second effective lattice plane picture.
Processing the second lattice plane picture to obtain a second effective lattice plane picture, which specifically comprises:
filtering the second point array surface picture to obtain a second point array surface filtering picture; performing binarization processing on the second point array surface filtering picture to obtain a second binarization picture; screening the area and the roundness of the second binary image, and taking the area obtained after screening as a second effective point; and determining a second effective bitmap according to a plurality of second effective points.
The area and the roundness of the second binarization picture are screened, and an area obtained after screening is used as a second effective point, and the method specifically comprises the following steps:
opening the second binary image to obtain a second smooth image; and extracting the characteristics of a white area in the second smooth picture, and screening an area with the area of 1500-3500 pixels and the roundness of the area of more than 0.65 as a second effective point.
Step 107: and calculating the second effective dot matrix diagram to obtain a plurality of second dot matrix straight line intervals.
And after a second effective dot matrix diagram is obtained, extracting coordinates of second effective points in the second effective dot matrix diagram, performing straight line fitting on the coordinates of the second effective points in each line by using a least square method to obtain fitted straight lines, then taking the mean value of the slope of each fitted straight line, endowing the mean value to each straight line again, and keeping the intercept constant. And then, the distance formula between the two parallel straight lines is utilized to obtain the distance between the adjacent fitting straight lines with the same slope. The effective dot matrix images before and after impact are processed in the same mode, and deformation quantity, namely local deformation quantity, between each row of dot matrixes can be obtained by subtracting the linear distance of the dot matrixes after impact corresponding to the linear distance of the dot matrixes before impact from the linear distance of the dot matrixes before impact. And accumulating the local deformation quantities of each row to obtain a total deformation quantity.
Calculating the second effective dot matrix diagram to obtain a plurality of second dot matrix linear intervals, and specifically comprising:
extracting a second effective point coordinate in the second effective dot matrix; performing linear fitting on the second effective point coordinates of each line by adopting a least square method to obtain a fitting straight line of each line; calculating the slope of the fitting straight line of each line to obtain a plurality of slopes; averaging a plurality of the slopes to obtain an average slope; assigning the average slope to the fitting straight line of each row, and keeping the intercept unchanged to obtain the fitting straight lines with the same slope; and calculating the distance between the adjacent fitting straight lines with the same slope by using a distance formula between the two parallel straight lines to obtain the distance between the second lattice straight lines.
Step 108: and subtracting the second lattice linear distance corresponding to the first lattice linear distance from the first lattice linear distance to obtain a plurality of local deformation quantities.
Step 109: and accumulating the local deformation quantities to obtain a total deformation quantity.
The obtained local deformation is plotted, and the relationship between the deformation and the impact frequency can be obtained by taking the impact frequency as a horizontal axis and the local deformation or the total deformation as a vertical axis.
And (3) carrying out impact tests on samples of the same material by adopting different impact times, repeating the steps 101-109, and obtaining the relationship between the impact times and the deformation quantity of the material after multiple tests.
In summary, the following steps: the method for measuring the cross-sectional deformation amount of the sample in the drop hammer impact test by utilizing image processing provided by the invention well replaces the original mode of manual measurement through a mechanical tool, reduces the workload and improves the accuracy of data acquisition.
Fig. 7 is a system block diagram of a material micro deformation quantity measuring system based on an impact test, as shown in fig. 7, including:
and the dotting module 201 is used for dotting the side surface of the sample to obtain a point array surface.
The shooting module 202 is configured to shoot the wavefront to obtain a first wavefront picture; and the system is also used for shooting the point array surface of the sample after impact to acquire a second point array surface picture. Optionally, the shooting module 202 is a CCD camera.
The image processing module 203 is configured to process the first lattice plane image to obtain a first effective lattice map, and calculate the first effective lattice map to obtain a plurality of first lattice linear intervals; and the second effective lattice diagram is calculated to obtain a plurality of second lattice straight line intervals.
The local deformation amount calculation module 204 is configured to subtract the second lattice linear distance corresponding to the first lattice linear distance from the first lattice linear distance to obtain a plurality of local deformation amounts.
And a total deformation amount calculating module 205, configured to accumulate the plurality of local deformation amounts to obtain a total deformation amount.
The embodiments in the present description are described in a progressive manner, each embodiment focuses on differences from other embodiments, and the same and similar parts among the embodiments are referred to each other. For the system disclosed by the embodiment, the description is relatively simple because the system corresponds to the method disclosed by the embodiment, and the relevant points can be referred to the description of the method part.
The principle and the embodiment of the present invention are explained by applying specific examples, and the above description of the embodiments is only used to help understanding the method and the core idea of the present invention; meanwhile, for a person skilled in the art, according to the idea of the present invention, the specific embodiments and the application range may be changed. In view of the above, the present disclosure should not be construed as limiting the invention.
Claims (8)
1. A material micro-deformation measuring method based on an impact test is characterized by comprising the following steps:
dotting the side surface of the sample to obtain a dot array surface;
shooting the point array surface to obtain a first point array surface picture;
shooting the point array surface of the sample after impact to obtain a second point array surface picture;
processing the first lattice plane picture to obtain a first effective lattice map;
calculating the first effective dot matrix diagram to obtain a plurality of first dot matrix linear intervals;
the calculating the first effective dot matrix map to obtain a plurality of first dot matrix linear intervals specifically includes:
extracting a first effective point coordinate in the first effective bitmap;
performing linear fitting on the first effective point coordinates of each line by adopting a least square method to obtain a fitting straight line of each line;
obtaining the distance between adjacent fitting straight lines by using a distance formula between the two parallel straight lines to obtain a plurality of first lattice straight line distances;
processing the second lattice plane picture to obtain a second effective lattice plane picture;
calculating the second effective dot matrix diagram to obtain a plurality of second dot matrix straight line intervals;
calculating the second effective dot matrix diagram to obtain a plurality of second dot matrix linear intervals, and specifically comprising:
extracting a second effective point coordinate in the second effective dot matrix;
performing linear fitting on the second effective point coordinates of each line by adopting a least square method to obtain a fitting straight line of each line;
calculating the slope of the fitting straight line of each line to obtain a plurality of slopes;
averaging a plurality of the slopes to obtain an average slope;
assigning the average slope to the fitting straight line of each row, and keeping the intercept unchanged to obtain the fitting straight lines with the same slope;
obtaining the distance between adjacent fitting straight lines with the same slope by using a distance formula between the two parallel straight lines to obtain the distance between the second lattice straight lines;
subtracting the second dot matrix linear distance corresponding to the first dot matrix linear distance from the first dot matrix linear distance to obtain a plurality of local deformation quantities;
and accumulating the local deformation quantities to obtain a total deformation quantity.
2. The method for measuring the microscopic deformation of a material based on an impact test according to claim 1, wherein the dotting the side surface of the sample to obtain a point front comprises:
and marking a dot matrix with fixed transverse and longitudinal intervals on the side surface of the sample by using an ultraviolet marking machine to obtain a dot array surface.
3. The method for measuring the microscopic deformation of a material based on an impact test according to claim 1, wherein the processing the first lattice plane image to obtain a first effective lattice plane image specifically comprises:
filtering the first point array picture to obtain a first point array filtering picture;
carrying out binarization processing on the first point array filtering picture to obtain a first binarized picture;
screening the area and the roundness of the first binarized picture, and taking the area obtained after screening as a first effective point;
and determining a first effective bitmap according to a plurality of first effective points.
4. The method for measuring the microscopic deformation of a material according to claim 3, wherein the screening of the area and the roundness of the first binarized image is performed, and the area obtained after the screening is used as a first effective point, specifically comprising:
opening the first binary picture to obtain a first smooth picture;
and extracting the characteristics of a white area in the first smooth picture, and screening an area with the area of 1500-3500 pixels and the roundness of the area of 0.65 or more as a first effective point.
5. The method for measuring the microscopic deformation of a material based on an impact test according to claim 1, wherein the processing the second lattice plane image to obtain a second effective lattice plane image specifically comprises:
filtering the second point array surface picture to obtain a second point array surface filtering picture;
performing binarization processing on the second point array surface filtering picture to obtain a second binarization picture;
screening the area and the roundness of the second binary image, and taking the area obtained after screening as a second effective point;
and determining a second effective bitmap according to a plurality of second effective points.
6. The method for measuring the microscopic deformation of the material based on the impact test as claimed in claim 5, wherein the step of screening the area and the roundness of the second binarized picture and using the screened area as the second valid point comprises:
opening the second binary image to obtain a second smooth image;
and extracting the characteristics of the white area in the second smooth picture, and screening the area with the area of 1500-3500 pixels and the roundness of the area of 0.65 or more as a second effective point.
7. A system for measuring microscopic deformation of a material based on an impact test, comprising:
the dotting module is used for dotting the side surface of the sample to obtain a dot array surface;
the shooting module is used for shooting the point array surface to acquire a first point array surface picture; the system is also used for shooting the point array surface of the sample after impact to obtain a second point array surface picture;
the image processing module is used for processing the first lattice plane image to obtain a first effective lattice map, and calculating the first effective lattice map to obtain a plurality of first lattice linear intervals; the second effective dot matrix image is calculated to obtain a plurality of second dot matrix linear intervals;
the calculating the first effective dot matrix map to obtain a plurality of first dot matrix linear intervals specifically includes:
extracting a first effective point coordinate in the first effective bitmap;
performing linear fitting on the first effective point coordinates of each line by adopting a least square method to obtain a fitting straight line of each line;
obtaining the distance between adjacent fitting straight lines by using a distance formula between the two parallel straight lines to obtain a plurality of first lattice straight line distances;
calculating the second effective dot matrix diagram to obtain a plurality of second dot matrix linear intervals, and specifically comprising:
extracting a second effective point coordinate in the second effective dot matrix;
performing linear fitting on the second effective point coordinates of each line by adopting a least square method to obtain a fitting straight line of each line;
calculating the slope of the fitting straight line of each line to obtain a plurality of slopes;
averaging a plurality of the slopes to obtain an average slope;
assigning the average slope to the fitting straight line of each row, and keeping the intercept unchanged to obtain the fitting straight lines with the same slope;
obtaining the distance between adjacent fitting straight lines with the same slope by using a distance formula between the two parallel straight lines to obtain the distance between the second lattice straight lines;
the local deformation quantity calculation module is used for subtracting the second lattice linear distance corresponding to the first lattice linear distance from the first lattice linear distance to obtain a plurality of local deformation quantities;
and the total deformation quantity calculating module is used for accumulating the local deformation quantities to obtain a total deformation quantity.
8. The system of claim 7, wherein the camera module is a CCD camera.
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| CN202110539000.9A CN113155648B (en) | 2021-05-18 | 2021-05-18 | Material micro-deformation measurement method and system based on impact test |
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