CN216698399U

CN216698399U - Plasma jet device, spraying equipment and solar cell manufacturing equipment

Info

Publication number: CN216698399U
Application number: CN202123269140.3U
Authority: CN
Inventors: 林维乐; 陈国栋; 刘召辉; 王燕东; 郭永胜
Original assignee: Contemporary Amperex Technology Co Ltd
Current assignee: Contemporary Amperex Technology Co Ltd
Priority date: 2021-12-23
Filing date: 2021-12-23
Publication date: 2022-06-07
Anticipated expiration: 2031-12-23
Also published as: WO2023116358A1

Abstract

The application discloses plasma jet apparatus, spraying equipment and solar cell manufacture equipment, plasma spraying equipment includes ionization injection mechanism, gas transmission passageway and medium conveying mechanism. The gas delivery channel is in communication with the ionization spray mechanism and is used for delivering gas to the ionization spray mechanism, and the ionization spray mechanism is used for ionizing gas. The medium conveying mechanism comprises a feeding channel and a spiral feeder arranged in the feeding channel, the feeding channel is communicated with the ionization spraying mechanism, and the spiral feeder is used for conveying the medium in the feeding channel to the ionization spraying mechanism so as to melt and spray the medium. The plasma jet device, the spraying equipment and the solar cell manufacturing equipment provided by the embodiment of the application can accurately control the ejection quantity of the medium and solve the problem of low film forming quality caused by the fact that the ejection quantity of the medium cannot be accurately controlled.

Description

Plasma jet device, spraying equipment and solar cell manufacturing equipment

Technical Field

The application relates to the field of battery manufacturing equipment, in particular to a plasma spraying device, spraying equipment and solar battery manufacturing equipment.

Background

A solar cell is a device that directly converts solar energy into electrical energy using the photovoltaic effect. To date, a wide variety of solar cells have been developed. The method comprises the following steps: single crystalline silicon solar cells, polycrystalline silicon solar cells, amorphous silicon solar cells, compound semiconductor solar cells, and the like.

In solar cell manufacturing, thermal spray techniques are typically used to spray the light energy absorbing material onto the substrate. The thermal spraying technique is a surface processing method in which a heat source is used to rapidly heat a spray material to a molten or semi-molten state, and the spray material is atomized and accelerated to be sprayed onto the surface of a pretreated workpiece through a high-speed gas flow or flame flow, thereby forming a coating. However, the existing spray coating device cannot adjust the ejection amount of the medium.

SUMMERY OF THE UTILITY MODEL

In view of the above, the present application provides a plasma spraying device, a spraying apparatus, and a solar cell manufacturing apparatus, which can solve the problem that the amount of ejected medium cannot be accurately controlled.

In a first aspect, the present application provides a plasma j et apparatus comprising an ionization j et mechanism, a gas delivery channel, and a medium delivery mechanism. The gas conveying channel is communicated with the ionization injection mechanism and is used for conveying gas to the ionization injection mechanism, and the ionization injection mechanism is used for ionizing gas; the medium conveying mechanism comprises a feeding channel and a spiral feeder arranged in the feeding channel, the feeding channel is communicated with the ionization spraying mechanism, and the spiral feeder is used for conveying the medium in the feeding channel to the ionization spraying mechanism so as to melt and spray the medium.

In the technical scheme of this application embodiment, set up gas delivery channel and medium conveying mechanism and will treat during ionization gas and the medium transport to ionization injection mechanism, set up ionization injection mechanism and be used for spouting the medium of melting or half molten state, ionization injection mechanism is used for the gas that ionization gas delivery channel carried in order to melt and spout the medium that the pay-off passageway was carried. And the quantity of the medium entering the ionization spraying mechanism can be changed by controlling the rotating speed of the screw feeder so as to adjust the spraying quantity of the ionization spraying mechanism, thereby improving the accuracy of the spraying quantity and the uniformity of the spraying.

In some embodiments, the plasma spray apparatus further comprises a driver connected to one end of the screw feeder. The driver is arranged, so that automatic control over the spiral feeder can be realized, and the efficiency and accuracy of medium injection control are improved.

In some embodiments, the gas delivery channel has an inlet for connection to a gas source and an outlet in communication with the ionizing spray mechanism. The gas conveying channel in the structure is used for connecting the gas source and the ionization injection mechanism, and conveying the gas in the gas source to the ionization injection mechanism, so that the gas is ionized, heat is released to melt the medium, and the medium is sprayed out.

In some embodiments, the inlet is provided with a control valve for controlling the flow of gas. The gas flow control valve is arranged to control the gas flow so as to adjust the ionization amount of the gas and control the melting temperature of the medium.

In some embodiments, the ionization spray mechanism comprises an anode gun head and a cathode gun head. The anode gun head is arranged at one end of the feeding channel and is provided with a first cavity communicated with the feeding channel; the cathode gun head is arranged at one end of the anode gun head, which is far away from the feeding channel, and is provided with a second cavity which is communicated with the first cavity and forms an ionization cavity for ionizing gas. The ionization cavity is directly arranged in the cathode gun head and the anode gun head, so that the structure of the ionization injection mechanism is simplified, and the ionization reaction efficiency is improved.

In some embodiments, one end of the cathode gun head, which is far away from the anode gun head, is further connected with a spraying gun head, a through spraying channel is arranged in the spraying gun head, and the spraying channel is communicated with the ionization cavity. The arrangement of the injection channel can control the injection direction of the medium in a molten or semi-molten state, and the injection accuracy is improved.

In some embodiments, the ejection channel increases in size gradually along the ejection direction of the media. The spray channel is arranged in a horn mouth shape, so that the spray surface of the spray opening is increased, the dispersion of the medium is improved, and the spray uniformity of the medium is improved.

In some embodiments, the jet opening of the jet gun head is also provided with a jet mask plate. The mask plate is arranged, so that the spraying area of powder can be accurately controlled, and the spraying accuracy is improved.

In some embodiments, an insulating member is further arranged between the anode gun head and the cathode gun head, and a through hole is formed in the insulating member. The cathode gun head and the anode gun head are isolated and separated by the aid of the insulating piece, short circuit of the cathode gun head and the anode gun head is prevented, and through holes are formed for enabling media and ionized gas to pass through smoothly.

In a second aspect, the present application provides a spraying apparatus, which includes a base and the plasma spraying device in the above embodiments, wherein the plasma spraying device is disposed on the base; the plasma spraying device comprises a base, a plurality of plasma spraying devices, a plurality of spraying holes and a plurality of control valves, wherein the number of the plasma spraying devices is multiple, the plurality of plasma spraying devices are arranged on the base at intervals, and the spraying holes of the plurality of plasma spraying devices face to the same side of the base. A plurality of plasma jet devices are arranged in one spraying device, so that various media can be jetted simultaneously, and the jetting efficiency is improved.

In some embodiments, the jetting directions of the plasma jet apparatuses are arranged to intersect at an angle to jet the media jetted from the plurality of plasma jet apparatuses to the same target position.

In some embodiments, the feed channel is disposed within the base, and the gas delivery channel is an annular conduit disposed circumferentially around the feed channel at spaced intervals. The gas conveying channel is arranged on the periphery of the feeding channel, the extending direction of the gas conveying channel is the same as that of the feeding channel, and gas and media can be conveyed to the injection mechanism conveniently.

In a third aspect, the present application provides a solar cell manufacturing apparatus including the spray coating apparatus in the above-described embodiments.

The foregoing description is only an overview of the technical solutions of the present application, and the present application can be implemented according to the content of the description in order to make the technical means of the present application more clearly understood, and the following detailed description of the present application is given in order to make the above and other objects, features, and advantages of the present application more clearly understandable.

Drawings

Features, advantages and technical effects of exemplary embodiments of the present application will be described below with reference to the accompanying drawings.

FIG. 1 is a schematic structural diagram of a plasma j et apparatus according to some embodiments of the present application;

FIG. 2 is a schematic structural view of a spray coating device according to some embodiments of the present application;

FIG. 3 is a schematic diagram of a spray coating device according to further embodiments of the present application.

Detailed description of the reference numerals

1. Spraying equipment;

10. a plasma jet device; 101. an ionizing spray mechanism; 102. a gas delivery channel; 103. a medium conveying mechanism; 104. a feed channel; 105. a screw feeder; 106. a driver; 107. an inlet; 108. a control valve; 109. an anode gun head; 110. a cathode gun head; 111. a first cavity; 112. a second cavity; 113. spraying a gun head; 114. a jet channel; 115. spraying a mask plate; 116. a feed pipe; 117. a feed hole; 118. an insulating member; 119. an ionization cavity;

20. a base.

Detailed Description

Embodiments of the present invention will be described in detail below with reference to the accompanying drawings. The following examples are merely used to more clearly illustrate the technical solutions of the present application, and therefore are only examples, and the protection scope of the present application is not limited thereby.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs; the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application; the terms "including" and "having," and any variations thereof, in the description and claims of this application and the description of the above figures are intended to cover non-exclusive inclusions.

In the description of the embodiments of the present application, the technical terms "first", "second", and the like are used only for distinguishing different objects, and are not to be construed as indicating or implying relative importance or implicitly indicating the number, specific order, or primary-secondary relationship of the technical features indicated. In the description of the embodiments of the present application, "a plurality" means two or more unless specifically defined otherwise.

Reference herein to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the application. The appearances of the phrase in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. It is explicitly and implicitly understood by one skilled in the art that the embodiments described herein can be combined with other embodiments.

In the description of the embodiments of the present application, the term "and/or" is only one kind of association relationship describing an associated object, and means that three relationships may exist, for example, a and/or B, and may mean: a exists alone, A and B exist simultaneously, and B exists alone. In addition, the character "/" herein generally indicates that the former and latter related objects are in an "or" relationship.

In the description of the embodiments of the present application, the term "plurality" refers to two or more (including two), and similarly, "plural sets" refers to two or more (including two sets), "plural pieces" refers to two or more (including two pieces).

In the description of the embodiments of the present application, the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", and the like, indicate the directions or positional relationships indicated in the drawings, and are only for convenience of description of the embodiments of the present application and for simplicity of description, but do not indicate or imply that the referred device or element must have a specific direction, be constructed and operated in a specific direction, and thus, should not be construed as limiting the embodiments of the present application.

In the description of the embodiments of the present application, unless otherwise explicitly stated or limited, the terms "mounted," "connected," "fixed," and the like are used in a broad sense, and for example, may be fixedly connected, detachably connected, or integrated; mechanical connection or electrical connection is also possible; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meanings of the above terms in the embodiments of the present application can be understood by those of ordinary skill in the art according to specific situations.

The solar cell has the advantages of high efficiency, low cost and the like, and is one of the main development directions of green energy in the future. In the prior art, the main photoelectric conversion element in the solar cell is a photoelectric conversion film layer, and the photoelectric conversion film layer is generally prepared by spraying and film-forming with a spraying device. Among them, plasma spraying apparatuses are widely used because they can spray molten powder while melting a medium.

Specifically, the plasma spraying apparatus ionizes a mixed gas of argon, hydrogen, helium, or the like into a high-temperature plasma using electric energy, and forms a plasma gas flow. The method utilizes high-temperature and high-speed plasma gas flow to melt metal or metal oxide and metal carbide and then spray the melted metal or metal oxide and metal carbide on the surface of a workpiece so as to form a photoelectric conversion film layer. The plasma spraying method has the advantages of high particle spraying speed, compact coating and high bonding strength, so most industrial atmospheric plasma spraying equipment is biased to select the spraying method. In particular to a solar thin film cell, a plasma spraying device is utilized to melt a medium and then spray the medium onto a substrate to form a solar light energy absorption thin film.

However, in the existing plasma spraying equipment, when the medium is input from the powder feeding pipe and sprayed out, the using amount of the medium cannot be accurately controlled, so that the spraying amount of the medium cannot be accurately controlled.

The applicant has found through research that by arranging the screw feeder in the feeding channel, when the conveying amount of the medium in the screw feeder is kept stable, the weight of the medium entering the ionization cavity can be adjusted by adjusting the rotating feeding speed of the screw feeder, and the spraying amount of the medium can be effectively controlled. Furthermore, the ejection amount of the medium can be accurately controlled, and the operation is simple and convenient and the control is accurate. The film forming efficiency is ensured, and the performance of the solar cell is improved.

Specifically, the plasma spraying device in the embodiment of the present application includes an ionization spray mechanism, a gas delivery channel, and a medium delivery structure. The gas delivery channel is in communication with the ionization spray mechanism and is used for delivering gas to the ionization spray mechanism, and the ionization spray mechanism is used for ionizing gas. The medium conveying mechanism comprises a feeding channel and a spiral feeder arranged in the feeding channel, the feeding channel is communicated with the ionization spraying mechanism, and the spiral feeder is used for conveying the medium in the feeding channel to the ionization spraying mechanism so as to melt and spray the medium.

In the technical scheme of this application embodiment, set up gas delivery channel and medium conveying mechanism and will wait that the ionized gas and medium convey to ionization injection mechanism, set up ionization injection mechanism and be used for spouting the medium of melting or half-molten state, ionization injection mechanism is used for the gas of ionization gas delivery channel 102 transport in order to melt and spout the medium that the pay-off passageway was carried. And the quantity of the medium entering the ionization spraying mechanism can be changed by controlling the rotating speed of the screw feeder, so that the spraying quantity of the ionization spraying mechanism is adjusted to improve the accuracy of the spraying quantity and the uniformity of the spraying.

The plasma jet device and the spraying equipment disclosed by the embodiment of the application can be used for spraying the solar cell film but not limited, and can also be used for industrial equipment which needs to melt and spray a medium.

For convenience of explanation, the following examples will be described by taking a plasma spray coating as an example in an embodiment of the present application. Referring to fig. 1, fig. 1 is a schematic structural diagram of a plasma spraying apparatus 10 according to some embodiments of the present disclosure.

As shown in fig. 1, a plasma spraying apparatus 10 provided in the embodiment of the present application includes an ionization spray mechanism 101, a gas delivery channel 102, and a medium delivery mechanism 103. Gas delivery channel 102 is in communication with ionizing spray mechanism 101 and is configured to deliver a gas to ionizing spray mechanism 101, and ionizing spray mechanism 101 is configured to ionize the gas. The medium conveying mechanism 103 includes a feed path 104 and a screw feeder 105 provided in the feed path 104. The feed channel 104 communicates with the ionization spray mechanism 101, and the screw feeder 105 is used to feed the medium in the feed channel 104 into the ionization spray mechanism 101 to melt and spray the medium.

In some embodiments of the present application, a feed tube 116 is also connected to the feed channel 104, and the feed tube 116 is used to feed media into the feed channel 104. A feed hole 117 is formed in the feed pipe 116, and the size of the feed hole 117 is gradually reduced along the medium conveying direction. The structure can facilitate the input of the medium from the feeding pipe 116, and improve the conveying efficiency of the medium.

The screw feeder 105 includes a rotating shaft and a screw blade provided on the rotating shaft in a circumferential direction. The rotating shaft drives the helical blade to rotate around the self axial direction, and the helical blade is used for bearing materials. Therefore, the faster the rotation speed of the rotary shaft, the faster the material conveying speed of the screw blade, and the more the material conveying amount.

The ionization injection mechanism 101 is used for generating plasma, positive charges and negative charges are respectively communicated to two ends of the ionization injection mechanism 101, the two charges meet to generate ionization reaction, surrounding gas is ionized into the plasma, and meanwhile, a large amount of heat is released to melt surrounding media. The plasma with positive charges moves to one end with negative charges under the action of the electrode, so that ion wind is generated to drive the molten medium to move. The gas delivery channel 102 is used for delivering a gas to be ionized to the ionization injection mechanism 101, the gas delivery channel 102 may be a cylindrical cavity, which is convenient for uniform delivery of the gas, and it should be noted that the gas delivery channel 102 may also be square, oval, etc., which is not limited in this embodiment of the present application. The medium conveying mechanism 103 is arranged at a distance from the gas conveying channel 102, and the medium conveying channel 103 is used for conveying the medium to be ionized into the ionization and injection mechanism 101.

The medium in the embodiment of the present application is used for spraying onto the substrate, and the medium is usually solid powder, and the particle size thereof can be determined by calculation according to the material of the medium, the spraying amount, and the like. Common media are titanium oxide, strontium oxide, lithium oxide, tungsten oxide, and the like. The specific type of the medium should also be selected according to the structural design of the solar cell, and is not limited herein. The gas to be ionized in the gas transmission channel 102 may be oxygen, carbon dioxide, argon, helium, ammonia, nitrogen, etc., which is not limited in this embodiment.

In the technical scheme of the embodiment of the application, a gas conveying channel 102 and a medium conveying mechanism 103 are arranged to convey gas to be ionized and a medium to an ionization injection mechanism 101; the ionization spray mechanism 101 is provided for spraying a medium in a molten or semi-molten state, and the ionization spray mechanism 101 is provided for ionizing the gas delivered from the gas delivery channel 102 to melt and spray the medium delivered from the feed channel 104. Furthermore, the amount of the medium entering the ionization spray mechanism 101 can be changed by controlling the rotation speed of the screw feeder 105, so as to adjust the spray amount of the ionization spray mechanism 101, and achieve the purpose of improving the control accuracy of the spray amount and the uniformity of the spray.

In some embodiments of the present application, the plasma spray apparatus 10 further includes a driver 106 connected to one end of the screw feeder 105. Alternatively, the driver 106 may be a driving motor, which controls the rotation of the driving motor to rotate the screw feeder 105 and control the rotation rate of the screw feeder 105. The provision of the driver 106 enables automatic control of the screw feeder 105, improving the efficiency and accuracy of the media ejection control.

In some embodiments of the present application, the gas delivery channel 102 has an inlet 107 and an outlet (not shown). The inlet 107 is used for connecting with an air source, and the outlet is communicated with the ionization jet mechanism 101. The gas source may be an inert gas or a readily available gas such as hydrogen, nitrogen or oxygen. The outlet and inlet ports 107 are typically provided at each end of the gas delivery passageway 102 to facilitate gas delivery and to prevent gas from remaining in the gas delivery passageway 102 and being wasted. The gas conveying channel 102 in the above structure is used for connecting a gas source and the ionization spray mechanism 101, and conveying the gas in the gas source to the ionization spray mechanism 101, so that the gas after ionization releases heat to melt the medium, and the medium is sprayed out.

In some embodiments of the present application, the inlet 107 is provided with a control valve 108 for controlling the flow of gas. The control valve 108 includes, but is not limited to, a pneumatic valve, an electric valve, an electromagnetic valve, and the like. The control valve 108 is not limited to manual control, but may be connected to a controller for automatic control or a remote control device for remote operation, so as to improve the convenience of operation. The provision of the control valve 108 enables control of the flow rate of the gas into the gas delivery channel 102, the gas being a raw material of the plasma of the molten medium, the more the amount of the gas, the more intense the ionization reaction that occurs, and the higher the amount of heat generated. Different media have different melting points, so the heat of ionization can be adjusted by adjusting the flow of gas to control the temperature of the ionization jet mechanism 101 and thus the temperature at which the media melts.

It is understood that the higher the flow rate of the gas, the faster the flow rate of the gas, and the higher the temperature in the ionization spray mechanism 101. The case of high temperatures is suitable for melting media with a higher melting point or for melting media with a higher mass. The lower the flow rate of the gas, and the lower the temperature in the ionization spray mechanism 101. The low temperature is the case for melting a medium with a lower melting point or for melting a medium with less quality. The control valve 108 arranged in the embodiment of the application can adjust the air inflow according to the condition of the medium, improve the melting quality of the medium, reduce the energy waste and improve the efficiency.

In some embodiments of the present application, ionization spray mechanism 101 comprises an anode lance tip 109 and a cathode lance tip 110. The anode lance tip 109 is disposed at one end of the feed channel 104 and has a first chamber 111 in communication with the feed channel 104. And the cathode gun head 110 is arranged at one end of the anode gun head 109 far away from the feeding channel 104. The cathode gun head 110 is provided with a second cavity 112, the second cavity 112 being in communication with the first cavity 111 and forming an ionisation cavity 119 for ionised gas.

In the structure, the anode gun head 109 has positive charges, the cathode gun head 110 has negative charges, and the gas between the two electrodes is ionized to generate plasma under the action of the anode gun head 109 and the cathode gun head 110. The plasma is positively charged so that the tip 110 is located at an end remote from the feed channel 104 and is able to direct the plasma towards the tip 110 and then out of the ionisation injection mechanism 101. The ionization cavity 119 is used to contain the gas to be ionized and provide a space where the ionization reaction occurs.

The ionization cavity 119 provides a containing space for the ionization reaction of the gas, and the first cavity 111 and the second cavity 112 are respectively arranged on the anode gun head 109 and the cathode gun head 110, so that sufficient electric energy can be provided for the generation of the ionization reaction, and meanwhile, the production and installation are facilitated.

In some embodiments of the present application, the first cavity 111 and/or the second cavity 112 are cylindrical, and the ionization reaction of the anode tip 109 and the cathode tip 110 is generally performed at the center of the cavities, so that the lengths of the media around the cylindrical first cavity 111 and the cylindrical second cavity 112 are equal to each other in the ionization reaction of the anode tip and the cathode tip, and thus the electric quantity can uniformly act on the gas in the ionization cavity 119, and the gas is uniformly acted on the medium after ionization, so as to improve the efficiency of medium melting and reduce energy loss. Of course, under different use conditions, the first cavity 111 and the second cavity 112 may also be square, oval, and the like, which is not limited in this application embodiment.

In some embodiments of the present application, a spray gun head 113 is further connected to an end of the cathode gun head 110, which is away from the anode gun head 109, a through spray channel 114 is provided in the spray gun head 113, and the spray channel 114 is communicated with the ionization cavity 119. The injection channel 114 is arranged, plasma in the ionization cavity 119 can be effectively gathered, the direction of the medium injection in the melting or semi-melting state is controlled by arranging the extending direction of the injection channel 114, and the injection accuracy is improved.

In some embodiments of the present application, the size of the ejection channels 114 gradually increases in the ejection direction of the media. The spray passage 114 is formed in a bell mouth shape, so that the spray surface of the spray opening is increased, the dispersion degree of the medium is improved, and the medium spray uniformity is improved.

In some embodiments of the present application, a jet mask 115 is further disposed on the jet port of the jet gun head 113. The spraying mask plate 115 is arranged, so that the spraying area of powder can be accurately controlled, and the spraying accuracy is improved. Moreover, the ejection mask 115 can be designed into a specific shape according to application requirements, and is used for ejecting the medium into a corresponding shape so as to meet different design requirements. For example, square injection holes may be formed in the injection mask 115, and the medium injected from the injection tip 113 may pass through the square injection holes of the injection mask 115 to form a square injection pattern on the substrate. The square injection holes can also be round, trapezoidal or any preset pattern, and the specific pattern is selected according to the requirement. Or, when the specific position of the substrate needs to be sprayed, the corresponding specific position on the spray mask plate 115 may be hollowed, and other positions may be covered, so that the medium sprayed by the spray gun head 113 through the spray holes of the spray mask plate 115 may form a pattern only in the corresponding specific position, and may not involve other positions.

In some embodiments of the present application, an insulator 118 is further disposed between the anode lance head 109 and the cathode lance head 110, and the insulator 118 is provided with a through hole. The insulator 118 may be an insulating washer or rubber ring, and the insulator 118 insulates the cathode and

anode tips

110 and 109 from short circuiting. Through holes are provided in the insulating member 118 for smooth passage of the medium and ionized air.

According to some embodiments of the present application, there is provided a spraying apparatus 1, as shown in fig. 2, the spraying apparatus 1 includes a base 20 and the plasma jet device 10 in any of the above embodiments, the plasma jet device 10 is disposed on the base 20. The number of the plasma spraying devices 10 is plural, the plural plasma spraying devices 10 are arranged on the base 20 at intervals, and the spraying ports of the plural plasma spraying devices 10 face to the same side of the base 20. A plurality of plasma jet devices 10 are arranged in one spraying device 1, so that a plurality of media can be jetted simultaneously, and the jetting efficiency is improved.

In the embodiment of the present application, as shown in fig. 2 and 3, three plasma spray devices 10 may be provided. Three plasma spray devices 10 are provided in parallel in the susceptor 20. It is to be understood that the number of the plasma spraying devices 10 is not limited to three, and may be set as needed, and is not limited herein. The medium delivery mechanism 103 and the gas delivery channel 102 are disposed in the base 20, and the control valve 108 extends into the plasma spraying device 10 through the surface of the base 20 and is communicated with the inlet 107 of the gas delivery channel 102. The integration of the control valve 108 with the base 20 can be improved to facilitate the control of the amount of media delivered. The feeding pipe 116 is arranged on the surface of the base 20, one end of the feeding pipe 116 extends into the base 20 and is communicated with the medium conveying channel, and the feeding pipe 116 conveys the medium into the medium conveying channel from the outside of the base 20.

In the three plasma spraying apparatuses 10, the gas supply path 102 and the medium supply mechanism 103 are independent of each other, and can be used to spray at least three different media, and the mass of the media is controlled by controlling the feed speed of each screw feeder 105, thereby controlling the spray ratio of the different media. Meanwhile, by controlling the gas flow rate in the respective gas delivery channel 102 and controlling the melting temperature of the corresponding medium, it can be ensured that each medium is completely melted. By adopting the structure, the proportion and the temperature of the spraying medium can be accurately controlled by the spraying equipment 1 by arranging the plurality of plasma spraying devices 10, and the spraying quality of the film layer is improved.

In some embodiments of the present application, the ejection directions of the plasma ejection devices 10 are arranged to intersect at an angle to eject the media ejected from the plurality of plasma ejection devices 10 to the same target location. It is understood that a plurality of plasma j et devices 10 may spray different media simultaneously to form a mixed media, or spray different substrates sequentially to form a multi-layer coating, or spray the same kind of substrate sequentially. The spraying mode can effectively improve the film forming efficiency of the film layer. The selection of the specific injection mode is not limited herein, and can be designed according to actual situations.

In some embodiments of the present disclosure, the injection angle of the plasma injection device 10 may be determined by calculation according to the injection distance, the injection area, and the position of the injection point, which is not limited herein. Set up plasma injection apparatus 10 through different angles, adjust the spraying direction of a plurality of plasma injection apparatus 10 to same target area, realize the spraying of using multiple powder simultaneously, promote the mixing homogeneity and the efficiency of spraying.

In some embodiments of the present application, referring to fig. 1 and 3 in combination, the feed channel 104 is disposed in the base 20, and the gas delivery channels 102 are annular conduits disposed circumferentially around the feed channel 104 at intervals. The feeding channel 104 and the gas delivery channel 102 in the embodiment of the present application are both disposed in the base 20, so as to improve the integration level of the device. Moreover, the gas delivery channel 102 is arranged on the periphery of the feeding channel 104, and the extension directions of the gas delivery channel 102 and the feeding channel 104 are the same, so that gas and medium can be delivered to the injection mechanism at the same time.

According to some embodiments of the present application, there is also provided a solar cell manufacturing apparatus comprising the spray coating apparatus 1 according to any one of the above aspects. It can be understood that the solar cell manufacturing apparatus provided in the present application may include other necessary components of the solar cell manufacturing apparatus besides the spraying apparatus 1 in the foregoing embodiment, and the solar cell manufacturing apparatus in the present embodiment can achieve the technical effects of any of the foregoing embodiments, which is not described herein again.

Finally, it should be noted that: the above embodiments are only used for illustrating the technical solutions of the present application, and not for limiting the same; although the present application has been described in detail with reference to the foregoing embodiments, it should be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; such modifications and substitutions do not depart from the spirit and scope of the present disclosure, and the present disclosure should be construed as being covered by the claims and the specification. In particular, the technical features mentioned in the embodiments can be combined in any way as long as there is no structural conflict. The present application is not intended to be limited to the particular embodiments disclosed herein but is to cover all embodiments that may fall within the scope of the appended claims.

Claims

1. A plasma spray apparatus, comprising

An ionizing spray mechanism;

a gas delivery channel in communication with the ionizing spray mechanism and configured to deliver a gas to the ionizing spray mechanism, the ionizing spray mechanism configured to ionize the gas; and the number of the first and second groups,

the medium conveying mechanism comprises a feeding channel and a spiral feeder arranged in the feeding channel, the feeding channel is communicated with the ionization spraying mechanism, and the spiral feeder is used for conveying the medium in the feeding channel to the ionization spraying mechanism so as to melt and spray the medium.

2. The plasma j et apparatus of claim 1, further comprising a driver connected to one end of the screw feeder.

3. The plasma j et apparatus of claim 1, wherein the gas delivery channel has an inlet for connection to a gas source and an outlet in communication with the ionizing jet mechanism.

4. The plasma j et apparatus of claim 3, wherein the inlet is provided with a control valve for controlling the flow of the gas.

5. The plasma j et apparatus of any one of claims 1 to 4, wherein the ionizing j et mechanism comprises,

the anode gun head is arranged at one end of the feeding channel and is provided with a first cavity communicated with the feeding channel;

the cathode gun head is arranged at one end, far away from the feeding channel, of the anode gun head, and is provided with a second cavity, and the second cavity is communicated with the first cavity to form an ionization cavity for ionizing the gas.

6. The plasma spraying device according to claim 5, wherein a spraying gun head is further connected to one end of the cathode gun head, which is far away from the anode gun head, a through spraying channel is arranged in the spraying gun head, and the spraying channel is communicated with the ionization cavity.

7. The plasma j et apparatus of claim 6, wherein the size of the ejection channel gradually increases in the ejection direction of the medium.

8. The plasma spraying device according to claim 6 or 7, wherein a spraying mask plate is further arranged on the spraying opening of the spraying gun head.

9. The plasma spraying device of claim 5, wherein an insulating member is further arranged between the anode gun head and the cathode gun head, and a through hole is formed in the insulating member.

10. A spray coating device, characterized by comprising

A base seat, a plurality of fixing holes and a plurality of fixing holes,

the plasma j et apparatus as claimed in any one of claims 1 to 9, which is provided to the base;

the plasma spraying device comprises a base, a plurality of plasma spraying devices and a plurality of spraying ports, wherein the number of the plasma spraying devices is multiple, the plasma spraying devices are arranged on the base at intervals, and the spraying ports of the plasma spraying devices face to the same side of the base.

11. The coating apparatus according to claim 10, wherein ejection directions of a plurality of said plasma jet means are arranged to intersect at an angle to eject said medium ejected from a plurality of said plasma jet means to a same target position.

12. A spray assembly according to claim 10 or claim 11 wherein said feed passage is provided in said base, said gas delivery passage being an annular duct circumferentially spaced around said feed passage.

13. A solar cell manufacturing apparatus, characterized by comprising the spray coating apparatus according to any one of claims 10 to 12.