CN216696499U

CN216696499U - POE module test fixture

Info

Publication number: CN216696499U
Application number: CN202123106239.1U
Authority: CN
Inventors: 张波
Original assignee: Shenzhen Dapu Communication Co ltd
Current assignee: Shenzhen Dapu Communication Co ltd
Priority date: 2021-12-07
Filing date: 2021-12-07
Publication date: 2022-06-07
Anticipated expiration: 2031-12-07

Abstract

The application provides POE module test fixture belongs to POE module test technical field. This POE module test fixture, including test equipment body and cooling subassembly. In the above-mentioned realization process, cool down the cooling to the first fin of a plurality of through the semiconductor refrigeration piece, and then cool down the cooling liquid of liquid reserve tank inside, and then make the cooling liquid cool down the cooling copper pipe that looses heat, the fan can absorb the inside gas of test equipment body through heat dissipation copper pipe and outlet duct, gas can be cooled down by the copper pipe that looses heat inside the copper pipe that looses heat and cool down, the inside gas of exhaust pipe can get into inside the test equipment body, and then cool down to the inside of test equipment body, can carry out comparatively effectual cooling to the inside cooling of test equipment body, can reduce the influence of temperature to the inside electrical apparatus circuit component of test equipment body, can improve the life of test equipment body.

Description

POE module test fixture

Technical Field

The application relates to POE module test field particularly, relates to a POE module test fixture.

Background

POE refers to a technology that can provide direct current for some IP-based terminals (such as IP phones, wireless local area network access points AP, etc.) while transmitting data signals to such devices without changing the existing ethernet wiring infrastructure, and a common device is a POE switch.

Need use check out test set to detect before the POE switch leaves the factory, with detect its data transmission performance, whether power supply performance etc. meet the requirements, in relevant technique, in order to improve the efficiency that detects, make check out test set can detect many POE switches simultaneously, this makes check out test set inside have a large amount of electrical circuit components, these electrical circuit components can produce certain heat at the during operation, and current check out test set mostly lacks effectual heat radiation structure, check out test set inside temperature can be continuous rising at the during operation, can accelerate the ageing of the inside electrical circuit component of check out test set, can reduce check out test set's life.

SUMMERY OF THE UTILITY MODEL

In order to compensate above not enough, this application provides a POE module test fixture, aims at improving that current check out test set lacks effectual heat radiation structure mostly, can reduce check out test set life's problem.

The embodiment of the application provides a POE module test fixture, including test equipment body and cooling subassembly.

The inside intercommunication of test equipment body has the outlet duct.

The cooling assembly comprises a liquid storage box, a semiconductor refrigeration piece, first fins, a fan, an exhaust pipe and a heat dissipation copper pipe, the liquid storage box is connected to one side of the testing equipment body, one end, far away from the testing equipment body, of the air outlet pipe is fixedly inserted into the liquid storage box, the semiconductor refrigeration piece is connected with one side of the liquid storage box, a plurality of first fins are arranged, one surfaces of the first fins are connected with a heat absorbing surface of the semiconductor refrigeration piece, sheet bodies of the first fins are located inside the liquid storage box, the fan is connected to the bottom wall of the liquid storage box, one end of the exhaust pipe is communicated with an air outlet of the fan, the exhaust pipe is communicated with the inside of the testing equipment body, the top end of the heat dissipation copper pipe is communicated with the air outlet pipe, and the pipe body of the heat dissipation copper pipe is located inside the liquid storage box, the bottom end of the heat dissipation copper pipe is communicated with an air suction port of the fan.

In the implementation process, the semiconductor refrigerating sheets are used for cooling the plurality of first fins, further cooling the cooling liquid in the liquid storage tank, further cooling the heat dissipation copper pipe by the cooling liquid, sucking the gas in the testing equipment body by the fan through the heat dissipation copper pipe and the air outlet pipe, allowing the gas in the air outlet pipe to enter the heat dissipation copper pipe, cooling the gas in the heat dissipation copper pipe by the heat dissipation copper pipe, allowing the gas in the heat dissipation copper pipe to enter the exhaust pipe under the action of the fan, allowing the gas in the exhaust pipe to enter the testing equipment body, thereby cooling the interior of the testing equipment body and effectively cooling the interior of the testing equipment body, the influence of temperature on the electric appliance circuit elements in the test equipment body can be reduced, and the service life of the test equipment body can be prolonged.

In a specific embodiment, the upper surface of the testing equipment body is provided with a detection socket, and the detection socket is provided with a plurality of sockets.

In a specific implementation scheme, the heat absorbing surface of the semiconductor refrigeration piece is provided with a second fin, the sheet body of the second fin is fixedly penetrated through one side of the liquid storage box, and one surface of each of the plurality of first fins is connected with one surface, far away from the semiconductor refrigeration piece, of the second fin.

In a specific implementation scheme, the pipe body of the exhaust pipe is fixedly inserted into the testing equipment body, and an exhaust port is formed in the pipe body of the exhaust pipe and located inside the testing equipment body.

In a specific embodiment, the exhaust port is provided with a plurality of exhaust ports, the plurality of exhaust ports are all located inside the test equipment body, and the plurality of exhaust ports are uniformly arranged.

In a specific embodiment, the heat dissipation copper pipes are provided with a plurality of heat dissipation copper pipes, the top ends of the plurality of heat dissipation copper pipes are communicated with the air outlet pipe, and the bottom ends of the plurality of heat dissipation copper pipes are communicated with the air suction port of the fan.

In a specific implementation scheme, the plurality of heat dissipation copper pipes are all arranged in a spiral shape, and the plurality of heat dissipation copper pipes are all fixedly penetrated through the plurality of first fins.

In a specific embodiment, the air suction port of the fan is communicated with an air suction pipe, and the bottom ends of the plurality of heat dissipation copper pipes are communicated with the air suction pipe.

In a specific embodiment, the air suction port of the blower is fixed to penetrate through the bottom wall of the liquid storage tank, and the air suction pipe is located inside the liquid storage tank.

In a specific embodiment, the cooling subassembly still includes the radiating piece, the radiating piece includes first communicating pipe, heat-conducting plate and second communicating pipe, the one end of first communicating pipe with the blast pipe is close to the one end of fan is linked together, the heat-conducting plate with the hot side of giving out heat of semiconductor refrigeration piece links to each other, the cavity has been seted up to the inside of heat-conducting plate, the other end of first communicating pipe with the cavity is linked together, the one end of second communicating pipe with the cavity is linked together, the other end of second communicating pipe with the outlet duct is linked together.

Drawings

In order to more clearly explain the technical solutions of the embodiments of the present application, the drawings that are required to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present application and therefore should not be considered as limiting the scope, and that for those skilled in the art, other related drawings can be obtained from these drawings without inventive effort.

Fig. 1 is a schematic structural diagram of a POE module test fixture provided in an embodiment of the present application;

fig. 2 is a schematic structural diagram of a test equipment body according to an embodiment of the present disclosure;

fig. 3 is a schematic structural diagram of a cooling assembly according to an embodiment of the present disclosure;

fig. 4 is a schematic structural diagram of a liquid storage tank according to an embodiment of the present application.

In the figure: 100-testing the equipment body; 110-an air outlet pipe; 120-test socket; 200-a temperature reduction assembly; 210-a liquid storage tank; 220-semiconductor refrigerating sheet; 221-a second fin; 230-a first fin; 240-a fan; 241-an air suction pipe; 250-an exhaust pipe; 251-an exhaust port; 260-heat dissipation copper pipe; 270-a heat sink; 271-a first communication pipe; 272-a thermally conductive plate; 2721-a cavity; 273-second communicating pipe.

Detailed Description

The technical solutions in the embodiments of the present application will be described below with reference to the drawings in the embodiments of the present application.

To make the objects, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions of the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are some embodiments of the present application, but not all embodiments. All other embodiments obtained by a person of ordinary skill in the art without any inventive work based on the embodiments in the present application are within the scope of protection of the present application.

Referring to fig. 1, the present application provides a POE module test fixture, which includes a test equipment body 100 and a cooling assembly 200.

Referring to fig. 1 and 2, an air outlet pipe 110 is communicated with the inside of the testing apparatus body 100, air inside the testing apparatus body 100 is exhausted from the air outlet pipe 110, a plurality of detecting sockets 120 are arranged on the upper surface of the testing apparatus body 100.

Referring to fig. 1 to 4, the cooling assembly 200 includes a liquid storage tank 210, a semiconductor chilling plate 220, first fins 230, a fan 240, an exhaust pipe 250 and a heat dissipation copper pipe 260, the liquid storage tank 210 is connected to one side of the testing device body 100, cooling liquid is disposed inside the liquid storage tank 210, one end of the air outlet pipe 110 away from the testing device body 100 is fixedly inserted inside the liquid storage tank 210, the semiconductor chilling plate 220 is connected to one side of the liquid storage tank 210, a second fin 221 is disposed on a heat absorbing surface of the semiconductor chilling plate 220, the heat absorbing surface of the semiconductor chilling plate 220 is connected to the second fin 221 through heat conducting silica gel, a sheet body of the second fin 221 is fixedly penetrated through one side of the liquid storage tank 210, the first fins 230 are provided with a plurality of pieces, one surfaces of the first fins 230 are connected to the heat absorbing surface of the semiconductor chilling plate 220, one surfaces of the first fins 230 are connected to one surface of the second fins 221 away from the semiconductor chilling plate 220, the lamellar body of the first fin 230 of a plurality of all is located inside the liquid reserve tank 210, and the semiconductor refrigeration piece 220 during operation can cool down the first fin 230 of a plurality of, and the first fin 230 of a plurality of can cool down the inside coolant liquid of liquid reserve tank 210.

In this application, fan 240 is connected in the diapire of liquid reserve tank 210, the one end of blast pipe 250 is linked together with fan 240's gas outlet, blast pipe 250 is linked together with test equipment body 100 is inside, the fixed inside of pegging graft in test equipment body 100 of body of blast pipe 250, gas vent 251 has been seted up to blast pipe 250's body, gas vent 251 is located inside test equipment body 100, a plurality of has been seted up to gas vent 251, a plurality of gas vent 251 all is located inside test equipment body 100, a plurality of gas vent 251 align to grid, the inside gas of blast pipe 250 can be more inside the test equipment body 100 of advancing for the row of diffusion.

In this embodiment, the top end of the heat dissipating copper tube 260 is connected to the air outlet tube 110, the tube body of the heat dissipating copper tube 260 is located inside the liquid storage tank 210, the bottom end of the heat dissipating copper tube 260 is connected to the air suction port of the fan 240, the heat dissipating copper tube 260 is provided with a plurality of heat dissipating copper tubes 260, the tube bodies of the heat dissipating copper tubes 260 are all arranged in a spiral shape, so as to increase the volume of the heat dissipating copper tube 260 located inside the liquid storage tank 210, further increase the cooling effect of the cooling liquid inside the liquid storage tank 210 on the heat dissipating copper tube 260, the tube bodies of the heat dissipating copper tubes 260 are all fixed to the sheet bodies of the first fins 230, the top ends of the heat dissipating copper tubes 260 are all connected to the air outlet tube 110, the gas dispersable inside the air outlet tube 110 enters the heat dissipating copper tubes 260, so as to increase the cooling effect, the bottom ends of the heat dissipating copper tubes 260 are all connected to the air suction port of the fan 240, and the air suction tube 241 is connected to the air suction port of the fan 240, the bottom ends of the plurality of heat dissipation copper pipes 260 are all communicated with the air suction pipe 241, an air suction port of the fan 240 fixedly penetrates through the bottom wall of the liquid storage box 210, and the air suction pipe 241 is located inside the liquid storage box 210.

Referring to fig. 3 and 4, the cooling assembly 200 further includes a heat sink 270, the heat sink 270 includes a first communication pipe 271, a heat conducting plate 272 and a second communication pipe 273, one end of the first communication pipe 271 is communicated with one end of the exhaust pipe 250 close to the fan 240, the heat conducting plate 272 is connected with the heat radiating surface of the semiconductor chilling plate 220 through heat conducting silica gel, a cavity 2721 is formed in the heat conducting plate 272, the other end of the first communication pipe 271 is communicated with the cavity 2721, one end of the second communication pipe 273 is communicated with the cavity 2721, and the other end of the second communication pipe 273 is communicated with the exhaust pipe 110.

In the present embodiment, the heat conductive plate 272 is a copper plate having good heat conductivity.

In this embodiment, the fan 240 can absorb the gas inside the second communicating pipe 273 through the heat dissipation copper pipe 260 during operation, the gas can be cooled down when passing through the heat dissipation copper pipe 260, the gas absorbed by the fan 240 can be discharged into the exhaust pipe 250, the gas inside the exhaust pipe 250 can be partially introduced into the cavity 2721 through the first communicating pipe 271, and then the heat conducting plate 272 is cooled down, and then the heat radiating surface of the semiconductor refrigeration piece 220 is cooled down, and then the refrigeration effect of the semiconductor refrigeration piece 220 can be improved.

The working principle of the POE module testing tool is as follows: when the testing device is used, the semiconductor refrigerating sheet 220 is opened, the semiconductor refrigerating sheet 220 cools the plurality of first fins 230, the cooling liquid in the liquid storage tank 210 is further cooled, the cooling liquid cools the plurality of heat dissipation copper pipes 260, then the fan 240 is opened, the fan 240 sucks gas in the testing device body 100 through the heat dissipation copper pipes 260 and the air outlet pipe 110, the gas in the air outlet pipe 110 can enter the plurality of heat dissipation copper pipes 260 in a dispersing manner, the gas can be cooled by the heat dissipation copper pipes 260 in the heat dissipation copper pipes 260, the gas in the heat dissipation copper pipes 260 can enter the exhaust pipe 250 under the action of the fan 240, one part of the gas in the exhaust pipe 250 can enter the testing device body 100 through the plurality of exhaust ports 251, the interior of the testing device body 100 is further cooled, the other part of the gas in the exhaust pipe 250 can enter the cavity 2721 through the first communication pipe 271, and then cool down heat-conducting plate 272, and then cool down the exothermic surface of semiconductor refrigeration piece 220, can carry out comparatively effectual cooling to the inside of test equipment body 100, can reduce the influence of temperature to the inside electrical components of test equipment body 100, can improve the life of test equipment body 100.

It should be noted that the specific model specifications of the semiconductor chilling plate 220 and the fan 240 need to be determined by type selection according to the actual specification of the device, and the specific type selection calculation method adopts the prior art, so detailed description is omitted.

The power supply of the semiconductor cooling plate 220 and the fan 240 and the principle thereof will be apparent to those skilled in the art and will not be described in detail herein.

The above description is only an example of the present application and is not intended to limit the scope of the present application, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, improvement and the like made within the spirit and principle of the present application shall be included in the protection scope of the present application. It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.

The above description is only for the specific embodiments of the present application, but the scope of the present application is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present application, and shall be covered by the scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.

Claims

1. POE module test fixture, which is characterized by comprising

The testing equipment comprises a testing equipment body (100), wherein an air outlet pipe (110) is communicated with the inside of the testing equipment body (100);

the cooling assembly (200) comprises a liquid storage tank (210), a semiconductor refrigeration piece (220), a first fin (230), a fan (240), an exhaust pipe (250) and a heat dissipation copper pipe (260), wherein the liquid storage tank (210) is connected to one side of the testing equipment body (100), one end, far away from the testing equipment body (100), of the air outlet pipe (110) is fixedly inserted into the liquid storage tank (210), the semiconductor refrigeration piece (220) is connected with one side of the liquid storage tank (210), the first fin (230) is provided with a plurality of fins, one surface of each of the first fins (230) is connected with a heat absorption surface of the semiconductor refrigeration piece (220), the sheet bodies of the first fins (230) are located inside the liquid storage tank (210), and the fan (240) is connected to the bottom wall of the liquid storage tank (210), one end of the exhaust pipe (250) is communicated with an air outlet of the fan (240), the exhaust pipe (250) is communicated with the inside of the testing equipment body (100), the top end of the heat dissipation copper pipe (260) is communicated with the air outlet pipe (110), the pipe body of the heat dissipation copper pipe (260) is located inside the liquid storage box (210), and the bottom end of the heat dissipation copper pipe (260) is communicated with an air suction port of the fan (240).

2. The POE module testing tool according to claim 1, wherein a detection socket (120) is arranged on the upper surface of the testing device body (100), and a plurality of detection sockets (120) are arranged.

3. The POE module test fixture of claim 1, wherein a second fin (221) is arranged on a heat absorbing surface of the semiconductor refrigeration piece (220), a sheet body of the second fin (221) is fixedly penetrated through one side of the liquid storage tank (210), and one surfaces of the first fins (230) are connected with one surfaces, far away from the semiconductor refrigeration piece (220), of the second fins (221).

4. The POE module testing tool according to claim 1, wherein a pipe body of the exhaust pipe (250) is fixedly inserted into the testing device body (100), an exhaust port (251) is formed in the pipe body of the exhaust pipe (250), and the exhaust port (251) is located inside the testing device body (100).

5. The POE module testing tool of claim 4, wherein a plurality of air vents (251) are formed, the air vents (251) are located inside the testing equipment body (100), and the air vents (251) are uniformly arranged.

6. The POE module testing tool according to claim 1, wherein a plurality of heat dissipation copper pipes (260) are arranged, the top ends of the heat dissipation copper pipes (260) are communicated with the air outlet pipe (110), and the bottom ends of the heat dissipation copper pipes (260) are communicated with an air suction port of the fan (240).

7. The POE module testing tool according to claim 6, wherein the plurality of heat dissipation copper pipes (260) are spirally arranged, and the plurality of heat dissipation copper pipes (260) are fixedly penetrated through the plurality of sheet bodies of the first fins (230).

8. The POE module testing tool according to claim 6, wherein an air suction port of the fan (240) is communicated with an air suction pipe (241), and bottom ends of the plurality of heat dissipation copper pipes (260) are communicated with the air suction pipe (241).

9. The POE module testing tool of claim 8, wherein an air suction port of the fan (240) is fixedly formed through a bottom wall of the liquid storage tank (210), and the air suction pipe (241) is located inside the liquid storage tank (210).

10. The POE module test fixture of claim 1, characterized in that, cooling subassembly (200) still includes heat dissipation piece (270), heat dissipation piece (270) include first communicating pipe (271), heat-conducting plate (272) and second communicating pipe (273), the one end of first communicating pipe (271) with blast pipe (250) are close to the one end of fan (240) is linked together, heat-conducting plate (272) with the face of sending out heat of semiconductor refrigeration piece (220) links to each other, cavity (2721) have been seted up to the inside of heat-conducting plate (272), the other end of first communicating pipe (271) with cavity (2721) are linked together, the one end of second communicating pipe (273) with cavity (2721) are linked together, the other end of second communicating pipe (273) with outlet duct (110) are linked together.