CN216673627U

CN216673627U - Heat conducting fin

Info

Publication number: CN216673627U
Application number: CN202122591035.5U
Authority: CN
Inventors: 卓家汶; 李厚宽; 郦唯诚
Original assignee: Finemat Applied Materials Co ltd
Current assignee: Finemat Applied Materials Co ltd
Priority date: 2021-10-27
Filing date: 2021-10-27
Publication date: 2022-06-03
Anticipated expiration: 2031-10-27

Abstract

The utility model relates to a heat conducting fin, which comprises a thin sheet body made of a heat conducting metal material, wherein the two opposite sides of the heat conducting fin are respectively a first side and a second side, the second side is etched to form a cavity, a heat conducting block positioned in the cavity and an annular wall part positioned at the periphery of the cavity, and the side surface of the heat conducting block facing the second side is a half-etched and coarsened micro-rough surface.

Description

Heat conducting fin

Technical Field

The present invention relates to a heat conducting fin, and more particularly, to a heat conducting fin capable of providing high heat conductivity when applied to a heat dissipating mechanism.

Background

The conventional electronic device often generates high temperature during operation, and in order to avoid the influence of the high temperature generated by the electronic device during operation on the working efficiency of the electronic device, a heat dissipation mechanism is usually installed on a heat source of the electronic device so as to transfer and quickly dissipate heat generated by the heat source.

In the existing heat dissipation mechanism, the base of the heat dissipation member is adhered to the heat source of the electronic device with heat dissipation paste, the heat dissipation member absorbs the heat generated by the heat source through the base and transfers the heat to the plurality of heat dissipation fins of the heat dissipation member, the heat dissipation surface area is enlarged by the plurality of heat dissipation fins, and then the air-cooled heat sink (such as a fan) mounted on the heat dissipation fins generates airflow to quickly dissipate the heat.

However, although the heat dissipating member in the conventional heat dissipating mechanism has a heat conducting property, it is difficult to achieve a good heat conducting effect in the process of conducting heat to the heat source by the heat dissipating member through the shallow heat dissipating paste, and thus further improvement is required.

SUMMERY OF THE UTILITY MODEL

The technical problem to be solved by the utility model is as follows: the utility model provides a heat-conducting fin, the not good technical problem of heat conductivility that solves current heat dissipation mechanism's radiating part to the heat source and provide.

The technical solution proposed by the utility model is as follows: the heat conducting fin is a thin sheet body made of a heat conducting metal material, the two opposite sides of the heat conducting fin are respectively a first side and a second side, the second side is etched to form a recess, at least one heat conducting block located in the recess and an annular wall part located on the periphery of the recess, and the side surface of the heat conducting block facing the second side is provided with a half-etched roughened micro-surface.

Preferably, in the above heat conducting sheet, the depth of the recess is 60% to 90% of the thickness of the heat conducting sheet, and the etching depth of the half-etched roughened micro rough surface is 2% to 25% of the thickness of the heat conducting sheet.

Preferably, in the above heat conducting sheet, the surface of the annular wall portion on the second side has a roughened surface roughened by half etching.

Preferably, in the above heat conductive sheet, the depth of the recess is 60% to 90% of the thickness of the heat conductive sheet, the etching depth of the half-etched roughened micro rough surface is 2% to 25% of the thickness of the heat conductive sheet, and the etching depth of the half-etched roughened rough surface is 2% to 25% of the thickness of the heat conductive sheet.

Preferably, in the above-described thermally conductive sheet, the thickness of the thermally conductive sheet is 0.4mm to 2 mm.

The utility model has the advantages that the heat conducting fin can be applied to a heat dissipation mechanism and at least has the following characteristics:

1. the heat conduction performance to the heat source is enhanced: the heat conducting sheet of the utility model provides a space for filling a heat radiating medium by a concave hole formed by etching a sheet body made of thin heat conducting metal materials, and a micro rough surface with semi-etching coarsening is formed on the surface of a heat conducting block, so that one side of the heat conducting sheet can be attached to a heat source of an electronic device, and the heat conducting sheet is provided with the micro rough surface and the other side filled with the heat radiating medium and is connected with a heat radiating part provided with a heat radiating fin, thereby utilizing the excellent heat conducting performance provided by the heat conducting sheet to effectively conduct the heat of the heat source to the heat radiating part for heat radiation.

2. Thinning: in view of the above, the heat conducting sheet of the present invention is a structure in which the cavity is formed by etching a sheet of thin heat conducting metal material, so that the heat conducting sheet provides a space for filling the heat dissipating medium with the cavity, and has a thin effect.

3. Easy to manufacture: the micro-rough surface in the heat conducting sheet is formed by half etching and is combined with the cavity which can be formed by etching, and in the process of etching and processing the heat conducting sheet by the heat conducting metal sheet, the heat conducting sheet can be manufactured by utilizing the control of the etching pattern under the condition of not increasing the manufacturing process and the cost.

4. Increase of heat dissipation surface area: the heat conducting sheet of the utility model forms at least one heat conducting block in the concave cavity formed by etching the sheet body of the thin heat conducting metal material, the side surface of the heat conducting block facing to the second side is a half-etched and coarsened micro-rough surface, and by means of the structure of the concave cavity and the micro-rough surface of the heat conducting block, the heat radiating surface area can be increased, the contact surface area between the heat conducting block and a heat radiating medium is increased, and the heat conducting performance is improved.

5. And (3) improving the mechanical strength: in view of the above, the heat conducting strip of the present invention forms at least one heat conducting block in the cavity formed by etching the thin heat conducting metal sheet, and the heat conducting block is matched with the annular wall portion at the periphery of the cavity, so as to improve the mechanical strength of the heat conducting strip itself and reduce the thermal deformation of the heat conducting strip.

The surface of the annular wall part on the second side can be further provided with a roughened surface formed by half etching, and the roughened surface is helpful for enlarging the heat dissipation surface area and the surface area coated by the heat dissipation medium, so that the heat dissipation performance of the heat conduction sheet is improved.

Drawings

Fig. 1 is a perspective view schematically showing a first preferred embodiment of the thermally conductive sheet of the present invention.

Fig. 2 is a schematic plan view of a preferred embodiment of the thermally conductive sheet shown in fig. 1.

FIG. 3 is a schematic sectional side view of the heat conductive sheet of FIG. 2 at a position of a sectional line A-A.

Fig. 4 is a partially enlarged view of fig. 3.

Fig. 5 is a schematic plan view of a second preferred embodiment of the thermally conductive sheet of the utility model.

Fig. 6 is a reference view showing a state in which the heat conductive sheet of fig. 1 according to the preferred embodiment is used in combination with a heat dissipating member and a fan as a heat source of an electronic device.

Description of the main component symbols:

10 heat-conducting fin 101 first side

102 second side 11 pocket

111 heat dissipation medium 12 heat conduction block

121, a slightly rough surface 13 and a wall surrounding part

131, roughened surface t, thickness of heat conducting sheet

d, the depth t1 of the cavity, and the height of the heat-conducting block protruding from the inner side of the cavity

20 heat dissipation member 21 heat dissipation fins

22, fan 30, electronic device

31 heat source

Detailed Description

The technical means adopted by the utility model to achieve the predetermined purpose of the utility model will be further described below with reference to the accompanying drawings and preferred embodiments of the utility model.

Referring to fig. 1 to 4 and 5, two preferred embodiments of the heat conducting sheet 10 of the present invention are disclosed, as can be seen from the drawings, the heat conducting sheet 10 is a thin sheet of a heat conducting metal material, the heat conducting metal material can be selected from pure copper, copper alloy, aluminum alloy, pure titanium, titanium alloy, stainless steel or other materials, and the thickness of the heat conducting sheet 10 is set according to the use requirement of the product. As shown in fig. 4, in the preferred embodiment, the thickness t of the thermally conductive sheet 10 is 0.4mm to 2mm, and the thickness t of the thermally conductive sheet 10 can be further set to 0.4mm to 1.5mm according to the requirement of reducing the thickness, and preferably, the thickness t of the thermally conductive sheet 10 is 0.5mm to 1 mm.

As shown in fig. 1 to 5, two opposite sides of the heat conducting sheet 10 are a first side 101 and a second side 102, the second side 102 is etched to form a cavity 11, at least one heat conducting block 12 located in the cavity 11, and a surrounding wall portion 13 located at the periphery of the cavity 11, a part or all of the surface of the heat conducting block 12 facing the second side 102 is a rough surface 121 formed by half-etching and roughening, and the rough surface 121 helps to enlarge the heat dissipation surface area and the surface area coated by the heat dissipation medium.

As shown in fig. 1 to 5, the heat conducting sheet 10 may further have a half-etched roughened surface 131 on part or all of the surface of the annular wall 13 on the second side 102, and the roughened surface 131 helps the heat conducting sheet 10 to expand the heat dissipation surface area and the surface area coated by the heat dissipation medium.

As shown in fig. 1 to 4 and 5, since the rough surface 121 and the roughened surface 131 of the heat conductive sheet 10 are formed by half etching, the rough surface 121 and the roughened surface 131 which are formed by half etching and roughened can be formed by etching the heat conductive sheet 10 together with the cavity 11 formed by etching in the process of etching the heat conductive sheet metal without increasing the manufacturing process and cost, and the heat conductive sheet 10 can be easily manufactured by controlling the etching pattern.

As shown in fig. 3 and 4, the etching depth of the half-etched roughened micro-rough surface 121 may be 2% to 25% of the thickness t of the heat conducting sheet 10, and the etching depth of the half-etched roughened surface 131 may be 2% to 25% of the thickness t of the heat conducting sheet 10. The width of the annular wall 13 is set according to the actual requirement of the product, and the depth d of the cavity 11 is 60% to 90% of the thickness t of the heat-conducting fin 10. The height t1 of the heat conducting block 12 protruding the inner side of the cavity 11 is less than or equal to the depth d of the cavity 11.

The shape of the heat conducting sheet 10 can be rectangular or other shapes, basically, the shape of the heat conducting sheet is set according to the usage environment of the product, and the shape, size and position of the heat conducting block 12 are also set according to the actual requirements of the product. The number of the heat conducting blocks 12 may be one or more, and as shown in fig. 1 and fig. 2, in the preferred embodiment, the heat conducting plate 10 has one heat conducting block 12, and the heat conducting block 12 is located in the central region of the cavity 11 of the heat conducting plate 10 or is offset to one side of the cavity 11. As shown in fig. 5, in the preferred embodiment, when there are a plurality of heat conducting blocks 12, the heat conducting blocks 12 are distributed in the cavity 11 of the heat conducting plate 10 at intervals. The arrangement positions of the heat conducting blocks 12 are set according to the requirements of the actual product, for example: the heat conducting sheet 10 is disposed in a space that is suitable for the position of the heat source or the mechanical strength thereof.

With the structure of the heat conducting sheet 10, it can be applied to the heat dissipating mechanism of the electronic device 30, as shown in fig. 6, the heat conducting sheet 10 can be pasted or coated with the heat dissipating medium 111 such as heat dissipating paste on the first side 101 of the heat conducting sheet 10 to cover the heat source 31 of the electronic device 30, the heat dissipating medium 111 such as heat dissipating paste filled in the second side 102 and the cavity 11 of the heat conducting sheet 10, and the heat conducting sheet 10 is provided with the heat dissipating member 20 having a plurality of heat dissipating fins 21 and the heat dissipating fins 21 are provided with the fan 22.

When the heat conducting sheet 10 is applied to a heat source 31 of an electronic device 30 to perform a heat dissipation function, the first side 101 of the heat conducting sheet 10 directly contacts or contacts the heat source 31 of the electronic device 30 through a heat dissipation medium 111 such as heat dissipation paste, so that heat generated by the heat source 31 is conducted to the heat conducting sheet 10, the heat dissipation surface area is enlarged by the micro-rough surface 121 of the heat conducting block 12, and the heat dissipation medium is filled in the heat conducting block 12, the second side 102 and the cavity 11 of the heat conducting sheet 10, so that the heat of the heat source 31 is rapidly dispersed to the heat conducting sheet 10, and the heat dissipation member 20 with a plurality of heat dissipation fins 21 and the fan 22 are guided by the heat conducting sheet 10 to generate auxiliary heat dissipation of air flow, thus, a better heat dissipation effect is achieved by virtue of the excellent heat conduction performance provided by the heat conducting sheet 10.

Although the present invention has been described with reference to the preferred embodiments, it should be understood that various changes, substitutions and alterations can be made herein without departing from the spirit and scope of the utility model as defined by the appended claims.

Claims

1. A heat conducting fin is characterized in that the heat conducting fin is a thin sheet body made of a heat conducting metal material, the two opposite sides of the heat conducting fin are respectively a first side and a second side, the second side is etched to form a recess, at least one heat conducting block located in the recess and an annular wall portion located on the periphery of the recess, and the side face, facing the second side, of the heat conducting block is provided with a half-etched roughened micro-rough surface.

2. A heat conductive sheet according to claim 1, wherein the depth of the recess is 60 to 90% of the thickness of the heat conductive sheet, and the etching depth of the half-etched roughened micro-roughened surface is 2 to 25% of the thickness of the heat conductive sheet.

3. A heat conductive sheet according to claim 1, wherein the surface of the annular wall portion on the second side has a roughened surface roughened by half etching.

4. A heat conductive sheet as claimed in claim 3, wherein the depth of the recess is 60% to 90% of the thickness of the heat conductive sheet, the etching depth of the half-etched roughened micro-roughened surface is 2% to 25% of the thickness of the heat conductive sheet, and the etching depth of the half-etched roughened surface is 2% to 25% of the thickness of the heat conductive sheet.

5. A thermally conductive sheet as claimed in any one of claims 1 to 4, wherein the thickness of the thermally conductive sheet is 0.4mm to 2 mm.