CN216671600U - Novel plastic package power device packaging platform - Google Patents
Novel plastic package power device packaging platform Download PDFInfo
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- CN216671600U CN216671600U CN202220194021.1U CN202220194021U CN216671600U CN 216671600 U CN216671600 U CN 216671600U CN 202220194021 U CN202220194021 U CN 202220194021U CN 216671600 U CN216671600 U CN 216671600U
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
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Abstract
The utility model discloses a novel plastic package power device packaging platform which comprises a plastic package body and a power assembly arranged in the plastic package body, wherein the power assembly comprises a ceramic copper-clad substrate, a chip is fixedly connected to the surface of the ceramic copper-clad substrate, one end of a terminal is fixedly connected to one end of the ceramic copper-clad substrate, the terminal extends out of the plastic package body, one side of the plastic package body, which extends out of the terminal, is step-shaped, and a vertical groove is formed in one side of the plastic package body, which extends out of the terminal. The device realizes that power single tube encapsulation is inside insulating, through the height of the relative cooling surface of lifting terminal, increase creepage distance and electric clearance, need not to carry out loaded down with trivial details potsherd operation of filling up during the installation, save assembly cost, electrified terminal part accords with the safety standard to creepage distance and electric clearance on the cooling surface along the plastic-sealed body surface and does not need to slot on the radiator, reduce cost, increase pottery covers copper base plate slide glass island area, can hold more heavy current specification chip, increase terminal sectional area, the reinforcing through-current capacity.
Description
Technical Field
The utility model relates to the technical field of power device packaging, in particular to a novel plastic package power device packaging platform.
Background
The power semiconductor device is widely applied to respective electric energy conversion equipment, various financial subsidies are gradually removed from new energy power generation systems such as photovoltaic power generation and wind power generation and new energy electric equipment such as electric automobiles, the requirements of the market on the cost of various new energy systems are stricter and stricter, in order to reduce the system cost, new energy equipment manufacturers gradually use a single-tube power device scheme to replace a modular power device technical scheme, the power grade of a single-tube power device is lower, and the devices are generally required to be connected in parallel to improve the system power. By taking a photovoltaic inverter as an example, the single-tube non-parallel scheme can realize the development of a machine with a power grade below 20kW, and the double-tube parallel scheme can realize a machine with a power grade below 50 kW; if a single-tube parallel scheme is used for realizing the development of a machine with higher power level, a larger number of single tubes need to be connected in parallel, and meanwhile, the parallel current sharing problem caused by inconsistent device parameters and asymmetric circuit layout exists in the technology, so that the design difficulty is caused.
The single tube package of current industry mainstream needs additionally to fill up the potsherd because the cooling surface is uninsulated, and the equipment flow is complicated, and for the potsherd fracture breakage that prevents to fill up, potsherd thickness is thicker usually, and the heat-sinking capability is relatively poor. Although the internal insulation single-tube package cooled in the liquid state provided by the publication number CN212517172U can improve the overall heat dissipation effect, the creepage distance and the electric gap between the terminal and the heat sink are still insufficient, so that extra machining cost is required to be added to the heat sink to increase the creepage distance and the electric gap so as to meet the safety standard, and therefore, the application of the single-tube scheme to higher power levels is limited, and therefore a novel plastic package power device package platform is urgently needed to solve the above problems.
SUMMERY OF THE UTILITY MODEL
The utility model aims to solve the defects in the prior art and provides a novel plastic package power device package platform.
In order to achieve the purpose, the utility model adopts the following technical scheme: a novel plastic package power device package platform comprises a plastic package body and a power assembly arranged in the plastic package body;
the power assembly comprises a ceramic copper-clad substrate, the size of a slide island on the surface of the ceramic copper-clad substrate is not less than 13.9mm by 10.8mm, and a chip is fixedly connected to the surface of the ceramic copper-clad substrate;
one end of the terminal is fixedly connected with one end of the ceramic copper-clad substrate, the terminal extends out of the plastic package body, and the vertical height of the lower surface of the terminal from the lower surface of the ceramic copper-clad substrate is not less than 3.5 mm;
one side of the plastic package body, which extends out of the terminal, is step-shaped, and one side of the plastic package body, which extends out of the terminal, is provided with a vertical groove.
As a further description of the above technical solution: the ceramic copper-clad substrate comprises copper-clad layers and ceramic layers arranged between the copper-clad layers.
As a further description of the above technical solution: the thickness of the ceramic layer is 0.63mm, and the thickness of the copper-clad layer is 0.2-0.4 mm.
As a further description of the above technical solution: the area of the carrying island on the surface of the ceramic copper-clad substrate is 19.0mm 12.5mm at most.
As a further description of the above technical solution: the front surface of the chip is connected with the copper-clad layer on the front surface of the ceramic copper-clad substrate through a bonding wire.
As a further description of the above technical solution: the lower copper-clad layer penetrates through the lower end of the plastic package body, and the lower copper-clad layer is exposed.
As a further description of the above technical solution: the step-shaped height of the plastic package body is 1-2mm, and the length of the plastic package body is 1-2 mm.
As a further description of the above technical solution: the vertical grooves are arranged between the two groups of terminals, the width of each vertical groove is 1-2mm, and the longitudinal depth of each vertical groove is 0.5-1.0 mm.
As a further description of the above technical solution: the terminal is bent, and the cross-sectional dimension of the terminal is not less than 1.2mm 0.8 mm.
As a further description of the above technical solution: the bonding wires are provided with a plurality of groups.
The utility model has the following beneficial effects:
1. according to the utility model, the ceramic layer for insulation is arranged inside the plastic package body, so that compared with the existing power single tube, the complex operation of padding a ceramic plate below the power single tube and coating two layers of heat-conducting silicone grease in the installation process is omitted, the operation process is simplified, and the cost can be reduced.
2. According to the utility model, the height of the terminal relative to the lower copper-clad layer is raised, so that the creepage distance and the electric clearance are increased, the safety standard is met, and the creepage distance and the creepage clearance are increased without additionally digging a groove on the lower radiator, so that the machining cost is greatly reduced.
3. According to the utility model, by increasing the area of the ceramic copper-clad substrate slide island, a chip with a larger current specification can be accommodated, the sectional area of the terminal is increased, the through-current capacity is enhanced, and the application power section range of the power single-tube scheme is expanded. The power output capacity of a single device is increased, the number of parallel devices can be reduced, the area of a PCB (printed circuit board) of the system is saved, and the design difficulty of the system is simplified.
4. According to the utility model, the vertical groove is formed on the terminal extending surface of the plastic package body, so that the extending part forms a protruding shape, when the device is applied to a high-pollution-level environment, a user can conveniently design a corresponding protective cover to be sleeved on the pin of the device, no gap is left around the pin, and discharge caused by dust accumulation between adjacent pins is avoided.
Drawings
Fig. 1 is a perspective view of a novel plastic package power device package platform provided by the utility model;
fig. 2 is a side view of a novel plastic package power device package platform provided by the utility model;
fig. 3 is a bottom perspective view of a novel plastic package power device package platform according to the present invention;
fig. 4 is a perspective view of an internal power component of a novel plastic package power device package platform according to the present invention;
fig. 5 is a side view of the power module inside the novel plastic package power device package platform according to the present invention;
fig. 6 is a top view of the power module inside the novel plastic package power device package platform according to the present invention.
Illustration of the drawings:
1. molding the body; 2. a power component; 201. a ceramic copper-clad substrate; 2011. coating a copper layer; 2012. a ceramic layer; 202. a chip; 203. a terminal; 3. a vertical trench; 4. and bonding wires.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention; the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance, and furthermore, unless otherwise explicitly stated or limited, the terms "mounted," "connected," and "connected" are to be construed broadly and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in a specific case to those of ordinary skill in the art.
Referring to fig. 1-6, one embodiment provided by the present invention: a novel plastic package power device packaging platform comprises a plastic package body 1 and a power component 2 arranged inside the plastic package body 1;
the power component 2 comprises a ceramic copper-clad substrate 201, the size of a slide island on the surface of the ceramic copper-clad substrate 201 is not less than 13.9mm 10.8mm, the maximum size can reach 19.0mm 12.5mm, and is more than 1.5 times of that of the existing common package, so that a chip 202 with a larger current specification can be accommodated, the surface of the ceramic copper-clad substrate 201 is fixedly connected with the chip 202, circuit patterns are etched on the upper layer of the ceramic copper-clad substrate 201 and used for connecting device electrodes, the chip 202 and the ceramic copper-clad substrate 201 are welded through solder paste, and the solder paste comprises SnAg3Cu0.5One or more chips 202 may be soldered to the carrier island;
one end of the terminal 203 is fixedly connected to one end of the ceramic copper-clad substrate 201, three or four terminals 203 are welded through solder, the terminal 203 extends out of the plastic package body 1, and the vertical height from the lower surface of the terminal 203 to the lower surface of the ceramic copper-clad substrate 201 is not less than 3.5 mm;
one side of the plastic package body 1 extending out of the terminal 203 is step-shaped, and one side of the plastic package body 1 extending out of the terminal 203 is provided with a vertical groove 3.
Further, the step-shaped height of the plastic package body 1 is 1-2mm, and the length is 1-2mm, and the preferred height is 1mm and the preferred length is 2 mm.
Further, the vertical groove 3 is disposed between the two sets of terminals 203, and the width of the vertical groove is 1-2mm, the longitudinal depth is 0.5-1mm, preferably the width is 1.2mm, and the longitudinal depth is 0.6 mm.
According to the technical scheme, through the structural design, the distance from the charged part of the terminal 203 to the copper-clad layer 2011 of the lower layer of the ceramic copper-clad substrate 201 along the bottom surface of the plastic package body 1 is greater than 5mm, the vertical height electrical gap from the lower surface of the copper-clad layer 2011 of the lower layer of the lower surface of the terminal 203 is greater than 3.5mm, the product meets the safety standard, the groove does not need to be additionally dug on the radiator below to increase the creepage distance and creepage gap, and the machining cost is greatly reduced.
Further, the ceramic copper-clad substrate 201 includes copper-clad layers 2011 and a ceramic layer 2012 arranged between the copper-clad layers, and the ceramic layer 2012 is Al2O3Ceramics or AlN ceramics, Si3N4A ceramic.
Further, the thickness of the ceramic layer 2012 is 0.63mm, and the thickness of the copper-clad layer 2011 is 0.2-0.4 mm.
According to the technical scheme, the insulating ceramic layer 2012 is arranged inside the plastic package body 1, the copper-clad layers 2011 are arranged on the upper side and the lower side of the ceramic layer 2012 respectively, the copper-clad layers 2011 on the lower layer are exposed outside the plastic package body 1, the operation of filling a ceramic plate in an installation link and smearing two layers of heat-conducting silicone grease is omitted when the product is installed under the conditions of ensuring heat dissipation and avoiding electric leakage, the operation flow is simplified, and the installation efficiency is improved
Further, the front surface of the chip 202 is connected to the copper-clad layer 2011 on the front surface of the ceramic copper-clad substrate 201 through the bonding wire 4, and the material of the bonding wire 4 is aluminum or an aluminum alloy, and the diameter is 125 micrometers to 500 micrometers.
Further, two-layer about copper layer 2011 is provided with, and lower floor covers copper layer 2011 and runs through the lower extreme of plastic-sealed body 1, and lower floor covers copper layer 2011 and is the exposed state to the heat of the whole power single tube of being convenient for is outwards gived off from the copper layer 2011 of lower floor.
Further, the terminal 203 is bent, and the cross-sectional dimension of the terminal 203 is not less than 1.2mm x 0.8mm, compared with the existing terminal 203, the sectional area is increased, so that the current capacity of the terminal 203 can be enhanced, and the application power range of the whole power single tube is increased.
Further, the bonding wires 4 are provided with a plurality of groups for connecting the chips 202 and the upper copper clad layer 2011.
The working principle is as follows: in the manufacturing process of the product, the ceramic layer 2012 for insulation is arranged inside the plastic package body 1, the copper-clad layers 2011 are respectively arranged on the upper side and the lower side of the ceramic layer 2012, and the copper-clad layer 2011 on the lower layer is exposed outside the plastic package body 1, so that under the conditions of ensuring heat dissipation and avoiding electric leakage, when the product is installed, the operation of padding a ceramic plate in an installation link and coating two layers of heat-conducting silicone grease is omitted, the operation process is simplified, the installation efficiency is improved, the island area of the copper-clad layer 2011 on the upper layer of the ceramic layer 2012 can maximally reach 19.0mm 12.5mm, which is more than 1.5 times of the existing common package, so that a chip 202 with a larger current specification can be accommodated, the sectional area of the terminal 203 connected to one end of the ceramic copper-clad substrate 201 is at least 1.2mm 0.8mm, the sectional area is increased compared with the existing terminal 203, and the flow capacity of the terminal 203 can be enhanced, the application power range of the whole power single tube is enlarged, and in the actual use process, the power output capacity of a single power single tube is increased, so that the parallel connection use number of the power single tubes can be reduced, the area of a PCB (printed circuit board) of a system is saved, and the design difficulty is reduced.
The welding is through bending treatment at the terminal 203 of pottery copper-clad substrate 201, and externally 1 bottom of plastic-sealed body also is provided with corresponding step-like arch, make terminal 203 the certain height of lifting, the height of the bottom step of plastic-sealed body 1 is 1mm, length is 2mm, through above-mentioned structural design, make the electrified part of terminal 203 along the distance that 1 bottom surface of plastic-sealed body covered copper layer 2011 of pottery copper-clad substrate 201 lower floor is greater than 5mm, the perpendicular high electrical clearance of covering copper layer 2011 lower surface of terminal 203 lower surface distance lower floor is greater than 3.5mm, make this product accord with safety standard, need not additionally to dig the groove on the radiator of below and increase creepage distance and creepage clearance, the machining cost that significantly reduces.
And vertical slot 3 has been seted up in the one side that stretches out the plastic-sealed body 1 at terminal 203, vertical slot 3's width is 1.2mm, vertical degree of depth is 0.6mm, thereby make the creepage distance between two sets of terminals 203 satisfy the safety standard, simultaneously owing to be provided with vertical slot 3, make the one side that terminal 203 stretches out the plastic-sealed body 1 split into the multiunit lug, use the protection casing on with the pin of terminal 203, the edge card of protection casing is in vertical slot 3, compare in current plastic-sealed body 1 who does not set up vertical slot 3, can not leave the gap around the pin, thereby avoid piling up the dust between the adjacent terminal 203 pin and discharge each other, thereby can be applicable to high polluted environment.
Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still make modifications to the technical solutions described in the foregoing embodiments, or make equivalent substitutions and improvements to part of the technical features of the foregoing embodiments, and any modifications, equivalent substitutions and improvements made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (10)
1. The utility model provides a novel plastic envelope power device encapsulates platform which characterized in that: the device comprises a plastic package body (1) and a power assembly (2) arranged in the plastic package body (1);
the power assembly (2) comprises a ceramic copper-clad substrate (201), the size of a carrying island on the surface of the ceramic copper-clad substrate (201) is not less than 13.9mm by 10.8mm, and a chip (202) is fixedly connected to the surface of the ceramic copper-clad substrate (201);
one end of the terminal (203) is fixedly connected with one end of the ceramic copper-clad substrate (201), the terminal (203) extends out of the plastic package body (1), and the vertical height of the lower surface of the terminal (203) from the lower surface of the ceramic copper-clad substrate (201) is not less than 3.5 mm;
one side of the plastic package body (1) extending out of the terminal (203) is step-shaped, and a vertical groove (3) is formed in one side of the plastic package body (1) extending out of the terminal (203).
2. The novel plastic package power device packaging platform according to claim 1, characterized in that: the ceramic copper-clad substrate (201) comprises copper-clad layers (2011) and ceramic layers (2012) arranged between the copper-clad layers.
3. The novel plastic package power device packaging platform according to claim 2, characterized in that: the thickness of ceramic layer (2012) is 0.63mm, the thickness of covering copper layer (2011) is 0.2-0.4 mm.
4. The novel plastic package power device packaging platform according to claim 1, characterized in that: the area of the carrying island on the surface of the ceramic copper-clad substrate (201) is 19.0mm 12.5mm at most.
5. The novel plastic package power device packaging platform according to claim 2, characterized in that: the front surface of the chip (202) is connected with the copper-clad layer (2011) on the front surface of the ceramic copper-clad substrate (201) through a bonding wire (4).
6. The novel plastic package power device packaging platform according to claim 2, characterized in that: it is two-layer about copper layer (2011) is provided with, lower floor cover copper layer (2011) and run through the lower extreme of plastic-sealed body (1), lower floor cover copper layer (2011) and be the exposed state.
7. The novel plastic package power device packaging platform according to claim 1, characterized in that: the step-shaped height of the plastic package body (1) is 1-2mm, and the length is 1-2 mm.
8. The novel plastic package power device packaging platform according to claim 1, characterized in that: the vertical grooves (3) are arranged between the two groups of terminals (203), the width of each vertical groove is 1-2mm, and the longitudinal depth of each vertical groove is 0.5-1 mm.
9. The novel plastic package power device packaging platform according to claim 1, characterized in that: the terminal (203) is bent, and the cross-sectional dimension of the terminal (203) is not less than 1.2mm 0.8 mm.
10. The novel plastic package power device packaging platform according to claim 5, wherein: the bonding wires (4) are provided with a plurality of groups.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220194021.1U CN216671600U (en) | 2022-01-24 | 2022-01-24 | Novel plastic package power device packaging platform |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220194021.1U CN216671600U (en) | 2022-01-24 | 2022-01-24 | Novel plastic package power device packaging platform |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216671600U true CN216671600U (en) | 2022-06-03 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202220194021.1U Active CN216671600U (en) | 2022-01-24 | 2022-01-24 | Novel plastic package power device packaging platform |
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| Country | Link |
|---|---|
| CN (1) | CN216671600U (en) |
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2022
- 2022-01-24 CN CN202220194021.1U patent/CN216671600U/en active Active
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