CN216670185U

CN216670185U - High-low temperature test equipment

Info

Publication number: CN216670185U
Application number: CN202122893049.2U
Authority: CN
Inventors: 黄庆云
Original assignee: TRANTEST PRECISION (CHINA) Ltd
Current assignee: TRANTEST PRECISION (CHINA) Ltd
Priority date: 2021-11-24
Filing date: 2021-11-24
Publication date: 2022-06-03
Anticipated expiration: 2031-11-24

Abstract

The utility model belongs to the technical field of test fixtures, and relates to high and low temperature test equipment, which comprises: test box and sealed heat preservation device, still be equipped with the installation area who is used for placing the pending PCBA board that awaits measuring in the sealed heat preservation device, be equipped with test interface on the test box, the pending PCBA board that awaits measuring passes through connecting wire and test interface electric connection, sealed heat preservation device includes: from last cover body component, first sealing member, the second sealing member of installing extremely down in proper order, be equipped with the cavity region on the first sealing member, so that first sealing member with can form the installation region between the second sealing member, just the lower terminal surface of first sealing member and the up end in close contact with of second sealing member, be equipped with the subassembly that adjusts the temperature in the test box, the subassembly that adjusts the temperature with sealed heat preservation device intercommunication.

Description

High-low temperature test equipment

Technical Field

The utility model belongs to the technical field of test jigs, and relates to high and low temperature test equipment.

Background

The PCB board is also called as a printed circuit board, is an important electronic component, is a support body of an electronic element, is a provider for connecting circuits of the electronic element, and is a PCB board with welded elements; after the soldering of the components on the PCB is completed, it is generally necessary to use high and low temperature testing equipment to test the functions of the PCB during high and low temperature operation.

When the conventional test equipment is used for testing the PCBA, the temperature control device, the upper die, the lower die and the lifting cylinder are arranged in the test equipment and matched, the lifting cylinder is used for driving the upper die to move up and down, when the PCBA is tested, the PCBA is placed in the mounting groove of the lower die, then the test equipment is operated to control the working of the lifting cylinder, so that the driving cylinder can drive the upper die to move close to the lower die, a product is fixed, then the test equipment is operated to regulate and control the temperature control device to control the temperature in the test equipment, and then the test equipment is operated to perform functional test on the PCBA; although this kind of technical scheme can carry out the functional test under high temperature, the low temperature to the PCBA board, because the device of location PCBA is located test equipment, and does not set up dedicated sealed heat preservation device for the actual temperature in the test equipment receives the influence of surrounding environment factor great, and the inside CPU module of test equipment also can produce a large amount of heats, leads to actual temperature in the test equipment not to accord with the temperature that test equipment set for, consequently when carrying out functional test to the PCBA board under high temperature or low temperature condition, accurate nature when can influence PCBA board functional test.

Disclosure of Invention

The utility model aims to provide high-low temperature test equipment aiming at the defects of the prior art, and aims to solve the problem that the conventional test equipment is low in accuracy when a function of a PCBA board is tested under the condition of high temperature or low temperature because the temperature in the test equipment is greatly influenced by ambient environment factors.

In order to achieve the purpose, the utility model adopts the following technical scheme:

a high and low temperature test apparatus comprising: test box and sealed heat preservation device, still be equipped with the installation area who is used for placing the pending PCBA board that awaits measuring in the sealed heat preservation device, be equipped with test interface on the test box, the pending PCBA board that awaits measuring passes through connecting wire and test interface electric connection, sealed heat preservation device includes: from last cover body component, first sealing member, the second sealing member of installing extremely down in proper order, be equipped with the cavity region on the first sealing member, so that first sealing member with can form the installation region between the second sealing member, just the lower terminal surface of first sealing member and the up end in close contact with of second sealing member, be equipped with the subassembly that adjusts the temperature in the test box, the subassembly that adjusts the temperature with sealed heat preservation device intercommunication.

Further, the cover assembly includes: the upper seat, the first cover body, the second cover body and the base, the upper end of the first cover body is fixed with the upper seat, the lower end of the first cover body is fixed with the base, the base is fixed on the first sealing element, the second cover body is fixedly arranged in the first cover body, and the bottom of the second cover body is fixed with the first sealing element.

Further, the temperature adjustment assembly comprises: the testing box comprises a testing box body, and is characterized in that the testing box body comprises a first air duct, a second air duct, a three-way joint, a vortex duct and a heating duct, wherein the side wall of the testing box body is further communicated with an air outlet duct and an air inlet duct, the air inlet duct is connected with a first connecting end of the three-way joint, a second connecting end of the three-way joint is communicated with an air inlet end of the first air duct, an air outlet end of the first air duct is communicated with the vortex duct, an air outlet end of the vortex duct is communicated with an air inlet end of the air outlet duct, a third connecting end of the three-way joint is communicated with an air inlet end of the second air duct, an air outlet end of the second air duct is communicated with the heating duct, an air outlet end of the heating duct is communicated with an air outlet end of the vortex duct, and an air outlet end of the air outlet duct is communicated with an installation area of the sealed heat preservation device.

Furthermore, a first control valve is arranged between the air inlet pipeline and the first connecting end of the three-way joint, and a second control valve is arranged on the first ventilation pipeline.

Furthermore, a first proportional valve is further arranged on the first ventilation pipeline, and a second proportional valve is further arranged on the second ventilation pipeline.

Furthermore, a CPU module is arranged in the test box body, and the CPU module is electrically connected with the first control valve, the second control valve, the first proportional valve and the second proportional valve at the same time.

Furthermore, a display screen is further arranged on the test box body and connected with the CPU module.

Further, the vortex pipeline is also provided with an exhaust end, and the exhaust end of the vortex pipeline is used for being connected with the exhaust pipeline.

Furthermore, the first sealing element and the second sealing element are both sponges.

Furthermore, a metal wire is arranged in the heating pipeline.

The utility model has the beneficial effects that:

through setting up sealed heat preservation device and test box into two equipment, sealed heat preservation device includes: the temperature adjusting component is communicated with the sealed heat preservation device and used for realizing the adjustment of high temperature and low temperature in the sealed heat preservation device, and the sealed heat preservation device is used for keeping the temperature in the test environment of the PCBA board to be tested from being influenced by the external environment, so that the problem that the test result is not high in accuracy when the function of the PCBA board is tested under different temperature conditions due to the fact that the temperature in the test equipment is greatly influenced by surrounding environment factors in the existing test equipment is solved; the high-temperature and low-temperature adjustment in the sealed heat preservation device can be realized by arranging the first air duct, the second air duct, the three-way joint, the vortex duct and the heating duct; through the arrangement of the first control valve, the second control valve, the first proportional valve and the second proportional valve, the temperature of air input into the heat preservation device can be regulated by controlling the opening or closing of the first control valve, the second control valve, the first proportional valve and the second proportional valve, and the high-temperature, low-temperature and normal-temperature environments in the sealed heat preservation device are simulated, so that the PCBA can be subjected to functional tests under the conditions of high temperature, low temperature and normal temperature; by arranging the exhaust pipeline, the exhaust pipeline can discharge hot gas generated during the refrigeration of the vortex tube on one hand, and can ensure that the air pressure in the sealed heat-insulating device can be kept stable on the other hand; through setting up first sealing member and second sealing member, and all set up the material of first sealing member and second sealing member into the sponge, the sponge can produce the compression under the effect of pressure, guarantees that the PCBA board that awaits measuring places at the inside back of installation area, and the bottom of installation area can be sealed completely by first sealing member and second sealing member.

Drawings

FIG. 1 is a schematic view of the internal structure of a test chamber according to the present invention;

FIG. 2 is a schematic structural view of the sealing and insulating device of the present invention;

FIG. 3 is a schematic cross-sectional view of the sealing and insulating device of the present invention;

fig. 4 is a schematic structural diagram of the present invention.

The labels in the figure are: 100-test chamber, 110-first vent line, 120-second vent line, 130-tee joint, 140-vortex line, 150-heating line, 160-inlet line, 170-outlet line, -exhaust line; 200-sealing insulation means, 210-cover body assembly, 211-upper seat, 212-first cover body, 213-second cover body, 214-base, 215-stainless steel adapter, 216-pagoda joint, 217-insulation cotton, 220-first sealing element, 230-second sealing element, 240-installation area; 310-a first control valve, 320-a second control valve, 330-a first proportional valve, 340-a second proportional valve; 400-a CPU module; 500-display screen; 600-a bracket.

Detailed Description

Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are illustrative and intended to be illustrative of the utility model and are not to be construed as limiting the utility model.

In the description of the present invention, it is to be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like, indicate orientations or positional relationships based on the orientations or positional relationships illustrated in the drawings, and are used merely for convenience in describing the present invention and for simplicity in description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed in a particular orientation, and be operated, and thus, are not to be construed as limiting the present invention.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically defined otherwise.

In the embodiments of the present invention, unless otherwise explicitly specified or limited, the terms "mounted," "connected," "fixed," and the like are to be construed broadly, e.g., as being fixedly connected, detachably connected, or integrated; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.

Referring to fig. 1 to 4, a high and low temperature test apparatus includes: the test box body 100 and the sealed heat preservation device 200 still are equipped with the installation area 240 that is used for placing the PCBA board that awaits measuring in the sealed heat preservation device 200, are equipped with test interface on the test box body 100, and the PCBA board that awaits measuring passes through connecting wire and test interface electric connection, and sealed heat preservation device 200 includes: the cover body component 210, the first sealing element 220 and the second sealing element 230 are sequentially installed from top to bottom, a hollow area is arranged on the first sealing element 220, so that an installation area 240 can be formed between the first sealing element 220 and the second sealing element 230, the lower end face of the first sealing element 220 is in close contact with the upper end face of the second sealing element 230, a temperature adjusting component is arranged in the test box 100, and the temperature adjusting component is communicated with the sealed heat preservation device 200.

In the above embodiment, the cover assembly 210 includes: the PCBA board to be tested is placed in the installation area 240, on one hand, the bottom of the installation area 240 can be completely sealed by the first sealing element 220 and the second sealing element 230, on the other hand, the sealing and heat-insulating device 200 does not need to be additionally provided with through holes for leading wires on the PCBA to penetrate out of the sealing and heat-insulating device 200, and when the PCBA board is used, the guide is only required to penetrate out from the contact surface between the first sealing element 220 and the second sealing element 230 to be connected with the test interface arranged on the test box body 100, and the first sealing element 220 and the second sealing element 230 which are made of sponge deform along with the shape of the lead, so that the sealing performance of the sealing and heat-insulating device 200 is ensured; still be equipped with stainless steel takeover 215 at the top of sealed heat preservation device 200, stainless steel takeover 215 communicates with the end of giving vent to anger of outlet duct 170, still be equipped with pagoda joint 216 in sealed heat preservation device 200, the one end and the stainless steel takeover 215 of pagoda joint 216 communicate, the other end and the top of second cover body 213 of pagoda joint 216 communicate, and further, still be equipped with heat preservation cotton 217 on the roof in first cover body 212, heat preservation cotton 217 can reduce the heat in the sealed heat preservation device 200 and give off to the external world from the roof of first cover body 212.

In the above embodiment, the temperature adjusting assembly includes: the testing box body 100 is further communicated with an air outlet pipeline 170 and an air inlet pipeline 160 on the side wall, the air inlet pipeline 160 is connected with a first connecting end of the three-way joint, a second connecting end of the three-way joint 130 is communicated with an air inlet end of the first air outlet pipeline 110, an air outlet end of the first air outlet pipeline 110 is communicated with the vortex pipeline 140, an air outlet end of the vortex pipeline 140 is communicated with an air inlet end of the air outlet pipeline 170, a third connecting end of the three-way joint 130 is communicated with an air inlet end of the second air outlet pipeline 120, an air outlet end of the second air outlet pipeline 120 is communicated with the heating pipeline 150, an air outlet end of the heating pipeline 150 is communicated with an air outlet end of the vortex pipeline 140, and an air outlet end of the air outlet pipeline 170 is communicated with the mounting area 240 of the sealed heat preservation device 200.

In the above embodiment, a first control valve 310 is further disposed between the air inlet pipe 160 and the first connection end of the three-way joint 130, specifically, the first control valve 310 is a master electromagnetic valve, the master electromagnetic valve is used for controlling external air to enter the three-way joint 130, a second control valve 320 is further disposed on the first air vent pipe 110, and specifically, the second control valve 320 includes: and an electromagnetic valve and a pneumatic valve, wherein the electromagnetic valve is used for controlling the pneumatic valve to open or close, so that the first vent pipe 110 can be communicated, further, a first proportional valve 330 is further arranged on the first vent pipe 110, the first proportional valve 330 is used for controlling the flow rate of air entering the vortex pipe 140, a second proportional valve 240 is further arranged on the second vent pipe 120, and the second proportional valve 240 is used for controlling the flow rate of air entering the heating pipe 150.

In the above embodiment, the test box 100 is further provided with a CPU module 400, the CPU module 400 is electrically connected to the first control valve 310, the second control valve 320, the first proportional valve 330 and the second proportional valve 240 at the same time, and further, the test box 100 is further provided with a display screen 500, an operation switch (not marked in the figure) and an emergency stop button (not marked in the figure), and the display screen 500, the operation switch and the emergency stop button are all connected to the CPU module 400.

In the above embodiment, the vortex pipe 140 further has an exhaust end, and the exhaust end of the vortex pipe 140 is used for connecting an exhaust pipe (not shown in the figure), and the exhaust pipe can exhaust hot gas generated during refrigeration of the vortex pipe 140 on one hand, and on the other hand, ensures that the air pressure in the sealed heat preservation device 200 can be kept stable.

In the above embodiment, the heating duct 150 is provided with the metal wire therein, and the metal wire is disposed so that the heating duct 150 can heat the passing air when the air enters the heating duct 150 to the inside.

In the above embodiment, the high and low temperature test apparatus further includes: the bracket 600 and the sealing and heat-preserving device 200 are arranged on the bracket 600.

In the above embodiment, the side wall of the testing box 100 is further provided with a vent hole.

The working principle is as follows: when the PCBA board is tested at low temperature, the first control valve 310 is opened, air circulates to the vortex pipeline 140 to generate cold air, then the first proportional valve 330 is opened to adjust the flow of the cold air output by the vortex pipeline 140, and the cold air enters the sealed heat preservation device 200, so that the PCBA board is tested at low temperature; during normal temperature testing, when the first proportional valve 330 and the second proportional valve 240 are both opened, the first control valve 310 is also opened, the gas entering the second air duct 120 outputs high-temperature gas through the heating duct 150, the gas entering the first air duct 110 outputs cold air under the action of the vortex duct 140, the high-temperature gas and the low-temperature gas are mixed at the air outlet duct 170 and enter the sealed heat preservation device 200, and the temperature of the normal-temperature air is output, so that the testing of the PCBA board under the normal temperature condition is realized; during the high-temperature test, the first proportional valve 330 is closed, the second proportional valve 240 is opened, the gas in the second gas passage 120 is regulated by the heating pipe 150 to output high-temperature gas, and the high-temperature gas enters the sealed heat preservation device 200 to output the temperature of high-temperature air, so that the test of the PCBA board under the high-temperature condition is realized.

The above-described embodiments are only one of the preferred embodiments of the present invention, and general changes and substitutions by those skilled in the art within the technical scope of the present invention are included in the protection scope of the present invention.

Claims

1. A high and low temperature test apparatus, comprising: test box (100) and sealed heat preservation device (200), still be equipped with installation area (240) that are used for placing the PCBA board that awaits measuring in sealed heat preservation device (200), be equipped with test interface on test box (100), the PCBA board that awaits measuring passes through connecting wire and test interface electric connection, sealed heat preservation device (200) include: from last cover body component (210), first sealing member (220), the second sealing member (230) of installing down in proper order, be equipped with the cavity region on first sealing member (220), so that first sealing member (220) with can form installation region (240) between second sealing member (230), just the lower terminal surface of first sealing member (220) and the up end in close contact with of second sealing member (230), be equipped with the subassembly that adjusts the temperature in test box (100), the subassembly that adjusts the temperature with sealed heat preservation device (200) intercommunication.

2. A high and low temperature test apparatus according to claim 1, wherein the enclosure assembly (210) comprises: go up seat (211), the first cover body (212), the second cover body (213) and base (214), the upper end and the upper seat (211) of the first cover body (212) are fixed, the lower extreme and the base (214) of the first cover body (212) are fixed, base (214) are fixed in on first sealing member (220), the second cover body (213) set firmly in the first cover body (212), just the second cover body (213) bottom is fixed with first sealing member (220).

3. A high and low temperature test apparatus according to claim 2, wherein the temperature adjustment assembly comprises: the testing device comprises a first ventilation pipeline (110), a second ventilation pipeline (120), a three-way joint (130), a vortex pipeline (140) and a heating pipeline (150), wherein the side wall of the testing box body (100) is also communicated with an air outlet pipeline (170) and an air inlet pipeline (160), the air inlet pipeline (160) is connected with a first connecting end of the three-way joint (130), a second connecting end of the three-way joint (130) is communicated with an air inlet end of the first ventilation pipeline (110), an air outlet end of the first ventilation pipeline (110) is communicated with the vortex pipeline (140), an air outlet end of the vortex pipeline (140) is communicated with an air inlet end of the air outlet pipeline (170), a third connecting end of the three-way joint (130) is communicated with an air inlet end of the second ventilation pipeline (120), an air outlet end of the second ventilation pipeline (120) is communicated with the heating pipeline (150), and an air outlet end of the heating pipeline (150) is communicated with an air outlet end of the vortex pipeline (140), and the air outlet end of the air outlet pipeline (170) is communicated with the mounting area (240) of the sealed heat preservation device (200).

4. The high and low temperature test equipment as claimed in claim 3, wherein a first control valve (310) is further provided between the air inlet pipe (160) and the first connection end of the three-way joint (130), and a second control valve (320) is further provided on the first vent pipe (110).

5. A high and low temperature test device according to claim 4, wherein the first vent pipe (110) is further provided with a first proportional valve (330), and the second vent pipe (120) is further provided with a second proportional valve (340).

6. The high and low temperature test equipment according to claim 5, wherein a CPU module (400) is further disposed in the test box (100), and the CPU module (400) is electrically connected to the first control valve (310), the second control valve (320), the first proportional valve (330), and the second proportional valve (340) at the same time.

7. The high and low temperature test equipment according to claim 6, wherein a display screen (500) is further arranged on the test box body (100), and the display screen (500) is connected with the CPU module (400).

8. A high and low temperature test device according to any one of claims 3 to 7, characterized in that the vortex tube (140) is further provided with a gas exhaust end, and the gas exhaust end of the vortex tube (140) is used for connecting the gas exhaust tube.

9. A high and low temperature test apparatus according to claim 1, wherein the first and second sealing members (220, 230) are sponge.

10. A high and low temperature test apparatus according to claim 3, wherein a wire is provided in the heating pipe (150).