CN216663271U - Conductive device for electroplating ceramic - Google Patents

Abstract

The utility model relates to the technical field of ceramic electroplating tools, in particular to a conductive device for electroplating ceramic, which comprises a conductive hook, a conductive base body connected with the conductive hook, a conductive cover body covering the conductive base body and a locking piece for locking the conductive base body and the conductive cover body, wherein the conductive base body and the conductive cover body are both electrically connected with the conductive hook, and the conductive base body is matched with the conductive cover body through the locking piece for clamping a ceramic workpiece. When the ceramic workpiece clamping device is used, the conductive base body is matched with the conductive cover body through the locking piece to clamp the ceramic workpiece, the clamping stability is improved, the conductive base body and the conductive cover body are electrically connected with the conductive hook, and the conductive base body and the conductive cover body respectively act on the ceramic workpiece under the condition that electroplating is met, so that the ceramic workpiece is conductive on two sides, the current distribution uniformity of the ceramic workpiece is ensured, the electroplating quality is improved, and the electroplating efficiency of the ceramic workpiece is improved.

Description

A conductive device for electroplating ceramics

technical field

The utility model relates to the technical field of ceramic electroplating appliances, in particular to a conductive device for electroplating ceramics.

Background technique

Under the vigorous development of the ceramic PCB and solar silicon wafer market, the existing electroplating fixtures are not stable in use, which is easy to damage the ceramic workpiece, and it is difficult to achieve double-sided simultaneous electroplating, which cannot meet the current market demand.

SUMMARY OF THE INVENTION

In order to overcome the shortcomings and deficiencies in the prior art, the purpose of the present invention is to provide a conductive device for electroplating ceramics.

The purpose of this utility model is achieved through the following technical solutions: a conductive device for electroplating ceramics, comprising a conductive hook, a conductive base connected with the conductive hook, a conductive cover covered on the conductive base, and a conductive base for locking the conductive base and the conductive The locking piece of the cover body, the conductive base body and the conductive cover body are both electrically connected to the conductive hook, and the conductive base body cooperates with the conductive cover body through the locking piece to clamp the ceramic workpiece.

Preferably, the conductive base includes a substrate, a first pressing plate covered on the substrate, a first conductive rod connected to the conductive hook, and a first conductive block fixedly connected to the first conductive rod, the conductive hook, the first conductive rod A conductive rod and the first conductive block are electrically connected in sequence, the first conductive rod is sandwiched between the base plate and the first pressure plate, and the base plate is provided with a first through hole; the first conductive block passes through the The first escaping through hole protrudes out of the base plate and cooperates with the conductive cover to clamp the ceramic workpiece.

Preferably, the base plate is provided with a first accommodating groove that communicates with the first through-hole, the first conductive rod is accommodated in the first accommodating groove, and the first pressing plate cover set in the first accommodating groove.

Preferably, the base plate is provided with screw holes for installing bolts, and the base plate is connected to the locking member through bolts.

Preferably, the conductive cover body includes a cover plate, a second pressure plate covered on the cover plate, a second conductive rod sandwiched between the cover plate and the second pressure plate, and a second conductive rod fixedly connected to the second conductive rod The conductive hook, the second conductive rod and the second conductive block are electrically connected in sequence, and the cover plate is provided with a second through hole; the second conductive block protrudes through the second through hole. The cover plate extends out and cooperates with the conductive base to clamp the ceramic workpiece.

Preferably, the cover plate is provided with a second accommodating groove that communicates with the second through-hole, the second conductive rod is accommodated in the second accommodating groove, and the second pressing plate The cover is arranged on the second accommodating groove.

Preferably, the locking member is a fixed clip; when the conductive base and the conductive cover cooperate to clamp the ceramic workpiece, the conductive base and the conductive cover are clamped in the fixed clip.

Preferably, both the conductive base and the conductive cover are provided with installation grooves for installing hinges, and the conductive base is hinged to the conductive cover through the hinges.

The beneficial effects of the utility model are: the conductive device for electroplating ceramics of the present utility model, the conductive base body cooperates with the conductive cover body to clamp the ceramic workpiece through the locking piece during use, which improves the clamping stability, and utilizes the conductive base body and the conductive cover. The body is electrically connected with the conductive hook. Under the condition of electroplating, the conductive base and the conductive cover act on the ceramic workpiece respectively, so that the ceramic workpiece is conductive on both sides, which ensures the uniform current distribution of the ceramic workpiece, improves the electroplating quality, and improves the ceramic workpiece. electroplating efficiency.

Description of drawings

Fig. 1 is the structural representation of the present utility model;

Fig. 2 is the partial structure schematic diagram of the present utility model;

Fig. 3 is the partial structure exploded schematic diagram of the present utility model;

Fig. 4 is the structural decomposition schematic diagram of the present utility model;

FIG. 5 is a schematic exploded view of the structure of the present invention from another perspective.

Reference numerals are: 1, conductive hook; 2, conductive base; 21, base plate; 22, first pressing plate; 23, first conductive rod; 24, first conductive block; 3, conductive cover; 31, cover; 32, the second pressure plate; 33, the second conductive rod; 34, the second conductive block; 4, the locking piece; , the second through hole to give way; 9, the second accommodating groove; 10, the installation groove.

Detailed ways

In order to facilitate the understanding of those skilled in the art, the present utility model will be further described below with reference to the embodiments and the accompanying drawings, and the contents mentioned in the embodiments are not intended to limit the present utility model.

As shown in Figures 1-5, a conductive device for electroplating ceramics includes a conductive hook 1, a conductive base 2 connected to the conductive hook 1, a conductive cover 3 covered on the conductive base 2, and a conductive base 2 for locking the conductive base 2. and the locking member 4 of the conductive cover 3, the conductive base 2 and the conductive cover 3 are both electrically connected to the conductive hook 1, and the conductive base 2 is connected to the conductive cover through the locking member 4 3 is used for clamping ceramic workpieces.

In the conductive device for electroplating ceramics, the conductive base 2 cooperates with the conductive cover 3 to clamp the ceramic workpiece through the locking member 4 during use, which improves the clamping stability, and the conductive base 2 and the conductive cover 3 are both connected to the conductive hook 1 . Electrical connection, under the condition of satisfying the electroplating conditions, the conductive base 2 and the conductive cover 3 act on the ceramic workpiece respectively, so that the ceramic workpiece is conductive on both sides, which ensures the uniform current distribution of the ceramic workpiece, improves the electroplating efficiency of the ceramic workpiece, and improves the electroplating quality. .

In this embodiment, the conductive base 2 includes a base plate 21 , a first pressing plate 22 covering the base plate 21 , a first conductive rod 23 connected to the conductive hook 1 , and a first conductive rod 23 fixedly connected to the first conductive rod 23 . A conductive block 24, the conductive hook 1, the first conductive rod 23 and the first conductive block 24 are electrically connected in sequence, the first conductive rod 23 is sandwiched between the base plate 21 and the first pressing plate 22, the base plate 21 is provided with a first through hole 5; the first conductive block 24 protrudes out of the base plate 21 through the first through hole 5, and cooperates with the conductive cover 3 to clamp the ceramic artifact.

With the above technical solution, only the first conductive block 24 of the conductive base 2 is in contact with the ceramic workpiece, and the first conductive block 24 cooperates with the conductive cover 3 to clamp the ceramic workpiece. Preferably, the number of the first conductive blocks 24 is at least One piece is convenient to hold at least one ceramic workpiece and perform electroplating at the same time, which ensures the uniform current distribution of the ceramic workpiece and improves the quality of electroplating.

In this embodiment, the base plate 21 defines a first accommodating groove 6 that communicates with the first through hole 5 , and the first conductive rod 23 is accommodated in the first accommodating groove 6. The first pressing plate 22 covers the first accommodating groove 6 .

By adopting the above technical solution, the exposure of the first conductive rod 23 to the electroplating solution during electroplating can avoid adverse effects on the electroplating effect of the ceramic workpiece.

In this embodiment, the base plate 21 is provided with screw holes 7 for installing bolts, and the base plate 21 is connected to the locking member 4 through bolts.

With the above technical solution, after the locking member 4 locks the conductive base 2 and the conductive cover 3, the stability is better, and at the same time, the locking member 4 is prevented from being separated from the conductive base 2 and easily lost.

In this embodiment, the conductive cover body 3 includes a cover plate 31 , a second pressure plate 32 covered on the cover plate 31 , a second conductive rod 33 sandwiched between the cover plate 31 and the second pressure plate 32 , and The second conductive rod 33 is fixedly connected to the second conductive block 34 , the conductive hook 1 , the second conductive rod 33 and the second conductive block 34 are electrically connected in sequence, and the cover plate 31 is provided with a second through hole 8 ; The second conductive block 34 protrudes out of the cover plate 31 through the second through hole 8, and cooperates with the conductive base 2 to clamp the ceramic workpiece.

With the above technical solution, only the second conductive block 34 of the conductive cover 3 is in contact with the ceramic workpiece, and the second conductive block 34 cooperates with the conductive base 2 to clamp the ceramic workpiece. Preferably, the number of the second conductive blocks 34 is at least One piece is convenient to hold at least one ceramic workpiece and perform electroplating at the same time, which ensures the uniform current distribution of the ceramic workpiece and improves the quality of electroplating. Specifically, the first conductive block 24 and the second conductive block 34 are used to clamp the ceramic workpiece. When the electroplating conditions are met, the first conductive block 24 and the second conductive block 34 act on the ceramic workpiece respectively, so that the ceramic workpiece is Double-sided conduction ensures the uniform current distribution of the ceramic workpiece, improves the electroplating efficiency of the ceramic workpiece, and improves the electroplating quality.

In this embodiment, the cover plate 31 is provided with a second accommodating groove 9 that communicates with the second through hole 8 , and the second conductive rod 33 is accommodated in the second accommodating groove groove 9 , the second pressing plate 32 covers the second accommodating groove 9 .

By adopting the above technical solution, the exposure of the second conductive rod 33 to the electroplating solution during electroplating can avoid adverse effects on the electroplating effect of the ceramic workpiece.

In this embodiment, the locking member 4 is a fixed clip; when the conductive base 2 and the conductive cover 3 cooperate to clamp the ceramic workpiece, the conductive base 2 and the conductive cover 3 are clamped to the fixed clamp in the folder.

With the above technical solution, the conductive base 2 and the conductive cover 3 are clamped in the fixing clip in the process of electroplating the ceramic workpiece, so as to improve the clamping stability of the ceramic workpiece. Preferably, the number of the fixing clips is at least one.

In this embodiment, both the conductive base body 2 and the conductive cover body 3 are provided with installation grooves 10 for installing hinges, and the conductive base body 2 is hinged to the conductive cover body 3 through the hinges.

The above technical solution is adopted to facilitate the opening and closing of the conductive device, avoid repeated alignment and calibration work, and improve work efficiency.

The above-mentioned embodiment is a better implementation scheme of the present invention. In addition, the present invention can also be realized in other ways. Any obvious replacements are within the protection scope of the present invention without departing from the concept of the present invention. Inside.

Claims (8)

1. A conductive device for electroplating ceramics is characterized in that: including electrically conductive couple, the electrically conductive base member be connected with electrically conductive couple, lid locate electrically conductive base member electrically conductive lid and be used for the retaining member of locking electrically conductive base member and electrically conductive lid, electrically conductive base member and electrically conductive lid all with electrically conductive couple electric connection, electrically conductive base member passes through the retaining member with electrically conductive lid cooperation is used for centre gripping ceramic work piece.

2. The electrically conductive device for plating ceramics according to claim 1, characterized in that: the conductive base body comprises a substrate, a first pressing plate, a first conductive rod and a first conductive block, the first pressing plate covers the substrate, the first conductive rod is connected with the conductive hook, the first conductive block is fixedly connected with the first conductive rod, the conductive hook, the first conductive rod and the first conductive block are electrically connected in sequence, the first conductive rod is clamped between the substrate and the first pressing plate, and the substrate is provided with a first abdicating through hole; the first conductive block protrudes out of the substrate through the first abdicating through hole and is matched with the conductive cover body to clamp the ceramic workpiece.

3. The conductive device for plating ceramics according to claim 2, characterized in that: the base plate is provided with a first containing groove communicated with the first yielding through hole, the first conducting rod is contained in the first containing groove, and the first pressing plate cover is arranged in the first containing groove.

4. The electrically conductive device for plating ceramics according to claim 2, characterized in that: the base plate is provided with a screw hole for installing a bolt, and the base plate is connected with the locking piece through the bolt.

5. The electrically conductive device for plating ceramics according to claim 1, characterized in that: the conductive cover body comprises a cover plate, a second pressing plate, a second conductive rod and a second conductive block, the second pressing plate is covered on the cover plate, the second conductive rod is clamped between the cover plate and the second pressing plate, the second conductive block is fixedly connected with the second conductive rod, the conductive hook, the second conductive rod and the second conductive block are sequentially electrically connected, and the cover plate is provided with a second abdicating through hole; the second conductive block protrudes out of the cover plate through the second abdicating through hole and is matched with the conductive base body to clamp the ceramic workpiece.

6. The electrically conductive device for plating ceramics according to claim 5, characterized in that: the cover plate is provided with a second accommodating groove communicated with the second yielding through hole, the second conducting rod is accommodated in the second accommodating groove, and the second pressing plate cover is arranged in the second accommodating groove.

7. The electrically conductive device for plating ceramics according to claim 1, characterized in that: the locking piece is a fixing clamp; when the conductive base body and the conductive cover body are matched to clamp the ceramic workpiece, the conductive base body and the conductive cover body are clamped in the fixing clamp.

8. The electrically conductive device for plating ceramics according to claim 1, characterized in that: the conductive base body and the conductive cover body are provided with mounting grooves for mounting hinges, and the conductive base body is hinged to the conductive cover body through the hinges.

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