CN216663118U - TTF cell culture device - Google Patents
TTF cell culture device Download PDFInfo
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- CN216663118U CN216663118U CN202123281518.1U CN202123281518U CN216663118U CN 216663118 U CN216663118 U CN 216663118U CN 202123281518 U CN202123281518 U CN 202123281518U CN 216663118 U CN216663118 U CN 216663118U
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Abstract
The utility model provides a TTF cell culture device, which comprises a device body, a cell culture plate and a cell culture plate, wherein a culture plate accommodating space is formed; the culture dish is placed in the culture dish accommodating space and is used for accommodating the tumor cell tissues and the culture solution; and the electrode assembly is arranged in the culture dish and applies an alternating electric field to tumor cell tissues and comprises a plurality of electrode plates which are arranged in pairs, each electrode plate comprises a flexible circuit board, at least one temperature sensor and at least one dielectric element, the temperature sensors are electrically connected to the same surface of the flexible circuit board, the temperature sensors are arranged at the bottoms of the electrode plates, the top ends of the temperature sensors are higher than the bottom ends of the dielectric elements in the height direction of the culture dish, and the dielectric elements are immersed in the culture solution from 1/6-2/5 height positions with the bottom ends facing upwards when the temperature sensors are completely immersed in the culture solution. The scheme can ensure that the applied electric field intensity is sufficient, simultaneously reduce the contact area of the dielectric element and the culture solution, and reduce the heat generated by the electrode plates when the electric field is applied.
Description
Technical Field
The utility model relates to the technical field of medical experimental equipment, in particular to a TTF cell culture device.
Background
Tumor therapeutic electric fields (TTFs) are a therapeutic approach to inhibit cell proliferation by interfering with cell mitosis with low intensity, medium frequency, alternating electric fields. In recent years, the feasibility of TTF on tumor treatment is proved through cell experiments at home and abroad, and meanwhile, reliable technical support is provided for further research and clinical application. The TTF cell experiment has the action principle that the tumor tissue cells are placed in a TTF cell culture device for in-vitro culture, the rapid division of the tumor cells is inhibited by using an electric field, and the treatment effect of the electric field on the tumor tissue cells is judged according to the number of the tumor cells in a fixed time.
The conventional electrode sheet for the TTF cell culture device includes a flexible circuit board, a temperature sensor and a dielectric element, which are welded to the same side of the flexible circuit board. The dielectric element has a through opening in the middle, and the temperature sensor is fixed in the opening of the dielectric element. A gap is formed between the dielectric element and the flexible circuit board due to welding. Insulating sealant is filled in the gap and the open pore of the dielectric element to protect soldering tin and a temperature sensor between the dielectric element and the flexible circuit board, and meanwhile, after the alternating voltage filters out the mixed direct voltage through the dielectric element, the pure alternating voltage is applied to the mixed liquid of the tumor cell tissue and the culture solution to form an alternating electric field.
During the experiment, the temperature sensor housed in the opening of the dielectric element needs to be completely immersed in the mixed liquid to accurately monitor the temperature of the mixed liquid. This requires that the electrode pads be mostly immersed in the mixed liquor. However, in the experimental process, the electrode plate is immersed in the mixed solution in a large area, and the electrode plate is immersed in the mixed solution in a large area, so that the heat of the mixed solution is increased easily, and the culture of tumor cell tissues of the mixed solution is not facilitated. In addition, the mixed liquid can submerge the partial welding department between flexible line way board and the dielectric element, and the electrode piece can face the threat of infiltration easily, and then leads to alternating voltage to mix with direct current voltage and directly leaks electricity along with the place of infiltration and cause the harm to the tumour cell tissue in the mixed liquid, influences the experimental result.
Therefore, it is necessary to provide an electrode sheet and a TTF cell culture device to solve the above-mentioned problems of the electrode sheet of the TTF cell culture device.
SUMMERY OF THE UTILITY MODEL
The present invention provides an improved TTF cell culture device that reduces the amount of heat generated by the electrodes when an electric field is applied.
The TTF cell culture device is realized by the following technical scheme: a TTF cell culture device, comprising:
the device body is provided with a culture dish accommodating space;
the culture dish is placed in the culture dish accommodating space and is used for accommodating tumor cell tissues and culture solution; and
the electrode assembly is arranged in the culture dish and applies an alternating electric field to tumor cell tissues and comprises a plurality of electrode plates which are arranged in pairs, each electrode plate comprises a flexible circuit board, at least one temperature sensor and at least one dielectric element, the temperature sensors are electrically connected to the same surface of the flexible circuit board, the temperature sensors are arranged at the bottoms of the electrode plates, the top ends of the temperature sensors are higher than the bottom ends of the dielectric elements in the height direction of the culture dish, and the dielectric elements are immersed in the culture solution at 1/6-2/5 from the bottom ends to the top when the temperature sensors are completely immersed in the culture solution.
Furthermore, a plurality of conductive electric cores which are arranged at intervals and welded with the corresponding dielectric elements are arranged on the flexible circuit board.
Furthermore, the flexible circuit board further comprises a conductive pad welded with the corresponding temperature sensor, and the height of the position where the conductive pad is located is lower than the height of the positions where the plurality of conductive battery cores are located.
Further, the dielectric element comprises a first dielectric element and a second dielectric element which are connected in series to the flexible circuit board, the flexible circuit board comprises a first conductive cell welded to the first dielectric element and a second conductive cell welded to the second dielectric element, and the first conductive cell and the second conductive cell are located at the same height.
Furthermore, the height of the position of the conductive pad is lower than the height of the positions of the first conductive cell and the second conductive cell, and the conductive pad is located between the first conductive cell and the second conductive cell.
Further, the dielectric member is immersed in the culture solution at a height of 1/5 from the bottom end upward when the temperature sensor is completely immersed in the culture solution.
Furthermore, a sealing glue is filled between the outer edge of the temperature sensor and the flexible circuit board.
Furthermore, an opening is formed in the center of the dielectric element, sealant is filled in the opening, and the sealant is filled between the dielectric element and the flexible circuit board.
Further, the device body is including locating location structure in the culture dish accommodation space, location structure including encircle set up in the peripheral locating surface of culture dish, the locating surface in the horizontal plane with culture dish location fit.
Further, location structure includes the constant head tank, the constant head tank with the culture dish accommodation space intercommunication, the top of culture dish is arranged in the constant head tank, the inner wall of constant head tank forms the locating surface.
Furthermore, the device body comprises a top plate, a bottom plate and a supporting piece, wherein the top plate, the bottom plate and the supporting piece are arranged oppositely, the supporting piece is supported between the top plate and the bottom plate, a space between the top plate and the bottom plate is formed into a culture dish accommodating space, a culture dish is placed on the bottom plate, and a positioning structure is arranged on one side surface, facing the top plate, of the bottom plate.
Furthermore, the device also comprises a circuit board arranged above the device body, and the electrode plates are electrically connected with the circuit board.
Furthermore, the device body comprises a connecting structure, the circuit board comprises a connecting and matching structure, and the connecting structure is matched and connected with the connecting and matching structure to fix the device body and the circuit board.
Further, the device body comprises an avoiding groove, the circuit board comprises a connecting seat, and the connecting seat is arranged in the avoiding groove.
Further, the electrode plate comprises a plug-in part, the circuit board comprises a plurality of matching parts, the plug-in part is correspondingly plugged with the corresponding matching parts one by one, and the plug-in part is fixedly bonded with the matching parts.
Furthermore, the flexible circuit board is approximately arranged in a T shape, the insertion part is arranged at the narrower end part of the flexible circuit board, and the dielectric element and the temperature sensor are arranged at the wider end part of the flexible circuit board.
Further, the electrode slice includes plug connection portion, plug connection portion include insulating casing and set up in contact pin in the insulating casing, the contact pin vertical welding connect in the circuit board, the last one side surface that stretches out the contact pin of insulating casing with the circuit board supports and leans on.
The technical scheme provided by the utility model can at least achieve the following beneficial effects:
when the temperature sensor is completely immersed into the culture solution, the dielectric element of the TTF cell culture device is immersed into the culture solution from the bottom end to the height of about 1/6-2/5, so that the area of the dielectric element immersed into the mixed solution can be reduced while the strength of the electric field applied to the mixed solution is sufficient, the heat of the mixed solution is reduced, and the influence of the heat generated by the dielectric element on tumor cell tissues in the mixed solution is reduced. In addition, the top of electrically conductive pad highly is less than the height of the bottom of electrically conductive electric core, when can avoiding temperature sensor to immerse the monitoring temperature in the mixed liquid completely, prevents that steam from corroding to the soldering tin that electrically conductive electric core corresponds avoids alternating voltage to mix with direct current voltage and causes the harm to the tumour cell tissue in the mixed liquid along with the place direct electric leakage of infiltration in the mixed liquid, ensures the experiment effect accuracy.
Drawings
FIG. 1 is a perspective assembly view of a TTF cell culture apparatus according to an exemplary embodiment of the present invention;
FIG. 2 is an exploded perspective view of the TTF cell culture device of FIG. 1;
FIG. 3 is a further exploded perspective view of the TTF cell culture device of FIG. 1;
FIG. 4 is a bottom view of the TTF cell culture apparatus of FIG. 3 with electrode pads electrically connected to the circuit board;
fig. 5 is a plan view of the electrode sheet shown in fig. 4;
fig. 6 is an exploded perspective view of the electrode sheet shown in fig. 5;
fig. 7 is a wiring diagram of a flexible wiring board of the electrode sheet in fig. 6;
FIG. 8 is a schematic view of the electrode pads of FIG. 4 soldered to a circuit board;
fig. 9 is a schematic diagram of the electrode sheet of fig. 4 being plugged with a circuit board.
Detailed Description
Reference will now be made in detail to the exemplary embodiments, examples of which are illustrated in the accompanying drawings. The following description refers to the accompanying drawings in which the same numbers in different drawings represent the same or similar elements unless otherwise indicated. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the present application. Rather, they are merely examples of apparatus and methods consistent with certain aspects of the present application.
Referring to fig. 1, fig. 1 is a perspective assembly view of a TTF cell culture apparatus 100.
The embodiment of the present application provides a TTF cell culture device 100 (hereinafter referred to as a culture device 100), where the culture device 100 includes a device body 10, a culture dish 30 disposed in the device body 10, a circuit board 20 disposed above the device body 10, and an electrode assembly 40 partially disposed in the culture dish 30 and electrically connected to the circuit board 20. Wherein, the device body 10 is formed with a culture dish accommodating space 101, and the culture dish accommodating space 101 is used for placing the culture dish 30. In some embodiments, the apparatus body 10 may form a plurality of culture dish accommodating spaces 101, so that a plurality of culture dishes 30 can be placed at the same time, and the number of culture dish accommodating spaces 101 is not limited in the present application.
The culture dish 30 is used for accommodating mixed liquid of tumor cell tissue and culture solution, and the culture dish 30 is placed in the culture dish accommodation space 101, and the culture dish 30 can be arranged with the culture dish accommodation space 101 in an equal number. In the embodiment shown in fig. 1, the apparatus body 10 is formed with three culture dish accommodating spaces 101, the three culture dish accommodating spaces 101 are distributed at intervals along the length direction of the apparatus body 10, and three culture dishes 30 are arranged in the culture dish accommodating spaces 101 in a one-to-one correspondence.
The present application is not limited to the specific structure of the apparatus body 10. In one embodiment, the device body 10 includes a bottom plate 102, a top plate 103, and a support 104 supported between the bottom plate 102 and the top plate 103, which are oppositely disposed. Wherein the space between the bottom plate 102 and the top plate 103 is formed as a culture dish accommodating space 101. The bottom plate 102 and the top plate 103 may be both configured as strip-shaped plates, and the culture dish accommodating space 101 is arranged at intervals along the length direction of the bottom plate 102 and the top plate 103. Referring to fig. 2, the supporting members 104 may be provided in multiple sets, and are arranged at intervals along the length direction of the bottom plate 102 and the top plate 103, each set of supporting members 104 may include two sub-supporting members 104a and 104b, and the two sub-supporting members 104a and 104b are oppositely arranged along the width direction of the bottom plate 102 and the top plate 103. The height of the support 104 may define the height difference between the bottom plate 102 and the top plate 103. The bottom plate 102 is used to provide a stable placement plane for the plurality of culture dishes 30, and ensure that the plurality of culture dishes 30 are at the same height.
The circuit board 20 is fixed to the device body 10. For example, the circuit board 20 may be fixed to the top of the apparatus body 10 directly above the culture dish 30. In one embodiment, the top plate 103 may be a transparent plate made of acrylic, and the circuit board 20 is supported and fixed on the top plate 103.
Referring to FIG. 2, FIG. 2 is an exploded perspective view of the culture device 100 shown in FIG. 1.
Referring to fig. 1 and 2, the electrode assembly 40 is fixed to the circuit board 20 and partially disposed in the culture dish 30, and can provide a stable electric field for the tumor cell tissue in the culture dish 30. The electrode group 40 may be provided in an equal number to the culture dish 30. The electrode assembly 40 includes a plurality of electrode pieces 401 arranged in pairs, and the electrode pieces 401 are electrically connected to the circuit board 20, and are configured to apply an alternating electric field to tumor cell tissues in the mixed solution. The electrode sheets 401 are provided in an even number, and are opposed to each other two by two, for example, two sheets, four sheets, six sheets, and the like. The number of electrode groups 40 and the number of electrode sheets 401 included in each electrode group 40 are not limited in the present application. In the embodiment shown in fig. 2, there are three electrode sets 40, one electrode set 40 is placed in each culture dish 30, each electrode set 40 includes two pairs of electrode plates 401, and four electrode plates 401 are arranged opposite to each other. In one embodiment, each pair of electrode sheets 401 is disposed in a pair opposite to each other and parallel to each other, and one pair of electrode sheets 401 of the two pairs of electrode sheets 401 is disposed perpendicular to the other pair of electrode sheets 401, so that the alternating electric field between the two electrode sheets 401 of one pair is perpendicular to the alternating electric field between the two electrode sheets 401 of the other pair.
Referring to FIG. 3, FIG. 3 is another exploded perspective view of the culture device 100 shown in FIG. 1.
In order to ensure the position stability of the culture dish 30 in the experimental process, the device body 10 further includes a positioning structure 105 disposed in the culture dish accommodating space 101, the positioning structure 105 includes a positioning surface 1050 disposed around the culture dish 30, the positioning surface 1050 is in positioning fit with the culture dish 30 in the horizontal plane, the reduction in the setting avoids the culture dish 30 to generate displacement in the horizontal plane, so as to ensure the position stability of the culture dish 30 relative to the device body 10.
The present application is not limited to the location and specific implementation of the positioning structure 105. In the embodiment shown in fig. 3, the positioning structure 105 includes a positioning groove 1051, the positioning groove 1051 is communicated with the culture dish accommodating space 101, the bottom end of the culture dish 30 is located in the positioning groove 1051, and the inner wall of the positioning groove 1051 forms a positioning surface 1050 for positioning and matching with the culture dish 30. The positioning structure 105 is realized by slotting on the device body 10, and has simple structure and convenient realization. A small gap can be left between the positioning surface 1050 and the culture dish 30, so that the bottom end of the culture dish 30 can be conveniently placed in the positioning groove 1051. In an embodiment, the positioning structure 105 is disposed on the bottom plate 102, and the depth of the positioning slot 1051 is smaller than the thickness of the bottom plate 102.
The shape of the contour surface in the positioning groove 1051 may be set according to the shape of the bottom end of the culture dish 30. In this embodiment, the top of the culture dish 30 is set to be a square structure, and the positioning slot 1051 is correspondingly set to be a square slot.
In one embodiment, the device body 10 is provided with a through hole 106, and the electrode pads 401 are electrically connected to the circuit board 20 through the through hole 106. In the embodiment shown in fig. 3, the through hole 106 is opened in the top plate 103 and penetrates the top plate 103 in the thickness direction of the top plate 103. The through holes 106 may be provided in plural numbers, and the electrode groups 40 are provided in one-to-one correspondence.
Referring to fig. 3 and 4, fig. 4 is a bottom view of the circuit board 20 and the electrode pads 401 electrically connected to each other.
The device body 10 has a connection structure, the circuit board 20 has a connection fitting structure, and the connection structure is connected with the connection fitting structure in a matching manner to fix the device body 10 and the circuit board 20. In the embodiment shown in fig. 4 and 5, the circuit board 20 may be provided as a rectangular plate having substantially the same shape as the top plate 103. The circuit board 20 is coupled to the connection structure of the top plate 103 by a connection fitting structure, which includes but is not limited to bolt connection and clamping connection. In a specific embodiment, the connecting structure is a fastener (not shown) and a second positioning hole 1030 provided on the top plate 103 of the device body 10 for the fastener (not shown) to pass through, and the connecting matching structure is a first positioning hole 202 provided on the circuit board 20. The first positioning hole 202 and the second positioning hole 1030 are coaxially disposed, and the circuit board 20 and the top plate 103 may be fixedly coupled by a fastener (not shown). The number of first positioning holes 202 and second positioning holes 1030 is not limited. In the embodiment shown in fig. 3 and 4, the first positioning holes 202 are disposed in plurality and spaced along the outer edge of the circuit board 20, the second positioning holes 1030 are disposed in plurality and spaced along the outer edge of the top plate 103, and the first positioning holes 202 and the second positioning holes 1030 are disposed in one-to-one correspondence.
The device body 10 further includes an avoiding groove 1031, and the avoiding groove 1031 may be provided in the top plate 103 and penetrate the top plate 103 in the thickness direction thereof. The avoiding groove 1031 may be provided at one end of the top plate 103 in the longitudinal direction and penetrate the end. The circuit board 20 further includes a connection socket (not shown) connected to an electric field generator (not shown) disposed in the relief groove 1031, the electric field generator (not shown) for controlling the magnitude of the TTF alternating voltage transmitted to the electrode group 40.
The connection manner of the support 104, the bottom plate 102, and the top plate 103 is not limited in the present application. In one embodiment, the support 104 is bolted to the base plate 102. For example, screws are threaded through the base plate 102 and into the support 104. The top plate 103 comprises a clamping groove 1033, the support 104 comprises a clamping plate 1040 at the top end, and the clamping plate 1040 is clamped and fixed in the clamping groove 1033. In other embodiments, the support 104 and the bottom plate 102 may be clamped, and the support 104 and the top plate 103 may be screwed.
Referring to fig. 5 to 7, fig. 5 is a plan view of the electrode sheet 401. Fig. 6 is an exploded perspective view of the electrode sheet 401. Fig. 7 shows a wiring diagram of the flexible wiring board 4011 of the electrode sheet 401.
The electrode sheet 401 includes a flexible wiring board 4011, dielectric elements 4014 respectively disposed on opposite sides of the flexible wiring board 4011, and an insulating support plate 4012. The insulating support plate 4012 is used for providing support for the flexible circuit board 4011. The flexible wiring board 4011 includes an insulating substrate 40110, a plurality of conductive cells 40112, and a plurality of conductive traces (not shown). The conductive traces (not shown) are disposed on the insulating substrate 40110 in an embedded manner. The insulating substrate 40110 and the conductive traces (not shown) are integrally formed. The conductive electric cores 40112 are arranged on the surface of the flexible circuit board 4011 at intervals, and the surface of the conductive electric cores is higher than the surface of the flexible circuit board 4011. The plurality of conductive cells 40112 are connected in series by conductive traces (not shown). The dielectric element 4014 and the flexible circuit board 4011 are welded through the conductive battery core 40112. The insulating substrate 40110 may be an insulating substrate such as polyimide or mylar, and the conductive core 40112 may be a copper foil. The dielectric component 4014 can be a ceramic chip with high dielectric constant, which has the property of blocking direct current and alternating current.
In one embodiment, the dielectric element 4014 may be provided in plurality. The plurality of dielectric elements 4014 can increase the electric field strength, and can reduce capacitive reactance compared with the arrangement of a smaller number of dielectric elements 4014, so that the electric field strength is more uniform, thereby ensuring the stability of the output waveform of the electric field generator (not shown) and ensuring the output power.
In the embodiment shown in fig. 5 to 7, the dielectric element 4014 includes a first dielectric element 4014a and a second dielectric element 4014b both soldered to the flexible circuit board 4011, and the first dielectric element 4014a and the second dielectric element 4014b are located at the same height. The first dielectric element 4014a and the second dielectric element 4014b are connected in series to the flexible wiring board 4011. The conductive cell 40112 of the flexible circuit board 4011 comprises a first conductive cell 401120 for soldering with the first dielectric element 4014a and a second conductive cell 401122 for soldering with the second dielectric element 4014b, wherein the first conductive cell 401120 and the second conductive cell 401122 are located at the same height.
In this embodiment, a gap (not shown) is formed after the dielectric element 4014 and the flexible wiring board 4011 are soldered, and a sealant (not shown) is filled in the gap (not shown) to protect a solder (not shown) between the dielectric element 4014 and the flexible wiring board 4011. The dielectric component 4014 has an opening 40140 in the center. In this embodiment, the sealant (not shown) is filled into the gap (not shown) from the outer edge of the dielectric element 4014 and the opening 40140 of the dielectric element 4014, respectively. When a sealant (not shown) is filled between the dielectric element 4014 and the flexible wiring board 4011, two different sealants (not shown) may be used for filling. A gap (not shown) between the outer edge of the dielectric element 4014 and the flexible circuit board 4011 can be sealed in a waterproof manner by adopting an UF (urea formaldehyde resin adhesive), and the UF has good fluidity and can flow to the bottom of the dielectric element 4014 through a capillary effect, so that a good filling effect is achieved; the gap (not shown) of the dielectric element 4014 at the opening 40140 is sealed by using UV dropping glue, and the UV glue (photosensitive glue) has the advantages of no Volatile Organic Compounds (VOC) and no pollution to the air environment, and is suitable for materials sensitive to temperature, solvents and humidity.
Referring to fig. 8, fig. 8 is a schematic diagram illustrating the electrode pads 401 being soldered to the circuit board 20.
Referring to fig. 9, fig. 9 is a schematic diagram of the electrode sheet 401 being plugged with the circuit board 20.
The electrode tabs 401 have the same mating parts 402 as compared with the manner in which the electrode tabs 401 are soldered to the circuit board 20 shown in fig. 8. The manner in which the electrode tabs 401 shown in fig. 9 are inserted into the circuit board 20 differs from the manner in which the electrode tabs 401 shown in fig. 8 are soldered to the circuit board 20 in that: the circuit board 20 has a fitting portion 201 fitted with the insertion portion 402 of the electrode tab 401. The mating portion 201 is located on the lower board 200 of the circuit board 20. The fitting portion 201 is provided in plurality. The plurality of matching portions 201 of the circuit board 20 are correspondingly plugged with the plugging portions 402 of the plurality of electrode pads 401 one by one, so as to electrically connect the plurality of electrode pads 401 with the circuit board 20. The insertion part 402 is fixedly bonded with the matching part 201, so that the shaking amount between the two parts can be reduced. When the electrode plate 401 needs to be replaced, the electrode plate 401 can be directly pulled out of the matching portion 201, a new electrode plate 401 is inserted after the adhesive coating is cleaned, and sealing glue is applied, so that the replacement step of the electrode plate 401 is simplified. In this embodiment, the plug part 402 is a male plug provided at an end of the flexible circuit board 4011, and the mating part 201 is a female socket provided on the circuit board 20. In other embodiments, the plug portion 402 of the electrode pad 401 may be a female socket disposed at an end of the flexible circuit board 4011, the mating portion 201 of the circuit board 20 is a male plug (not shown) disposed in mating relation with the plug portion 402 of the electrode pad 401, the number of the male plugs (not shown) is multiple, and the multiple male plugs (not shown) are plugged into the plug portions 402 of the electrode pads 401 in a one-to-one correspondence.
Specifically, the upper ends of the plurality of pins 4021 of the insertion part 402 are inserted into the mating part 201, thereby electrically connecting the electrode pads 401 to the circuit board 20. A side surface 40200 of the insulating housing 4020 facing the circuit board 20 abuts against a lower surface of the mating part 201, and an adhesive is applied to the joint portion.
In one embodiment, one end of the pin 4021 electrically connected to the flexible circuit board 4011 is covered with an insulating adhesive to prevent the electrode pad 401 from being short-circuited with the circuit board 20. Organic silica gel can be chooseed for use to the insulating cement, and organic silica gel has lower tear strength, when the sealing of organic silica gel became invalid, is convenient for tear the clearance, and then glues again and seals convenient operation is swift.
Referring to fig. 5 to 7 again, the electrode plate 401 further includes a temperature sensor 4016, the temperature sensor 4016 and the dielectric element 4014 are disposed on the same surface of the flexible circuit board 4011, and the temperature sensor 4016 is disposed at the bottom of the electrode plate 401, so as to be completely immersed in the mixed liquid of the culture dish 30 and measure the temperature of the culture solution in the culture dish 30. The temperature sensor 4016 may employ a thermistor.
During the experiment, the contact area of the dielectric component 4014 and the mixed solution is inversely proportional to the impedance of the culture apparatus 100. The excessive arrangement of the mixed liquid increases the contact area between the dielectric element 4014 and the mixed liquid, thereby reducing the impedance and increasing the heat generation. Too little mixed liquor is provided, which reduces the contact area between the dielectric component 4014 and the mixed liquor. And the height error of the mixed liquid level caused by the welding height error of the electrode plate 401 and the circuit board 20, the machining error of the electrode plate 401 and the dropping operation error of the experimenter can be amplified under the condition of too little mixed liquid, and the influence on the experiment is increased.
The flexible wiring board 4011 further includes conductive pads 4019 provided in pairs and soldered to the temperature sensor 4016. The conductive pads 4019 are electrically connected to conductive traces (not shown). The plug 402 is electrically connected to the temperature sensor 4016 via conductive traces (not shown) soldered to the conductive pads 4019. The height of the top end of the conductive pad 4019 is lower than the heights of the bottom ends of the first conductive battery cell 401120 and the second conductive battery cell 401122, so that when the temperature sensor 4016 is prevented from being completely immersed in the mixed liquid to monitor the temperature, water vapor is prevented from eroding soldering tin (not shown) corresponding to the first conductive battery cell 401120 and the second conductive battery cell 401122, damage to tumor cell tissues in the mixed liquid due to direct leakage of alternating voltage mixed with direct current voltage along with the water seepage place is avoided, and accuracy of experimental effect is ensured.
The temperature sensor 4016 may be provided in plural, for example, may be provided at the same height of the flexible wiring board 4011 at intervals side by side. The number of pairs of conductive pads 4019 is the same as the number of temperature sensors 4016. In this embodiment, there are 2 temperature sensors 4016, and there are 2 pairs of conductive pads 4019.
In an alternative embodiment, the temperature sensor 4016 is located between the first dielectric element 4014a and the second dielectric element 4014b, i.e., the conductive pad 4019 is located between the first conductive cell 401120 and the second conductive cell 401122.
In this example, the dimensions of the culture dish 30 are set to 6cm and the wall thickness is set to 2 mm.
In this embodiment, the top end of the temperature sensor 4016 is slightly higher than the bottom end of the dielectric element 4014, and when the temperature sensor 4016 is completely immersed in the culture solution, the dielectric element 4014 is immersed in the culture solution from the bottom end to the height of about 1/6-2/5, so as to reduce the area of the dielectric element 4014 immersed in the mixed solution, reduce the heat of the mixed solution, and reduce the influence of the heat generated by the dielectric element 4014 on the tumor cell tissue in the mixed solution. In this embodiment, the dielectric element 4014 covers the electrically conductive core 40112 centrally, i.e., the bottom end of the dielectric element 4014 is lower than the bottom end of the electrically conductive core 40112. Preferably, the bottom end of the conductive core 40112 is above the surface of the culture fluid. That is, in the height direction, the distance from the bottom end to the top end of the conductive cell 40112 is 1/5 to 2/3 of the distance from the bottom end to the top end of the dielectric element 4014. In a preferred embodiment, dielectric 4014 is submerged in the culture solution from its bottom end up to a height of about 1/5. In this embodiment, the volume of the culture solution in the culture dish 30 is about 15 to 25ml, and the height of the liquid surface is about 0.41 to 0.69 cm.
In this embodiment, the periphery of the temperature sensor 4016 is sealed with a sealant (not shown) for water-proof. Sealant (not shown in the figure) can be organic silica gel, the organic silica gel has lower tear strength, and when the organic silica gel is sealed to lose efficacy, the organic silica gel is convenient to tear off and then sealed again, so that the operation is convenient and quick, meanwhile, the service life of the electrode plate 401 is prolonged, and the maintenance cost is reduced.
The shape of the electrode sheet 401 is not limited in the present invention. In one embodiment, the electrode sheet 401 is disposed in an inverted T-shape. The shape of the flexible circuit board 4011 is substantially the same as that of the insulating support plate 4012, and the flexible circuit board is also arranged in an inverted "T" shape, and the dielectric element 4014 is arranged in a circular sheet shape.
The opposite two electrode pads 401 may be controlled to be energized by the circuit board 20, so that an electric field is generated between the opposite two electrode pads 401. It should be noted that only two electrode sheets 401 oppositely disposed are energized simultaneously at the same time. For example, taking the example that the electrode group 40 includes two pairs of electrode pads 401, the two pairs of electrode pads 401 are 4010, 4013, 4015, and 4017 (refer to fig. 4), the electrode pads 4010 and 4015 form one pair, and the electrode pads 4013 and 4017 form another pair. At the same time, circuit board 20 may control electrode pads 4010, 4015 to be energized simultaneously, or control electrode pads 4013, 4017 to be energized simultaneously, with an electric field being generated only between the two electrode pads 401 that are energized simultaneously.
When the temperature sensor 4016 of the TTF cell culture apparatus 100 of the present invention is completely immersed in the culture solution, the dielectric element 4014 is immersed in the culture solution from the bottom end to a height of about 1/6 to 2/5, so that the area of the dielectric element 4014 immersed in the mixed solution can be reduced while ensuring that the electric field intensity applied to the mixed solution is sufficient, the heat of the mixed solution can be reduced, and the influence of the heat generated by the dielectric element 4014 on the tumor cell tissue in the mixed solution can be reduced. In addition, the height that highly is less than the bottom of electrically conductive electricity core 40112 of the top of electrically conductive pad 4019 can avoid temperature sensor 4016 to immerse when monitoring the temperature in the mixed liquid completely, prevents that steam from corroding to the soldering tin (not shown) that electrically conductive electricity core 40112 corresponds avoids alternating voltage to mix with direct current voltage and directly leaks electricity along with the place of infiltration and causes the harm to the tumour cell tissue in the mixed liquid, ensures experiment effect accuracy.
The above description is only exemplary of the present application and should not be taken as limiting the present application, as any modification, equivalent replacement, or improvement made within the spirit and principle of the present application should be included in the scope of protection of the present application.
Claims (17)
1. A TTF cell culture device, comprising:
the device body is provided with a culture dish accommodating space;
the culture dish is placed in the culture dish accommodating space and is used for accommodating tumor cell tissues and culture solution; and
the electrode assembly is arranged in the culture dish and applies an alternating electric field to tumor cell tissues and comprises a plurality of electrode plates which are arranged in pairs, each electrode plate comprises a flexible circuit board, at least one temperature sensor and at least one dielectric element, the temperature sensors are electrically connected to the same surface of the flexible circuit board, the temperature sensors are arranged at the bottoms of the electrode plates, the top ends of the temperature sensors are higher than the bottom ends of the dielectric elements in the height direction of the culture dish, and the dielectric elements are immersed in the culture solution at 1/6-2/5 from the bottom ends to the top when the temperature sensors are completely immersed in the culture solution.
2. The TTF cell culture device according to claim 1, wherein the flexible printed circuit board has a plurality of conductive cells spaced apart from each other and soldered to corresponding dielectric elements.
3. The TTF cell culture device of claim 2, wherein the flexible circuit board further comprises conductive pads soldered to the respective temperature sensors, the conductive pads being located at a height lower than a height of the plurality of conductive cells.
4. The TTF cell culture device of claim 3, wherein the dielectric element comprises a first dielectric element and a second dielectric element connected in series to the flexible circuit board, the flexible circuit board comprising a first conductive cell soldered to the first dielectric element and a second conductive cell soldered to the second dielectric element, the first conductive cell and the second conductive cell being at a same elevation.
5. The TTF cell culture device of claim 4, wherein the conductive pad is located at a height that is lower than a height at which the first conductive core and the second conductive core are located, and wherein the conductive pad is located between the first conductive core and the second conductive core.
6. TTF cell culture device according to claim 1, wherein the dielectric element is immersed in the culture liquid at a height of 1/5 from the bottom end upwards when the temperature sensor is fully immersed in the culture liquid.
7. The TTF cell culture device according to claim 1, wherein a sealant is filled between an outer edge of the temperature sensor and the flexible wiring board.
8. The TTF cell culture device according to claim 1, wherein an opening is formed in the center of the dielectric element, the opening is filled with a sealant, and the sealant is filled between the dielectric element and the flexible printed circuit board.
9. TTF cell culture device according to claim 1, wherein the device body comprises a positioning structure arranged in the culture dish receiving space, the positioning structure comprising a positioning surface arranged around the periphery of the culture dish, the positioning surface being in positioning engagement with the culture dish in a horizontal plane.
10. The TTF cell culture device according to claim 9, wherein the positioning structure comprises a positioning groove, the positioning groove is in communication with the dish accommodating space, a top end of the dish is disposed in the positioning groove, and an inner wall of the positioning groove forms the positioning surface.
11. The TTF cell culture device according to claim 9, wherein the device body comprises a top plate, a bottom plate, and a support member supported between the top plate and the bottom plate, the space between the top plate and the bottom plate being formed as the dish accommodating space, the dish being placed on the bottom plate, and a side surface of the bottom plate facing the top plate being provided with a positioning structure.
12. The TTF cell culture device according to claim 1, further comprising a circuit board above the device body, the electrode tabs being electrically connected to the circuit board.
13. The TTF cell culture device of claim 12, wherein the device body comprises a connection structure, wherein the circuit board comprises a connection mating structure, and wherein the connection structure mates with the connection mating structure to secure the device body to the circuit board.
14. The TTF cell culture device according to claim 12, wherein the device body includes an avoiding groove, and the circuit board includes a connection seat disposed in the avoiding groove.
15. The TTF cell culture device according to claim 12, wherein the electrode sheet includes an insertion portion, the circuit board includes a plurality of fitting portions, the insertion portions are inserted into the corresponding fitting portions in a one-to-one correspondence, and the insertion portions are fixedly bonded to the fitting portions.
16. TTF cell culture apparatus according to claim 15, wherein the flexible circuit board is arranged in a substantially "T" shape, the plug portion is provided at a narrower end portion of the flexible circuit board, and the dielectric element and the temperature sensor are provided at a wider end portion of the flexible circuit board.
17. The TTF cell culture device according to claim 12, wherein the electrode sheet comprises a plug portion, the plug portion comprises an insulating housing and a pin disposed in the insulating housing, the pin is perpendicularly soldered to the circuit board, and a side surface of the insulating housing, which extends out of the pin, abuts against the circuit board.
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| CN202123281518.1U CN216663118U (en) | 2021-12-24 | 2021-12-24 | TTF cell culture device |
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| CN202123281518.1U CN216663118U (en) | 2021-12-24 | 2021-12-24 | TTF cell culture device |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN114107055A (en) * | 2021-12-24 | 2022-03-01 | 江苏海莱新创医疗科技有限公司 | TTF cell culture device |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114107055A (en) * | 2021-12-24 | 2022-03-01 | 江苏海莱新创医疗科技有限公司 | TTF cell culture device |
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