CN216663117U - TTF cell culture device - Google Patents

Abstract

The application provides a TTF cell culture device, its including be formed with the device body of culture dish accommodation space, be fixed in the device body and including the circuit board of a plurality of cooperation portions, place in the culture dish accommodation space of device body and be used for holding the culture dish of the mixed liquid of tumour cell tissue and culture solution and arrange the electrode group in the culture dish in, the electrode group is including a plurality of electrode slices that set up in pairs, the electrode slice includes the grafting portion of being connected with the cooperation portion detachably of circuit board. The electrode plate of the TTF cell culture device is detachably connected with the matching part of the circuit board through the insertion part, the electrode plate can be directly detached from the circuit board when the electrode plate needs to be replaced, a new electrode plate is inserted after the adhesive coating is cleaned, and the adhesive is sealed, so that the replacement steps of the electrode plate are simplified.

Description

TTF cell culture device

Technical Field

The application relates to the technical field of medical experimental equipment, in particular to a TTF cell culture device.

Background

Tumor therapeutic electric fields (TTFs) are a therapeutic approach to inhibit cell proliferation by interfering with cell mitosis with low intensity, medium frequency, alternating electric fields. In recent years, the treatment effect of TTF on tumor cells is studied at home and abroad through cell experiments. In the experimental process, the tumor tissue cells are placed in a TTF cell culture device for in vitro culture, the electric field generated by the electric field generator is used for inhibiting the rapid division of the tumor cells, and the treatment effect of the electric field on the tumor tissue cells is judged according to the number of the tumor cells in a fixed time.

The existing TTF cell culture device usually welds an electrode plate applying TTF on a circuit board, the electrode plate needs to be replaced when damaged, when the electrode plate is detached, a soldering iron needs to be used firstly to melt a welding spot, then a tin suction gun is used to clean residual soldering tin of the welding spot, and finally a new electrode plate can be welded again.

Therefore, there is a need to provide an improved TTF cell culture device to solve the problems of the background art.

SUMMERY OF THE UTILITY MODEL

The utility model provides a TTF cell culture device, which can simplify the replacement steps of electrode plates.

The TTF cell culture device is realized by the following technical scheme: a TTF cell culture device, comprising: the device body is provided with a culture dish accommodating space; a circuit board fixed to the device body and including a plurality of fitting portions; the culture dish is placed in the culture dish accommodating space and is used for mixing the tumor cell tissues and the culture solution; and the electrode group is arranged in the culture dish and comprises a plurality of electrode plates which are arranged in pairs, and the electrode plates comprise plug-in parts which are detachably connected with the matching parts of the circuit board.

Furthermore, the matching part of the circuit board is a female socket arranged on the circuit board, and the inserting part of the electrode plate is a male plug arranged on the electrode plate.

Furthermore, the matching part of the circuit board is a male plug arranged on the circuit board, and the inserting part of the electrode plate is a female socket arranged on the circuit board.

Furthermore, the inserting part is welded on the electrode plate, and the matching part is welded on the circuit board.

Furthermore, the electrode plate comprises a flexible circuit board and at least one dielectric element arranged on the flexible circuit board, and the inserting part and the dielectric element are arranged at two opposite ends of the flexible circuit board.

Furthermore, the electrode plate also comprises at least one temperature sensor which is arranged on the flexible circuit board and is positioned on the same side with the dielectric element.

Furthermore, a plurality of conductive electric cores which are arranged at intervals and welded with the corresponding dielectric elements are arranged on the flexible circuit board.

Furthermore, the end part of the flexible circuit board, which is far away from the plugging part, is provided with a conductive bonding pad welded with the corresponding temperature sensor.

Furthermore, the conductive bonding pad and the insertion part are respectively arranged at two opposite ends of the flexible circuit board.

Furthermore, the conductive battery cell is arranged at the position of the flexible circuit board between the plug part and the conductive bonding pad.

Furthermore, the conductive battery cell is arranged on the flexible circuit board in a manner of being close to the conductive bonding pad.

Further, the insertion part is electrically connected with the flexible circuit board and the circuit board, and the top end of the dielectric element is higher than the top end of the temperature sensor in the height direction of the culture dish.

Furthermore, the flexible circuit board is roughly arranged in a T shape, the insertion part is arranged at the narrower end part of the flexible circuit board, and the dielectric element and the temperature sensor are arranged at the wider end part of the flexible circuit board.

Further, the temperature sensor and the dielectric element are arranged such that when the temperature sensor is fully immersed in the culture solution, the dielectric element is immersed in the culture solution from the height of 1/5 with the bottom end facing upwards.

Furthermore, the electrode plate also comprises an insulating support plate arranged on the flexible circuit board, and the insulating support plate and the dielectric element are respectively arranged on two opposite sides of the flexible circuit board.

Further, sealant is filled between the temperature sensor and the flexible circuit board; and/or the dielectric element is provided with an opening, the opening is filled with sealant, and the sealant is filled between the dielectric element and the flexible circuit board.

Furthermore, the inserting part is provided with an insulating shell and a plurality of contact pins arranged in the insulating shell, one ends of the contact pins are electrically connected with the flexible circuit board, and the other ends of the contact pins are electrically connected with the matching part of the circuit board in an inserting mode.

Further, the device body is including locating location structure in the culture dish accommodation space, location structure including encircle set up in the peripheral locating surface of culture dish, the locating surface in the horizontal plane with culture dish location fit.

Further, location structure includes the constant head tank, the constant head tank with the culture dish accommodation space intercommunication, the bottom of culture dish is arranged in the constant head tank, the inner wall of constant head tank forms the locating surface.

Further, the device body comprises a top plate, a bottom plate and a supporting piece, wherein the top plate, the bottom plate and the supporting piece are arranged oppositely, the supporting piece is supported between the top plate and the bottom plate, a space between the top plate and the bottom plate is formed into a culture dish accommodating space, a culture dish is placed on the bottom plate, and a positioning structure is arranged on one side surface, facing the top plate, of the bottom plate.

Furthermore, the device body comprises a connecting structure, the circuit board comprises a connecting and matching structure, and the connecting structure and the connecting and matching structure are matched and connected to fix the device body and the circuit board.

Further, the device body comprises an avoiding groove, the circuit board comprises a connecting seat, and the connecting seat is arranged in the avoiding groove.

Furthermore, the electrode plate is of an inverted T-shaped structure, and the upper end of the electrode plate is electrically connected with the circuit board through the insertion part.

Furthermore, the inserting part comprises an insulating shell and a contact pin arranged in the insulating shell, and one end of the contact pin connected with the electrode plate is coated with insulating glue.

The technical scheme provided by the application can at least achieve the following beneficial effects:

the application provides an electrode slice of TTF cell culture device through the grafting portion that sets up on it and the cooperation portion detachably fixed connection on the circuit board, can directly dismantle the electrode slice from the circuit board when needing to change the electrode slice, insert new electrode slice and seal glue after the clearance bond coat can, simplified the change step of electrode slice.

Drawings

FIG. 1 is a schematic view of a TTF cell culture apparatus shown in an exemplary embodiment of the present application;

FIG. 2 is an exploded view of the TTF cell culture device shown in FIG. 1;

FIG. 3 is a further exploded view of the TTF cell culture device shown in FIG. 1;

FIG. 4 is a bottom view of the TTF cell culture device shown in FIG. 1 with electrode tabs electrically connected to a circuit board;

FIG. 5 is a schematic view of the structure of an electrode sheet in the TTF cell culture apparatus shown in FIG. 1;

fig. 6 is an exploded view of the electrode sheet shown in fig. 5;

FIG. 7 is a schematic view of the flexible wiring board shown in FIG. 6;

fig. 8 is a sectional view of the insertion part connected to the electrode tabs shown in fig. 3 being inserted into the fitting part of the circuit board;

FIG. 9 is a schematic illustration of the TTF cell culture device shown in FIG. 1, in which the mating part and the mating part are not mated;

FIG. 10 is a schematic view of the TTF cell culture apparatus shown in FIG. 1, in which the mating part and the mating part are mated.

Detailed Description

Reference will now be made in detail to the exemplary embodiments, examples of which are illustrated in the accompanying drawings. When the following description refers to the accompanying drawings, like numbers in different drawings represent the same or similar elements unless otherwise indicated. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the present application. Rather, they are merely examples of apparatus and methods consistent with aspects of the present application.

Referring to fig. 1, fig. 1 is a schematic view of a TTF cell culture apparatus 100.

The embodiment of the present application provides a TTF cell culture device 100 (hereinafter referred to as a culture device 100), where the culture device 100 includes a device body 10, a culture dish 30 disposed in the device body 10, a circuit board 20 disposed above the device body 10, and an electrode assembly 40 partially disposed in the culture dish 30 and electrically connected to the circuit board 20. Wherein, the device body 10 is formed with a culture dish accommodating space 101, and the culture dish accommodating space 101 is used for placing the culture dish 30. In some embodiments, the apparatus body 10 may form a plurality of culture dish accommodating spaces 101, so that a plurality of culture dishes 30 can be placed at the same time, and the number of culture dish accommodating spaces 101 is not limited in the present application.

The culture dish 30 is used for accommodating mixed liquid of tumor cell tissue and culture solution, and the culture dish 30 is placed in the culture dish accommodation space 101, and the culture dish 30 can be arranged with the culture dish accommodation space 101 in an equal number. In the embodiment shown in fig. 1, the apparatus body 10 is formed with three culture dish accommodating spaces 101, the three culture dish accommodating spaces 101 are distributed at intervals along the length direction of the apparatus body 10, and three culture dishes 30 are arranged in the culture dish accommodating spaces 101 in a one-to-one correspondence.

The present application is not limited to the specific structure of the apparatus body 10. In one embodiment, the device body 10 includes a bottom plate 102, a top plate 103, and a support 104 supported between the bottom plate 102 and the top plate 103, which are oppositely disposed. Wherein a space between the bottom plate 102 and the top plate 103 is formed as a dish accommodating space 101. The bottom plate 102 and the top plate 103 may be both configured as strip-shaped plates, and the culture dish accommodating space 101 is arranged at intervals along the length direction of the bottom plate 102 and the top plate 103. The supporting members 104 may be provided in a plurality of groups, and are arranged at intervals along the length direction of the bottom plate 102 and the top plate 103, each group of supporting members 104 may include two sub-supporting members 104a and 104b (refer to fig. 2), and the two sub-supporting members 104a and 104b are oppositely arranged along the width direction of the bottom plate 102 and the top plate 103. The height of the support 104 may define the height difference between the bottom plate 102 and the top plate 103. The bottom plate 102 is used to provide a stable placement plane for the plurality of culture dishes 30, and ensure that the plurality of culture dishes 30 are at the same height.

The circuit board 20 is fixed to the device body 10. For example, the circuit board 20 may be fixed to the top of the apparatus body 10, directly above the culture dish 30. In one embodiment, the top plate 103 may be a transparent plate made of acrylic, and the circuit board 20 is supported and fixed on the top plate 103.

Referring to FIG. 2, FIG. 2 is an exploded view of the culture device 100 shown in FIG. 1.

The electrode assembly 40 is fixed to the circuit board 20 and partially disposed in the culture dish 30, and can provide a stable electric field for the tumor cell tissue in the culture dish 30. The electrode group 40 may be provided in an equal number to the culture dish 30. The electrode assembly 40 includes a plurality of electrode pieces 401 arranged in pairs, and the electrode pieces 401 are electrically connected to the circuit board 20, and are configured to apply an alternating electric field to tumor cell tissues in the mixed solution. The electrode sheets 401 are provided in an even number, and are opposed to each other two by two, for example, two sheets, four sheets, six sheets, and the like. The number of electrode groups 40 and the number of electrode sheets 401 included in each electrode group 40 are not limited in the present application. In the embodiment shown in fig. 2, there are three electrode sets 40, one electrode set 40 is placed in each culture dish 30, each electrode set 40 includes two pairs of electrode plates 401, and four electrode plates 401 are arranged opposite to each other.

In one embodiment, each pair of electrode sheets 401 is disposed in a pair opposite to each other and parallel to each other, and one pair of electrode sheets 401 of the two pairs of electrode sheets 401 is disposed perpendicular to the other pair of electrode sheets 401, so that the alternating electric field between the two electrode sheets 401 forming one pair is perpendicular to the alternating electric field between the two electrode sheets 401 of the other pair.

Referring to FIG. 3, FIG. 3 is a further exploded view of the culture device 100 shown in FIG. 1.

In order to ensure the position stability of the culture dish 30 in the experimental process, the device body 10 further includes a positioning structure 105 disposed in the culture dish accommodating space 101, the positioning structure 105 includes a positioning surface 1050 disposed around the culture dish 30, the positioning surface 1050 is in positioning fit with the culture dish 30 in the horizontal plane, the reduction in the setting avoids the culture dish 30 to generate displacement in the horizontal plane, so as to ensure the position stability of the culture dish 30 relative to the device body 10.

The present application is not limited to the location and specific implementation of the positioning structure 105. In the embodiment shown in fig. 3, the positioning structure 105 includes a positioning groove 1051, the positioning groove 1051 is communicated with the culture dish accommodating space 101, the bottom end of the culture dish 30 is located in the positioning groove 1051, and the inner wall of the positioning groove 1051 forms a positioning surface 1050 for positioning and matching with the culture dish 30. The positioning structure 105 is realized by slotting on the device body 10, and has simple structure and convenient realization. A small gap can be left between the positioning surface 1050 and the culture dish 30, so that the bottom end of the culture dish 30 can be conveniently placed in the positioning groove 1051. In an embodiment, the positioning structure 105 is disposed on the bottom plate 102, and the depth of the positioning slot 1051 is smaller than the thickness of the bottom plate 102.

The shape of the contour surface in the positioning groove 1051 may be set according to the shape of the bottom end of the culture dish 30. In this embodiment, the top of the culture dish 30 is set to be a square structure, and the positioning slot 1051 is correspondingly set to be a square slot.

In one embodiment, the device body 10 is provided with a through hole 106, and the electrode pads 401 are electrically connected to the circuit board 20 through the through hole 106. In the embodiment shown in fig. 3, the through hole 106 is opened in the top plate 103 and penetrates the top plate 103 in the thickness direction of the top plate 103. The through holes 106 may be provided in plural numbers, and are provided in one-to-one correspondence with the electrode groups 40.

Referring to fig. 3 and 4, fig. 4 is a bottom view of the circuit board 20 and the electrode pads 401 connected to each other.

The device body 10 has a connection structure, the circuit board 20 has a connection fitting structure, and the connection structure is connected with the connection fitting structure in a matching manner to fix the device body 10 and the circuit board 20. In the embodiment shown in fig. 4 and 5, the circuit board 20 may be provided as a rectangular plate, substantially the same shape as the top plate 103. The circuit board 20 is coupled to the connecting structure of the top plate 103 through a connecting structure, which includes, but is not limited to, a bolt connection and a snap connection. In a specific embodiment, the connecting structure is a fastener (not shown) and a second positioning hole 1030 provided on the top plate 103 of the device body 10 for the fastener (not shown) to pass through, and the connecting matching structure is a first positioning hole 202 provided on the circuit board 20. The first positioning hole 202 is coaxially disposed with the second positioning hole 1030. The circuit board 20 and the top plate 103 may be fixedly connected by a fastener (not shown). The number of first positioning holes 202 and second positioning holes 1030 is not limited. In the embodiment shown in fig. 4 and 5, the first positioning holes 202 are disposed in plurality and spaced along the outer edge of the circuit board 20, the second positioning holes 1030 are disposed in plurality and spaced along the outer edge of the top plate 103, and the first positioning holes 202 and the second positioning holes 1030 are disposed in one-to-one correspondence.

The device body 10 further includes an avoidance groove 1031, and the avoidance groove 1031 may be provided in the top plate 103 and penetrate the top plate 103 in the thickness direction thereof. The avoiding groove 1031 may be provided at one end of the top plate 103 in the longitudinal direction and penetrate the end. The circuit board 20 further includes a connection socket (not shown) connected to an electric field generator (not shown) disposed in the relief groove 1031, the electric field generator (not shown) for controlling the magnitude of the TTF alternating voltage transmitted to the electrode group 40.

The connection manner of the support 104, the bottom plate 102, and the top plate 103 is not limited in the present application. In one embodiment, the support 104 is bolted to the base plate 102. For example, screws are threaded through the base plate 102 and into the support 104. The top plate 103 comprises a clamping groove 1033, the support 104 comprises a clamping plate 1040 at the top end, and the clamping plate 1040 is clamped and fixed in the clamping groove 1033. In other embodiments, the support 104 and the bottom plate 102 may be clamped, and the support 104 and the top plate 103 may be screwed.

Referring to fig. 5 to 7, fig. 5 is a schematic structural diagram of an electrode sheet 401. Fig. 6 shows an exploded view of the electrode sheet 401. Fig. 7 shows a wiring diagram of the flexible wiring board 4011.

The electrode sheet 401 includes a flexible wiring board 4011, dielectric elements 4014 respectively provided on both side surfaces of the flexible wiring board 4011, and an insulating support plate 4012. The insulating support plate 4012 is used for providing support for the flexible circuit board 4011. The flexible wiring board 4011 includes an insulating substrate 40110, a plurality of conductive cells 40112, and a plurality of conductive traces (not shown). The conductive traces (not shown) are disposed on the insulating substrate 40110 in an embedded manner. The insulating substrate 40110 and the conductive traces (not shown) are integrally formed. The conductive electric cores 40112 are arranged on the surface of the flexible circuit board 4011, and the surface of the conductive electric cores is higher than the surface of the flexible circuit board 4011. The plurality of conductive cells 40112 are connected in series by conductive traces (not shown). The dielectric element 4014 and the flexible circuit board 4011 are welded through the conductive battery core 40112. The insulating substrate 40110 may be an insulating substrate such as polyimide or mylar, and the conductive core 40112 may be a copper foil. The dielectric component 4014 can be a ceramic chip with high dielectric constant, which has the property of blocking direct current and alternating current.

In one embodiment, the dielectric element 4014 may be provided in plurality. The plurality of dielectric elements 4014 can increase the electric field strength, and can reduce capacitive reactance compared with the arrangement of a smaller number of dielectric elements 4014, so that the electric field strength is more uniform, thereby ensuring the stability of the output waveform of the electric field generator (not shown) and ensuring the output power.

In the embodiment shown in fig. 5 to 7, the dielectric element 4014 includes a first dielectric element 4014a and a second dielectric element 4014b both soldered to the flexible circuit board 4011, and the first dielectric element 4014a and the second dielectric element 4014b are located at the same height. The flexible circuit board 4011 comprises a first conductive core 401120 for soldering with the first dielectric component 4014a and a second conductive core 401122 for soldering with the second dielectric component 4014b, wherein the first conductive core 401120 and the second conductive core 401122 are located at the same height.

Referring to fig. 8 to 10, fig. 8 is a schematic diagram illustrating the electrode plate 401 being plugged with the circuit board 20. Fig. 9 is a schematic diagram of the TTF cell culture device shown in fig. 1, in which the mating part 201 is not mated with the mating part 402. Fig. 10 is a schematic diagram of the TTF cell culture device shown in fig. 1 in which the mating part 201 is mated with the mating part 402.

The electrode sheet 401 includes a plug 402, and the plug 402 is disposed on an end portion of the flexible wiring board 4011 near the circuit board 20. The circuit board 20 has a plurality of fitting portions 201 that are provided in a fitting manner with the insertion portions 402 of the electrode pads 401, the plurality of fitting portions 201 are inserted into the insertion portions 402 of the plurality of electrode pads 401 in a one-to-one correspondence, and the insertion portions 402 are fixedly bonded to the fitting portions 201. Thus, the electrical connection between the electrode plate 401 and the circuit board 20 is ensured, and the shaking amount between the electrode plate and the circuit board can be reduced. When the electrode plate 401 needs to be replaced, the electrode plate 401 can be directly pulled out of the matching portion 201, a new electrode plate 401 is inserted after the adhesive coating is cleaned, and sealing glue is applied, so that the replacement step of the electrode plate 401 is simplified. In this embodiment, the plug part 402 is a male plug provided at an end of the flexible circuit board 4011, and the mating part 201 is a female socket provided on the circuit board 20. In other embodiments, the plug portion 402 of the electrode pad 401 may be a female socket disposed at an end of the flexible circuit board 4011, the mating portion 201 of the circuit board 20 is a male plug (not shown) disposed in mating relation with the plug portion 402 of the electrode pad 401, the number of the male plugs (not shown) is multiple, and the multiple male plugs (not shown) are plugged into the plug portions 402 of the electrode pads 401 in a one-to-one correspondence.

Specifically, the plug part 402 includes an insulating housing 4020 and a pin 4021 disposed in the insulating housing 4020, a lower end of the pin 4021 is electrically connected to the flexible circuit board 4011, and an upper end of the pin 4021 is inserted into the mating part 201, thereby achieving electrical connection between the electrode pad 401 and the circuit board 20. The insulating housing 4020 includes a side surface 40200 facing the circuit board 20, a pin 4021 protruding from the surface 40200, the surface 40200 abutting against a lower surface of the mating part 201, and an adhesive glue applied at the joint portion.

In one embodiment, the end of the pin 4021 connected to the electrode pad 401 is covered with an insulating adhesive (not shown) to prevent the electrode pad 401 from being shorted to the circuit board 20. The insulating glue (not shown in the figure) can be organic silica gel, the organic silica gel has lower tear strength, and when the organic silica gel is sealed to lose efficacy, the organic silica gel is convenient to tear and remove, and then the adhesive sealing is carried out again, so that the operation is convenient and fast.

Referring to fig. 5 to 7 again, the electrode plate 401 further includes a temperature sensor 4016, the temperature sensor 4016 and the dielectric element 4014 are disposed on the same surface of the flexible circuit board 4011, and the temperature sensor 4016 is disposed at the bottom of the electrode plate 401, so as to be completely immersed in the mixed liquid in the culture dish 30 and measure the temperature of the mixed liquid in the culture dish 30. The temperature sensor 4016 may employ a thermistor.

During the experiment, the contact area of the dielectric component 4014 and the mixed solution is inversely proportional to the impedance of the culture apparatus 100. The excessive setting of the mixed liquid increases the contact area between the dielectric element 4014 and the mixed liquid, thereby reducing the impedance and increasing the heat generation. Too little mixed liquid is provided, which reduces the contact area between the dielectric element 4014 and the mixed liquid. And the height error of the mixed liquid level caused by the welding height error of the electrode plate 401 and the circuit board 20, the machining error of the electrode plate 401 and the dropping operation error of an experimenter can be amplified under the condition of too little mixed liquid, and the influence on the experiment is increased.

In one embodiment, the tips of the first dielectric 4014a and the second dielectric 4014b are higher than the tip of the temperature sensor 4016 in the height direction of the culture dish 30. After setting like this, when temperature sensor 4016 is immersed in the mixed liquor completely, first dielectric 4014a and second dielectric 4014b can partially immerse the mixed liquor for temperature sensor 4016 reduces the area of contact of first dielectric 4014a and second dielectric 4014b and mixed liquor under the prerequisite that can detect the mixed liquor temperature, thereby reduces the heat that electrode slice 401 produced when applying the electric field.

The flexible circuit board 4011 further comprises a conductive pad 4019 welded to the temperature sensor 4016, the conductive pad 4019 is used for being welded to the temperature sensor 4016, and the height of the position of the conductive pad 4019 is lower than the heights of the positions of the first conductive battery cell 401120 and the second conductive battery cell 401122.

In alternative embodiments, a plurality of temperature sensors 4016 may be provided, for example, they may be arranged side by side at the same height of the flexible wiring board 4011. The number of the conductive pads 4019 is the same as the number of the temperature sensors 4016. In this embodiment, the number of the temperature sensors 4016 and the number of the conductive pads 4019 are 2.

In an alternative embodiment, the conductive pad 4019 is located between the first conductive core 401120 and the second conductive core 401122, i.e., the temperature sensor 4016 is located between the first dielectric element 4014a and the second dielectric element 4014 b.

In this example, the size of the culture dish 30 is set to 6cm, and the wall thickness is set to 2 mm.

When the temperature sensor 4016 is completely immersed in the mixed solution, the dielectric element 4014 is immersed in the mixed solution from the bottom end to a height of about 1/6 to 2/5. In a preferred embodiment, dielectric element 4014 is immersed in the mixed liquor from the bottom end up to a height of about 1/5. In this embodiment, the volume of the mixed solution in the culture dish 30 is about 15 to 25ml, and the liquid level is about 0.41 to 0.69 cm.

In one embodiment, the periphery of the temperature sensor 4016 may be sealed waterproof by a sealant (not shown). Sealant (not shown in the figure) can be organic silica gel, the organic silica gel has lower tear strength, and when the organic silica gel is sealed to lose efficacy, the organic silica gel is convenient to tear off and then sealed again, so that the operation is convenient and quick, meanwhile, the service life of the electrode plate 401 is prolonged, and the maintenance cost is reduced.

In one embodiment, the center of the dielectric 4014 is provided with an opening 40140, and the dielectric 4014 can be sealed by dispensing at the opening 40140. For example, the gap of the dielectric 4014 at the opening 40140 can be sealed by using UV paste, which has the advantages of no volatile VOC (volatile organic compound), no pollution to air environment, and the like, and is suitable for temperature, solvent, and moisture-sensitive materials. In one embodiment, a gap between the outer edge of the dielectric element 4014 and the flexible circuit board 4011 may be sealed by UF (urea formaldehyde resin) glue, which has good fluidity and can flow to the bottom of the dielectric element 4014 by capillary effect to achieve good filling effect, so that the pad of the dielectric element 4014 can be protected.

The shape of the electrode sheet 401 is not limited in the present application. In one embodiment, the electrode sheet 401 is disposed in an inverted "T" shape. The shape of the flexible circuit board 4011 is substantially the same as that of the insulating support plate 4012, and the flexible circuit board is also arranged in an inverted "T" shape, and the dielectric element 4014 is arranged in a circular sheet shape.

The opposite two electrode pads 401 may be controlled to be energized by the circuit board 20, so that an electric field is generated between the opposite two electrode pads 401. It should be noted that only two electrode pads 401 are energized simultaneously at the same time, and the two electrode pads 401 that are energized simultaneously are disposed opposite to each other. For example, taking the example that the electrode group 40 includes four electrode pads 401, and the four electrode pads 401 are 4010, 4013, 4015, 4017 (refer to fig. 4), the circuit board 20 may control the electrode pads 4010, 4015 to be simultaneously energized, or control the electrode pads 4013, 4017 to be simultaneously energized at the same time, and an electric field is generated only between the two electrode pads 401 that are simultaneously energized.

The electrode tabs 401 of the cell culture device 100 of the present invention and the circuit board 20 are fixed to each other by inserting the insertion portions of the electrode tabs 401 into the fitting portions 201 of the circuit board 20, and are electrically connected to each other. When the electrode sheet 401 needs to be replaced, the electrode sheet 401 can be directly pulled out from the matching part 201, a new electrode sheet 401 is inserted and sealed, and the replacement step of the electrode sheet 401 of the TTF cell culture device is simplified.

The above description is only exemplary of the present application and should not be taken as limiting the present application, as any modification, equivalent replacement, or improvement made within the spirit and principle of the present application should be included in the scope of protection of the present application.

Claims (24)

1. A TTF cell culture device, comprising:

the device body is provided with a culture dish accommodating space;

a circuit board fixed to the device body and including a plurality of fitting portions;

the culture dish is placed in the culture dish accommodating space and is used for accommodating mixed liquid of the tumor cell tissues and the culture solution; and

and the electrode group is arranged in the culture dish and comprises a plurality of electrode plates which are arranged in pairs, and the electrode plates comprise plug-in parts which are detachably connected with the matching parts of the circuit board.

2. The TTF cell culture device according to claim 1, wherein the mating portion of the circuit board is a female socket provided thereon, and the insertion portion of the electrode sheet is a male plug provided thereon.

3. The TTF cell culture device according to claim 1, wherein the mating portion of the circuit board is a male plug provided thereon, and the plug portion of the electrode sheet is a female socket provided thereon.

4. The TTF cell culture device according to claim 1, wherein the insertion portion is soldered to the electrode plate, and the engagement portion is soldered to the circuit board.

5. The TTF cell culture device according to claim 1, wherein the electrode sheet comprises a flexible printed circuit board and at least one dielectric element disposed on the flexible printed circuit board, and the plug portion and the dielectric element are disposed at opposite ends of the flexible printed circuit board.

6. TTF cell culture device according to claim 5, wherein the electrode sheet further comprises at least one temperature sensor provided on the flexible wiring board and located on the same side as the dielectric element.

7. The TTF cell culture device according to claim 6, wherein the flexible printed circuit board is provided with a plurality of conductive cells arranged at intervals and welded to corresponding dielectric elements.

8. TTF cell culture device according to claim 7, wherein the end of the flexible circuit board remote from the plug part is provided with an electrically conductive pad to which the respective temperature sensor is soldered.

9. The TTF cell culture device according to claim 8, wherein the conductive pad and the plug are respectively provided at opposite ends of the flexible wiring board.

10. The TTF cell culture device of claim 9, wherein the conductive core is disposed at a location of the flexible circuit board between the mating part and the conductive pad.

11. The TTF cell culture device according to claim 10, wherein the conductive core is disposed on the flexible circuit board in proximity to the conductive pad.

12. The TTF cell culture device according to claim 10, wherein the plug portion electrically connects the flexible wiring board and the circuit board, and a tip of the dielectric element is higher than a tip of the temperature sensor in a height direction of the culture dish.

13. TTF cell culture apparatus according to any of claims 6 to 12, wherein the flexible circuit board is arranged substantially in a "T" shape, the plug is provided at a narrower end of the flexible circuit board, and the dielectric element and the temperature sensor are provided at a wider end of the flexible circuit board.

14. TTF cell culture apparatus according to any of claims 6 to 12, wherein the temperature sensor and the dielectric element are arranged such that when the temperature sensor is fully immersed in the culture liquid, the dielectric element is immersed in the culture liquid from the bottom end up at a height of 1/5.

15. TTF cell culture apparatus according to any one of claims 6 to 12, wherein the electrode sheet further comprises an insulating support plate provided on the flexible wiring board, the insulating support plate and the dielectric element being provided on opposite sides of the flexible wiring board, respectively.

16. TTF cell culture device according to any of claims 6 to 12, wherein a sealing glue is filled between the temperature sensor and the flexible wiring board; and/or

The flexible printed circuit board is characterized in that an opening is formed in the dielectric element, sealant is filled in the opening, and the sealant is filled between the dielectric element and the flexible printed circuit board.

17. The TTF cell culture device according to any one of claims 1 to 12, wherein the plug part has an insulating housing and a plurality of pins disposed in the insulating housing, one end of the plurality of pins being electrically connected to the flexible circuit board, and the other end of the plurality of pins being electrically connected to the mating part of the circuit board.

18. TTF cell culture device according to any of claims 1 to 12, wherein the device body comprises a positioning structure arranged in the culture dish receiving space, the positioning structure comprising a positioning surface arranged around the periphery of the culture dish, the positioning surface being in positioning engagement with the culture dish in a horizontal plane.

19. The TTF cell culture device according to claim 18, wherein the positioning structure comprises a positioning groove, the positioning groove is in communication with the dish accommodating space, the bottom end of the dish is disposed in the positioning groove, and an inner wall of the positioning groove forms the positioning surface.

20. The TTF cell culture device according to claim 18, wherein the device body comprises a top plate, a bottom plate and a support member supported between the top plate and the bottom plate, the top plate and the bottom plate being arranged opposite to each other, the space between the top plate and the bottom plate being formed as the culture dish accommodating space, the culture dish being placed on the bottom plate, and a side surface of the bottom plate facing the top plate being provided with a positioning structure.

21. TTF cell culture apparatus according to any of claims 1 to 12, wherein the apparatus body comprises a connection structure and the circuit board comprises a connection mating structure, the connection structure and the connection mating structure mating-fixing the apparatus body and the circuit board.

22. TTF cell culture device according to any of claims 1 to 12, wherein the device body comprises an avoiding groove, and the circuit board comprises a connection seat disposed in the avoiding groove.

23. The TTF cell culture device according to any one of claims 1 to 12, wherein the electrode sheet has an inverted T-shaped structure, and an upper end of the electrode sheet is electrically connected to the circuit board through the insertion part.

24. The TTF cell culture device according to any of claims 1 to 12, wherein the plug part comprises an insulating housing and a plug pin arranged in the insulating housing, and one end of the plug pin connected with the electrode sheet is coated with an insulating glue.

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