CN216648267U

CN216648267U - Positioning device for wafer film covering processing

Info

Publication number: CN216648267U
Application number: CN202123153071.XU
Authority: CN
Inventors: 刘磊; 王小波; 郑强
Original assignee: Wuxi Silicon Semiconductor Technology Co ltd
Current assignee: Wuxi Silicon Semiconductor Technology Co ltd
Priority date: 2021-12-15
Filing date: 2021-12-15
Publication date: 2022-05-31
Anticipated expiration: 2031-12-15

Abstract

The utility model discloses a positioning device for wafer film coating processing, and particularly relates to the field of positioning device equipment.

Description

Positioning device for wafer film covering processing

Technical Field

The utility model relates to the technical field of positioning devices, in particular to a positioning device for wafer film covering processing.

Background

Wafer refers to a silicon wafer used to fabricate silicon semiconductor circuits, the starting material of which is silicon. And dissolving the high-purity polycrystalline silicon, doping the dissolved high-purity polycrystalline silicon into silicon crystal seed crystals, and slowly pulling out the silicon crystal seed crystals to form cylindrical monocrystalline silicon. Silicon crystal stick is grinding, the polishing, and the section back forms silicon wafer, also is the wafer, needs fix a position the wafer during wafer tectorial membrane, but the positioner of current wafer tectorial membrane equipment is fixed specification mostly, and is not convenient enough when fixing a position the wafer of not unidimensional, needs to change positioner, has reduced machining efficiency.

SUMMERY OF THE UTILITY MODEL

In order to overcome the above-mentioned drawbacks of the prior art, embodiments of the present invention provide a positioning device for wafer film covering processing, so as to solve the above-mentioned problems in the background art.

In order to achieve the purpose, the utility model provides the following technical scheme: a positioning device for wafer film covering processing comprises:

the mounting bases are oppositely arranged, the opposite side walls of the two mounting bases are respectively provided with a movable sleeve and a movable rod, the movable rod partially extends into the movable sleeve and can move along the radial direction of the movable sleeve, an elastic part is arranged in the movable sleeve, one end of the elastic part is connected with the rod head of the movable rod, the other end of the elastic part is connected with the side wall of the mounting base, and the top of the mounting base is respectively provided with a mounting plate;

the clamping plates are respectively and oppositely arranged on the side walls of the mounting plates.

Preferably, the side wall of the mounting plate is provided with a slot, and a limit groove is arranged in the slot.

Preferably, the side wall of the clamping plate is provided with an inserting plate inserted into the inserting groove and a limiting plate extending into the limiting groove.

Preferably, the elastic member is made of a spring in an extended state.

Preferably, the lateral wall of mounting panel is provided with the jack with the slot intercommunication, the mounting panel top is provided with the spacing hole with the jack intercommunication.

Preferably, the lateral wall of splint is provided with the through-hole with the jack is coaxial, the inside of slot is provided with the screw hole with the through-hole is coaxial, the bottom of mount pad is provided with the mounting hole with the screw hole intercommunication.

Preferably, the top of the clamping plate is provided with a placing groove, and the side wall of the placing groove is provided with an anti-slip mat.

The utility model has the technical effects and advantages that:

through the cooperation of limiting plate and spacing groove, under the condition that uses screw or bolt, still can keep the stability of splint, through the setting of mounting hole, make things convenient for the screw to install on processing platform, through fixing a mount pad, another mount pad is unset, makes things convenient for the pulling movable rod, and then adjusts the interval between the splint, reaches the purpose that carries out the centre gripping to unidimensional wafer, and the setting of elastic component, the splint of being convenient for are tighter to the wafer centre gripping.

Drawings

FIG. 1 is a schematic view of the overall structure of the present invention;

FIG. 2 is an exploded schematic view of the present invention;

FIG. 3 is a schematic view of a portion of the mounting base of the present invention;

fig. 4 is a schematic view of the structure of the splint portion of the present invention.

The reference signs are: 100. a mounting seat; 100a, mounting holes; 110. mounting a plate; 110a, a jack; 111. a slot; 111a, a threaded hole; 112. a limiting groove; 200. a movable sleeve; 210. an elastic member; 300. a movable rod; 400. a splint; 400a, placing grooves; 410. inserting plates; 410a, a through hole; 420. and a limiting plate.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the utility model and are not intended to limit the utility model.

The utility model provides a positioning device for wafer film covering processing, which can still keep the stability of a clamping plate under the condition of using a screw or a bolt through the matching of a limiting plate and a limiting groove, facilitates the screw to be arranged on a processing platform through the arrangement of a mounting hole, facilitates the screw to be arranged on a processing platform, facilitates the pulling of a movable rod through fixing one mounting seat and unfixing the other mounting seat, further adjusts the distance between the clamping plates, achieves the purpose of clamping wafers with different sizes, and is convenient for the clamping plates to clamp the wafers through the arrangement of an elastic part, mainly comprises a mounting seat 100 and a clamping plate 400, wherein:

the two installation bases 100 are oppositely arranged, the opposite side walls of the two installation bases 100 are respectively provided with a movable sleeve 200 and a movable rod 300, the movable rod 300 partially extends into the movable sleeve 200 and can move along the radial direction of the movable sleeve 200, an elastic part 210 is arranged in the movable sleeve 200, one end of the elastic part 210 is connected with the rod head of the movable rod 300, the other end of the elastic part is connected with the side wall of the installation base 100, and the top of the installation base 100 is respectively provided with an installation plate 110; the side wall of the mounting plate 110 is provided with a slot 111, a limiting groove 112 is arranged inside the slot 111, and one mounting seat 100 is fixed while the other mounting seat 100 is not fixed, so that the movable rod 300 can be conveniently pulled, the distance between the clamping plates 400 can be adjusted, and the purpose of clamping wafers with different sizes can be achieved;

the elastic member 210 is made of a spring in an extended state, and the arrangement of the elastic member 210 facilitates the clamping of the wafer by the clamping plate 400;

the side wall of the mounting plate 110 is provided with a jack 110a communicated with the slot 111, the top of the mounting plate 110 is provided with a limit hole communicated with the jack 110a, and the mounting plate is inserted into the jack 110a through a screw or a bolt and then enters the through hole 410a of the clamping plate 400, so that the stability of the clamping plate 400 can be kept;

the clamping plates 400 are respectively and oppositely arranged on the side walls of the mounting plate 110, and the wafer is clamped through the clamping plates 400;

the side wall of the clamping plate 400 is provided with an inserting plate 410 inserted into the inserting groove 111 and a limiting plate 420 extending into the limiting groove 112, and the stability of the clamping plate 400 can be still maintained under the condition of using screws or bolts through the matching of the limiting plate 420 and the limiting groove 112;

the side wall of the clamping plate 400 is provided with a through hole 410a coaxial with the insertion hole 110a, a threaded hole 111a coaxial with the through hole 410a is formed in the slot 111, the bottom of the mounting seat 100 is provided with a mounting hole 100a communicated with the threaded hole 111a, and screws are conveniently mounted on the processing platform through the arrangement of the threaded hole 111 a;

the top of the clamping plate 400 is provided with a placing groove 400a, the side wall of the placing groove 400a is provided with an anti-slip pad, and the wafer is placed more stably through the placing groove 400 a.

The working principle of the utility model is as follows: in the use of the device, through the cooperation of limiting plate 420 and spacing groove 112, under the condition of using screw or bolt, still can keep splint 400's stability, setting through mounting hole 100a, make things convenient for the screw to install on processing platform, through fixing a mount pad 100, another mount pad 100 is unset, conveniently stimulate movable rod 300, and then adjust the interval between splint 400, reach the purpose that carries out the centre gripping to unidimensional wafer, the setting of elastic component 210, the splint 400 of being convenient for is tighter to the wafer centre gripping.

While the utility model has been described above with reference to an embodiment, various modifications may be made and equivalents may be substituted for elements thereof without departing from the scope of the utility model. In particular, the various features of the disclosed embodiments of the utility model may be used in any combination, provided that no structural conflict exists, and the combinations are not exhaustively described in this specification merely for the sake of brevity and resource conservation. Therefore, it is intended that the utility model not be limited to the particular embodiments disclosed, but that the utility model will include all embodiments falling within the scope of the appended claims.

Claims

1. The utility model provides a positioner is used in processing of wafer tectorial membrane which characterized in that includes:

the mounting device comprises mounting seats (100), wherein the two mounting seats (100) are arranged oppositely, the opposite side walls of the two mounting seats (100) are respectively provided with a movable sleeve (200) and a movable rod (300), part of the movable rod (300) extends into the movable sleeve (200) and can move along the radial direction of the movable sleeve (200), an elastic part (210) is arranged in the movable sleeve (200), one end of the elastic part (210) is connected with the rod head of the movable rod (300), the other end of the elastic part is connected with the side wall of the mounting seat (100), and the top of the mounting seat (100) is respectively provided with a mounting plate (110);

the clamping plates (400), and the clamping plates (400) are respectively and oppositely arranged on the side walls of the mounting plates (110).

2. The positioning device for wafer coating processing according to claim 1, wherein: a slot (111) is formed in the side wall of the mounting plate (110), and a limiting groove (112) is formed in the slot (111).

3. The positioning device for wafer coating processing according to claim 2, wherein: the side wall of the clamping plate (400) is provided with an inserting plate (410) inserted into the inserting groove (111) and a limiting plate (420) extending into the limiting groove (112).

4. The positioning device for wafer coating processing according to claim 3, wherein: the elastic member (210) is made of a spring in an extended state.

5. The positioning device for wafer coating processing according to claim 4, wherein: the lateral wall of mounting panel (110) is provided with jack (110 a) with slot (111) intercommunication, mounting panel (110) top is provided with the spacing hole with jack (110 a) intercommunication.

6. The positioning device for wafer coating processing according to claim 5, wherein: the lateral wall of splint (400) is provided with through-hole (410 a) with the axle center with jack (110 a), the inside of slot (111) is provided with screw hole (111 a) with the axle center with through-hole (410 a), the bottom of mount pad (100) is provided with mounting hole (100 a) with screw hole (111 a) intercommunication.

7. The positioning device for wafer coating processing according to claim 6, wherein: a placing groove (400 a) is formed in the top of the clamping plate (400), and anti-slip pads are arranged on the side walls of the placing groove (400 a).