CN216648238U

CN216648238U - Efficient bending equipment for wafer cleaning panel

Info

Publication number: CN216648238U
Application number: CN202123298202.3U
Authority: CN
Inventors: 陆先锋
Original assignee: Wuxi Songlinda Technology Co ltd
Current assignee: Wuxi Songlinda Technology Co ltd
Priority date: 2021-12-24
Filing date: 2021-12-24
Publication date: 2022-05-31
Anticipated expiration: 2031-12-24

Abstract

The utility model discloses efficient bending equipment for a wafer cleaning panel, which belongs to the technical field of wafer cleaning panel processing and comprises an installation platform, a circulating mechanism and a heating mechanism, wherein the installation platform is horizontally arranged, a heating groove is formed in the top of the installation platform, the heating mechanism is positioned in the heating groove in the installation platform, the circulating mechanism is positioned on the installation platform, and the circulating mechanism is communicated with the heating mechanism. The wafer cleaning panel is softened, and after the wafer cleaning panel is softened, the wafer cleaning panel is bent manually to be bent into a corresponding bending degree, so that the bending work of the wafer cleaning panel is realized, and the working efficiency is improved.

Description

Efficient bending equipment for wafer cleaning panel

Technical Field

The utility model relates to the technical field of wafer cleaning panel processing, in particular to efficient bending equipment for a wafer cleaning panel.

Background

Wafer refers to a silicon wafer used for making silicon semiconductor circuits, the starting material of which is silicon. And dissolving the high-purity polycrystalline silicon, doping the dissolved high-purity polycrystalline silicon into silicon crystal seed crystals, and slowly pulling out the silicon crystal seed crystals to form cylindrical monocrystalline silicon. After the silicon crystal bar is ground, polished and sliced, a silicon wafer, namely a wafer, is formed. Domestic wafer production lines are dominated by 8 inches and 12 inches. The main processing modes of the wafer are sheet processing and batch processing, i.e. 1 or more wafers are processed simultaneously. As semiconductor feature sizes become smaller and smaller, processing and measurement equipment becomes more and more advanced, so that new data characteristics appear in wafer processing. Meanwhile, the characteristic size is reduced, so that the influence of the particle number in the air on the quality and the reliability of the processed wafer is increased during wafer processing, and the particle number has new data characteristics along with the improvement of cleanness. In the process of producing the wafer plate, the wafer plate needs to be bent so as to be used subsequently, and in the existing production, no equipment for bending the wafer plate exists, so that the equipment for efficiently bending the wafer cleaning panel needs to be provided for use.

SUMMERY OF THE UTILITY MODEL

The embodiment of the utility model provides efficient bending equipment for a wafer cleaning panel, and aims to solve the problems in the prior art.

The embodiment of the utility model adopts the following technical scheme: the utility model provides a high-efficient equipment of bending of wafer cleaning panel, includes mount table, circulation mechanism and heating mechanism, the mount table is the level setting, the top of mount table is equipped with the heating bath, heating mechanism is located the heating bath of mount table, circulation mechanism is located the mount table, circulation mechanism is linked together with heating mechanism.

Further, circulation mechanism is including circulation suction pump, inlet tube and circulation case, the circulation case is located the mount table, the circulation suction pump is located the mount table and is located the side of circulation case, the both ends of inlet tube are linked together with circulation case and circulation suction pump respectively.

Furthermore, the heating mechanism comprises a hot water pipe and a cooling pipe, the water outlet end of the circulating water suction pump at one end of the hot water pipe is communicated with the water outlet end of the circulating water suction pump, the hot water pipe is horizontally arranged in a heating groove in the mounting table, the cooling pipe is horizontally arranged in the mounting table and is communicated with the hot water pipe, the other end of the cooling pipe is communicated with the circulating box, and a heating wire is arranged in the hot water pipe.

Further, mounting racks are respectively arranged at two ends of the mounting table.

Furthermore, a water valve is arranged on the hot water pipe.

The embodiment of the utility model adopts at least one technical scheme which can achieve the following beneficial effects:

when the wafer cleaning panel bending device is used, the heating mechanism works to heat, hot water is continuously conveyed under the cooperation of the circulating mechanism and conveyed into the hot water pipe in the heating groove, the position, where the wafer cleaning panel needs to be bent, is placed at the position of the hot water pipe during bending, the wafer cleaning panel is heated, the wafer cleaning panel is softened, the wafer cleaning panel is bent manually after being softened, the wafer cleaning panel is bent into corresponding bending degree, the bending work of the wafer cleaning panel is realized, and the working efficiency is improved.

Drawings

The accompanying drawings, which are included to provide a further understanding of the utility model and are incorporated in and constitute a part of this specification, illustrate embodiments of the utility model and together with the description serve to explain the utility model and not to limit the utility model. In the drawings:

FIG. 1 is a schematic perspective view of the present invention;

FIG. 2 is a side view of the present invention;

FIG. 3 is a top view of the present invention;

reference numerals:

the device comprises an installation table 1, a heating tank 11, a circulating mechanism 2, a circulating water pump 21, a water inlet pipe 22, a circulating box 23, a heating mechanism 3, a hot water pipe 31, a cooling pipe 32, an installation frame 4 and a water valve 5.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention more apparent, the technical solutions of the present invention will be clearly and completely described below with reference to the specific embodiments of the present invention and the accompanying drawings. It is to be understood that the described embodiments are merely exemplary of the utility model, and not restrictive of the full scope of the utility model. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Referring to fig. 1 to 3, an embodiment of the utility model provides efficient bending equipment for a wafer cleaning panel, which includes an installation table 1, a circulation mechanism 2 and a heating mechanism 3, wherein the installation table 1 is horizontally arranged, a heating groove 11 is arranged at the top of the installation table 1, the heating mechanism 3 is located in the heating groove 11 in the installation table 1, the circulation mechanism 2 is located on the installation table 1, and the circulation mechanism 2 is communicated with the heating mechanism 3. When using, heating mechanism 3 works and heats, carry the continuous transport of hot water under the cooperation of circulation mechanism 2, carry the hot water to the hot-water line 31 in the heating bath 11 in, need bend the wafer cleaning panel and obtain the place and place the position at hot-water line 31 during bending, heat the wafer cleaning panel, make the wafer cleaning panel become soft, the operation of bending it through artifical crooked wafer cleaning panel after the wafer cleaning panel becomes soft, bend the wafer cleaning panel into corresponding camber, the realization is to the work of bending of wafer cleaning panel.

Specifically, the circulation mechanism 2 comprises a circulation water pump 21, a water inlet pipe 22 and a circulation box 23, the circulation box 23 is located on the mounting table 1, the circulation water pump 21 is located on the mounting table 1 and located beside the circulation box 23, and two ends of the water inlet pipe 22 are respectively communicated with the circulation box 23 and the circulation water pump 21; the heating mechanism 3 comprises a hot water pipe 31 and a cooling pipe 32, the water outlet end of the one-end circulation water pump 21 of the hot water pipe 31 is communicated, the hot water pipe 31 is horizontally arranged in the heating groove 11 in the mounting table 1, the cooling pipe 32 is horizontally arranged in the mounting table 1, the cooling pipe 32 is communicated with the hot water pipe 31, the other end of the cooling pipe 32 is communicated with the circulation box 23, and a heating wire is arranged in the hot water pipe 31. When the water circulation device is used, the water in the circulation box 23 is pumped outwards into the hot water pipe 31 through the water inlet pipe 22 by the circulation water pump 21, the heating wire in the hot water pipe 31 heats the water, the heating operation is performed on the bent part of the wafer cleaning panel after the water is continuously heated, so that the wafer cleaning panel is softened, the subsequent bending is facilitated after the wafer cleaning panel is softened, the hot water flows back into the circulation box 23 through the cooling pipe 32 after the water is heated, and the wafer cleaning panel is bent for the next heating operation.

Specifically, two ends of the mounting table 1 are respectively provided with a mounting rack 4. The mounting frame 4 may support the cooling pipe 32 and the hot water pipe 31.

Specifically, a water valve 5 is arranged on the hot water pipe 31. The water in the circulation box 23 can be conveyed into the hot water pipe 31 by opening the water valve 5, so that the water is heated.

The above description is only an example of the present invention, and is not intended to limit the present invention. Various modifications and alterations to this invention will become apparent to those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention should be included in the scope of the claims of the present invention.

Claims

1. The utility model provides a high-efficient equipment of bending of wafer cleaning panel, a serial communication port, including mount table (1), circulation mechanism (2) and heating mechanism (3), mount table (1) is the level setting, the top of mount table (1) is equipped with heating bath (11), heating mechanism (3) are located heating bath (11) in mount table (1), circulation mechanism (2) are located mount table (1), circulation mechanism (2) are linked together with heating mechanism (3).

2. The wafer cleaning panel efficient bending device according to claim 1, characterized in that: circulation mechanism (2) are including circulation suction pump (21), inlet tube (22) and circulation case (23), circulation case (23) are located mount table (1), circulation suction pump (21) are located mount table (1) and are located the side of circulation case (23), the both ends of inlet tube (22) are linked together with circulation case (23) and circulation suction pump (21) respectively.

3. The wafer cleaning panel efficient bending device according to claim 2, wherein: heating mechanism (3) are including hot-water line (31) and cooling tube (32), the play water end of the one end circulation suction pump (21) of hot-water line (31) is linked together, hot-water line (31) level is located heating bath (11) in mount table (1), cooling tube (32) level sets up in mount table (1), cooling tube (32) are linked together with hot-water line (31), the other end and circulation case (23) of cooling tube (32) are linked together, be equipped with the heater strip in hot-water line (31).

4. The wafer cleaning panel efficient bending device according to claim 1, characterized in that: and mounting frames (4) are respectively arranged at two ends of the mounting table (1).

5. The wafer cleaning panel efficient bending device according to claim 3, wherein: a water valve (5) is arranged on the hot water pipe (31).