CN216624566U - Miniaturized PCB antenna of multilayer - Google Patents
Miniaturized PCB antenna of multilayer Download PDFInfo
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- CN216624566U CN216624566U CN202122925470.7U CN202122925470U CN216624566U CN 216624566 U CN216624566 U CN 216624566U CN 202122925470 U CN202122925470 U CN 202122925470U CN 216624566 U CN216624566 U CN 216624566U
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Abstract
The utility model relates to the technical field of antennas, in particular to a multi-layer miniaturized PCB antenna, which comprises a PCB substrate and an antenna body arranged on the PCB substrate, wherein the antenna body comprises a radiation routing, a radio frequency pin patch, a grounding pin patch and a signal pad; the radiation routing, the PCB substrate and the radio frequency pin patch are correspondingly provided with first through holes, and the radiation routing, the PCB substrate and the ground pin patch are correspondingly provided with second through holes. The radio frequency pin patch and the ground pin patch are novel in structure, the radio frequency pin patch and the ground pin patch can be accurately attached to a PCB substrate, meanwhile, the radio frequency pin patch and the ground pin patch can be guaranteed to be arranged corresponding to a radiation wiring line, alignment and subsequent connection are facilitated, assembly and production of the radio frequency pin patch and the ground pin patch can be achieved by directly adopting an SMT (surface mount technology) patch process, the production process is simple, the working efficiency is improved, and the structure is reliable.
Description
Technical Field
The utility model relates to the technical field of antennas, in particular to a multi-layer miniaturized PCB antenna.
Background
In a wireless communication device such as a mobile phone and a WIFI transmitter, an antenna is undoubtedly one of the most important components in the wireless communication device as a component for transmitting and receiving radio waves to transmit and exchange radio signals. The prior small-sized antenna in the traditional technology adopts a ceramic calcining process, and has high production and processing cost and low efficiency.
Disclosure of Invention
The utility model provides a multi-layer miniaturized PCB antenna aiming at the problems in the prior art, which is novel in structure and ingenious in design, under the arrangement of the first through hole and the second through hole, a radio frequency pin patch and a grounding pin patch can be accurately attached to a PCB substrate, meanwhile, the arrangement corresponding to a radiation wiring can be ensured, the alignment and the subsequent connection are convenient, the assembly and the production of the radio frequency pin patch and the grounding pin patch can be realized by directly adopting an SMT (surface mount technology) patch process, the production process is simple, the working efficiency is improved, and the structure is reliable.
In order to solve the technical problems, the utility model adopts the following technical scheme:
the utility model provides a multi-layer miniaturized PCB antenna, which comprises a PCB substrate and an antenna body arranged on the PCB substrate, wherein the antenna body comprises a radiation routing, a radio frequency pin patch, a grounding pin patch and a signal pad; the radiation routing is arranged on one side of the PCB substrate, the radio frequency pin patch, the ground pin patch and the signal pad are all arranged on the other side of the PCB substrate, the radiation routing is correspondingly provided with first through holes, and the radiation routing is correspondingly provided with second through holes.
The radio frequency pin patch and the grounding pin patch are both copper foil patches.
The radiation routing is provided with a radio frequency part, a grounding part and a signal part, the radio frequency part is provided with the first through hole, the grounding part is provided with the second through hole, the area of the radio frequency part is consistent with that of the radio frequency pin patch, the area of the grounding part is consistent with that of the grounding pin patch, and the area of the signal part is consistent with that of the signal pad.
The radiation routing line comprises a first horizontal section, a vertical section, a second horizontal section, a signal connecting section and a third horizontal section which are sequentially connected, the radio frequency part and the grounding part are arranged on the first horizontal section at intervals, and the signal part is arranged on the signal connecting section.
Wherein the radio frequency pin patch is the same size as the ground pin patch.
The area of the radio frequency pin patch and the area of the grounding pin patch are 2.08-2.48 mm.
Wherein the area of the signal bonding pad is 1.8 mm-2.2 mm.
The utility model has the beneficial effects that:
the radio frequency pin patch and the grounding pin patch can be accurately attached to the PCB substrate under the arrangement of the first through hole and the second through hole, and meanwhile, the radio frequency pin patch and the grounding pin patch can be correspondingly arranged with the radiation wiring, so that the alignment and the subsequent connection are convenient, the assembly and the production of the radio frequency pin patch and the grounding pin patch can be realized by directly adopting an SMT (surface mount technology) patch process, the production process is simple, the working efficiency is improved, and the structure is reliable.
Drawings
Fig. 1 is a front view of a multi-layered miniaturized PCB antenna of the present invention.
Fig. 2 is a rear view of a multi-layered miniaturized PCB antenna of the present invention.
The reference numerals in fig. 1 to 2 include:
1. a PCB substrate; 2. radiating the wiring; 3. radio frequency pin pasting; 4. a ground pin is pasted with a chip; 5. a signal pad; 6. a first through hole; 7. a second perforation; 8. a radio frequency site; 9. a ground portion; 10. a signal site; 11. a first horizontal segment; 12. a vertical section; 13. a second horizontal segment; 14. a signal connection section; 15. and a third horizontal segment.
Detailed Description
In order to facilitate understanding of those skilled in the art, the present invention will be further described with reference to the following examples and drawings, which are not intended to limit the present invention. The present invention is described in detail below with reference to the attached drawings.
A multi-layer miniaturized PCB antenna is disclosed, as shown in figures 1 to 2, and comprises a PCB substrate 1 and an antenna body arranged on the PCB substrate 1, wherein the antenna body comprises a radiation routing 2, a radio frequency pin patch 3, a grounding pin patch 4 and a signal pad 5; the radiation routing 2 is arranged on one side of the PCB substrate 1, the radio frequency pin patch 3, the ground pin patch 4 and the signal pad 5 are arranged on the other side of the PCB substrate 1, the radiation routing 2 is correspondingly provided with a first perforation 6 on the PCB substrate 1 and the radio frequency pin patch 3, and the radiation routing 2 is correspondingly provided with a second perforation 7 on the PCB substrate 1 and the ground pin patch 4. Specifically, the radio frequency pin patch 3 and the ground pin patch 4 can be accurately attached to the PCB substrate 1 under the arrangement of the first through hole 6 and the second through hole 7, the arrangement corresponding to the radiation wiring 2 can be ensured, the alignment and the subsequent connection are convenient, the assembly and the production of the radio frequency pin patch 3 and the ground pin patch 4 can be realized by directly adopting an SMT (surface mount technology) patch process, the production process is simple, the working efficiency is improved, and the structure is reliable.
In this embodiment, the radio frequency pin patch 3 and the ground pin patch 4 are both copper foil patches. The radio frequency pin patch 3 is connected with a radio frequency coaxial cable, and is used for realizing the conduction of the radio frequency pin patch 3, the radio frequency coaxial cable and the grounding pin patch 4.
In this embodiment, the radiation trace 2 is provided with a radio frequency portion 8, a ground portion 9, and a signal portion 10, the radio frequency portion 8 is provided with the first through hole 6, the ground portion 9 is provided with the second through hole 7, the area of the radio frequency portion 8 is the same as the area of the radio frequency pin patch 3, the area of the ground portion 9 is the same as the area of the ground pin patch 4, and the area of the signal portion 10 is the same as the area of the signal pad 5.
In this embodiment, the radiation routing 2 includes a first horizontal segment 11, a vertical segment 12, a second horizontal segment 13, a signal connection segment 14, and a third horizontal segment 15 that are connected in sequence, the radio frequency portion 8 and the grounding portion 9 are disposed on the first horizontal segment 11 at an interval, and the signal portion 10 is disposed on the signal connection segment 14.
In this embodiment, the rf pin patch 3 and the ground pin patch 4 have the same size. The areas of the radio frequency pin patch 3 and the grounding pin patch 4 are 2.08-2.48 mm.
In this embodiment, the area of the signal pad 5 is 1.8mm to 2.2 mm.
Specifically, under the above setting, the antenna frequency band covers 2400-2500 MHz, and has the characteristics of size miniaturization, high efficiency, and omnidirectional directivity.
Although the present invention has been described with reference to the above preferred embodiments, it should be understood that various changes, substitutions and alterations can be made herein without departing from the spirit and scope of the utility model as defined by the appended claims.
Claims (7)
1. A miniaturized PCB antenna of multilayer which characterized in that: the antenna comprises a PCB substrate and an antenna body arranged on the PCB substrate, wherein the antenna body comprises a radiation wiring, a radio frequency pin patch, a grounding pin patch and a signal pad; the radiation routing is arranged on one side of the PCB substrate, the radio frequency pin patch, the ground pin patch and the signal pad are all arranged on the other side of the PCB substrate, the radiation routing is correspondingly provided with first through holes, and the radiation routing is correspondingly provided with second through holes.
2. A multi-layered miniaturized PCB antenna as claimed in claim 1, wherein: the radio frequency pin patch and the grounding pin patch are both copper foil patches.
3. A multi-layered miniaturized PCB antenna as claimed in claim 1, wherein: the radiation routing is provided with a radio frequency part, a grounding part and a signal part, the radio frequency part is provided with the first perforation, the grounding part is provided with the second perforation, the area of the radio frequency part is consistent with that of the radio frequency pin patch, the area of the grounding part is consistent with that of the grounding pin patch, and the area of the signal part is consistent with that of the signal pad.
4. A multi-layered miniaturized PCB antenna according to claim 3, characterized in that: the radiation routing comprises a first horizontal section, a vertical section, a second horizontal section, a signal connecting section and a third horizontal section which are sequentially connected, the radio frequency part and the grounding part are arranged on the first horizontal section at intervals, and the signal part is arranged on the signal connecting section; the radiation routing wires are arranged in an inverted 'e' shape.
5. A multi-layered miniaturized PCB antenna as claimed in claim 1, wherein: the radio frequency pin patch is the same size as the ground pin patch.
6. A multi-layer miniaturized PCB antenna as in claim 5, wherein: the area of the radio frequency pin patch and the area of the grounding pin patch are 2.08-2.48 mm.
7. A multi-layered miniaturized PCB antenna as claimed in claim 1, wherein: the area of the signal bonding pad is 1.8 mm-2.2 mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122925470.7U CN216624566U (en) | 2021-11-24 | 2021-11-24 | Miniaturized PCB antenna of multilayer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122925470.7U CN216624566U (en) | 2021-11-24 | 2021-11-24 | Miniaturized PCB antenna of multilayer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216624566U true CN216624566U (en) | 2022-05-27 |
Family
ID=81699969
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122925470.7U Active CN216624566U (en) | 2021-11-24 | 2021-11-24 | Miniaturized PCB antenna of multilayer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216624566U (en) |
-
2021
- 2021-11-24 CN CN202122925470.7U patent/CN216624566U/en active Active
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