CN216624234U

CN216624234U - Vacuum gas circuit structure of HARP equipment

Info

Publication number: CN216624234U
Application number: CN202122425574.1U
Authority: CN
Inventors: 赵兴; 韩晓刚; 裴雷洪
Original assignee: Shanghai Huali Integrated Circuit Manufacturing Co Ltd
Current assignee: Shanghai Huali Integrated Circuit Manufacturing Co Ltd
Priority date: 2021-10-09
Filing date: 2021-10-09
Publication date: 2022-05-27
Anticipated expiration: 2031-10-09

Abstract

The utility model discloses a vacuum gas circuit structure of HARP equipment, wherein a vacuum adsorption gas hole and a pressure relief gas hole are formed on the surface of a heater in the HARP equipment, the vacuum adsorption gas hole is communicated with a vacuum pipeline, the pressure relief gas hole is communicated with a bypass pipeline, the vacuum pipeline provides vacuum to adsorb a wafer, and the bypass pipeline provides gas to relieve the vacuum adsorption of the wafer and relieve the pressure of a cavity of the HARP equipment. According to the utility model, the vacuum pipeline and the bypass pipeline are respectively provided with different pipelines, so that particles sucked by the vacuum pipeline cannot be blown to the surface of the wafer or the chamber of the HARP equipment again, thus the burden of the subsequent wafer cleaning process caused by the particles can be better avoided, and the possible pollution to the chamber of the HARP equipment can be better avoided.

Description

Vacuum gas circuit structure of HARP equipment

Technical Field

The utility model relates to the field of integrated circuit manufacturing, in particular to a vacuum gas circuit structure of HARP equipment.

Background

The method is characterized in that the HARP process (high aspect ratio process) is carried out on a wafer in HARP equipment, a vacuum pipeline is opened in the HARP process, the wafer is adsorbed on the surface of a heater (heater), after the HARP process is finished, vacuum is stopped, a bypass pipeline is opened to be communicated with a cavity of the HARP equipment for pressure relief, namely air is blown into the HARP equipment, and the vacuum pipeline and the bypass pipeline of the existing HARP equipment are in a shared pipeline state.

In long-term observation and research on the HARP process, it is found that when the wafer is vacuum-adsorbed, particles on the surface of the wafer or particles in the HARP equipment chamber are sucked into the pipeline by vacuum, and since the vacuum pipeline and the bypass pipeline share the same pipeline, when the bypass pipeline is opened, the particles sucked into the pipeline are blown to the surface of the wafer or blown into the HARP equipment chamber again along with the blown gas, thereby causing the cleaning burden of the subsequent cleaning process of the wafer or causing the pollution of the HARP equipment chamber. Therefore, how to prevent the particles sucked into the pipeline from being blown to the surface of the wafer or the chamber of the HARP equipment again is a technical problem to be solved in the field.

SUMMERY OF THE UTILITY MODEL

The utility model aims to provide a vacuum gas path structure of HARP equipment, which can prevent particles sucked into a pipeline from being blown to the surface of a wafer or a chamber of the HARP equipment again.

In order to solve the technical problems, according to the vacuum gas path structure of the HARP equipment provided by the utility model, the surface of the heater in the HARP equipment is provided with the vacuum adsorption gas hole and the pressure relief gas hole, the vacuum adsorption gas hole is communicated with the vacuum pipeline, the pressure relief gas hole is communicated with the bypass pipeline, the vacuum pipeline provides vacuum to adsorb the wafer, and the bypass pipeline provides gas to relieve the vacuum adsorption of the wafer and relieve the pressure of the cavity of the HARP equipment.

In a specific embodiment, the vacuum absorption air hole and the pressure relief air hole are arranged at intervals.

In a specific embodiment, the vacuum pipeline is provided with a vacuum control valve, the vacuum control valve is in an open state during the HARP process of the wafer, and the vacuum control valve is in a closed state after the HARP process is finished.

In a specific embodiment, the bypass pipeline is provided with a bypass control valve, the bypass control valve is in a closed state during the HARP process of the wafer, and the bypass control valve is in an open state after the HARP process is finished.

In a specific embodiment, the bypass line is fitted with a filter element for filtering the gas.

In a specific embodiment, the filter element is mounted between the bypass control valve and the pressure relief vent.

In a specific embodiment, the vacuum line is in communication with a plant-side vacuum system.

In a particular embodiment, the sub-pressure generated by the plant-side vacuum system is lower than the pressure of the chamber of the HARP device.

In a specific embodiment, the bypass pipeline is communicated with a plant-side gas supply system.

In a specific embodiment, the pressure of the gas provided by the plant-side gas supply system is greater than the pressure of the chamber of the HARP device, and the gas provided by the plant-side gas supply system is dry compressed air or nitrogen or argon.

According to the utility model, the vacuum pipeline and the bypass pipeline are respectively provided with different pipelines, so that particles sucked by the vacuum pipeline cannot be blown to the surface of the wafer or the chamber of the HARP equipment again, thus the burden of the subsequent wafer cleaning process caused by the particles can be better avoided, and the possible pollution to the chamber of the HARP equipment can be better avoided.

Drawings

In order to more clearly illustrate the technical solution of the present invention, the drawings needed to be used in the present invention are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to the drawings without creative efforts.

FIG. 1 is a schematic view of a vacuum suction state in an embodiment of a vacuum gas path structure according to the present invention;

FIG. 2 is a schematic view illustrating a pressure relief state in an embodiment of the vacuum gas circuit structure of the present invention;

fig. 3 is a schematic view of a heater surface of an embodiment of the vacuum gas circuit structure of the present invention, wherein the dotted line is a wafer placement position.

In the figure, 1-heater; 2-vacuum adsorption of air holes; 3-pressure relief air hole; 4-vacuum pipeline; 5-a bypass line; 6-a wafer; 7-a plant-side vacuum system; 8-a plant service end gas supply system; 41-a vacuum control valve; 51-a bypass control valve; 52-Filter element.

Detailed Description

The technical solutions in the present invention will be described clearly and completely with reference to the accompanying drawings, and it should be understood that the described embodiments are some, but not all embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Referring to fig. 1, 2 and 3, a vacuum gas path structure of a HARP device according to the present invention is shown, in which a vacuum adsorption air hole and a pressure relief air hole are formed on a surface of a heater in the HARP device, the vacuum adsorption air hole is communicated with a vacuum pipeline, the pressure relief air hole is communicated with a bypass pipeline, the vacuum pipeline provides vacuum to adsorb a wafer, and the bypass pipeline provides gas to release vacuum adsorption of the wafer and is communicated with a cavity of the HARP device and relieve pressure.

The working principle of the embodiment of the utility model is as follows: after the wafer is loaded into the HARP equipment, the wafer is placed on the surface of the heater, at the moment, the vacuum pipeline is opened, the vacuum pipeline absorbs the wafer and the surface of the heater through the vacuum absorption air holes by utilizing negative pressure so as to ensure that the position of the wafer is fixed in the HARP process, and refer to fig. 1; after the HARP process is finished, the vacuum pipeline is closed, the bypass pipeline is opened at the same time, and gas enters the chamber of the HARP equipment from the pressure relief air hole for pressure relief, referring to fig. 2; because the vacuum pipeline and the bypass pipeline are two pipelines which are not shared mutually, particles sucked by the vacuum pipeline cannot be blown to the surface of the wafer or the chamber of the HARP equipment again, and therefore, the burden of a subsequent wafer cleaning process caused by the particles can be better avoided from being increased, and the pollution to the chamber of the HARP equipment can be better avoided.

In a specific embodiment, referring to fig. 3, the vacuum suction vent is spaced apart from the pressure relief vent. Understandably, the uniform distribution of the vacuum adsorption air holes and the pressure relief air holes is beneficial to better vacuum adsorption and better pressure relief; it should be noted that the square holes in fig. 3 represent vacuum adsorption air holes, and the circular holes represent pressure relief air holes, but the shapes in fig. 3 are only used for distinguishing the vacuum adsorption air holes and the pressure relief air holes, and do not represent the actual shapes of the vacuum adsorption air holes and the pressure relief air holes, and no matter the vacuum adsorption air holes or the pressure relief air holes, the purpose of ventilation can be achieved, and there is no special requirement for the shapes of the openings, and the vacuum adsorption air holes and the pressure relief air holes are actually smaller and more dense.

In a specific embodiment, the vacuum pipeline is provided with a vacuum control valve, the vacuum control valve is in an open state during the HARP process of the wafer, and the vacuum control valve is in a closed state after the HARP process is finished. Understandably, in this embodiment, the opening or closing of the vacuum line is controlled by a vacuum control valve; generally speaking, a recipe (parameter) may be set on the apparatus to control the closing or opening of the vacuum control valve.

In a specific embodiment, the bypass pipeline is provided with a bypass control valve, the bypass control valve is in a closed state during the HARP process of the wafer, and the bypass control valve is in an open state after the HARP process is finished. Understandably, in the present embodiment, the bypass pipeline is controlled to be opened or closed by a bypass control valve; generally, the opening or closing of the bypass control valve is also realized by arranging a recipe on the equipment.

In a specific embodiment, the bypass line is fitted with a filter element for filtering the gas. Preferably, the filter element is installed between the bypass control valve and the pressure relief vent. Understandably, since the gas of the bypass pipeline is directly blown to the surface of the wafer and the chamber of the HARP equipment, in order to ensure the cleanliness, a filter element is usually added to further filter the gas.

In a specific embodiment, the vacuum line is in communication with a plant-side vacuum system. Preferably, the negative pressure generated by the plant-side vacuum system is lower than the pressure of the chamber of the HARP device. Understandably, since integrated circuit enterprises generally have centrally provided vacuum systems meeting the use requirements, and the vacuum systems are connected to various factories requiring vacuum, when the equipments of the factories require vacuum, the facilities can be directly connected to the vacuum provided by the factory service end.

In a specific embodiment, the bypass pipeline is communicated with a plant-side gas supply system. Preferably, the pressure of the gas provided by the plant-side gas supply system is greater than the pressure of the chamber of the HARP device, and the gas provided by the plant-side gas supply system is dry compressed air, nitrogen or argon.

In summary, the vacuum pipeline and the bypass pipeline are respectively provided with different pipelines, so that the particles sucked by the vacuum pipeline are not blown to the surface of the wafer or the chamber of the HARP equipment again, thereby better avoiding the load increase of the subsequent wafer cleaning process caused by the particles and better avoiding the possible pollution to the chamber of the HARP equipment.

The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the utility model, and any modifications, equivalents, improvements and the like made within the spirit and principle of the present invention should be included in the scope of the present invention.

Claims

1. A vacuum air path structure of HARP equipment is characterized in that a vacuum adsorption air hole and a pressure relief air hole are formed in the surface of a heater in the HARP equipment, the vacuum adsorption air hole is communicated with a vacuum pipeline, the pressure relief air hole is communicated with a bypass pipeline, the vacuum pipeline provides vacuum to adsorb a wafer, and the bypass pipeline provides gas to relieve the vacuum adsorption of the wafer and relieve the pressure of a cavity of the HARP equipment.

2. The vacuum gas circuit structure according to claim 1, wherein the vacuum suction holes and the pressure release holes are alternately arranged.

3. The vacuum gas circuit structure according to claim 1, wherein the vacuum pipeline is provided with a vacuum control valve, the vacuum control valve is in an open state during a HARP process for a wafer, and the vacuum control valve is in a closed state after the HARP process is completed.

4. The vacuum gas circuit structure according to claim 1, wherein the bypass pipeline is provided with a bypass control valve, the bypass control valve is in a closed state during a HARP process for a wafer, and the bypass control valve is in an open state after the HARP process is finished.

5. The vacuum gas circuit structure according to claim 4, wherein the bypass line is installed with a filter element for filtering gas.

6. The vacuum gas circuit structure of claim 5, wherein the filter element is installed between the bypass control valve and the pressure relief vent.

7. The vacuum gas circuit structure of claim 1, wherein the vacuum circuit is in communication with a plant-side vacuum system.

8. The vacuum gas circuit structure of claim 7, wherein the sub-pressure generated by the plant-side vacuum system is lower than the pressure of the chamber of the HARP equipment.

9. The vacuum gas circuit structure of claim 1, wherein the bypass circuit is connected to a plant-side gas supply system.

10. The vacuum gas circuit structure of claim 9, wherein the pressure of the gas provided by the plant-side gas supply system is greater than the pressure of the chamber of the HARP equipment, and the gas provided by the plant-side gas supply system is dry compressed air or nitrogen or argon.