CN216621477U - Chip mounter fatigue degree monitoring system based on infrared imaging temperature measurement - Google Patents

Abstract

The utility model discloses a chip mounter fatigue degree monitoring system based on infrared imaging temperature measurement, which comprises: the system comprises an infrared camera, a vibration sensor, an LCD display screen, acquisition equipment, a data monitoring center and a client. The utility model can realize the non-manual on-line real-time monitoring of the fatigue condition of the chip mounter and the monitoring of abnormal vibration and temperature rise conditions of the robot arm of the chip mounter in the operation process, thereby reducing the manual work intensity, saving the cost and improving the measurement precision.

Description

Chip mounter fatigue degree monitoring system based on infrared imaging temperature measurement

Technical Field

The utility model relates to a chip mounter fatigue monitoring and alarming system, in particular to a chip mounter fatigue monitoring system based on infrared imaging temperature measurement.

Background

In traditional assembly line, the main equipment is different with the people, the people can have a rest when tired, but the machine can not, must work all the time, this has just caused the machine fatigue, the long-term accumulation can cause the equipment to damage, and robotic arm is as the key part of main equipment work, can produce great vibration in the course of the work, after the long-time work of robotic arm, crackle and then breaking occur in its main shaft, if breaking occur can harm staff's personal safety, and damage other equipment parts, moreover, if after the arm fracture, it changes comparatively trouble, influence actual production manufacturing efficiency.

In the traditional assembly line manufacturing, a robot arm used for grabbing electronic devices on a chip mounter can only be maintained by means of timing shutdown of equipment or no production task. In intensive production enterprises with numerous personnel and labor types and complex management links and modes, due to the unpredictability of assembly line work and the single maintenance means, the intensive production enterprises are maintained regularly by manpower, but due to the lack of specific equipment, the damage degree of workers to a mechanical arm bearing of a chip mounter cannot be measured, only simple lubrication cleaning work can be carried out, and the intensive production enterprises are maintained afterwards for many times, namely, the intensive production enterprises are replaced when the production is stopped due to the damage of the equipment. Thus, the current methods are time consuming, labor intensive, and inefficient.

The maintenance of the robot arm in the factory has the following problems: in the maintenance process, due to the lack of professional equipment, an operator only judges some visible damages by naked eyes, such as track breakage and the like, but the monitoring on the slide rail main shaft of the robot arm is basically equal to nothing, but the slide rail main shaft controls the motion path of the robot arm, once the slide rail main shaft is damaged, the equipment cannot move, the robot arms collide with each other, even casualties are caused to the personnel, and therefore the practicability and the safety have great hidden dangers.

Disclosure of Invention

The utility model aims to overcome the defects of the prior art and provides a chip mounter fatigue degree monitoring system based on infrared imaging temperature measurement, so that the fatigue condition of the chip mounter can be monitored in real time in a non-manual online manner, and the abnormal vibration and temperature rise condition of a robot arm of the chip mounter in the operation process can be monitored, so that the manual labor intensity can be reduced, the cost is saved, and the working efficiency is improved.

In order to achieve the purpose, the utility model is realized by the following technical scheme:

the utility model relates to a chip mounter fatigue degree monitoring system based on infrared imaging temperature measurement, which is characterized by comprising the following components: the system comprises an infrared camera, a vibration sensor, an LCD display screen, acquisition equipment, a data monitoring center and a mobile phone client;

the infrared camera is arranged on a shell cross rod of the chip mounter and used for acquiring real-time temperature data of a sliding rail of an arm of the chip mounter and transmitting the real-time temperature data to the acquisition equipment;

the vibration sensor is fixed on a main shaft of a robot arm of the chip mounter through threads and used for acquiring vibration frequency and displacement data of the main shaft of the robot arm and transmitting the vibration frequency and displacement data to acquisition equipment;

the collecting device sends the received vibration frequency, displacement data and real-time temperature data to the LCD display screen for real-time display, and simultaneously sends the data to the data monitoring center and the mobile phone client for real-time display through the wireless communication module of the collecting device.

The chip mounter fatigue degree monitoring system based on infrared imaging temperature measurement is also characterized in that: the acquisition device includes: the system comprises an STM32F103ZET6 processor, a wireless communication module and a serial port circuit with the model number of MAX 485; the infrared camera is an MLX90640 camera, the vibration sensor is an LH-ST-485 sensor, the wireless communication module is an LTE-615 module, and the LCD display screen is a display screen driven by ST 7789;

a pin PA3/TXD2 and a pin PA2/RXD2 of the STM32F103ZET6 processor are respectively connected with a pin DI and a pin RO of the MAX485 serial port circuit, and a pin A and a pin B of the serial port circuit are respectively connected with a pin A and a pin B of the vibration sensor and used for acquiring the vibration frequency and displacement data;

a PB10/SCL pin and a PB11/SDA pin of the STM32F103ZET6 processor are respectively connected with an SCL pin and an SDA pin of an MLX90640 camera and are used for acquiring the real-time temperature data;

the PA9/TXD1 pin and the PA10/RXD1 pin of the STM32F103ZET6 processor are respectively connected with an RX pin and a TX pin of an LTE-615 module and used for transmitting collected data;

the PA4/CS pin, the PA5/CLK pin and the PA7/MOSI pin of the STM32F103ZET6 processor are respectively connected with the CS pin, the SCL pin and the SDA pin of the display screen and are used for displaying real-time temperature, vibration frequency and displacement data.

Compared with the prior art, the utility model has the beneficial effects that:

1. the utility model utilizes the infrared imaging technology, completes the real-time monitoring of the fatigue degree of the chip mounter through the infrared camera, the vibration sensor, the LCD display screen, the acquisition equipment, the data monitoring center and the client, and has the advantages of low cost, easy popularization, good real-time performance and high accuracy;

2. the utility model monitors the fatigue degree of the chip mounter from two aspects, and the running condition of the mechanical arm of the chip mounter can represent the fatigue degree of the chip mounter to a great extent, so that the running condition of the mechanical arm of the chip mounter is monitored from two aspects, on one hand, the vibration frequency and the displacement of a main shaft of a sliding rail in the motion of the mechanical arm of the chip mounter are monitored, on the other hand, the real-time temperature of the sliding rail is monitored, and the sliding rail is prevented from generating deformation due to excessive friction heating.

3. The utility model realizes automatic measurement, has good real-time monitoring result and high accuracy, greatly reduces the labor intensity of workers, improves the measurement precision, reduces the cost and can be widely applied to monitoring of the robotic arm of the chip mounter.

Drawings

FIG. 1 is a schematic diagram of the spatial arrangement of the system of the present invention;

FIG. 2 is a circuit schematic of the system of the present invention;

FIG. 3 is a data transfer flow diagram of the system of the present invention;

reference numbers in the figures: 1, an infrared camera; 2, a vibration sensor; 3, a mechanical arm of the chip mounter and a slide rail main shaft; 4, an operator; 5LCD display screen; 6, collecting equipment; 7, a data monitoring center; 8, a mobile phone client; 9 a microprocessor; 10 wireless communication module.

Detailed Description

In this embodiment, as shown in fig. 1 and 3, a system for monitoring fatigue of a chip mounter based on infrared imaging temperature measurement includes: the system comprises an infrared camera 1, a vibration sensor 2, an LCD display screen 5, a collection device 6, a data monitoring center 7 and a mobile phone client 8.

As shown in fig. 1, an infrared camera 1 is mounted on a housing cross bar of a chip mounter to monitor the temperature of a slide rail of a robot arm of the chip mounter, and the temperature of the slide rail gradually rises due to heat generated by friction in the motion process of the robot arm of the chip mounter, so that real-time temperature data obtained by the infrared camera 1 is sent to a collection device 6; vibration sensor 2 is fixed in on chip mounter robotic arm main shaft through the screw thread, the other end is connected to on the collection equipment 6, can produce the vibration in the chip mounter robotic arm motion process, and vibration sensor can transmit the chip mounter robotic arm main shaft vibration frequency and the displacement data who gather for collection equipment 6, then collection equipment 6 sends received vibration frequency and displacement data for LCD display screen and real-time temperature data and shows in real time, send through self wireless communication module simultaneously and show in real time for data monitoring center and mobile client, as shown in fig. 3.

The acquisition device 6 includes: the system comprises a microprocessor 9, a wireless communication module 10 and a serial port circuit 11 with the model of MA485, wherein the wireless communication module 10 is powered and connected with a 3G/4G network, measured vibration frequency, displacement data and real-time temperature data are remotely transmitted to a data monitoring center 7 through signal tower transfer and displayed on mobile phone APP software designed on a mobile phone client 8, so that the problem that equipment faults cannot be found in time due to accidents or insufficient personnel is prevented, and the waste of personnel is reduced;

in this embodiment, as shown in fig. 2, the vibration sensor 2 is an MEMS chip with high performance, and is a high-performance, anti-interference and composite vibration sensor developed and produced by using an embedded technology, a temperature sensing technology and a vibration sensing technology, and communicates with the microprocessor 9 through an RS485 chip 11; the microprocessor model 9 of the acquisition equipment 6 is STM32F103ZET6, the chip has stable performance, the requirement on program compiling is high, and the program confidentiality is also ensured; the infrared camera 1 adopts MLX90640, is a 32 x 24 pixel thermal infrared array sensor which meets the industrial standard and is completely calibrated, adopts 4-pin TO39 package and an I2C compatible digital interface, can read the sensor through IIC, and ensures the high precision of data; the wireless communication module 10 adopts an LTE-615 module, and is an embedded terminal for wireless data transmission by using a 7-module full-network module, and an LCD display screen is driven by ST 7789.

As shown in fig. 2, pins PA3/TXD2 and pins PA2/RXD2 of the STM32F103ZET6 processor are respectively connected to pins DI and RO of the MAX485 serial circuit, and pins a and B of the MAX485 serial circuit 11 are connected to pins a and B of the vibration sensor, so as to obtain vibration frequency and displacement data;

a PB10/SCL pin and a PB11/SDA pin of the STM32F103ZET6 processor are respectively connected with an SCL pin and an SDA pin of the infrared camera and are used for acquiring real-time temperature data;

the PA9/TXD1 pin and the PA10/RXD1 pin of the STM32F103ZET6 processor are respectively connected with an RX pin and a TX pin of an LTE-615 module and used for transmitting vibration frequency and displacement data and real-time temperature data; meanwhile, the PA4/CS pin, the PA5/CLK pin and the PA7/MOSI pin of the STM32F103ZET6 processor are respectively connected with the CS pin, the SCL pin and the SDA pin of the LCD module, so that temperature and vibration information can be displayed in real time.

In conclusion, the utility model is based on the vibration sensor and the infrared imaging temperature measurement, can realize accurate monitoring at lower cost, can timely find abnormal conditions in the motion process of the mechanical arm of the chip mounter so as to monitor the fatigue degree of the chip mounter, maximizes the utilization of human resources, realizes online real-time monitoring of assembly line work, and has the advantages of accurate monitoring, good real-time monitoring result, high accuracy, reduction of labor intensity and cost saving.

Claims (2)

1. The utility model provides a chip mounter fatigue degree monitoring system based on infrared imaging temperature measurement which characterized in that includes: the system comprises an infrared camera (1), a vibration sensor (2), an LCD display screen (5), acquisition equipment (6), a data monitoring center (7) and a mobile phone client (8);

the infrared camera (1) is arranged on a shell cross rod of the chip mounter and used for acquiring real-time temperature data of a sliding rail of an arm of the chip mounter and transmitting the real-time temperature data to the acquisition equipment (6);

the vibration sensor (2) is fixed on a main shaft of a robot arm of the chip mounter through threads and used for acquiring vibration frequency and displacement data of the main shaft of the robot arm and transmitting the vibration frequency and displacement data to the acquisition equipment (6);

the acquisition equipment (6) sends the received vibration frequency and displacement data and the real-time temperature data to the LCD display screen (5) for real-time display, and simultaneously sends the data to the data monitoring center (7) and the mobile phone client (8) for real-time display through the wireless communication module of the acquisition equipment.

2. The infrared imaging temperature measurement-based chip mounter fatigue degree monitoring system according to claim 1, wherein: the acquisition device (6) comprises: the system comprises an STM32F103ZET6 processor (9), a wireless communication module (10) and a serial port circuit (11) with the model number of MAX 485; the infrared camera is an MLX90640 camera, the vibration sensor is an LH-ST-485 sensor, the wireless communication module is an LTE-615 module, and the LCD display screen is a display screen driven by ST 7789;

pins PA3/TXD2 and PA2/RXD2 of the STM32F103ZET6 processor are respectively connected with a DI pin and an RO pin of the MAX485 serial port circuit, and a pin A and a pin B of the serial port circuit (11) are respectively connected with a pin A and a pin B of the vibration sensor and are used for acquiring the vibration frequency and the displacement data;

a PB10/SCL pin and a PB11/SDA pin of the STM32F103ZET6 processor are respectively connected with an SCL pin and an SDA pin of an MLX90640 camera and are used for acquiring the real-time temperature data;

the PA9/TXD1 pin and the PA10/RXD1 pin of the STM32F103ZET6 processor are respectively connected with an RX pin and a TX pin of an LTE-615 module and used for transmitting collected data;

the PA4/CS pin, the PA5/CLK pin and the PA7/MOSI pin of the STM32F103ZET6 processor are respectively connected with the CS pin, the SCL pin and the SDA pin of the display screen and are used for displaying real-time temperature, vibration frequency and displacement data.

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