CN216607635U - Semiconductor glass wafer laser coding machine with dust collection structure - Google Patents
Semiconductor glass wafer laser coding machine with dust collection structure Download PDFInfo
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- CN216607635U CN216607635U CN202122418805.6U CN202122418805U CN216607635U CN 216607635 U CN216607635 U CN 216607635U CN 202122418805 U CN202122418805 U CN 202122418805U CN 216607635 U CN216607635 U CN 216607635U
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- threaded rod
- fixedly connected
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- 239000000428 dust Substances 0.000 title claims abstract description 61
- 239000011521 glass Substances 0.000 title claims abstract description 37
- 239000004065 semiconductor Substances 0.000 title claims abstract description 16
- 230000007246 mechanism Effects 0.000 claims abstract description 25
- 238000010521 absorption reaction Methods 0.000 claims abstract description 16
- 230000008878 coupling Effects 0.000 claims description 18
- 238000010168 coupling process Methods 0.000 claims description 18
- 238000005859 coupling reaction Methods 0.000 claims description 18
- 239000000779 smoke Substances 0.000 abstract description 19
- 238000010009 beating Methods 0.000 abstract description 5
- 235000012431 wafers Nutrition 0.000 description 40
- 230000008859 change Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 241000252254 Catostomidae Species 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
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Abstract
The utility model belongs to the field of coding machines, and particularly relates to a semiconductor glass wafer laser coding machine with a dust collection structure, which comprises a working box, a lifting mechanism and a dust collection mechanism, wherein the working box is provided with a dust collection hole; when the wafer need beat the sign indicating number, through opening first motor, it rises to support first fixed plate through the threaded rod, and through first fixed plate with lid box lifting, the glass wafer can be placed at the top of work box through the lifting of lid box, this moment can be through opening the threaded rod, fall the top of work box with the lid box, can carry out the sign indicating number of beating of glass wafer in the inside of lid box this moment, when beating sign indicating number work and producing the smoke and dust, through opening two fan motor, utilize two fan motor to blow apart the extension, and carry the inside to the work box through the sieve, this moment through opening two dust absorption pumps, can send the smoke and dust respectively to two collecting box inside collections through the pipeline, it is great to have solved job site smoke and dust, the problem of operational environment has been influenced.
Description
Technical Field
The utility model relates to the field of coding machines, in particular to a semiconductor glass wafer laser coding machine with a dust collection structure.
Background
With the development and demand of society, the demand of people for semiconductor glass wafers is higher and higher.
When semiconductor glass wafers are produced, the wafers need to be coded, and at the moment, a laser coding machine is needed.
When the existing laser coding machine codes the glass wafer, larger smoke dust can be generated due to the high temperature of laser, but the existing coding machine does not have a dust collection mechanism to treat the smoke dust, so that the smoke dust on a working site is larger, and the problem of influencing the working environment is caused; therefore, a semiconductor glass wafer laser coding machine with a dust suction structure is provided for solving the problems.
SUMMERY OF THE UTILITY MODEL
The utility model provides a semiconductor glass wafer laser coding machine with a dust collection structure, which aims to make up for the defects of the prior art and solve the problems that when a laser coding machine codes a glass wafer, larger smoke dust can be generated due to the high temperature of laser, but the smoke dust is not treated by a dust collection mechanism of the conventional coding machine, so that the smoke dust on a working site is larger, and the working environment is influenced.
The technical scheme adopted by the utility model for solving the technical problems is as follows: the utility model relates to a semiconductor glass wafer laser coding machine with a dust collection structure, which comprises a working box, a lifting mechanism and a dust collection mechanism, wherein the working box is provided with a dust collection hole; the lifting mechanism is fixedly connected to one side of the outer surface of the working box, and the dust collection mechanism is fixedly connected to two sides of the outer surface of the working box;
the lifting mechanism comprises a cover box, a first thread fixing piece, a second thread fixing piece, a first motor and a limiting block, wherein the cover box is arranged at the top of the working box, the first thread fixing piece is fixedly connected to one side of the outer surface of the cover box, the second thread fixing piece is fixedly connected to one side of the outer surface of the working box, a threaded rod is inserted into internal threads of the first thread fixing piece, one end of the threaded rod is fixedly connected with a first fixing plate through a bearing, the first fixing plate is fixedly connected to one side of the outer surface of the cover box, the first motor is mounted at the top of the first fixing plate, and the limiting block is fixedly connected to the other end of the threaded rod;
dust absorption mechanism comprises fan motor, collecting box and dust absorption pump, fan motor installs in the inner chamber top of work box, the collecting box rigid coupling is in the surface both sides of work box, the dust absorption pump rigid coupling is in the top of two collecting boxes, the both ends of dust absorption pump all communicate there is the pipeline, one the pipeline is pegged graft in the inside of work box, another the pipeline is pegged graft in the inside of collecting box, the sieve has been seted up at the top of work box, can deliver to two collecting box inside collections respectively with the smoke and dust through the pipeline.
Preferably, the top rigid coupling of lid box has the laser coding device, just the one end of laser coding device extends to the inside of lid box, and the one end of being convenient for through the laser coding device is when the lid box falls to the work box inside, beats the sign indicating number work to the glass wafer at work box top.
Preferably, the number of the fan motors is two, and the two fan motors are respectively located on two sides of one end of the laser coding device, so that smoke generated during coding of the wafer can be conveniently conveyed to the inside of the working box through the arrangement of the two fan motors.
Preferably, the both ends of threaded rod are respectively threaded and are pegged graft in the inside of first thread mounting and second thread mounting, just the one end of threaded rod passes through the bearing rigid coupling in the bottom of first fixed plate, the other end of threaded rod extends to the outside of second thread mounting, and the rigid coupling is in the top of stopper, is convenient for when opening first motor, through the screw-thread fit of threaded rod and second thread mounting for the threaded rod can be in the inside lift of second thread mounting, and drives the lid box and go up and down, carries on spacingly through the stopper to the lift of lid box.
Preferably, the inside rigid coupling of work box has the second fixed plate, the top of second fixed plate has second rotation axis and first rotation axis through the bearing rigid coupling, the top rigid coupling of second rotation axis has the commentaries on classics board, the one end rigid coupling of first rotation axis has half-tooth gear, the other end and the second motor rigid coupling of first rotation axis, the external fixed surface of second rotation axis has cup jointed the straight-teeth gear, the surface of straight-teeth gear and half-tooth gear meshes mutually, has solved and can only carry out single wafer and has beaten the problem of sign indicating number.
Preferably, the second motor is installed in the bottom of second fixed plate, the top of work box is run through to the one end of second rotation axis, and extends to the inside of lid box, is convenient for drive first rotation axis through the second motor and rotates to finally through the rotation of the inside commentaries on classics board of work box, the glass wafer that drives commentaries on classics board top rotates.
The utility model has the advantages that:
1. according to the utility model, through the lifting mechanism and the dust absorption mechanism, when a wafer needs to be coded, the threaded rod is driven to rotate by starting the first motor, the threaded rod is matched with the thread of the second thread fixing piece through the rotation of the threaded rod, the threaded rod is enabled to ascend in the second thread fixing piece, the first fixing plate is supported and ascended through the threaded rod, the cover box is lifted through the first fixing plate, a glass wafer can be placed at the top of the work box through the uplifting of the cover box, at the moment, the cover box can fall to the top of the work box through opening the threaded rod, at the moment, the coding of the glass wafer can be carried out in the cover box, when smoke dust is generated in the coding work, the two fan motors are started, the two fan motors are utilized to blow off the extension and convey the extension to the inside of the work box through the sieve plate, at the moment, the two dust absorption pumps are started, the smoke dust can be respectively conveyed to the insides of the two collection boxes through the pipelines to be collected, the problem that the working environment is influenced due to large smoke dust in a working site is solved;
2. according to the utility model, through the rotating mechanism, when the glass wafer needs to be placed, the glass wafer can be placed on the top of the rotating plate when the cover box is lifted through the arrangement of the rotating plate, at the moment, the second motor is started, the first rotating shaft and the half-tooth gear are driven to rotate by the second motor, the straight gear is driven to intermittently rotate by the rotation of the half-tooth gear, and the rotating plate can intermittently rotate at the moment, so that the laser coding device can intermittently code the wafer on the top of the rotating plate, and the problem that only a single wafer can be coded is solved.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the embodiments or the description of the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without inventive labor.
FIG. 1 is a schematic sectional front view of a working box according to a first embodiment;
FIG. 2 is a schematic side view of the working box according to the first embodiment;
FIG. 3 is a schematic perspective view of a working box according to a first embodiment;
fig. 4 is a schematic structural view of a chuck according to a second embodiment.
In the figure: 1. a work box; 2. covering the box; 3. a laser coding device; 4. a fan motor; 5. a first motor; 6. a first threaded fastener; 7. a first fixing plate; 8. a threaded rod; 9. a second threaded fastener; 10. a limiting block; 11. a collection box; 12. a dust suction pump; 13. a second motor; 14. a first rotating shaft; 15. a half-tooth gear; 16. a spur gear; 17. a second rotation shaft; 18. rotating the plate; 19. a sieve plate; 20. a second fixing plate; 21. and (4) sucking discs.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Example one
Referring to fig. 1-3, a semiconductor glass wafer laser coding machine with a dust collection structure includes a work box 1, a lifting mechanism and a dust collection mechanism; the lifting mechanism is fixedly connected to one side of the outer surface of the working box 1, and the dust suction mechanism is fixedly connected to two sides of the outer surface of the working box 1;
the lifting mechanism comprises a cover box 2, a first thread fixing piece 6, a second thread fixing piece 9, a first motor 5 and a limiting block 10, wherein the cover box 2 is arranged at the top of the working box 1, the first thread fixing piece 6 is fixedly connected to one side of the outer surface of the cover box 2, the second thread fixing piece 9 is fixedly connected to one side of the outer surface of the working box 1, a threaded rod 8 is inserted into the internal thread of the first thread fixing piece 6, one end of the threaded rod 8 is fixedly connected with a first fixing plate 7 through a bearing, the first fixing plate 7 is fixedly connected to one side of the outer surface of the cover box 2, the first motor 5 is arranged at the top of the first fixing plate 7, and the limiting block 10 is fixedly connected to the other end of the threaded rod 8;
the dust collection mechanism comprises a fan motor 4, collection boxes 11 and a dust collection pump 12, the fan motor 4 is mounted at the top of an inner cavity of the working box 1, the collection boxes 11 are fixedly connected to two sides of the outer surface of the working box 1, the dust collection pump 12 is fixedly connected to the tops of the two collection boxes 11, two ends of the dust collection pump 12 are communicated with pipelines, one pipeline is inserted into the working box 1, the other pipeline is inserted into the collection boxes 11, and a sieve plate 19 is arranged at the top of the working box 1; when the glass wafer code printing machine works, when a wafer needs to be printed, the threaded rod 8 is driven to rotate by the first motor 5 through the opening of the first motor 5, the threaded rod 8 is enabled to ascend inside the second thread fixing part 9 through the rotation of the threaded rod 8 and the thread matching of the second thread fixing part 9, the first fixing plate 7 is supported and ascended through the threaded rod 8, the cover box 2 is lifted through the first fixing plate 7, the glass wafer can be placed at the top of the working box 1 through the lifting of the cover box 2, at the moment, the cover box 2 can be dropped to the top of the working box 1 through the opening of the threaded rod 8, the glass wafer code printing can be carried out inside the cover box 2, when smoke dust is generated during code printing work, the two fan motors 4 are opened, the extension is blown away through the two fan motors 4, the extension is conveyed to the inside of the working box 1 through the sieve plate 19, at the moment, through the opening of the two dust suction pumps 12, the smoke dust can be respectively sent to the two collecting boxes 11 through the pipelines to be collected.
The top of the cover box 2 is fixedly connected with a laser coding device 3, and one end of the laser coding device 3 extends into the cover box 2; during operation, be convenient for beat sign indicating number device 3's one end through the laser and fall to the work box 1 when inside at lid box 2, beat sign indicating number work to the glass wafer at work box 1 top.
The number of the fan motors 4 is two, and the two fan motors 4 are respectively positioned on two sides of one end of the laser coding device 3; during operation, be convenient for through the setting of two fan motor 4, the inside of work box 1 is sent to the smoke and dust that produces when conveniently beating the sign indicating number with the wafer.
Two ends of the threaded rod 8 are respectively in threaded connection with the first thread fixing part 6 and the second thread fixing part 9, one end of the threaded rod 8 is fixedly connected to the bottom of the first fixing plate 7 through a bearing, and the other end of the threaded rod 8 extends to the outside of the second thread fixing part 9 and is fixedly connected to the top of the limiting block 10; during operation, be convenient for when opening first motor 5, through the screw-thread fit of threaded rod 8 and second screw thread mounting 9 for threaded rod 8 can go up and down in second screw thread mounting 9 is inside, and drives lid box 2 and goes up and down, goes up and down to lid box 2 through stopper 10 and carries on spacingly.
A second fixed plate 20 is fixedly connected inside the work box 1, a second rotating shaft 17 and a first rotating shaft 14 are fixedly connected to the top of the second fixed plate 20 through a bearing, a rotating plate 18 is fixedly connected to the top of the second rotating shaft 17, a half-tooth gear 15 is fixedly connected to one end of the first rotating shaft 14, the other end of the first rotating shaft 14 is fixedly connected to a second motor 13, a straight gear 16 is fixedly sleeved on the outer surface of the second rotating shaft 17, and the straight gear 16 is meshed with the outer surface of the half-tooth gear 15; the during operation, through the setting of changeing board 18, can place the top of changeing board 18 with the glass wafer when lid box 2 rises, this moment through opening second motor 13, utilize second motor 13 to drive first rotation axis 14 and half-tooth gear 15 and rotate, the rotation that utilizes half-tooth gear 15 drives spur gear 16 and carries out intermittent type and rotate, it can intermittent type rotation to change board 18 this moment, can make the laser beat sign indicating number device 3 carry out intermittent type's the sign indicating number work of beating to the wafer that changes 18 tops, the problem of can only carrying out single wafer and beating the sign indicating number has been solved.
The second motor 13 is installed at the bottom of the second fixing plate 20, and one end of the second rotating shaft 17 penetrates through the top of the work box 1 and extends into the cover box 2; during operation, the second motor 13 is convenient to drive the first rotating shaft 14 to rotate, and finally the glass wafer on the top of the rotating plate 18 is driven to rotate through the rotation of the rotating plate 18 inside the working box 1.
Example two
Referring to fig. 4, in a first comparative example, as another embodiment of the present invention, four suction cups 21 are disposed on the top of the rotating plate 18; in operation, the four suckers 21 are convenient to arrange, so that the stability of the glass wafer in the rotation of the rotating plate 18 is convenient.
The working principle is that when the wafers need to be coded, the threaded rod 8 is driven to rotate by the first motor 5 by starting the first motor 5, the threaded rod 8 is enabled to ascend inside the second thread fixing part 9 by the rotation of the threaded rod 8 and the thread matching of the second thread fixing part 9, the first fixing plate 7 is supported and ascended by the threaded rod 8, the cover box 2 is lifted by the first fixing plate 7, the glass wafers can be placed on the top of the working box 1 by lifting the cover box 2, at the moment, the cover box 2 can be dropped to the top of the working box 1 by opening the threaded rod 8, coding of the glass wafers can be carried out inside the cover box 2, when smoke dust is generated in coding work, the two fan motors 4 are started, the extension is blown away by the two fan motors 4 and is conveyed to the inside of the working box 1 by the sieve plate 19, at the moment, by starting the two dust suction pumps 12, the smoke dust can be respectively sent to the two collecting boxes 11 through the pipelines to be collected.
In addition, when needs place the glass wafer, through the setting of changeing board 18, can place the top of changeing board 18 with the glass wafer when lid box 2 rises, this moment through opening second motor 13, utilize second motor 13 to drive first rotation axis 14 and the rotation of half-tooth gear 15, the rotation that utilizes half-tooth gear 15 drives spur gear 16 and carries out intermittent type and rotates, it can intermittent type rotation to change board 18 this moment, can make laser beat sign indicating number device 3 carry out intermittent type to the wafer at changeing board 18 top and beat sign indicating number work, the problem of can only carrying out single wafer and beat the sign indicating number has been solved.
In the description herein, references to the description of "one embodiment," "an example," "a specific example" or the like are intended to mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the utility model. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
The foregoing shows and describes the general principles, essential features, and advantages of the utility model. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, which are described in the specification and illustrated only to illustrate the principle of the present invention, but that various changes and modifications may be made therein without departing from the spirit and scope of the present invention, which fall within the scope of the utility model as claimed.
Claims (6)
1. A semiconductor glass wafer laser coding machine with dust collection structure is characterized in that: comprises a working box (1), a lifting mechanism and a dust suction mechanism; the lifting mechanism is fixedly connected to one side of the outer surface of the working box (1), and the dust collection mechanism is fixedly connected to two sides of the outer surface of the working box (1);
the lifting mechanism comprises a cover box (2), a first thread fixing piece (6), a second thread fixing piece (9), a first motor (5) and a limiting block (10), the cover box (2) is arranged at the top of the working box (1), the first thread fixing piece (6) is fixedly connected to one side of the outer surface of the cover box (2), the second thread fixing piece (9) is fixedly connected to one side of the outer surface of the working box (1), a threaded rod (8) is inserted into the internal thread of the first thread fixing piece (6), one end of the threaded rod (8) is fixedly connected with a first fixing plate (7) through a bearing, the first fixing plate (7) is fixedly connected to one side of the outer surface of the cover box (2), the first motor (5) is installed at the top of the first fixing plate (7), and the limiting block (10) is fixedly connected to the other end of the threaded rod (8);
dust absorption mechanism comprises fan motor (4), collecting box (11) and dust absorption pump (12), fan motor (4) are installed in the inner chamber top of work box (1), collecting box (11) rigid coupling is in the surface both sides of work box (1), dust absorption pump (12) rigid coupling is in the top of two collecting box (11), the both ends of dust absorption pump (12) all communicate there is the pipeline, one the pipeline is pegged graft in the inside of work box (1), another the pipeline is pegged graft in the inside of collecting box (11), sieve (19) have been seted up at the top of work box (1).
2. The semiconductor glass wafer laser coding machine with the dust absorption structure as claimed in claim 1, wherein: the top rigid coupling of lid box (2) has laser coding device (3), just the one end of laser coding device (3) extends to the inside of lid box (2).
3. The semiconductor glass wafer laser coding machine with the dust absorption structure as claimed in claim 2, wherein: the number of the fan motors (4) is two, and the two fan motors (4) are respectively positioned on two sides of one end of the laser coding device (3).
4. The semiconductor glass wafer laser coding machine with the dust absorption structure as claimed in claim 3, wherein: the two ends of the threaded rod (8) are respectively in threaded connection with the first thread fixing part (6) and the second thread fixing part (9), one end of the threaded rod (8) is fixedly connected to the bottom of the first fixing plate (7) through a bearing, the other end of the threaded rod (8) extends to the outer portion of the second thread fixing part (9), and the other end of the threaded rod is fixedly connected to the top of the limiting block (10).
5. The semiconductor glass wafer laser coding machine with the dust absorption structure as claimed in claim 4, wherein: the inside rigid coupling of work box (1) has second fixed plate (20), the top of second fixed plate (20) has second rotation axis (17) and first rotation axis (14) through the bearing rigid coupling, the top rigid coupling of second rotation axis (17) has rotor plate (18), the one end rigid coupling of first rotation axis (14) has half-tooth gear (15), the other end and second motor (13) rigid coupling of first rotation axis (14), the fixed cup joint in surface of second rotation axis (17) has spur gear (16), the surface of spur gear (16) and half-tooth gear (15) meshes mutually.
6. The semiconductor glass wafer laser coding machine with the dust absorption structure of claim 5, wherein: the second motor (13) is mounted at the bottom of the second fixing plate (20), and one end of the second rotating shaft (17) penetrates through the top of the working box (1) and extends into the cover box (2).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122418805.6U CN216607635U (en) | 2021-10-08 | 2021-10-08 | Semiconductor glass wafer laser coding machine with dust collection structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122418805.6U CN216607635U (en) | 2021-10-08 | 2021-10-08 | Semiconductor glass wafer laser coding machine with dust collection structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216607635U true CN216607635U (en) | 2022-05-27 |
Family
ID=81691543
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122418805.6U Expired - Fee Related CN216607635U (en) | 2021-10-08 | 2021-10-08 | Semiconductor glass wafer laser coding machine with dust collection structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216607635U (en) |
-
2021
- 2021-10-08 CN CN202122418805.6U patent/CN216607635U/en not_active Expired - Fee Related
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Granted publication date: 20220527 |
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