CN216600695U

CN216600695U - High-speed composite chip mounter feeding device

Info

Publication number: CN216600695U
Application number: CN202220081911.1U
Authority: CN
Inventors: 伍远宏; 郭晓卫; 杨钟
Original assignee: Judaxiang Equipment Shenzhen Co ltd
Current assignee: Judaxiang Equipment Shenzhen Co ltd
Priority date: 2022-01-13
Filing date: 2022-01-13
Publication date: 2022-05-24
Anticipated expiration: 2032-01-13

Abstract

The utility model belongs to the technical field of feeding equipment, and discloses a feeding device of a high-speed composite chip mounter, which comprises a shell, an upper guide plate, a lower guide plate, a material taking platform, a material taking frame and a material taking groove, wherein the upper guide plate is positioned above the lower guide plate, the material taking platform is positioned on one side of the lower guide plate, the material taking frame is positioned at the top of the material taking platform, the material taking groove is positioned above the inner wall of the material taking frame, the upper guide plate, the lower guide plate, the material taking platform, the material taking frame and the material taking groove are simultaneously positioned between the two shells, top blocks are arranged above the two sides of the material taking frame, a bottom block is arranged below the inner part of the top block, the bottom block is in sliding connection with the top blocks, the material taking structure pushes the bottom block to the surface of a material belt film through the top blocks, then the top blocks push the bottom block to fix the film through a first spring, so that the film can be effectively fixed through the bottom blocks, thereby increasing stability when the paster is taken out.

Description

High-speed composite chip mounter feeding device

Technical Field

The utility model belongs to the technical field of feeding equipment, concretely relates to high-speed compound chip mounter material feeding unit.

Background

The LED chip mounter has the advantages of high mounting speed, high mounting precision, stable mounting quality, reliability and the like as a support column type device in the field of LED mounting, is an indispensable device in the modern LED mounting industry, each suction nozzle rod of the existing chip mounter is provided with a feeder, the thickness of the visible feeder is thinner, the more the feeders are provided on the same position, and the mounting speed of the chip mounter is naturally faster.

And in prior art, the material strap membrane stability is relatively poor when the chip mounter feeder is fed, leads to the material strap membrane to be taken the material structure and takes out the feeder to there is the dust on the material strap membrane surface, influences the paster quality.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a high-speed compound chip mounter material feeding unit to it is relatively poor to solve the stability of current feeder pay-off, and the problem of the dust in the material area membrane can not be clear away to the feeder.

In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a high-speed compound chip mounter material feeding unit, includes shell, upper guide, lower baffle, gets the material platform, gets the material frame and gets the silo, the upper guide is located the top of lower baffle, it is located one side of lower baffle to get the material platform, it is located the top of getting the material platform to get the material frame, it is located the inner wall top of getting the material frame to get the silo, upper guide, lower guide, get the material platform, get the material frame and get the silo and be located between two shells simultaneously, it all is provided with the kicking block to get the both sides top of material frame, the inside below of kicking block is provided with the bottom block, bottom block and kicking block sliding connection, the kicking block with get the inner wall sliding connection of material platform, the lower guide is provided with the guide pulley between the baffle and the material frame of getting.

Preferably, the guide plate is installed at the bottom of the upper guide plate, and dust absorption pastes are arranged on two sides of the guide plate.

Preferably, the inner wall of the material taking table is provided with inner grooves at two sides close to the ejector block, side blocks are arranged below the outer surface of the ejector block, and the side blocks are in clearance fit with the inner grooves.

Preferably, a first spring is arranged between the bottom block and the top block, and a second spring is arranged between the side block and the inner groove.

Preferably, the upper guide plate is provided with an air pump on one side opposite to the guide plate, and the output end of the air pump is connected with the guide plate.

Preferably, the air cock is installed to the output of guide plate, the air cock is located between two dust absorption pastes, two the dust absorption pastes the inner wall that is fixed in two shells respectively.

Compared with the prior art, the utility model, following beneficial effect has:

(1) the utility model discloses set up kicking block and bottom block, got the material structure and promoted the bottom block to the surface of material area membrane through the kicking block, it is fixed with the material area membrane that the kicking block promotes the bottom block through first spring after that, can take the effectual fixing of material area membrane through the bottom block like this to increase the stability when the paster is got the material.

(2) The utility model discloses set up guide plate and dust absorption subsides, blown the surface of material area membrane through the gas pocket with the gas of air pump output through the guide plate, the dust absorption subsides are adsorbed near the dust of material area membrane simultaneously, can effectual reduction material area membrane surface dust like this.

Drawings

Fig. 1 is a schematic structural view of the present invention;

FIG. 2 is a schematic structural view of the top block and the bottom block of the present invention;

FIG. 3 is an enlarged view taken at A in FIG. 1;

in the figure: 1. a housing; 2. an upper guide plate; 3. a lower guide plate; 4. a material taking table; 5. taking a material frame; 6. a material taking groove; 7. an air pump; 8. a dust absorption patch; 9. a guide wheel; 10. a top block; 11. a bottom block; 12. a first spring; 13. a side block; 14. an inner tank; 15. a second spring; 16. a baffle; 17. an air tap.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-3, the present invention provides the following technical solutions: a feeding device of a high-speed composite chip mounter comprises a shell 1, an upper guide plate 2, a lower guide plate 3 and a material taking table 4, get material frame 5 and material taking groove 6, upper guide 2 is located the top of lower guide 3, it is located one side of lower guide 3 to get material platform 4, it is located the top of getting material platform 4 to get material frame 5, it is located the inner wall top of getting material frame 5 to get material groove 6, upper guide 2, lower guide 3, get material platform 4, it is located between two shells 1 simultaneously to get material frame 5 and get material groove 6, it all is provided with kicking block 10 to get the both sides top of material frame 5, kicking block 10 can make things convenient for feeding agencies to promote bottom block 11 downwards, the inside below of kicking block 10 is provided with bottom block 11, bottom block 11 can be stable fixed with the material area membrane, bottom block 11 and kicking block 10 sliding connection, kicking block 10 and the inner wall sliding connection who gets material platform 4, lower guide 3 and get and be provided with guide pulley 9 between the material frame 5, guide pulley 9 can make the material area membrane move steadily.

Furthermore, a guide plate 16 is installed at the bottom of the upper guide plate 2, dust-absorbing patches 8 are arranged on two sides of the guide plate 16, and the dust can be effectively collected by the dust-absorbing patches 8.

Furthermore, inner grooves 14 are formed in two sides, close to the top block 10, of the inner wall of the material taking table 4, side blocks 13 are installed below the outer surface of the top block 10, the side blocks 13 are in clearance fit with the inner grooves 14, and the stability of the top block 10 can be effectively improved.

Specifically, a first spring 12 is arranged between the bottom block 11 and the top block 10, the first spring 12 can push the bottom block 11 to fix the material film, a second spring 15 is arranged between the side block 13 and the inner groove 14, and the second spring 15 can ensure that the top block 10 returns to the original position.

It is worth to say that, the air pump 7 is installed on one side of the upper guide plate 2 opposite to the guide plate 16, and the output end of the air pump 7 is connected with the guide plate 16, so that the ash in the material-carrying film can be effectively removed through the guide plate 16.

Further, air cock 17 is installed to the output of guide plate 16, and air cock 17 is located between two dust absorption subsides 8, and two dust absorption subsides 8 are fixed in the inner wall of two shells 1 respectively, and air cock 17 can be with the leading-in surface to the material area membrane of gas to make the dust on material area membrane surface clear up.

The utility model discloses a theory of operation and use flow: when the utility model is used, a material belt film enters the bottom of the guide wheel 9 through the space between the upper guide plate 2 and the lower guide plate 3, the material belt film is guided into the material taking frame 5 by the guide wheel 9, when the material taking frame 5 moves to the position below the material taking groove 6, the material taking structure moves to the position above the material taking groove 6 and then moves downwards, when the material taking structure touches the top block 10, the top block 10 firstly pushes the side block 13 to move downwards, and when the bottom block 11 contacts the material belt film, the bottom block 11 simultaneously supports against the two sides of the material belt film through the first spring 12, so that the stability of the material belt film during material taking can be effectively improved;

when the material tape film is taken and moved, the air pump 7 is used for ventilating the air nozzle 17 through the guide plate 16, so that the air nozzle 17 blows air towards the material tape film, and dust on the surface of the material tape film is adsorbed by the dust absorption pastes 8 on the two sides of the material tape film.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a high-speed compound chip mounter material feeding unit, includes shell (1), upper baffle (2), lower baffle (3), gets material platform (4), gets material frame (5) and gets silo (6), upper baffle (2) are located the top of lower baffle (3), get one side that material platform (4) are located lower baffle (3), it is located the top of getting material platform (4) to get material frame (5), it is located the inner wall top of getting material frame (5) to get silo (6), upper baffle (2), lower baffle (3), get material platform (4), get material frame (5) and get silo (6) and be located between two shells (1) simultaneously, its characterized in that: get both sides top of material frame (5) and all be provided with kicking block (10), the inside below of kicking block (10) is provided with bottom (11), bottom (11) and kicking block (10) sliding connection, kicking block (10) and the inner wall sliding connection who gets material platform (4), be provided with guide pulley (9) down between baffle (3) and the material frame of getting (5).

2. The feeding device of a high-speed composite chip mounter according to claim 1, wherein: the bottom of the upper guide plate (2) is provided with a guide plate (16), and both sides of the guide plate (16) are provided with dust collection pastes (8).

3. The feeding device of a high-speed composite chip mounter according to claim 1, wherein: the inner wall of the material taking table (4) is provided with inner grooves (14) on two sides close to the ejector block (10), side blocks (13) are mounted below the outer surface of the ejector block (10), and the side blocks (13) are in clearance fit with the inner grooves (14).

4. The feeding device of the high-speed composite chip mounter according to claim 3, wherein: a first spring (12) is arranged between the bottom block (11) and the top block (10), and a second spring (15) is arranged between the side block (13) and the inner groove (14).

5. The feeding device of a high-speed composite chip mounter according to claim 2, wherein: and the upper guide plate (2) is provided with an air pump (7) back to one side of the guide plate (16), and the output end of the air pump (7) is connected with the guide plate (16).

6. The feeding device of the high-speed composite chip mounter according to claim 5, wherein: air cock (17) are installed to the output of guide plate (16), air cock (17) are located between two dust absorption subsides (8), two dust absorption subsides (8) are fixed in the inner wall of two shells (1) respectively.