CN216600531U - Power conversion equipment and heat radiation structure thereof - Google Patents
Power conversion equipment and heat radiation structure thereof Download PDFInfo
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- CN216600531U CN216600531U CN202121837209.5U CN202121837209U CN216600531U CN 216600531 U CN216600531 U CN 216600531U CN 202121837209 U CN202121837209 U CN 202121837209U CN 216600531 U CN216600531 U CN 216600531U
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Abstract
The utility model discloses a power conversion device and a heat dissipation structure thereof, wherein the heat dissipation structure of the power conversion device comprises: the shell is a radiator for radiating heat of the circuit board; wherein, the casing is provided with the holding tank, and the radiator sets up in the holding tank. The heat dissipation structure of the power conversion equipment realizes heat dissipation of the circuit board by arranging the heat radiator, and improves the heat dissipation effect compared with the heat radiator; through set up the holding tank on the casing, set up the radiator in the holding tank, reduced the height of radiator protrusion in the casing to the volume of whole structure has been reduced. Therefore, the heat dissipation structure of the power conversion equipment improves the heat dissipation effect and reduces the volume.
Description
Technical Field
The utility model relates to the technical field of heat dissipation of electrical equipment, in particular to power conversion equipment and a heat dissipation structure thereof.
Background
At present, power conversion equipment mainly comprises a shell and a circuit board arranged in the shell, wherein glue is filled in the shell. Because the inside encapsulating of casing leads to whole radiating effect relatively poor.
In order to improve the heat dissipation effect, a heat sink is usually disposed outside the casing, and the whole heat sink is located outside the casing, resulting in a large volume of the whole power conversion device.
In addition, above-mentioned power conversion equipment still includes the panel beating link plate, and the casing is between radiator and panel beating link plate, and the panel beating link plate card is gone into the radiator and is strengthened the restraint with the help of screw and shell fragment. The power supply conversion equipment has the advantages of more assembling materials, more assembling procedures and lower production efficiency.
In summary, how to realize heat dissipation of the power conversion device, not only improving the heat dissipation effect, but also reducing the volume is a problem to be solved urgently by those skilled in the art.
SUMMERY OF THE UTILITY MODEL
In view of the above, an object of the present invention is to provide a heat dissipation structure of a power conversion device, which can improve the heat dissipation effect and reduce the size. Another object of the present invention is to provide a power conversion apparatus including the above heat dissipation structure.
In order to achieve the purpose, the utility model provides the following technical scheme:
a heat dissipation structure of a power conversion apparatus, comprising: a housing, a heat sink for dissipating heat from the heating element; wherein, the casing is provided with the holding tank, the radiator set up in the holding tank.
Optionally, the heat sink sinks in the receiving groove, or the heat sink and the notch of the receiving groove are flush.
Optionally, the receiving groove is a through groove or a semi-through groove, and the heat sink does not extend out of an end of the receiving groove.
Optionally, the outer wall of the heat sink is flush with the outer wall of the housing.
Optionally, the bottom of the accommodating groove is provided with at least one avoiding hole to enable the heating element to contact with the heat sink.
Optionally, the heat sink is sealingly connected to the housing.
Optionally, the heat sink and the casing are connected in a sealing manner through a sealing ring, and the sealing ring is arranged on the periphery of the avoiding hole.
Optionally, the heat sink is fixedly connected to the housing by clamping.
Optionally, the receiving groove is a through groove or a semi-through groove, and the heat sink and the housing are clamped at least one end of the receiving groove.
Optionally, the heat dissipation structure of the power conversion device further includes a circuit board, and the heating element is disposed on the circuit board;
the casing is provided with a hole for filling and a plugging piece for plugging the hole for filling, wherein the hole for filling is higher than the circuit board.
Optionally, the hole of irritating and the notch of holding tank are located the homonymy of casing.
Optionally, the outer wall of the heat sink is provided with a conformal design structure capable of being integrated with the outer wall of the housing.
Optionally, the housing includes a first housing and a second housing that are fixedly connected, and the receiving groove is disposed in the second housing.
Optionally, the first housing is provided with a hanging hole;
and/or the first shell and the second shell are both plastic pieces and are fixedly connected through ultrasonic welding;
and/or, first casing is provided with first cable pressfitting spare, the second casing is provided with second cable pressfitting spare, first cable pressfitting spare with second cable pressfitting spare butt joint forms the line hole of crossing that is used for supplying the cable to pass through, just first cable pressfitting spare with second cable pressfitting spare all be used for with cable sealing connection.
According to the heat dissipation structure of the power conversion equipment, the heat dissipation of the circuit board is realized by arranging the heat radiator, and compared with the heat radiator, the heat dissipation effect is improved; through set up the holding tank on the casing, set up the radiator in the holding tank, reduced the height of radiator protrusion in the casing to the volume of whole structure has been reduced. Therefore, the heat dissipation structure of the power conversion equipment improves the heat dissipation effect and reduces the volume.
Based on the heat dissipation structure of the power conversion equipment, the utility model further provides the power conversion equipment, which comprises the heat dissipation structure, wherein the heat dissipation structure is the heat dissipation structure of any one of the power conversion equipment.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the provided drawings without creative efforts.
Fig. 1 is a schematic structural diagram of a heat dissipation structure of a power conversion device according to an embodiment of the present invention;
fig. 2 is a cross-sectional view of a heat dissipation structure of a power conversion apparatus according to an embodiment of the present invention;
fig. 3 is a partial schematic view of a heat dissipation structure of a power conversion device according to an embodiment of the present invention;
fig. 4 is an exploded view of a heat dissipation structure of a power conversion device according to an embodiment of the present invention;
fig. 5 is a schematic structural diagram of a first housing in a heat dissipation structure of a power conversion device according to an embodiment of the present invention;
fig. 6 is a schematic structural diagram of a second housing in the heat dissipation structure of the power conversion device according to the embodiment of the present invention;
fig. 7 is a schematic structural diagram of a heat sink in a heat dissipation structure of a power conversion device according to an embodiment of the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
As shown in fig. 1 to 4 and fig. 6, the heat dissipation structure of the power conversion apparatus according to the embodiment of the present invention includes: a housing, a heat sink 300 for dissipating heat of the heat generating element 501; wherein, the housing is provided with a receiving groove 203, and the heat sink 300 is disposed in the receiving groove 203.
The heating element 501 is disposed in the housing, and the specific type and structure of the heating element 501 are selected according to actual needs. Specifically, the heating element 501 is disposed on the circuit board 500, and the circuit board 500 is fixed in the housing. The fixing structure of the circuit board 500 is selected according to actual needs, and this embodiment does not limit this.
The heat dissipation structure of the power conversion device provided by the above embodiment, by providing the heat sink 300, realizes heat dissipation of the circuit board 500, and improves the heat dissipation effect compared with a structure without a heat sink; by providing the receiving groove 203 on the housing and disposing the heat sink 300 in the receiving groove 203, the height of the heat sink 300 protruding from the housing is reduced, thereby reducing the volume of the entire structure. Therefore, the heat dissipation structure of the power conversion equipment improves the heat dissipation effect and reduces the volume.
In the heat dissipation structure of the power conversion device, the heat sink 300 protrudes out of the receiving groove 203, or the heat sink 300 sinks into the receiving groove 203, or the heat sink 300 is flush with the notch of the receiving groove 203. To further reduce the volume, the heat sink 300 may be chosen to sink in the receiving groove 203, or the heat sink 300 may be flush with the notch of the receiving groove 203.
It is understood that the heat sink 300 sinks in the receiving groove 203, which means that the heat sink 300 is lower than the notch of the receiving groove 203.
The size and shape of the receiving groove 203 are designed according to the heat sink 300, for example, the heat sink 300 and the receiving groove 203 are rectangular, which is not limited in this embodiment. In practical applications, the accommodating groove 203 is a through groove or a semi-through groove for facilitating the installation of the heat sink 300. At this time, the end of the heat sink 300 protruding out of the receiving groove 203 or the end of the heat sink 300 not protruding out of the receiving groove 203 may be selected. In order to reduce the volume, the end of the heat sink 300 that does not protrude out of the receiving groove 203 may be selected.
Specifically, if the receiving groove 203 is a through groove, openings are provided at both ends of the receiving groove 203, and at this time, the heat sink 300 does not extend out of the two openings of the receiving groove 203, or the heat sink 300 extends out of one opening of the receiving groove 203, or the heat sink 300 extends out of the two openings of the receiving groove 203; if the receiving groove 203 is a semi-through groove, one end of the receiving groove 203 is open, and the other end is closed, and at this time, the heat sink 300 does not extend out of the opening of the receiving groove 203, or the heat sink 300 extends out of the opening of the receiving groove 203.
In the heat dissipation structure of the power conversion apparatus, in order to reduce the size to the maximum, the outer wall of the heat sink 300 may be selected to be flush with the outer wall of the housing, as shown in fig. 1 and 2.
In the heat dissipation structure of the power conversion apparatus, in order to improve the heat dissipation effect, at least one avoiding hole 204 is formed at the bottom of the receiving groove 203 so that the heating element 501 contacts the heat sink 300. It is understood that the heat generating element 501 is in heat conductive contact with the heat sink 300, specifically, the heat generating element 501 is in direct heat conductive contact with the heat sink 300, or the heat generating element 501 is in indirect heat conductive contact with the heat sink 300 through a heat conductive coating or the like, which is selected according to actual needs, and this embodiment is not limited thereto.
The number, shape, and size of the avoiding holes 204 are selected according to actual needs, for example, the size and number of the heating elements 501. Specifically, one or more than two of the avoiding holes 204 may be provided. For convenience of production and manufacture, the number of the avoiding holes 204 may be two. The two avoiding holes 204 may be equal or unequal in size, and the two avoiding holes 204 may be the same or different in shape.
The heating element 501 is located in the avoiding hole 204, and the heating element 501 may protrude from the avoiding hole 204 or may not protrude from the avoiding hole 204, which is selected according to actual needs and is not limited in this embodiment.
In the heat dissipation structure of the power conversion device, the avoidance hole 204 is formed, so that the heating element 501 is in contact with the heat sink 300, and the heat dissipation effect is improved.
If the bottom of the receiving groove 203 is provided with the avoiding hole 204, the heat sink 300 may be selected to be hermetically connected to the housing for facilitating subsequent potting. Specifically, the heat sink 300 and the receiving groove 203 are hermetically connected.
The sealing structure is selected according to actual requirements. Optionally, the heat sink 300 and the housing are hermetically connected by a sealing ring 600, and the sealing ring 600 is disposed at the periphery of the avoiding hole 204.
The number of the sealing rings 600 is selected according to actual needs, for example, the number of the avoiding holes 204. Specifically, one, two or more seal rings 600 may be provided. If there are more than two avoidance holes 204, the seal rings 600 and the avoidance holes 204 may be selected to correspond to each other in order to ensure sealing performance.
In order to facilitate installation of the seal ring 600, the housing may be provided with a seal groove 205, and the seal ring 600 may be disposed in the seal groove 205. At this time, the sealing groove 205 is located at the periphery of the avoidance hole 204. It will be appreciated that there is a one-to-one correspondence between seal grooves 205 and seal rings 600.
In the heat dissipation structure of the power conversion apparatus, the heat sink 300 is fixedly connected to the housing to improve stability. To facilitate the detachment, the heat sink 300 is detachably and fixedly connected to the housing, for example, the heat sink 300 is fixedly connected by a fastener or a snap structure. In order to reduce the number of parts, the heat sink 300 may be connected to the housing by snap-fitting.
Specifically, one of the heat sink 300 and the housing is provided with a clamping groove 303, the other is provided with a buckle 206, and the buckle 206 is in clamping fit with the clamping groove 303. For design convenience, the card slot 303 may be disposed on the heat sink 300 and the clip 206 may be disposed on the housing.
As shown in fig. 7, if the heat sink 300 includes a heat dissipating substrate 301 and heat dissipating fins 302 disposed on the heat dissipating substrate 301, the optional card slot 303 is disposed on the heat dissipating substrate 301.
The structure of the heat sink 300 may be other structures, and is selected according to actual needs, which is not limited in this embodiment.
In practical applications, to facilitate the clamping, the receiving groove 203 is a through groove or a semi-through groove, and the heat sink 300 and the housing are clamped at least one end of the receiving groove 203.
In the heat dissipation structure of the power conversion device, if the heat sink 300 is connected to the housing in a sealing manner through the sealing ring 600, when the heat sink 300 is connected to the housing in a clamping manner, a certain pressing force is generated on the sealing ring 600, so that the heat sink deforms to achieve a sealing effect.
Optionally, the heat dissipation structure of the power conversion device further includes a circuit board 500, and the heat generating element 501 is disposed on the circuit board 500. In order to achieve potting, the housing is provided with a potting hole 201 and a plug 700 for plugging the potting hole 201. In order to simplify the structure, the hole 201 is higher than the circuit board 500.
In the structure, the colloid is poured from the filling and sealing hole 201, and because the height difference exists between the pouring area and the circuit board 500, the colloid at the position of the circuit board 500 can be filled to the maximum extent without additionally arranging the air outlet and without arranging the sealing plug for sealing the air outlet, so that the structure is simplified, the assembly logistics are reduced, the assembly process is reduced, and the production efficiency is improved.
In order to ensure the height difference between the hole 201 and the circuit board 500, the notches of the hole 201 and the receiving groove 203 may be located on the same side of the housing. In practical applications, the hole 201 may be disposed at other positions, and is not limited to the above limitation.
In the heat dissipation structure of the power conversion device, the shape of the heat sink 300 is selected according to actual needs. In order to improve the appearance, the outer wall of the heat sink 300 may be provided with a conformal structure that can be integrated with the outer wall of the housing.
The heat sink 300 may be manufactured by an aluminum extrusion molding process or a die-casting molding process, and is selected according to actual needs, which is not limited in this embodiment.
In the heat dissipation structure of the power conversion equipment, the specific structure of the shell is selected according to actual needs. For the convenience of installation, the housing may be selected to include a first housing 100 and a second housing 200 fixedly connected to each other, and the receiving groove 203 is disposed in the second housing 200.
It can be understood that the first casing 100 and the second casing 200 are hermetically connected, and the first casing 100 and the second casing 200 may be sequentially distributed along the thickness direction of the casings, or may be sequentially distributed along the length direction or the width direction of the casings, and are selected according to actual needs. For convenience of assembly, the first and second cases 100 and 200 may be sequentially distributed in a thickness direction of the cases, i.e., the first and second cases 100 and 200 may be sequentially distributed in a thickness direction of the circuit board 500.
As shown in fig. 5, the first housing 100 is provided with the hanging hole 102, so that a hanging plate is not required to be provided, thereby reducing the number of assembly materials, reducing the number of assembly processes, and improving the production efficiency. The size and shape of the hanging hole 102 are designed according to actual needs, and this embodiment is not limited to this.
For convenience of production, the first casing 100 and the second casing 200 may be both plastic parts, and the first casing 100 and the second casing 200 are fixedly connected by ultrasonic welding. In this case, it is optional that both the first and second housings 100 and 200 are molded by a mold.
Of course, the first casing 100 and the second casing 200 may be made of other materials, such as metal parts; the first casing 100 and the second casing 200 may be fixedly connected by bonding or other means, and are not limited to the above-described embodiments.
In the above power conversion device, the cable 400 is electrically connected to the circuit board 500, and in order to facilitate wire passing, as shown in fig. 1 to 3 and fig. 5 to 6, the first housing 100 is provided with a first cable pressing member 101, the second housing 200 is provided with a second cable pressing member 202, the first cable pressing member 101 and the second cable pressing member 202 are butted to form a wire passing hole for the cable 400 to pass through, and both the first cable pressing member 101 and the second cable pressing member 202 are used for being connected to the cable 400 in a sealing manner.
The material, size and shape of the first cable pressing member 101 and the second cable pressing member 202 are selected according to actual needs, which is not limited in this embodiment.
To explain the present invention more specifically, a more specific heat dissipation structure of a power conversion apparatus is provided below.
Specifically, the heat dissipation structure of the power conversion device includes: first casing 100, second casing 200, radiator 300, circuit board 500, sealing washer 600 and shutoff piece 700, wherein, second casing 200 is provided with irritates hole 201, second cable pressfitting spare 202, holding tank 203 and seal groove 205, and radiator 300 sets up in holding tank 203, and the tank bottom of holding tank 203 is provided with dodges the hole 204, and radiator 300 passes through the tank bottom sealing connection of sealing washer 600 and holding tank 203, and first casing 100 is provided with first cable pressfitting spare 101 and hangs dress hole 102.
The assembly mode of the heat dissipation structure of the power conversion equipment is as follows: the circuit board 500 is disposed on the second housing 200; the first shell 100 and the second shell 200 are fixedly connected through ultrasonic welding, the first cable pressing piece 101 and the second cable pressing piece 202 are butted to form a wire passing hole for the cable 400 to pass through, and the first cable pressing piece 101 and the second cable pressing piece 202 are both used for being connected with the cable 400 in a sealing mode; the sealing ring 600 is placed in the sealing groove 205, the heat sink 300 is clamped in the accommodating groove 203, and the heat sink 300 is hermetically connected with the second shell 200 through the sealing ring 600; and then, encapsulating the hole 201 from the encapsulating hole, and after the encapsulating is finished, using a blocking piece 700 to block the encapsulating hole 201 to finish the assembly.
Based on the heat dissipation structure of the power conversion device provided by the above embodiment, this embodiment further provides a power conversion device, where the power conversion device includes a heat dissipation structure, and the heat dissipation structure is the heat dissipation structure of the power conversion device provided by the above embodiment.
Since the heat dissipation structure of the power conversion device provided by the above embodiment has the above technical effects, and the power conversion device includes the heat dissipation structure of the power conversion device, the power conversion device also has corresponding technical effects, and details are not repeated herein.
The type of the power conversion device is selected according to actual needs, for example, the power conversion device optimizer or the shutdown device is described above, which is not limited in this embodiment.
The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the utility model. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (14)
1. A heat radiation structure of a power conversion apparatus, comprising: a housing, a heat sink (300) for dissipating heat from the heat generating element (501); wherein the housing is provided with a receiving groove (203), and the heat sink (300) is arranged in the receiving groove (203);
the shell comprises a first shell (100) and a second shell (200) which are fixedly connected, and the accommodating groove (203) is formed in the second shell (200).
2. The heat dissipation structure of claim 1, wherein the heat sink (300) is sunk in the receiving groove (203) or the notches of the heat sink (300) and the receiving groove (203) are flush.
3. The heat dissipation structure according to claim 1, wherein the receiving groove (203) is a through groove or a semi-through groove, and the heat sink (300) does not protrude beyond an end of the receiving groove (203).
4. The heat dissipation structure of claim 1, wherein the outer wall of the heat sink (300) is flush with the outer wall of the housing.
5. The heat dissipation structure according to claim 1, wherein the bottom of the receiving groove (203) is provided with at least one relief hole (204) to bring the heat generating element (501) into contact with the heat sink (300).
6. The heat dissipation structure according to claim 5, wherein the heat sink (300) is sealingly connected to the housing.
7. The heat dissipation structure of claim 6, wherein the heat sink (300) and the housing are hermetically connected by a sealing ring (600), and the sealing ring (600) is disposed at the periphery of the avoiding hole (204).
8. The heat dissipation structure of claim 1, wherein the heat sink (300) is fixedly connected to the housing by a snap fit.
9. The heat dissipating structure of claim 8, wherein the receiving groove (203) is a through groove or a semi-through groove, and the heat sink (300) and the housing are snap-fitted at least one end of the receiving groove (203).
10. The heat dissipation structure according to claim 1, further comprising a circuit board (500), wherein the heat generating element (501) is provided to the circuit board (500);
the housing is provided with a hole (201) and a sealing piece (700) for sealing the hole (201), wherein the hole (201) is higher than the circuit board (500).
11. The heat dissipating structure of claim 10, wherein the hole (201) and the notch of the receiving groove (203) are located on the same side of the housing.
12. The heat dissipation structure of claim 1, characterized in that the outer wall of the heat sink (300) is provided with a conformal design that can be integrated with the outer wall of the housing.
13. The heat dissipation structure according to any one of claims 1 to 12,
the first shell (100) is provided with a hanging hole (102);
and/or the first shell (100) and the second shell (200) are both plastic parts, and the first shell (100) and the second shell (200) are fixedly connected through ultrasonic welding;
and/or, first casing (100) are provided with first cable pressfitting spare (101), second casing (200) are provided with second cable pressfitting spare (202), first cable pressfitting spare (101) with second cable pressfitting spare (202) butt joint forms and is used for supplying the line hole of crossing that cable (400) passed through, just first cable pressfitting spare (101) with second cable pressfitting spare (202) all be used for with cable (400) sealing connection.
14. A power conversion apparatus comprising a heat dissipation structure, wherein the heat dissipation structure is as claimed in any one of claims 1 to 13.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121837209.5U CN216600531U (en) | 2021-08-06 | 2021-08-06 | Power conversion equipment and heat radiation structure thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121837209.5U CN216600531U (en) | 2021-08-06 | 2021-08-06 | Power conversion equipment and heat radiation structure thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216600531U true CN216600531U (en) | 2022-05-24 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202121837209.5U Active CN216600531U (en) | 2021-08-06 | 2021-08-06 | Power conversion equipment and heat radiation structure thereof |
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| Country | Link |
|---|---|
| CN (1) | CN216600531U (en) |
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- 2021-08-06 CN CN202121837209.5U patent/CN216600531U/en active Active
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