CN216600276U

CN216600276U - Auxiliary tool for improving line passing capability of IC carrier plate sheet

Info

Publication number: CN216600276U
Application number: CN202123329462.2U
Authority: CN
Inventors: 柯亮宇; 邓永涛; 高航; 林斯亚; 王晓凌
Original assignee: Zhuhai Zhongjing Electronic Circuit Co ltd
Current assignee: Zhuhai Zhongjing Electronic Circuit Co ltd
Priority date: 2021-12-27
Filing date: 2021-12-27
Publication date: 2022-05-24
Anticipated expiration: 2031-12-27

Abstract

The utility model provides an auxiliary tool for improving the line passing capacity of an IC carrier plate thin plate, which relates to the technical field of auxiliary tools of IC carrier plate thin plates, and comprises a first clamp plate, wherein the bottom of the first clamp plate is provided with a second clamp plate, the top surface of the first clamp plate is provided with a PIN hole, the PIN hole penetrates through the first clamp plate, the top surface of the second clamp plate is fixed with a PIN needle, the PIN needle is spliced with the PIN hole, the top surfaces of the first clamp plate and the second clamp plate are respectively provided with a hollow groove, the hollow grooves respectively penetrate through the first clamp plate and the second clamp plate, the first clamp plate and the second clamp plate are provided with the first clamp plate and the second clamp plate, the PIN needle and the PIN hole are respectively spliced, the plate is sleeved in the designed first clamp plate and the second clamp plate, then the horizontal line is processed, the whole surface of the thin plate is stretched and fixed by the design, the impact resistance of the thin plate is improved, the horizontal loss rate of the plate thickness less than 0.1mm is reduced to 0.00%, no wrinkle defect.

Description

Auxiliary tool for improving line passing capability of IC carrier plate sheet

Technical Field

The utility model relates to a utensil technical field is assisted to IC support plate sheet metal, especially relates to a promote IC support plate sheet metal and cross line ability and assist utensil.

Background

At present, IC carrier plates are generally divided into two types of core plate plates and non-core plate plates, the IC carrier plates with the core plate plates are generally too thick, the non-core plate plates lack rigidity and are easy to warp IC, the development of packaging technology is very important, and the chip packaging is indispensable in an integrated circuit, so that the article mainly summarizes the current situation of integrated circuit packaging, including DIP packaging, PLCC plastic pin sheet Wu carrier packaging and QFP/PFP square flat Wu/flat component type packaging which are widely applied at the present stage; at present, the advanced technologies such as BGA ball grid array (Wu X) packaging, CSP chip size packaging, MCM multi-chip module system packaging and the like are adopted.

An assistant tool for printing conductive adhesive on a flexible circuit board is disclosed according to the patent with the patent number of CN202841720U, and comprises a flat plate, wherein the flat plate has a certain thickness, the thickness of the flat plate is at least larger than that of an IC packaging device welded on an FPC insulating substrate, and a hollow window is arranged on the flat plate. The utility model discloses a through the setting of this dull and stereotyped fretwork window, and make FPC insulating substrate when placing on the flat board, IC encapsulation device can sink to this fretwork window to make FPC print the conducting resin and more level and more smooth.

The plate with the thickness larger than 0.10mm is machined by the existing horizontal line, the linear speed setting interval is 2.5-6.5m/min, the plate damage and wrinkling phenomena are avoided, but the plate with the thickness smaller than 0.1mm cannot be overcome.

SUMMERY OF THE UTILITY MODEL

The utility model aims at solving the defects existing in the prior art and providing an assistant tool for improving the line passing capacity of an IC carrier plate sheet.

In order to achieve the above purpose, the utility model adopts the following technical scheme: the utility model provides a promote IC support plate sheet metal and cross line ability and assist utensil, includes first splint, the bottom of first splint is equipped with second splint, the PIN hole has been seted up to the top surface of first splint, and the PIN hole runs through first splint, the top surface of second splint is fixed with the PIN needle, and PIN needle and PIN hole peg graft, the cavity recess has been seted up respectively to the top surface of first splint and second splint, and the cavity recess runs through first splint, second splint respectively.

Preferably, the projection plane of the PIN needle and the projection plane of the PIN hole are overlapped with each other.

Preferably, the diameter of the PIN hole is 1.35mm, and the shortest distance between the perpendicular bisector of the PIN hole and the edge of the first splint is 4 mm.

Preferably, the side of the first clamping plate and the side of the second clamping plate have a nearest distance of 4mm to the hollow groove.

Preferably, the PIN has a diameter of 1.35 mm.

Preferably, the first clamping plate and the second clamping plate have a thickness of 1.5 mm.

Preferably, the distance between the adjacent PIN hole on the longer edge of the first clamping plate is 71mm, and the distance between the two nearest PIN holes on the longer edge of the first clamping plate from the perpendicular bisector is 72 mm.

Preferably, the distance between the adjacent PIN hole on the short edge of first splint is 56.8mm, and the distance between two the nearest PIN holes of the short edge of first splint distance perpendicular bisector is 57.2 mm.

Preferably, the distance between the PIN holes of the first clamping plate on the longer two sides in the axial symmetry structure is 502 mm.

Preferably, the distance between the PIN holes in the axisymmetric configuration on the two shorter sides of the first splint is 402 mm.

Advantageous effects

The utility model discloses in, be equipped with first splint and second splint, and be equipped with PIN needle and PIN hole respectively on first splint and second splint surface, and PIN needle and PIN hole are pegged graft, embolia the first splint that have already designed and the second splint is supplementary with the plate, process horizontal line again, this kind of design makes the whole face of sheet metal tensile fixed, has promoted the shock resistance of sheet metal, makes the thick horizontal line board damage rate that is less than 0.1mm plate of board reduce to 0.00% from 55.00%, no fold defect.

Drawings

FIG. 1 is an overall structure diagram of the present invention;

fig. 2 is an exploded view of the present invention;

FIG. 3 is a structural diagram of the first clamping plate of the present invention;

fig. 4 is a structural diagram of the second splint of the present invention.

Illustration of the drawings:

1. a first splint; 2. a second splint; 3. a hollow groove; 4. a PIN needle; 5. and a PIN hole.

Detailed Description

In order to make the technical means, the creation features, the achievement purposes and the functions of the present invention easy to understand, the present invention will be further explained below with reference to the following embodiments and the accompanying drawings, but the following embodiments are only the preferred embodiments of the present invention, and not all embodiments are included. Based on the embodiments in the implementation, other embodiments obtained by those skilled in the art without any creative work belong to the protection scope of the present invention.

Specific embodiments of the present invention will be described below with reference to the accompanying drawings.

The specific embodiment is as follows:

referring to fig. 1-4, an auxiliary tool for improving line passing capacity of an IC carrier plate comprises a first clamp plate 1, a second clamp plate 2 is arranged at the bottom of the first clamp plate 1, a PIN hole 5 is formed in the top surface of the first clamp plate 1, the PIN hole 5 penetrates through the first clamp plate 1, a PIN needle 4 is fixed on the top surface of the second clamp plate 2, the PIN needle 4 is inserted into the PIN hole 5, hollow grooves 3 are formed in the top surfaces of the first clamp plate 1 and the second clamp plate 2 respectively, and the hollow grooves 3 penetrate through the first clamp plate 1 and the second clamp plate 2 respectively. The projection plane of the PIN needle 4 and the projection plane of the PIN hole 5 are overlapped.

First splint 1 and second splint 2, and be equipped with PIN needle 4 and PIN hole 5 respectively on first splint 1 and second splint 2 surface, and PIN needle 4 pegs graft with PIN hole 5, embolia the plate in first splint 1 that has already designed and second splint 2 are supplementary, again horizontal line processes, and this kind of design makes the whole face of plate tensile fixed, has promoted the shock resistance of plate, makes the plate thickness be less than 0.1mm plate horizontal line board loss rate reduce to 0.00% from 55.00%, no fold defect.

The diameter of the PIN hole 5 is 1.35mm, and the shortest distance between the perpendicular bisector of the PIN hole 5 and the plate edge of the first clamping plate 1 is 4 mm. The side of the first clamping plate 1 and the second clamping plate 2 is closest to the hollow groove 3 by 4 mm. The PIN 4 has a diameter of 1.35 mm. The thickness of the first clamping plate 1 and the second clamping plate 2 is 1.5 mm. The distance between the adjacent PIN hole 5 on the longer edge of the first splint 1 is 71mm, and the distance between the two nearest PIN holes 5 on the longer edge of the first splint 1 from the perpendicular bisector is 72 mm. The distance between adjacent PIN holes 5 on the shorter side of the first splint 1 is 56.8mm, and the distance between two nearest PIN holes 5 on the shorter side of the first splint 1 from the perpendicular bisector is 57.2 mm. The distance between the PIN holes 5 of the first splint 1 on the longer sides in an axisymmetric structure is 502 mm. The distance between the PIN holes 5 in an axisymmetric configuration on the shorter two sides of the first clamping plate 1 is 402 mm.

The distance between the PIN hole 5 on the first splint 1 between the adjacent PIN hole 5 on the short side of the first splint 1 and the distance between the two nearest PIN holes 5 on the short side of the first splint 1 from the perpendicular bisector are different so as to prevent the IC thin plate from being reversely mounted during loading and play a role in fool proofing.

The utility model discloses a theory of operation: placing an IC carrier plate thin plate between a first clamping plate 1 and a second clamping plate 2, wherein the diameter of a positioning hole in the IC carrier plate thin plate is 1.5mm, the positioning hole is spliced with a PIN needle 4, then the PIN needle 4 is spliced with a PIN hole 5, finally the first clamping plate 1 and the second clamping plate 2 are attached, the PIN needle 4 and the PIN hole 5 are respectively arranged on the surfaces of the first clamping plate 1 and the second clamping plate 2, the PIN needle 4 is spliced with the PIN hole 5, the plate is sleeved in the assistance of the first clamping plate 1 and the second clamping plate 2 which are designed, and then the horizontal line is processed, the whole plate surface of the thin plate is stretched and fixed by the design, the impact resistance of the thin plate is improved, the loss rate of the horizontal line plate of the plate with the plate thickness smaller than 0.1mm is reduced to zero, and the defect of no wrinkle is overcome.

In the present disclosure, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may comprise direct contact between the first and second features, or may comprise contact between the first and second features not directly. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.

The foregoing shows and describes the general principles, essential features, and advantages of the invention. It should be understood by those skilled in the art that the present invention is not limited by the above embodiments, and the description in the above embodiments and the description is only preferred examples of the present invention, and is not intended to limit the present invention, and that the present invention can have various changes and modifications without departing from the spirit and scope of the present invention, and these changes and modifications all fall into the scope of the claimed invention. The scope of the invention is defined by the appended claims and equivalents thereof.

Claims

1. The utility model provides a promote IC support plate sheet and cross line ability and assist utensil, includes first splint (1), its characterized in that: the bottom of first splint (1) is equipped with second splint (2), PIN needle (4) have been seted up to the top surface of first splint (1), and PIN needle (4) run through first splint (1), the top surface of second splint (2) is fixed with PIN hole (5), and PIN needle (4) peg graft with PIN hole (5), well hollow groove (3) have been seted up respectively to the top surface of first splint (1) and second splint (2), and well hollow groove (3) run through first splint (1), second splint (2) respectively.

2. The assistive device for improving the threading capability of the IC carrier plate of claim 1, wherein: the projection surface of the PIN needle (4) and the projection surface of the PIN hole (5) are overlapped.

3. The assistive device for improving the threading capability of the IC carrier plate of claim 1, wherein: the diameter of PIN hole (5) is 1.35mm, the perpendicular bisector of PIN hole (5) is 4mm with first splint (1) board limit minimum distance.

4. The assistive device for improving the threading capability of the IC carrier plate of claim 1, wherein: the shortest distance between the side surfaces of the first clamping plate (1) and the second clamping plate (2) and the hollow groove (3) is 4 mm.

5. The assistive device for improving the threading capability of the IC carrier plate of claim 1, wherein: the diameter of the PIN needle (4) is 1.35 mm.

6. The assistive device for improving the threading capability of the IC carrier plate of claim 1, wherein: the thickness of the first clamping plate (1) and the second clamping plate (2) is 1.5 mm.

7. The assistive device for improving the threading capability of the IC carrier plate of claim 1, wherein: the distance between adjacent PIN hole (5) on the longer edge of first splint (1) is 71mm, the distance is 72mm between two the nearest PIN holes (5) of first splint (1) longer edge distance perpendicular bisector.

8. The assistive device for improving the threading capability of the IC carrier plate of claim 1, wherein: the distance between adjacent PIN hole (5) on the short edge of first splint (1) is 56.8mm, the distance is 57.2mm between two the nearest PIN holes (5) of first splint (1) short edge distance perpendicular bisector.

9. The assistive device for improving the threading capability of the IC carrier plate of claim 1, wherein: the distance between the PIN holes (5) of the first clamping plate (1) which are axially symmetrical on the longer two edges is 502 mm.

10. The assistive device for improving the threading capability of the IC carrier plate of claim 1, wherein: the distance between the PIN holes (5) of the first clamping plate (1) in the axisymmetric structure on the shorter two edges is 402 mm.