CN216600208U - Circuit board with two-sided boss - Google Patents
Circuit board with two-sided boss Download PDFInfo
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- CN216600208U CN216600208U CN202122999767.8U CN202122999767U CN216600208U CN 216600208 U CN216600208 U CN 216600208U CN 202122999767 U CN202122999767 U CN 202122999767U CN 216600208 U CN216600208 U CN 216600208U
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- solder mask
- glass fiber
- circuit board
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Abstract
The utility model discloses a circuit board with a double-sided boss, which comprises a first solder mask layer, a first copper-coated glass fiber layer, a first resin adhesive layer, a copper substrate layer, a second resin adhesive layer, a second copper-coated glass fiber layer and a second solder mask layer which are sequentially stacked, wherein a first heat conduction boss extending upwards to the upper surface of the first solder mask layer is arranged on the upper surface of the copper substrate layer, a second heat conduction boss extending downwards to the lower surface of the second solder mask layer is arranged on the lower surface of the copper substrate layer, a first blind hole penetrating downwards to the upper surface of the first resin adhesive layer is formed in the upper surface of the first solder mask layer, a second blind hole penetrating upwards to the lower surface of the second resin adhesive layer is formed in the lower surface of the second solder mask layer, the heat conduction bosses are arranged on the upper surface and the lower surface of the copper substrate layer, the separation of electric conduction and heat conduction is realized, and heat generated by components on the circuit board can be directly led into the copper substrate layer through the heat conduction bosses, the heat conduction and the heat dissipation performance are greatly improved.
Description
Technical Field
The present invention relates to a circuit board, and more particularly, to a circuit board with double-sided bumps.
Background
The metal substrates such as automobiles, lasers, stage lamps and medical instruments have high requirements on the precision and the heat conduction performance of the circuit boards, but the performance of the circuit boards on the market at present cannot meet the requirements of the products.
Disclosure of Invention
In order to overcome the defects of the prior art, the utility model provides a circuit board with double-sided bosses.
The technical scheme adopted by the utility model for solving the technical problem is as follows:
the utility model provides a circuit board with two-sided boss, covers the fine layer of glass, first resin glue film, copper base plate layer, second resin glue film, the fine layer of second cover copper and second solder mask including the first solder mask that stacks gradually, the upper surface on copper base plate layer is provided with upwards extends to the first heat conduction boss of the upper surface on first solder mask layer, the lower surface on copper base plate layer is provided with downwards and extends to the second heat conduction boss of the lower surface on second solder mask layer, downwards run through to have been seted up to the upper surface on first solder mask layer a plurality of first blind holes of the upper surface on first resin glue film, upwards run through to have been seted up to the lower surface on second solder mask layer a plurality of second blind holes of the lower surface on second resin glue film.
The upper surface of first resin glue film has been seted up and has been link up to the lower surface of second resin glue film is vertical insulated hole, the resin colloid has been glued in the insulated hole, seted up in the resin colloid and be vertical first via hole, first via hole upwards run through to the first upper surface of covering the fine layer of copper glass, and run through downwards to the second covers the fine layer of copper glass's lower surface, be provided with the connection in the first via hole the first fine connecting portion of annular that covers the fine layer of copper glass and the fine layer of second copper glass, set up in the fine connecting portion of annular glass and be vertical second via hole.
The first resin adhesive layer, the second resin adhesive layer and the resin colloid are acrylic acid hot melt adhesive layers, and the layer thicknesses of the first resin adhesive layer and the second resin adhesive layer are the same and are all 0.024-0.026 mm.
The aperture of the first blind hole and the aperture of the second blind hole are respectively 0.020-0.022 mm.
The first copper-clad glass fiber layer and the second copper-clad glass fiber layer are the same in layer thickness and are both 0.13-0.15mm in thickness.
The layer thickness of the first solder mask layer is the same as that of the second solder mask layer, and the layer thickness of the first solder mask layer is 0.019-0.020 mm.
The layer thickness of the copper substrate layer is 1.1-1.3 mm.
The utility model has the beneficial effects that: according to the utility model, the heat conduction bosses are arranged on the upper surface and the lower surface of the copper substrate layer, so that the separation of electric conduction and heat conduction is realized, heat generated by components on the circuit board can be directly led into the copper substrate layer through the heat conduction bosses, the heat conduction and the heat dissipation performance are greatly improved, and the solder mask layer is provided with the blind holes penetrating to the surface of the resin adhesive layer, so that the components can be conveniently installed.
Drawings
The utility model is further illustrated with reference to the following figures and examples.
FIG. 1 is one of the schematic structural diagrams of the present invention;
FIG. 2 is a second schematic structural diagram of the present invention.
Detailed Description
In the description of the present invention, it is to be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like, indicate orientations or positional relationships based on the orientations or positional relationships illustrated in the drawings, and are used merely for convenience in describing the present invention and for simplicity in description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed in a particular orientation, and be operated, and thus, are not to be construed as limiting the present invention. Further, in the description of the present invention, "a plurality" or "a plurality" means two or more unless specifically defined otherwise.
Referring to fig. 1 and 2, a circuit board with two-sided boss, including the first solder mask 1 that stacks gradually, first covering the fine layer 2 of copper glass, first resin glue film 3, copper substrate layer 4, second resin glue film 5, the fine layer 6 of second covering the copper glass and second solder mask 7, the upper surface on copper substrate layer 4 is provided with upwards extends to the first heat conduction boss 8 of the upper surface on first solder mask 1, the lower surface on copper substrate layer 4 is provided with downwards extends to the second heat conduction boss 9 of the lower surface on second solder mask 7, the upper surface on first solder mask 1 has been seted up and has been run through downwards to a plurality of first blind holes 10 of the upper surface on first resin glue film 3, the lower surface on second solder mask 7 has been seted up and has been run through upwards to a plurality of second blind holes 11 of the lower surface on second resin glue film 5.
This embodiment all sets up the heat conduction boss through the upper and lower two sides at copper base plate layer 4, has realized electric conduction and heat-conducting separation, and the heat that components and parts produced on the circuit board can directly leading-in copper base plate layer 4 through the heat conduction boss, has improved heat conduction and heat dispersion greatly, sets up a plurality of blind holes that run through to resin glue layer surface on the solder mask, the components and parts installation of being convenient for.
The upper surface of first resin adhesive layer 3 has been seted up and has been link up extremely the lower surface of second resin adhesive layer 5 be vertical insulated hole 12, the encapsulating has resin colloid 13 in insulated hole 12, set up in the resin colloid 13 and be vertical first via hole 14, first via hole 14 upwards run through extremely the first upper surface of covering the fine layer 2 of copper, and run through extremely downwards the second covers the lower surface of the fine layer 6 of copper, be provided with the connection in the first via hole 14 the first fine connecting portion 15 of annular glass who covers the fine layer 2 of copper and the fine layer 6 of second copper, set up in the fine connecting portion 15 of annular glass and be vertical second via hole 16.
The first resin adhesive layer 3, the second resin adhesive layer 5 and the resin colloid 13 are all acrylic acid hot melt adhesive layers, and the layer thicknesses of the first resin adhesive layer 3 and the second resin adhesive layer 5 are the same and are all 0.024-0.026 mm.
The aperture of the first blind hole 10 and the aperture of the second blind hole 12 are respectively 0.020-0.022 mm.
The first copper-clad glass fiber layer 2 and the second copper-clad glass fiber layer 6 are the same in layer thickness and are both 0.13-0.15mm in thickness.
The layer thickness of the first solder mask layer 1 and the second solder mask layer 7 is the same and is 0.019-0.020 mm.
The layer thickness of the copper substrate layer 4 is 1.1-1.3 mm.
In the manufacturing process of the copper-clad plate, the first heat-conducting boss 8 and the second heat-conducting boss 9 are etched after the double-sided covering dry film on the copper substrate layer 4 is exposed, then the first copper-clad glass fiber layer 2 with the opening matched with the boss and the second copper-clad glass fiber layer 6 are laminated on the upper surface and the lower surface of the copper substrate layer 4 at high temperature, then the insulating hole 12 is drilled by laser, the insulating hole 12 is filled with vacuum potting adhesive, then secondary drilling and copper plating are carried out on the resin colloid 13, and then a plurality of blind holes are formed.
The above embodiments do not limit the scope of the present invention, and those skilled in the art can make equivalent modifications and variations without departing from the overall concept of the present invention.
Claims (7)
1. A circuit board with a double-sided boss is characterized by comprising a first solder mask layer (1), a first copper-clad glass fiber layer (2), a first resin adhesive layer (3), a copper substrate layer (4), a second resin adhesive layer (5), a second copper-clad glass fiber layer (6) and a second solder mask layer (7) which are sequentially laminated, the upper surface of the copper substrate layer (4) is provided with a first heat conduction boss (8) which extends upwards to the upper surface of the first solder mask layer (1), the lower surface of the copper substrate layer (4) is provided with a second heat conduction boss (9) which extends downwards to the lower surface of the second solder mask layer (7), the upper surface of the first solder mask layer (1) is provided with a plurality of first blind holes (10) which penetrate downwards to the upper surface of the first resin glue layer (3), and a plurality of second blind holes (11) which penetrate upwards to the lower surface of the second resin glue layer (5) are formed in the lower surface of the second solder mask layer (7).
2. The circuit board with the double-sided boss according to claim 1, wherein a vertical insulating hole (12) penetrating through to the lower surface of the second resin adhesive layer (5) is formed in the upper surface of the first resin adhesive layer (3), a resin colloid (13) is filled in the insulating hole (12), a vertical first via hole (14) is formed in the resin colloid (13), the first via hole (14) penetrates upwards to the upper surface of the first copper-clad glass fiber layer (2) and downwards to the lower surface of the second copper-clad glass fiber layer (6), an annular glass fiber connecting portion (15) connecting the first copper-clad glass fiber layer (2) and the second copper-clad glass fiber layer (6) is formed in the first via hole (14), and a vertical second via hole (16) is formed in the annular glass fiber connecting portion (15).
3. The circuit board with the double-sided boss according to claim 2, wherein the first resin glue layer (3), the second resin glue layer (5) and the resin colloid (13) are acrylic hot melt glue layers, and the layer thicknesses of the first resin glue layer (3) and the second resin glue layer (5) are the same and are both 0.024-0.026 mm.
4. The circuit board with double-sided bosses according to claim 1, characterized in that the first blind hole (10) and the second blind hole (11) have a hole diameter of 0.020-0.022mm respectively.
5. The circuit board with the double-sided boss according to claim 1, wherein the first copper-clad glass fiber layer (2) and the second copper-clad glass fiber layer (6) have the same layer thickness and are both 0.13-0.15 mm.
6. The circuit board with double-sided bosses according to claim 1, characterized in that the layer thickness of the first solder mask layer (1) and the second solder mask layer (7) is the same and both are 0.019-0.020 mm.
7. The circuit board with double-sided embossings as claimed in claim 1, characterised in that the layer thickness of the copper substrate layer (4) is 1.1-1.3 mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122999767.8U CN216600208U (en) | 2021-11-30 | 2021-11-30 | Circuit board with two-sided boss |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122999767.8U CN216600208U (en) | 2021-11-30 | 2021-11-30 | Circuit board with two-sided boss |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216600208U true CN216600208U (en) | 2022-05-24 |
Family
ID=81652239
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122999767.8U Active CN216600208U (en) | 2021-11-30 | 2021-11-30 | Circuit board with two-sided boss |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216600208U (en) |
-
2021
- 2021-11-30 CN CN202122999767.8U patent/CN216600208U/en active Active
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