CN216600191U - Multilayer high density circuit board - Google Patents
Multilayer high density circuit board Download PDFInfo
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- CN216600191U CN216600191U CN202122760723.XU CN202122760723U CN216600191U CN 216600191 U CN216600191 U CN 216600191U CN 202122760723 U CN202122760723 U CN 202122760723U CN 216600191 U CN216600191 U CN 216600191U
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- circuit board
- side frame
- board body
- multilayer high
- fixedly connected
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Abstract
The utility model relates to the technical field of circuit boards, in particular to a multilayer high-density circuit board which comprises a circuit board body, two groups of first side frames and two groups of second side frames, wherein the two groups of first side frames are respectively arranged on the front side surface and the rear side surface of the circuit board body, the two groups of second side frames are respectively arranged on the left side surface and the right side surface of the circuit board body, the left side and the right side of the lower end surface of each first side frame are integrally provided with first connecting plates, and the lower ends of the first connecting plates are integrally provided with first mounting plates. According to the utility model, the side edge of the circuit board body is protected by the first side frame and the second side frame, so that the condition that the side edge of the circuit board body has a raised angle is avoided; the first side frame, the second side frame and the circuit board body are convenient to mount and dismount, so that the circuit board body is convenient to maintain and replace; through the setting of spring and elasticity rubber column, play the effect of shock attenuation buffering to the circuit board body, reduce the damage of impact force to the circuit board body.
Description
Technical Field
The utility model relates to the technical field of circuit boards, in particular to a multilayer high-density circuit board.
Background
The circuit board, namely the circuit board, is also called as a printed circuit board or a printed circuit board, so that the circuit is miniaturized and visualized, and plays an important role in the batch production of fixed circuits and the optimization of the layout of electrical appliances. The multilayer circuit board is a multilayer wiring layer, and a dielectric layer is arranged between every two layers and can be made to be very thin. The multilayer wiring board has at least three conductive layers, two of which are on the outer surface and the remaining one of which is incorporated in an insulating board. The electrical connection between them is usually achieved by means of plated-through holes in the cross-section of the circuit board.
As disclosed in patent publication No. CN210694656U, there is disclosed a multilayer high-density printed circuit board which is convenient for fixing, comprising a multilayer high-density printed circuit board, a fixing frame, a fixing means and a sliding means; multilayer high-density printed circuit board: the multilayer high-density printed circuit board comprises an insulating plate, a middle layer and a bottom layer, wherein the insulating plate is connected with the top of the middle layer, and the middle layer is connected with the top of the bottom layer; fixing the frame: the multilayer high-density printed circuit board is arranged in the fixing frame.
However, the multilayer high-density printed circuit board convenient to fix still has obvious defects in the using process: 1. the multilayer high-density printed circuit board in the multilayer high-density printed circuit board convenient to fix and the fixing frame are inconvenient to mount and dismount, so that the multilayer high-density printed circuit board is inconvenient to replace and maintain; 2. the multilayer high-density printed circuit board convenient to fix does not have a damping mechanism, and when the fixing frame is impacted, the multilayer high-density printed circuit board inside is easily damaged.
To this end, we have proposed a multilayer high density wiring board.
SUMMERY OF THE UTILITY MODEL
The present invention is directed to a multilayer high-density wiring board to solve the problems set forth in the background art.
In order to achieve the purpose, the utility model provides the following technical scheme: a multilayer high-density circuit board comprises a circuit board body, two groups of first side frames and two groups of second side frames, wherein the two groups of first side frames are respectively arranged on the front side surface and the rear side surface of the circuit board body, the two groups of second side frames are respectively arranged on the left side surface and the right side surface of the circuit board body, the left side and the right side of the lower end surface of each first side frame are uniformly provided with first connecting plates in a molded manner, the lower ends of the first connecting plates are provided with second connecting plates in a molded manner, the first connecting plates and the second connecting plates are respectively provided with first connecting holes and second connecting holes for connecting bolts to pass through, the outer sides of the adjacent first connecting plates and the adjacent second connecting plates are jointly clamped with a connecting clamping seat, and the two side walls of the connecting clamping seat are respectively provided with third connecting holes for connecting bolts to pass through, connect cassette upper end integrated into one piece and be provided with the corner seat, the equal equidistance fixedly connected with first connecting block of upper and lower both sides wall in first side frame and the second side frame, from top to bottom the equal fixedly connected with spring of the relative side of first connecting block, the one end fixedly connected with second connecting block of first connecting block is kept away from to the spring, just be located the inside fixedly connected with elastic rubber post of spring between first connecting block and the second connecting block, circuit board body centre gripping is in from top to bottom between the second connecting block.
First mounting panel and first side frame parallel arrangement, first connecting plate sets up with first side frame and first mounting panel are all perpendicular, first mounting hole has been seted up on the first mounting panel. The screw penetrates through the first mounting hole to be fixedly connected with the mounting surface, and the first mounting plate is fixedly mounted, so that the first side frame is fixedly mounted, and the first side frame can be kept horizontal after being mounted.
The second mounting panel and second side frame parallel arrangement, the second connecting plate sets up with second side frame and the equal perpendicular setting of second mounting panel, the second mounting hole has been seted up on the second mounting panel. The screws penetrate through the second mounting holes to be fixedly connected with the mounting surface, and the second mounting plate is fixedly mounted, so that the second side frame is fixedly mounted, and the second side frame can be kept horizontal after being mounted.
The connecting clamping seat is fixedly connected with the first connecting plate and the second connecting plate which are clamped in the connecting clamping seat through the same connecting bolt. And fixedly connecting the clamping seat with the first connecting plate and the second connecting plate through the connecting bolts, so that the adjacent first side frame and the second side frame are fixedly connected, and the corner seat is fixedly installed.
The corner seat is clamped at the outer sides of the adjacent first side frame and the second side frame. The corner seat is clamped outside the first side frame and the second side frame, the joint of the first side frame and the second side frame is covered, and the connecting structural strength of the first side frame and the second side frame is improved.
The second connecting block orientation one side fixedly connected with fixture block of circuit board body, the equal fixedly connected with fixed block of both sides wall about the circuit board body, the draw-in groove that is used for joint fixture block is seted up to the fixed block lateral surface. After installing first side frame and second side frame at circuit board body side for circuit board body centre gripping is in from top to bottom between the second connecting block, and make the fixture block joint in the draw-in groove, carry out spacing fixed to the circuit board body, make the circuit board body can not remove about moving around.
Compared with the prior art, the utility model has the beneficial effects that:
1. according to the utility model, the side edge of the circuit board body is protected through the first side frame and the second side frame, so that the condition that the side edge of the circuit board body has a raised angle is avoided;
2. the first side frame, the second side frame and the circuit board body are convenient to mount and dismount, so that the circuit board body is convenient to maintain and replace;
3. the multilayer high-density circuit board is integrally installed through the first installation hole in the first installation plate and the second installation hole in the second installation plate, the circuit board body does not need to be punched and installed, and the circuit board body is not easy to damage;
4. according to the utility model, the arrangement of the spring and the elastic rubber column plays a role in damping and buffering the circuit board body, and when the upper side surface and the lower side surface of the first side frame and the second side frame are impacted, the spring and the elastic rubber column can absorb impact force, so that the damage of the impact force to the circuit board body is reduced.
Drawings
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is an enlarged view of a portion of FIG. 1A;
FIG. 3 is a schematic front view of the present invention;
FIG. 4 is a schematic side view of the present invention;
FIG. 5 is a schematic top view of the present invention;
FIG. 6 is a schematic bottom view of the present invention.
In the figure: 1. a circuit board body; 2. a first side frame; 3. a second side frame; 4. a first connecting plate; 5. a first mounting plate; 6. a second connecting plate; 7. a second mounting plate; 8. a connecting bolt; 9. connecting the card holder; 10. a corner seat; 11. a first connection block; 12. a spring; 13. a second connecting block; 14. an elastic rubber column; 15. a first mounting hole; 16. a second mounting hole; 17. a clamping block; 18. and (5) fixing blocks.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1-6, the present invention provides a technical solution: the utility model provides a multilayer high density circuit board, includes circuit board body 1, two sets of first side frames 2 and two sets of second side frames 3, and two sets of first side frames 2 set up respectively in circuit board body 1 front and back both sides face, and two sets of second side frames 3 set up respectively in circuit board body 1 left and right sides face. The side edge of the circuit board body 1 is protected through the first side frame 2 and the second side frame 3, and the condition that the corner is formed on the side edge of the circuit board body 1 is avoided.
The left and right sides of the lower end face of the first side frame 2 are provided with a first connecting plate 4 in an integral forming way, the lower end of the first connecting plate 4 is provided with a first mounting plate 5 in an integral forming way, the first mounting plate 5 is arranged in parallel with the first side frame 2, the first connecting plate 4 is arranged in a vertical way with the first side frame 2 and the first mounting plate 5, the first mounting plate 5 is provided with a first mounting hole 15, the front and back sides of the lower end face of the second side frame 3 are provided with a second connecting plate 6 in an integral forming way, the lower end of the second connecting plate 6 is provided with a second mounting plate 7 in an integral forming way, the second mounting plate 7 is arranged in parallel with the second side frame 3, the second connecting plate 6 is arranged in a vertical way with the first side frame 3 and the second mounting plate 7, the second mounting hole 16 is arranged on the second mounting plate 7, the first connecting hole and the second connecting hole for the connecting bolt 8 to pass through are respectively arranged on the first connecting plate 4 and the second connecting plate 6, the connection clamping seat 9 is clamped between the adjacent first connecting plate 4 and the adjacent second connecting plate 6, the connection clamping seat 9 and the first connecting plate 4 and the second connecting plate 6 which are clamped in the connection clamping seat 9 are fixedly connected through the same connecting bolt 8, the two side walls of the connection clamping seat 9 are provided with third connecting holes for the connecting bolt 8 to penetrate through, the corner seat 10 is integrally formed at the upper end of the connection clamping seat 9, and the corner seat 10 is clamped outside the adjacent first side frame 2 and the second side frame 3. After the first side frame 2 and the second side frame 3 are clamped on the outer side of the circuit board body 1, the adjacent first connecting plate 4 and the second connecting plate 6 are contacted, then the connecting clamping seat 9 is clamped on the outer sides of the first connecting plate 4 and the second connecting plate 6, so that the corner seat 10 at the upper end of the outer sides of the first connecting plate 4 and the second connecting plate 6 is clamped on the corners and the upper side surface of the first side frame 2 and the second side frame 3, then the connecting clamping seat 9, the first connecting plate 4 and the second connecting plate 6 are fixedly connected through the connecting bolt 8 penetrating through the first connecting hole, the second connecting hole and the third connecting hole, so that the first side frame 2 and the second side frame 3 can be fixedly connected, the circuit board body 1 is arranged between the first side frame 2 and the second side frame 3, and the circuit board body 1 and the first side frame 2 and the second side frame 3 are convenient to install and dismantle, through the setting of first mounting hole 15 on the first mounting panel 5 and the second mounting hole 16 on the second mounting panel 7, be convenient for install first side frame 2, second side frame 3 and its inside circuit board body 1, need not to punch the installation to circuit board body 1, be difficult for causing the damage to circuit board body 1.
Equal equidistance fixedly connected with first connecting block 11 of upper and lower both sides wall in first side frame 2 and the second side frame 3, the equal fixedly connected with spring 12 of the relative side of first connecting block 11 from top to bottom, the one end fixedly connected with second connecting block 13 of first connecting block 11 is kept away from to spring 12, just be located the inside fixedly connected with elastic rubber post 14 of spring 12 between first connecting block 11 and the second connecting block 13, 1 centre gripping of circuit board body is between upper and lower second connecting block 13, one side fixedly connected with fixture block 17 of second connecting block 13 towards circuit board body 1, the equal fixedly connected with fixed block 18 of both sides wall about circuit board body 1, the draw-in groove that is used for joint fixture block 17 is seted up to the 18 lateral surfaces of fixed block. Install first side frame 2 and second side frame 3 after circuit board body 1 side, make 1 centre gripping of circuit board body between upper and lower second connecting block 13, and make fixture block 17 joint in the draw-in groove, carry on spacing fixed to circuit board body 1, make circuit board body 1 can not remove about going on, through the setting of spring 12 and elastic rubber post 14, play the effect of shock attenuation buffering to circuit board body 1, when the side receives the impact about first side frame 2 and second side frame 3, spring 12 and elastic rubber post 14 can absorb the impact force, reduce the damage of impact force to circuit board body 1.
Specifically, during use, install first side frame 2 and second side frame 3 in 1 side of circuit board body, make circuit board body 1 centre gripping between upper and lower second connecting block 13, and make fixture block 17 joint in the draw-in groove, then will connect cassette 9 joint in adjacent first connecting plate 4 and the 6 outside of second connecting plate, make the corner seat 10 joint of first connecting plate 4 and the 6 outside upper ends of second connecting plate in first side frame 2 and the 3 turning of second side frame and last side, rethread connecting bolt 8 passes first connecting hole, second connecting hole and third connecting hole, thereby will connect cassette 9, first connecting plate 4 and second connecting plate 6 are connected fixedly, can be connected fixedly first side frame 2 and second side frame 3, thereby install circuit board body 1 between first side frame 2 and second side frame 3, pass mounting bolt first mounting hole 15 on first mounting panel 5 and second mounting hole 16 on the second mounting panel 7 and circuit board 16 and be connected fixedly The mounting surfaces are fixedly connected, namely the first side frame 2, the second side frame 3 and the circuit board body 1 inside the first side frame and the second side frame can be mounted; the side edge of the circuit board body 1 is protected through the first side frame 2 and the second side frame 3, and the situation that the side edge of the circuit board body 1 is warped is avoided; the first side frame 2, the second side frame 3 and the circuit board body 1 are convenient to mount and dismount, so that the circuit board body 1 is convenient to maintain and replace; the multilayer high-density circuit board is integrally installed through the first installation hole 15 on the first installation plate 5 and the second installation hole 16 on the second installation plate 7, the circuit board body 1 does not need to be punched and installed, and the circuit board body 1 is not easy to damage; through the setting of spring 12 and elastic rubber post 14, play the effect of shock attenuation buffering to circuit board body 1, when the side received the impact about first side frame 2 and second side frame 3, spring 12 and elastic rubber post 14 can absorb the impact force, reduce the damage of impact force to circuit board body 1.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.
Claims (8)
1. The utility model provides a multilayer high density circuit board, includes circuit board body (1), two sets of first side frames (2) and two sets of second side frames (3), its characterized in that: two groups of first side frames (2) are respectively arranged on the front side surface and the rear side surface of the circuit board body (1), two groups of second side frames (3) are respectively arranged on the left side surface and the right side surface of the circuit board body (1), the left side and the right side of the lower end surface of each first side frame (2) are uniformly provided with first connecting plates (4) in an integrated forming manner, the lower ends of the first connecting plates (4) are provided with first mounting plates (5) in an integrated forming manner, the front side and the rear side of the lower end surface of each second side frame (3) are respectively provided with second connecting plates (6) in an integrated forming manner, the lower ends of the second connecting plates (6) are provided with second mounting plates (7) in an integrated forming manner, the first connecting holes and the second connecting holes for connecting bolts (8) to pass through are respectively arranged on the first connecting plates (4) and the second connecting plates (6), and connecting clamping seats (9) are jointly clamped on the outer sides of the adjacent first connecting plates (4) and the second connecting plates (6), connect cassette (9) both sides wall and all set up the third connecting hole that supplies connecting bolt (8) to pass, it is provided with corner seat (10) to connect cassette (9) upper end integrated into one piece, the equal equidistance fixedly connected with first connecting block (11) of both sides wall about in first side frame (2) and second side frame (3), from top to bottom the equal fixedly connected with spring (12) of a side that first connecting block (11) is relative, the one end fixedly connected with second connecting block (13) of first connecting block (11) are kept away from in spring (12), just be located spring (12) inside fixedly connected with elastic rubber post (14) between first connecting block (11) and second connecting block (13), circuit board body (1) centre gripping is in from top to bottom between second connecting block (13).
2. The multilayer high-density wiring board according to claim 1, wherein: first mounting panel (5) and first side frame (2) parallel arrangement, first connecting plate (4) all set up perpendicularly with first side frame (2) and first mounting panel (5).
3. The multilayer high-density wiring board according to claim 1, wherein: a first mounting hole (15) is formed in the first mounting plate (5).
4. A multilayer high density wiring board according to claim 1, characterized in that: the second mounting plate (7) and the second side frame (3) are arranged in parallel, and the second connecting plate (6) is perpendicular to the second side frame (3) and the second mounting plate (7).
5. The multilayer high-density wiring board according to claim 1, wherein: and a second mounting hole (16) is formed in the second mounting plate (7).
6. The multilayer high-density wiring board according to claim 1, wherein: the connecting clamping seat (9) is fixedly connected with the first connecting plate (4) and the second connecting plate (6) which are clamped in the connecting clamping seat through the same connecting bolt (8).
7. The multilayer high-density wiring board according to claim 1, wherein: the corner seat (10) is clamped at the outer sides of the adjacent first side frame (2) and the second side frame (3).
8. The multilayer high-density wiring board according to claim 1, wherein: second connecting block (13) orientation one side fixedly connected with fixture block (17) of circuit board body (1), the equal fixedly connected with fixed block (18) of both sides wall about circuit board body (1), the draw-in groove that is used for joint fixture block (17) is offered to fixed block (18) lateral surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122760723.XU CN216600191U (en) | 2021-11-12 | 2021-11-12 | Multilayer high density circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122760723.XU CN216600191U (en) | 2021-11-12 | 2021-11-12 | Multilayer high density circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216600191U true CN216600191U (en) | 2022-05-24 |
Family
ID=81645811
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122760723.XU Active CN216600191U (en) | 2021-11-12 | 2021-11-12 | Multilayer high density circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216600191U (en) |
-
2021
- 2021-11-12 CN CN202122760723.XU patent/CN216600191U/en active Active
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