CN216599931U - Sound circuit board and sound - Google Patents
Sound circuit board and sound Download PDFInfo
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- CN216599931U CN216599931U CN202123176608.4U CN202123176608U CN216599931U CN 216599931 U CN216599931 U CN 216599931U CN 202123176608 U CN202123176608 U CN 202123176608U CN 216599931 U CN216599931 U CN 216599931U
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Abstract
The application provides a stereo set circuit board and stereo set. The sound circuit board comprises a circuit main board, an audio power supply module, a sound interface module and a sound filtering module; the input end of the sound filtering module is connected with the audio transceiving end of the sound interface module, the sound filtering module comprises an audio filtering capacitor and a radiator, the audio filtering capacitor is connected with a circuit mainboard and comprises an electrolytic capacitor and a ceramic capacitor, the electrolytic capacitor and the ceramic capacitor are arranged at intervals, the volume of the electrolytic capacitor is larger than that of the ceramic capacitor, the radiator is arranged at the edge of the adjacent circuit mainboard, the radiator is arranged at the adjacent ceramic capacitor, and the radiator is far away from the electrolytic capacitor. The electrolytic capacitor and the ceramic capacitor serve as filter capacitors, and the ceramic capacitor replaces the electrolytic capacitor originally arranged at the position under the condition of meeting the requirement of filtering the audio signal, so that the distance between the electrolytic capacitor and the radiator is further increased, and the probability of burning the electrolyte in the electrolytic capacitor is effectively reduced.
Description
Technical Field
The utility model relates to the technical field of circuit boards, in particular to a sound circuit board and a sound.
Background
Along with the improvement to the high tone quality requirement of stereo set, integrate the inside circuit of stereo set to make the inside electronic component of stereo set reduce the influence of sound, promptly through the space volume that reduces the inside electronic component of stereo set, the blockking that receives when reducing sound and leading in. On the audio frequency circuit board of high integration, the produced heat of electronic component all scatters and disappears through the radiator on the circuit board to improve heat dispersion.
However, the audio circuit board needs to use an electrolytic capacitor with a large capacity to reduce noise, i.e. filter audio signals, and the radiator is arranged on the circuit board, which easily causes the electrolyte in the electrolytic capacitor to be burnt out, thereby easily causing the sound quality of the sound to be obviously reduced.
SUMMERY OF THE UTILITY MODEL
The utility model aims to overcome the defects in the prior art and provides a sound circuit board for improving the sound quality of a sound and the sound.
The purpose of the utility model is realized by the following technical scheme:
an audio circuit board comprising: the circuit comprises a circuit main board, an audio power supply module, a sound interface module and a sound filtering module; the circuit main board is provided with a power supply area, the audio power supply module is arranged in the power supply area, and the input end of the audio power supply module is used for receiving audio signals; the circuit main board is also provided with an interface area, the sound interface module is positioned in the interface area, the first output end of the audio power supply module is connected with the power supply end of the sound interface module, and the sound interface module is used for being plugged with an audio receiving and transmitting port; the circuit mainboard still has the filtering area, stereo set filtering module is located in the filtering area, stereo set filtering module's input with audio frequency receiving and dispatching end connection of stereo set interface module, stereo set filtering module include with audio frequency filter capacitor and radiator that circuit mainboard is connected, audio frequency filter capacitor includes electrolytic capacitor and the ceramic capacitor that the interval set up, electrolytic capacitor's volume is greater than ceramic capacitor's volume, the radiator is close the edge setting of circuit mainboard, just the radiator is close ceramic capacitor sets up, the radiator is kept away from electrolytic capacitor sets up.
In one embodiment, the distance between the radiator and the electrolytic capacitor is 20mm to 26 mm.
In one embodiment, the distance between the radiator and the electrolytic capacitor is 23 mm.
In one embodiment, the circuit board further has a first heat dissipation auxiliary area, the first heat dissipation auxiliary area is disposed adjacent to the heat sink, and the acoustic filtering module further includes a first heat dissipation copper wire, and the first heat dissipation copper wire is located in the first heat dissipation auxiliary area.
In one embodiment, the circuit main board further has a second heat dissipation auxiliary area, the second heat dissipation auxiliary area is disposed adjacent to the electrolytic capacitor, and the acoustic filtering module further includes a second heat dissipation copper wire, and the second heat dissipation copper wire is located in the second heat dissipation auxiliary area.
In one embodiment, the audio filtering module further includes a rectifying circuit, the second output end of the audio power supply module is connected to the input end of the rectifying circuit, the output end of the rectifying circuit is connected to the first end of the ceramic capacitor, the second end of the ceramic capacitor is connected to the first end of the electrolytic capacitor, and the second end of the electrolytic capacitor is grounded.
In one embodiment, the sound filtering module further includes an electronic switch connected to the circuit board, and the rectifying circuit is connected to the audio transceiving end of the sound interface module through the electronic switch to control transceiving of audio signals.
In one embodiment, the acoustic filter module further includes a heat insulation sheet connected to the electronic switch, the heat insulation sheet is located between the electronic switch and the heat sink, and the heat insulation sheet is used for insulating heat dissipated by the heat sink.
In one embodiment, the sound filtering module further comprises an insulating sheet connected with the electronic switch, the insulating sheet is located between the electronic switch and the heat radiator, and the insulating sheet is used for isolating the electronic switch and conducting electricity between the heat radiators.
A sound box comprises the sound box circuit board in any one of the above embodiments.
Compared with the prior art, the utility model has at least the following advantages:
electrolytic capacitor and ceramic capacitor act as filter capacitor, satisfy under the filtering requirement to audio signal, replace the electrolytic capacitor who originally sets up here with ceramic capacitor for electrolytic capacitor and ceramic capacitor's interval increase, thereby make the interval between electrolytic capacitor and the radiator further increase, reduced the probability that the electrolyte in the electrolytic capacitor burns out effectively, reduced the probability that electrolytic capacitor became invalid promptly, thereby improved the filtering quality to audio signal effectively, and then improved the tone quality of stereo set.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.
FIG. 1 is a schematic diagram of an embodiment of an audio circuit board;
fig. 2 is a partial schematic view of an acoustic filter module of the acoustic circuit board of fig. 1.
Detailed Description
To facilitate an understanding of the utility model, the utility model will now be described more fully with reference to the accompanying drawings. Preferred embodiments of the present invention are shown in the drawings. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only and do not represent the only embodiments.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used herein in the description of the utility model is for the purpose of describing particular embodiments only and is not intended to be limiting of the utility model. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
The utility model relates to a circuit board of a sound box. In one embodiment, the sound circuit board comprises a circuit main board, an audio power supply module, a sound interface module and a sound filtering module. The circuit main board is provided with a power supply area. The audio power supply module is arranged in the power supply area, and the input end of the audio power supply module is used for receiving audio signals. The circuit main board is also provided with an interface area. The audio interface module is located in the interface area, a first output end of the audio power supply module is connected with a power supply end of the audio interface module, and the audio interface module is used for being connected with an audio receiving and transmitting port in an inserting mode. The circuit main board is also provided with a filtering area. The sound filtering module is located in the filtering area, the input end of the sound filtering module is connected with the audio receiving and transmitting end of the sound interface module, and the sound filtering module comprises an audio filtering capacitor and a radiator which are connected with the circuit main board. The audio filter capacitor comprises an electrolytic capacitor and a ceramic capacitor which are arranged at intervals. The volume of the electrolytic capacitor is larger than that of the ceramic capacitor. The radiator is arranged close to the edge of the circuit main board, the radiator is arranged close to the ceramic capacitor, and the radiator is arranged far away from the electrolytic capacitor. Electrolytic capacitor and ceramic capacitor act as filter capacitor, satisfy under the filtering requirement to audio signal, replace the electrolytic capacitor who originally sets up here with ceramic capacitor for electrolytic capacitor and ceramic capacitor's interval increase, thereby make the interval between electrolytic capacitor and the radiator further increase, reduced the probability that the electrolyte in the electrolytic capacitor burns out effectively, reduced the probability that electrolytic capacitor became invalid promptly, thereby improved the filtering quality to audio signal effectively, and then improved the tone quality of stereo set.
Please refer to fig. 1, which is a schematic structural diagram of an audio circuit board according to an embodiment of the present invention.
The audio circuit board 10 of an embodiment includes a circuit board 100, an audio power supply module 200, an audio interface module 300, and an audio filter module 400. The circuit board 100 has a power supply area. The audio power supply module 200 is disposed in the power supply area, and an input end of the audio power supply module 200 is configured to receive an audio signal. The circuit board 100 also has an interface area. The sound interface module 300 is located in the interface area, a first output end of the audio power supply module 200 is connected with a power supply end of the sound interface module 300, and the sound interface module 300 is used for plugging an audio transceiving port. The circuit board 100 further has a filtering area. The acoustic filtering module 400 is located in the filtering area, an input end of the acoustic filtering module 400 is connected to an audio transceiving end of the acoustic interface module 300, please refer to fig. 2, and the acoustic filtering module 400 includes an audio filtering capacitor and a heat sink 410 connected to the circuit board 100. The audio filter capacitor comprises an electrolytic capacitor C5 and a ceramic capacitor C1 which are arranged at intervals. The volume of the electrolytic capacitor C5 is larger than that of the ceramic capacitor C1. The heat sink 410 is disposed adjacent to the edge of the circuit board 100, the heat sink 410 is disposed adjacent to the ceramic capacitor C1, and the heat sink 410 is disposed away from the electrolytic capacitor C5.
In this embodiment, the electrolytic capacitor C5 and the ceramic capacitor C1 serve as filter capacitors, and the ceramic capacitor C1 replaces the electrolytic capacitor C5 originally arranged therein under the condition of meeting the requirement of filtering the audio signal, so that the distance between the electrolytic capacitor C5 and the ceramic capacitor C1 is increased, and the distance between the electrolytic capacitor C5 and the radiator 410 is further increased, thereby effectively reducing the possibility of burning out the electrolyte in the electrolytic capacitor C5, that is, reducing the possibility of failure of the electrolytic capacitor C5, thereby effectively improving the filtering performance of the audio signal, and further improving the sound quality of the sound. The electrical conduction between each module and each electronic component is realized through the circuit inside the circuit main board 100, that is, the circuit main board 100 has a plurality of copper foil traces therein to electrically connect each module and each electronic component.
In one embodiment, referring to fig. 2, the distance between the heat sink 410 and the electrolytic capacitor C5 is 20mm to 26 mm. In this embodiment, the electrolytic capacitor C5 and the ceramic capacitor C1 together serve as a filter capacitor, so as to facilitate filtering the audio signal, so as to filter noise in the audio signal. The radiator 410 is used for performing heat dissipation processing on the circuit main board 100, so that a large amount of heat is accumulated on the radiator 410, the temperature of the radiator 410 is high, the radiator 410 is arranged away from the electrolytic capacitor C5, the electrolytic capacitor C5 is conveniently separated from the radiator 410, a heat exchange path between the electrolytic capacitor C5 and the radiator 410 is increased, the heat exchange rate between the electrolytic capacitor C5 and the radiator 410 is reduced, the probability that the electrolytic capacitor C5 burns out the internal electrolyte due to overhigh temperature is further reduced, that is, the probability that the electrolytic capacitor C5 fails is reduced, and the normal use of the electrolytic capacitor C5 is ensured. In another embodiment, in order to save the space volume occupied by the audio circuit board in the interior of the audio, the distance between the radiator 410 and the electrolytic capacitor C5 is set to 23mm, so that the volume and the weight of the audio circuit board are reduced under the condition that the high sound quality of the audio is ensured.
In one embodiment, referring to fig. 2, the circuit board 100 further has a first auxiliary heat dissipation area 140, the first auxiliary heat dissipation area 140 is disposed adjacent to the heat sink 410, the acoustic filter module 400 further includes a first copper heat dissipation line 420, and the first copper heat dissipation line 420 is disposed in the first auxiliary heat dissipation area 140. In this embodiment, the first heat dissipation copper wire 420 is disposed in the first heat dissipation auxiliary area 140, the first heat dissipation copper wire 420 is used for absorbing heat of the circuit main board 100, and the first heat dissipation copper wire 420 may also be used as a connection wire between other electronic components. In addition, the first auxiliary heat dissipation area 140 is disposed adjacent to the heat sink 410, and the first heat dissipation copper wires 420 absorb part of heat around the heat sink 410 to increase the heat dissipation performance of the circuit board 100, so as to reduce the heat conduction from the heat sink 410 to the electrolytic capacitor C5, and further reduce the possibility that the electrolyte in the electrolytic capacitor C5 is burned out, thereby ensuring the normal use of the electrolytic capacitor C5.
In one embodiment, referring to fig. 2, the circuit board 100 further has a second auxiliary heat dissipation area 150, the second auxiliary heat dissipation area 150 is disposed adjacent to the electrolytic capacitor C5, the acoustic filter module 400 further includes a second heat dissipation copper wire 430, and the second heat dissipation copper wire 430 is disposed in the second auxiliary heat dissipation area 150. In this embodiment, the second heat dissipation copper wire 430 is disposed in the second heat dissipation auxiliary area 150, the second heat dissipation copper wire 430 is used for absorbing heat of the circuit main board 100, and the second heat dissipation copper wire 430 may also be used as a connection wire between other electronic components. In addition, the second auxiliary heat dissipation area 150 is disposed adjacent to the electrolytic capacitor C5, and the second heat dissipation copper wires 430 absorb part of heat around the electrolytic capacitor C5 to increase the heat dissipation performance of the circuit board 100, so as to reduce the temperature on the electrolytic capacitor C5, further reduce the possibility that the electrolyte in the electrolytic capacitor C5 is burned out, and ensure the normal use of the electrolytic capacitor C5.
In one embodiment, referring to fig. 2, the sound filtering module 400 further includes a rectifying circuit 440, a second output terminal of the audio power supply module 200 is connected to an input terminal of the rectifying circuit 440, an output terminal of the rectifying circuit 440 is connected to a first terminal of the ceramic capacitor C1, a second terminal of the ceramic capacitor C1 is connected to a first terminal of the electrolytic capacitor C5, and a second terminal of the electrolytic capacitor C5 is grounded. In this embodiment, the rectifier circuit 440 rectifies the electrical signal output by the second output terminal of the audio power supply module 200, the second output terminal of the audio power supply module 200 is used for outputting an electrical signal corresponding to the audio signal, and the rectifier circuit 440 makes the audio signal output more stable to improve the output sound quality. The ceramic capacitor C1 primarily filters the audio signal, and the electrolytic capacitor C5 secondarily filters the audio signal, that is, interference signals with different frequencies in the audio signal are filtered out, so as to further improve the quality of the audio signal.
In another embodiment, referring to fig. 2, the sound filtering module 400 further includes an electronic switch U1 connected to the circuit board 100, and the rectifying circuit 440 is connected to the audio transceiving terminal of the sound interface module 300 through the electronic switch U1 to control transceiving of audio signals. The electronic switch U1 controls the output of the rectifying circuit 440 to output a rectified audio signal.
Further, referring to fig. 2, the acoustic filter module 400 further includes a heat insulation sheet 450 connected to the electronic switch U1, the heat insulation sheet 450 is located between the electronic switch U1 and the heat sink 410, and the heat insulation sheet 450 is used for isolating heat dissipated by the heat sink 410. In this embodiment, the electronic switch U1 is disposed adjacent to the heat sink 410, and in order to reduce the heat transfer from the heat sink 410 to the electronic switch U1, the heat insulation sheet 450 is disposed between the electronic switch U1 and the heat sink 410, so as to effectively reduce the rate of heat transfer from the heat sink 410 to the electronic switch U1, reduce the probability of damage to the electronic switch U1 due to over-high temperature, and ensure the normal operation of the electronic switch U1.
Still further, referring to fig. 2, the acoustic filter module 400 further includes an insulating sheet 460 connected to the electronic switch U1, the insulating sheet 460 is located between the electronic switch U1 and the heat sink 410, and the insulating sheet 460 is used for isolating electrical conduction between the electronic switch U1 and the heat sink 410. In this embodiment, the electronic switch U1 is disposed adjacent to the heat sink 410, the heat sink 410 is made of metal, the electronic switch U1 passes current during operation, and in order to avoid heat generation caused by current flowing through the heat sink 410, the insulating sheet 460 is disposed between the electronic switch U1 and the heat sink 410, so as to effectively isolate the current flowing between the electronic switch U1 and the heat sink 410. In another embodiment, the insulating sheet 460 is a rubber pad.
In one embodiment, the application further provides a sound box, which comprises the sound box circuit board in any one of the above embodiments. In this embodiment, the audio circuit board includes a circuit main board, an audio power supply module, an audio interface module, and an audio filter module. The circuit main board is provided with a power supply area. The audio power supply module is arranged in the power supply area, and the input end of the audio power supply module is used for receiving audio signals. The circuit main board is also provided with an interface area. The audio interface module is located in the interface area, a first output end of the audio power supply module is connected with a power supply end of the audio interface module, and the audio interface module is used for being connected with an audio receiving and transmitting port in an inserting mode. The circuit main board is also provided with a filtering area. The sound filtering module is located in the filtering area, the input end of the sound filtering module is connected with the audio receiving and transmitting end of the sound interface module, and the sound filtering module comprises an audio filtering capacitor and a radiator which are connected with the circuit main board. The audio filter capacitor comprises an electrolytic capacitor and a ceramic capacitor which are arranged at intervals. The volume of the electrolytic capacitor is larger than that of the ceramic capacitor. The radiator is arranged close to the edge of the circuit main board, the radiator is arranged close to the ceramic capacitor, and the radiator is arranged far away from the electrolytic capacitor. The electrolytic capacitor and the ceramic capacitor serve as filter capacitors, the ceramic capacitor is used for replacing the electrolytic capacitor originally arranged at the position under the condition of meeting the requirement of filtering the audio signals, the distance between the electrolytic capacitor and the ceramic capacitor is increased, the distance between the electrolytic capacitor and the radiator is further increased, the probability that electrolyte in the electrolytic capacitor is burnt out is effectively reduced, namely, the probability that the electrolytic capacitor fails is reduced, the filtering performance of the audio signals is effectively improved, and the tone quality of the sound is improved.
The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the utility model. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (10)
1. A sound board, comprising:
a circuit main board, a power supply board,
the circuit main board is provided with a power supply area, the audio power supply module is arranged in the power supply area, and the input end of the audio power supply module is used for receiving an audio signal;
the circuit main board is provided with an audio interface module, the audio interface module is positioned in the interface area, a first output end of the audio power supply module is connected with a power supply end of the audio interface module, and the audio interface module is used for being plugged with an audio receiving and transmitting port;
the circuit board is provided with a circuit interface module, the circuit board is provided with a circuit board, the circuit board is provided with a circuit board, the circuit board, and the circuit board, the circuit board is provided with a circuit board, the circuit board, and the circuit board, the circuit.
2. The acoustic circuit board of claim 1, wherein the heat sink is spaced from the electrolytic capacitor by 20mm to 26 mm.
3. The acoustic circuit board of claim 2, wherein the heat sink is spaced 23mm from the electrolytic capacitor.
4. The audio circuit board of claim 1, wherein said circuit board further comprises a first heat dissipation aid, said first heat dissipation aid being disposed adjacent to said heat sink, said audio filter module further comprising first heat dissipation copper wires, said first heat dissipation copper wires being disposed within said first heat dissipation aid.
5. The audio circuit board of claim 1, wherein said circuit board further comprises a second heat dissipation auxiliary area, said second heat dissipation auxiliary area being disposed adjacent to said electrolytic capacitor, said audio filter module further comprising second heat dissipation copper wires, said second heat dissipation copper wires being disposed in said second heat dissipation auxiliary area.
6. The acoustic circuit board of claim 1, wherein the acoustic filter module further comprises a rectifier circuit, the second output terminal of the audio power supply module is connected to the input terminal of the rectifier circuit, the output terminal of the rectifier circuit is connected to the first terminal of the ceramic capacitor, the second terminal of the ceramic capacitor is connected to the first terminal of the electrolytic capacitor, and the second terminal of the electrolytic capacitor is grounded.
7. The audio circuit board of claim 6, wherein the audio filter module further comprises an electronic switch connected to the circuit board, and the rectifier circuit is connected to the audio transceiving end of the audio interface module through the electronic switch to control transceiving of audio signals.
8. The acoustic circuit board of claim 7, wherein the acoustic filter module further comprises a heat shield coupled to the electronic switch, the heat shield being positioned between the electronic switch and the heat sink, the heat shield being configured to insulate heat dissipated by the heat sink.
9. The acoustic panel circuit of claim 7, wherein the acoustic filter module further comprises an insulating sheet coupled to the electronic switch, the insulating sheet being positioned between the electronic switch and the heat sink, the insulating sheet being configured to isolate electrical communication with the heat sink.
10. An audio device comprising an audio circuit board according to any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123176608.4U CN216599931U (en) | 2021-12-15 | 2021-12-15 | Sound circuit board and sound |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123176608.4U CN216599931U (en) | 2021-12-15 | 2021-12-15 | Sound circuit board and sound |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216599931U true CN216599931U (en) | 2022-05-24 |
Family
ID=81612397
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202123176608.4U Active CN216599931U (en) | 2021-12-15 | 2021-12-15 | Sound circuit board and sound |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216599931U (en) |
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2021
- 2021-12-15 CN CN202123176608.4U patent/CN216599931U/en active Active
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