CN216597524U - Carrier platform for chip bonding - Google Patents
Carrier platform for chip bonding Download PDFInfo
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- CN216597524U CN216597524U CN202123419030.0U CN202123419030U CN216597524U CN 216597524 U CN216597524 U CN 216597524U CN 202123419030 U CN202123419030 U CN 202123419030U CN 216597524 U CN216597524 U CN 216597524U
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Abstract
The utility model discloses a carrier platform for chip bonding, which comprises a base, a top plate and a carrier, wherein the carrier comprises a carrier upper plate, a middle shockproof backing plate and a carrier lower plate, the carrier upper plate is provided with a plurality of chip through holes matched with the shapes of chips, the middle shockproof plate is provided with a middle negative pressure suction hole corresponding to the center of the chip through hole one by one, the base comprises a bottom plate and a lug, the lug is fixed on the bottom plate, the side surface of the lug is provided with a negative pressure interface, the lug is provided with a negative pressure channel, the top plate is fixed on the base through a fixing structure, the top plate is provided with an open slot which is opened above and matched with the shapes of the carrier, the carrier is placed in the open slot, the open slot is provided with a negative pressure groove, the negative pressure groove is provided with a negative pressure upper through hole corresponding to the negative pressure channel on the base, the carrier platform can effectively absorb shock when placing and sucking the chips, the chip is well protected, and the bonding precision is effectively improved.
Description
Technical Field
The utility model relates to a carrier platform for chip bonding is applicable to the production in integrated circuit manufacturing field.
Background
The chip is called as a packaged chip in a broad sense, a chip body is placed on a carrier table and then bonded, bonding is a technology that two homogeneous or heterogeneous semiconductor materials with clean surfaces and flat atomic levels are subjected to surface cleaning and activation treatment and are directly bonded under certain conditions, and the chip is bonded into a whole through van der waals force, molecular force and even atomic force, so that higher accuracy is required; at present, in the chip bonding process, the carrier table is provided with a groove, and the carrier lower plate is sucked by the larger negative pressure, so that the lower plate is deformed, the bonding precision is inaccurate, and the chip placed on the upper plate of the carrier can vibrate due to the suction force and the bonding precision is also inaccurate.
SUMMERY OF THE UTILITY MODEL
The utility model discloses the technical problem that will solve is: a carrier platform for chip bonding can effectively absorb shock when placing and sucking a chip, protect the chip, effectively improve bonding precision and enable the flexibility of the carrier platform to be better.
In order to solve the technical problem, the technical scheme of the utility model is that: a carrier table for chip bonding comprises a base, a top plate and a carrier, wherein the carrier comprises a carrier upper plate, an intermediate shockproof cushion plate and a carrier lower plate, the carrier upper plate is provided with a plurality of chip through holes matched with the shapes of chips, the intermediate shockproof plate is provided with intermediate negative pressure suction holes corresponding to the centers of the chip through holes one by one, the carrier lower plate is provided with lower plate negative pressure suction holes, the lower plate negative pressure suction holes correspond to the intermediate negative pressure suction holes one by one, and the carrier upper plate, the intermediate shockproof cushion plate and the carrier lower plate are stacked and fixed together through clamping structures;
the base comprises a bottom plate and a convex block, the convex block is fixed on the bottom plate, a negative pressure interface is arranged on the side face of the convex block, a negative pressure channel is arranged on the convex block, and the negative pressure interface is connected with the negative pressure channel;
the roof is fixed on the base through a fixing structure, an open slot with an upper opening matched with the shape of the carrier is formed in the roof, the carrier is placed in the open slot, a negative pressure groove is formed in the open slot, and a negative pressure channel on the base is correspondingly connected with a negative pressure upper through hole formed in the negative pressure groove.
As a preferred scheme, the clamping structure comprises a plurality of screw holes arranged on the carrier upper plate, the middle shockproof cushion plate and the carrier lower plate, and a plurality of counter bores which are in one-to-one correspondence with the screw holes on the carrier upper plate, wherein connecting screws are installed in the screw holes, and the carrier upper plate, the middle shockproof cushion plate and the carrier lower plate are fixedly connected through the screws.
As an optimal scheme, open slot one end is the material loading end, and the other end is location material pushing end, location material pushing end is equipped with the location flange, be equipped with the unloading breach that is used for promoting the carrier on the location flange, the material loading end of open slot is provided with the assembly mouth that makes things convenient for the carrier to insert or take out.
Preferably, the upper end of the top plate is provided with an upper limit baffle plate for limiting the upper end surface of the carrier.
Preferably, a plurality of supporting protrusions are arranged at the bottom of the negative pressure groove at intervals, and the depth of each supporting protrusion is the same as that of the negative pressure groove.
As a preferred scheme, a plurality of strip-shaped mounting holes are formed in the periphery of the bottom plate.
As a preferable scheme, the carrier upper plate, the intermediate shockproof cushion plate and the carrier lower plate are all rectangular plates with the same size, and the chip through holes, the intermediate negative pressure suction holes and the lower plate negative pressure suction holes are all distributed in a rectangular array.
Preferably, the fitting opening is provided in the shape of a flared opening.
After the technical scheme is adopted, the utility model discloses an effect is: the carrier table for chip bonding comprises a base, a top plate and a carrier, wherein the carrier comprises a carrier upper plate, an intermediate shockproof cushion plate and a carrier lower plate, the carrier upper plate is provided with a plurality of chip through holes matched with the shapes of chips, the intermediate shockproof plate is provided with intermediate negative pressure suction holes in one-to-one correspondence with the centers of the chip through holes, the carrier lower plate is provided with lower plate negative pressure suction holes, the lower plate negative pressure suction holes are in one-to-one correspondence with the intermediate negative pressure suction holes, and the carrier upper plate, the intermediate shockproof cushion plate and the carrier lower plate are stacked and fixed together through clamping structures;
the base comprises a bottom plate and a convex block, the convex block is fixed on the bottom plate, a negative pressure interface is arranged on the side face of the convex block, a negative pressure channel is arranged on the convex block, and the negative pressure interface is connected with the negative pressure channel;
the carrier is placed in the open slot, a negative pressure groove is arranged on the open slot, and a negative pressure upper through hole correspondingly connected with a negative pressure channel on the base is arranged on the negative pressure groove;
firstly, sequentially stacking and fixing a carrier upper plate, an intermediate shockproof base plate and a carrier lower plate together through a clamping structure, then manually putting chips into chip through holes one by one, wherein the intermediate shockproof base plate and the carrier lower plate are positioned below the carrier upper plate to play a supporting role, the chip through holes limit the positions of the chips, chip placing grooves are formed, then the carrier is put into an open slot, and a negative pressure groove is arranged, so that the edge of the carrier is supported through the open slot, a plurality of chip placing grooves are positioned above the negative pressure groove, then air is pumped by a negative pressure interface on a lug, and the carrier is firmly adsorbed on the open slot through the negative pressure channel; this carrier platform protection chip that can be fine reduces chip vibrations, improves the accuracy.
And the clamping structure comprises a plurality of screw holes arranged on the carrier upper plate, the middle shockproof cushion plate and the carrier lower plate, and a plurality of counter bores which are in one-to-one correspondence with the screw holes on the carrier upper plate, the screw holes are internally provided with connecting screws, the carrier upper plate, the middle shockproof cushion plate and the carrier lower plate are connected and fixed by the screws, the screw holes can not only be used for connecting and fixing, but also can accurately position the positions of the screw holes, so that the connection and the fixation are accurate, and the middle shockproof cushion plate can effectively reduce the vibration and the impact of the chip and protect the chip.
And because the one end of the open slot is a feeding end, the other end is a positioning pushing end, the positioning pushing end is provided with a positioning flange, the positioning flange is provided with a discharging notch for pushing the carrier, the feeding end of the open slot is provided with an assembling port for facilitating the insertion or extraction of the carrier, the upper end of the top plate is provided with an upper limiting baffle for limiting the upper end surface of the carrier, the position of the carrier is limited, the moving direction of the carrier is single, and the feeding and discharging of the carrier are facilitated.
And because the bottom of the negative pressure groove is provided with a plurality of supporting bulges at intervals, the supporting bulges have the same depth as the negative pressure groove, and the bulges effectively support the lower surface of the carrier, thereby avoiding the deformation of the carrier caused by lack of support at the center during negative pressure air extraction.
And because a plurality of strip-shaped mounting holes are formed in the periphery of the base plate, the bonding position of the carrier table can be quickly moved and fixed, so that the carrier table is more flexible.
And because the carrier upper plate, the middle shockproof backing plate and the carrier lower plate are all rectangular plates with the same size, and the chip through holes, the middle negative pressure suction holes and the lower plate negative pressure suction holes are all distributed in a rectangular array, the space of the plates is fully utilized, so that chips can be bonded as many as possible at one time, and the production efficiency is improved.
The assembly opening is in an expanding shape, so that the assembly opening has a guiding function, and a worker can conveniently align the carrier to the assembly opening
Drawings
The present invention will be further explained with reference to the drawings and examples.
Fig. 1 is a perspective view of an embodiment of the present invention;
fig. 2 is a perspective view of the carrier according to the embodiment of the present invention;
fig. 3 is a top view of the present invention;
fig. 4 is a front view of an embodiment of the invention;
FIG. 5 is a cross-sectional view at A-A of FIG. 4;
FIG. 6 is a schematic view of the construction of the intermediate crash pad;
FIG. 7 is a schematic view of a lower plate structure of the carrier;
in the drawings: 1. a base; 101. a base plate; 102. a bump; 103. a strip-shaped mounting hole; 2. a top plate; 3. loading the carrier to a plate; 301. a chip through hole; 4. a middle shockproof cushion plate; 401. a middle negative pressure suction hole; 5. a carrier lower plate; 501. a lower plate negative pressure suction hole; 6. a quick connector; 7. pressing the hole under negative pressure; 8. negative pressure side holes; 9. an open slot; 901. an assembly port; 10. a negative pressure groove; 1001. a support protrusion; 11. a negative pressure upper through hole; 12. a feeding end; 13. positioning a material pushing end; 1301. positioning the flange; 1302. a blanking gap; 14. an upper limiting baffle; 15. chip placing groove.
Detailed Description
The present invention will be described in further detail with reference to the following examples.
In this embodiment, the longitudinal direction is the length direction of the carrier, and the transverse direction is the width direction of the carrier.
As shown in fig. 1 to 7, a carrier table for chip bonding includes a base 1, a top plate 2 and a carrier, the carrier includes a carrier upper plate 3, an intermediate shock-proof pad 4 and a carrier lower plate 5, the carrier upper plate 3 is provided with a plurality of chip through holes 301 adapted to the chip shape, the intermediate shock-proof plate is provided with intermediate negative pressure suction holes 401 corresponding to the centers of the chip through holes 301 one by one, the carrier lower plate 5 is provided with lower plate negative pressure suction holes 501, the lower plate negative pressure suction holes 501 correspond to the intermediate negative pressure suction holes 401 one by one, and the carrier upper plate 3, the intermediate shock-proof pad 4 and the carrier lower plate 5 are stacked and fixed together by a clamping structure; further, the middle shockproof backing plate 4 and the carrier lower plate 5 are positioned below the carrier upper plate 3 to play a supporting role, and the chip through holes 301 limit the positions of the chips, so that the chip placing grooves 15 are formed;
the base 1 comprises a bottom plate 101 and a bump 102, the bump 102 is fixed on the bottom plate 101, a negative pressure interface is arranged on the side surface of the bump 102, a negative pressure channel is arranged on the bump 102, and the negative pressure interface is connected with the negative pressure channel;
the roof 2 is fixed in on the base 1 through fixed knot constructs, be equipped with the open slot 9 of top open-ended and carrier shape adaptation on the roof 2, the carrier place in the open slot 9, be equipped with negative pressure recess 10 on the open slot 9, be equipped with on the negative pressure recess 10 with the negative pressure passageway on the base 1 correspond and be connected negative pressure upper hole 11.
In this embodiment, press from both sides tight structure including setting up a plurality of screw on carrier upper plate 3, middle shockproof backing plate 4 and carrier hypoplastron 5 to and the counter bore of a plurality of and screw one-to-one on the carrier upper plate 3, screw internal thread installation connecting screw, the screw is connected carrier upper plate 3, middle shockproof backing plate 4 and carrier hypoplastron 5 fixedly, and the screwhead can screw in the counter bore, thereby processing after the protruding influence can not appear on the surface, the same reason fixed structure also adopts screw threaded connection, is equipped with two screws on negative pressure recess 10, makes roof 2 and base 1 can firmly laminate through the screw, can not take place to leak when ensureing the negative pressure and bleed.
Furthermore, the chip through hole 301, the middle negative pressure suction hole 401 and the lower plate negative pressure suction hole 501 are simple in shape, so that the processing is convenient, and the production efficiency can be greatly improved; the middle shockproof backing plate 4 is adopted in the middle, so that the chip can be placed under the buffer effect, the vibration of the chip can be reduced under the negative pressure air exhaust, and the bonding precision is improved.
As shown in fig. 1 and 5, the negative pressure port includes a quick connector 6, the upper surface of the projection 102 is provided with a negative pressure lower hole 7 and a negative pressure side hole 8, the side surface of the projection 102 is connected with the quick connector 6, the negative pressure lower hole 7 is connected with the negative pressure side hole 8, and then is connected with the negative pressure upper through hole 11 to form a complete negative pressure channel, the quick connector 6 is connected with an air pipe, and the air pipe is connected with a negative pressure device, so that negative pressure suction can be performed.
As shown in fig. 3, one end of the open slot 9 is a feeding end 12, the other end is a positioning pushing end 13, the positioning pushing end 13 is provided with a positioning flange 1301, the positioning flange 1301 is provided with a discharging notch 1302 for pushing a carrier, the feeding end 12 of the open slot 9 is provided with an assembly port 901 for facilitating insertion or extraction of the carrier, and the upper end of the top plate 2 is provided with an upper limiting baffle 14 for limiting the upper end surface of the carrier, so that the open slot 9 is adapted to the shape of the carrier and limits the upper end surface of the carrier, thereby enabling the moving direction of the carrier to be single and facilitating feeding and discharging; therefore, a worker only needs to manually push the carrier into the open slot 9 from the assembling opening 901, and the loading is completed when one end of the carrier is attached to the positioning flange 1301; because the pushed carrier is attached to the bottom of the open slot 9, the open slot 9 also has a certain longitudinal depth so as to be inconvenient for blanking, a blanking notch 1302 is arranged, and the part of the carrier exposed at the blanking notch 1302 is convenient for manual pushing blanking; certainly, the upper limiting baffle 14 is not arranged on the top plate 2, the carrier is clamped longitudinally through the clamping jaw device, and then the carrier is placed on the open slot 9 from top to bottom, and the two ends of the top plate 2 are provided with notches, so that the clamping jaws can be used for loading and unloading.
As shown in fig. 1 and 5, a plurality of supporting protrusions 1001 are spaced at the bottom of the negative pressure groove 10, the depth of the supporting protrusions 1001 is the same as that of the negative pressure groove 10, and the supporting protrusions 1001 are distributed below the spacing of the negative pressure suction holes of the lower plate, which is beneficial to supporting the carrier and preventing the deformation of the carrier during negative pressure suction.
In this embodiment, a plurality of bar-shaped mounting holes 103 are formed around the bottom plate 101, the bar-shaped mounting holes 103 can be fixed at a processing position by bolts and nuts, and the bonding position of the carrier table can be quickly moved and fixed, so that the carrier table is more flexible.
As shown in fig. 2, 5 and 6, the carrier upper plate 3, the intermediate vibration-proof pad 4 and the carrier lower plate 5 are rectangular plates with the same size, and the chip through holes 301, the intermediate negative pressure suction holes 401 and the lower plate negative pressure suction holes 501 are all distributed in a rectangular array, so that loading is facilitated after combination, and the space of the plate is fully utilized to enable bonding of chips as many as possible at one time.
In this embodiment, the assembly opening 901 is designed to be in an expanded shape, so that when the material is manually loaded, a guiding effect is achieved, and the loading speed can be effectively increased.
The utility model discloses a theory of operation is: the method comprises the steps of firstly positioning through screw holes in a carrier upper plate 3, a middle shockproof cushion plate 4 and a carrier lower plate 5, then fixing through screws, then manually placing chips in a chip placing groove 15, pushing the carrier into an open groove 9 from an assembling port 901 after the chips are fully placed, completing feeding when one end of the carrier is attached to a positioning flange 1301, then inserting an air pipe into a quick-insertion connector 6, connecting the air pipe with a negative pressure device, starting air extraction, enabling the carrier to be located above a negative pressure groove 10, enabling the negative pressure groove 10 to be adsorbed on the open groove 9 firmly when vacuum is formed in the negative pressure groove 10 through continuous air extraction, then adjusting strip-shaped mounting holes 103 arranged on the periphery of a bottom plate 101 to be in proper bonding positions to carry out bonding, closing the negative pressure device after bonding is completed, pushing out the carrier from a blanking notch 1302 by workers, then unloading the chips, and then repeating the operations.
The above-mentioned embodiments are merely descriptions of the preferred embodiments of the present invention, and are not intended to limit the scope of the present invention, and various modifications and alterations made to the technical solution of the present invention without departing from the spirit of the present invention are intended to fall within the scope of the present invention defined by the claims.
Claims (8)
1. A chip bonding carrier platform is characterized in that: the device comprises a base, a top plate and a carrier, wherein the carrier comprises a carrier upper plate, an intermediate shockproof cushion plate and a carrier lower plate, the carrier upper plate is provided with a plurality of chip through holes matched with the shapes of chips, the intermediate shockproof plate is provided with intermediate negative pressure suction holes in one-to-one correspondence with the centers of the chip through holes, the carrier lower plate is provided with lower plate negative pressure suction holes, the lower plate negative pressure suction holes are in one-to-one correspondence with the intermediate negative pressure suction holes, and the carrier upper plate, the intermediate shockproof cushion plate and the carrier lower plate are stacked and fixed together through clamping structures;
the base comprises a bottom plate and a convex block, the convex block is fixed on the bottom plate, a negative pressure interface is arranged on the side face of the convex block, a negative pressure channel is arranged on the convex block, and the negative pressure interface is connected with the negative pressure channel;
the roof is fixed on the base through a fixing structure, an open slot with an upper opening matched with the shape of the carrier is formed in the roof, the carrier is placed in the open slot, a negative pressure groove is formed in the open slot, and a negative pressure channel on the base is correspondingly connected with a negative pressure upper through hole formed in the negative pressure groove.
2. The die bonding carrier table of claim 1, wherein: the clamping structure comprises a plurality of screw holes formed in the carrier upper plate, the middle shockproof cushion plate and the carrier lower plate, and counter bores formed in the carrier upper plate and corresponding to the screw holes one by one, connecting screws are installed in the screw holes, and the carrier upper plate, the middle shockproof cushion plate and the carrier lower plate are fixedly connected through the screws.
3. The die bonding carrier table of claim 2, wherein: open slot one end is the material loading end, and the other end is location and pushes away the material end, location pushes away the material end and is equipped with the location flange, be equipped with the unloading breach that is used for promoting the carrier on the location flange, the material loading end of open slot is provided with the assembly mouth that makes things convenient for the carrier to insert or take out.
4. The die bonding carrier table of claim 3, wherein: and the upper end of the top plate is provided with an upper limiting baffle for limiting the upper end surface of the carrier.
5. The die bonding carrier table of claim 4, wherein: the bottom of the negative pressure groove is provided with a plurality of supporting bulges at intervals, and the depth of the supporting bulges is the same as that of the negative pressure groove.
6. The die bonding carrier table of claim 5, wherein: and a plurality of strip-shaped mounting holes are formed in the periphery of the bottom plate.
7. The die bonding carrier table of claim 6, wherein: the carrier upper plate, the middle shockproof base plate and the carrier lower plate are rectangular plates with the same size, and the chip through holes, the middle negative pressure suction holes and the lower plate negative pressure suction holes are all distributed in a rectangular array.
8. The die bonding carrier table of claim 7, wherein: the assembling opening is arranged in a flaring shape.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123419030.0U CN216597524U (en) | 2021-12-31 | 2021-12-31 | Carrier platform for chip bonding |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123419030.0U CN216597524U (en) | 2021-12-31 | 2021-12-31 | Carrier platform for chip bonding |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216597524U true CN216597524U (en) | 2022-05-24 |
Family
ID=81630451
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202123419030.0U Active CN216597524U (en) | 2021-12-31 | 2021-12-31 | Carrier platform for chip bonding |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216597524U (en) |
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2021
- 2021-12-31 CN CN202123419030.0U patent/CN216597524U/en active Active
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