CN216594540U - Pressure test equipment for semiconductor device - Google Patents
Pressure test equipment for semiconductor device Download PDFInfo
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- CN216594540U CN216594540U CN202122742432.8U CN202122742432U CN216594540U CN 216594540 U CN216594540 U CN 216594540U CN 202122742432 U CN202122742432 U CN 202122742432U CN 216594540 U CN216594540 U CN 216594540U
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Abstract
The utility model discloses a pressure test device of a semiconductor device, wherein a transmission area of the pressure test device is provided with a tray for carrying the semiconductor device to be tested and a transmission manipulator, the test area is provided with a test station, a test air bag, a buffer air bag, an air pressure pipeline assembly and a test manipulator, the transmission manipulator transfers the semiconductor device from the tray to a junction area, and the test manipulator transfers the semiconductor device from the junction area to the test station; the test air bag and the buffer air bag are oppositely arranged at a test station; the air pressure pipeline assembly comprises an air pressure valve, a first electronic regulating valve, a second electronic regulating valve, a first vent pipeline and a second vent pipeline, the air pressure valve is connected with an air source, the first vent pipeline is communicated with an outlet of the air pressure valve and the test air bag, the second vent pipeline is communicated with the air pressure valve and the buffer air bag, and the first electronic regulating valve/the second electronic regulating valve respectively regulate air flow of the first vent pipeline/the second vent pipeline. The utility model solves the problem of setting the air pressure of the buffer air bag during pressure test.
Description
Technical Field
The utility model relates to the field of pressure testing, in particular to pressure testing equipment of a semiconductor device.
Background
Before the chip is shipped out, the chip needs to be tested for various performance parameters, including the bearing capacity against the external pressure. In the prior art, the corresponding testing equipment usually utilizes a pressure gauge or a heavy object to perform pressure test on the sensor, but the pressure application is uneven and unstable in the mode, the testing efficiency is low, the testing performance is single, and the quality control for mass production is not easy.
In the prior art, a solution for implementing batch testing by applying a pressure to be tested on a chip to be tested uniformly and over a large area by an air bag pressure application method has been proposed, for example, chinese patent No. CN209745468U, but even if the air bag pressure application method is adopted, the chip may be damaged.
SUMMERY OF THE UTILITY MODEL
The utility model aims to provide a pressure testing device of a semiconductor device, which can realize quality control of mass-produced chips while protecting the chips from being crushed.
In order to achieve the purpose, the technical scheme adopted by the utility model is as follows:
a pressure test device of a semiconductor device comprises a transmission area, a test area and an interface area, wherein the transmission area is provided with a tray and a transmission manipulator, the test area is provided with a test station, a test air bag, a buffer air bag, an air pressure pipeline assembly and a test manipulator, the tray is configured to carry one or more semiconductor devices to be tested, the transmission manipulator is configured to transfer the semiconductor devices to be tested from the tray to the interface area, and the test manipulator is configured to transfer the semiconductor devices to be tested from the interface area to the test station;
the test air bag and the buffer air bag are oppositely arranged at a test station;
the pneumatic line assembly comprises a pneumatic valve, a first electronic regulating valve, a second electronic regulating valve, a first vent line and a second vent line, wherein an inlet of the pneumatic valve is configured to be connected with a gas source, the first vent line is configured to communicate an outlet of the pneumatic valve with the test air bag, the second vent line is configured to communicate an outlet of the pneumatic valve with the buffer air bag, the first electronic regulating valve is configured to regulate the gas flow of the first vent line, and the second electronic regulating valve is configured to regulate the gas flow of the second vent line.
Further, the number of test stations corresponding to a single test manipulator is plural, and the test manipulator is provided on the tank chain so as to be capable of being conveyed to positions corresponding to different test stations.
Further, the pressure test equipment further comprises a pressing mechanism which corresponds to the test stations one by one, and the pressing mechanism is configured to press a test air bag arranged above the test stations, so that the test air bag generates pressure on the semiconductor devices to be tested and placed on the test stations.
Furthermore, the pressing mechanisms corresponding to the plurality of test stations are arranged in a linkage mode or independently.
Further, the number of the test manipulator and the pneumatic pipeline assembly is two.
Furthermore, the test stations, the test air bags and the buffer air bags correspond to one another, and each air pressure pipeline component corresponds to the test air bags and the buffer air bags of the plurality of test stations;
the test station is arranged in double rows, and the two air pressure pipeline assemblies are symmetrically arranged.
Further, the test area is also provided with a discharge tray, the test robot is also configured to transfer the semiconductor device subjected to the test from the test station to the interface area, and the transport robot is also configured to transfer the semiconductor device from the interface area to the discharge tray.
Further, the air pressure valve is an ADAM device.
Further, the first electronic regulating valve and the second electronic regulating valve are EP devices.
Further, the pressure testing device further comprises a human-machine interaction interface configured to set operating parameters of the EP device, the operating parameters of the EP device including airflow rate and/or airflow velocity.
The technical scheme provided by the utility model has the following beneficial effects:
a. the new control mode that the second electronic regulating valve controls the air inlet of the buffering air bag solves the problems of error and inaccuracy caused by manually regulating the air pressure valve;
b. the air inlet pressure is controlled and the pressure value provided by the buffer air bag is adjusted automatically through the buffer air pressure in the imported key parameter setting (ECM) when products are converted every time, so that the phenomenon of missing adjustment is avoided;
c. the original manual operation is changed into an automatic system and is integrated into the existing control system, the ADAM is shared with the original pressure air bag, the occupied space is very small, the risk caused by the wrong setting of the buffering air bag is avoided, the workload is reduced, and the operation is simple.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments described in the present application, and other drawings can be obtained by those skilled in the art without creative efforts.
Fig. 1 is a horizontal cross-sectional view of a pressure testing apparatus provided in an exemplary embodiment of the present disclosure;
FIG. 2 is a schematic electrical architecture diagram of an ADAM provided by an exemplary embodiment of the present disclosure;
wherein the reference numerals include: 100-transmission area, 110-tray, 120-discharge tray, 200-test area, 210-test station, 300-interface area, 410-pneumatic valve, 420-first electronic regulating valve, 430-second electronic regulating valve.
Detailed Description
In order to make the technical solutions of the present invention better understood, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that the terms "first," "second," and the like in the description and claims of the present invention and in the drawings described above are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used is interchangeable under appropriate circumstances such that the embodiments of the utility model described herein are capable of operation in sequences other than those illustrated or described herein. Furthermore, the terms "comprises," "comprising," and "having," and any variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, apparatus, article, or device that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed, but may include other steps or elements not expressly listed or inherent to such process, method, article, or device.
In one embodiment of the present invention, there is provided a pressure test apparatus of a semiconductor device, referring to fig. 1, including a transfer area 100, a test area 200, and an interface area 300, the transfer area 100 being provided with a tray 110, a discharge tray 120, and a transfer robot (not shown), the test area 200 being provided with a test station 210, a test bladder, a buffer bladder, a pneumatic line assembly, and a test robot (not shown), the tray 110 being configured to carry one or more semiconductor devices to be tested (not shown), the transfer robot being configured to transfer the semiconductor devices to be tested from the tray 110 to the interface area 300, the test robot being configured to transfer the semiconductor devices to be tested from the interface area 300 to the test station 210; after testing is complete, the test robot is further configured to transfer the semiconductor devices for which testing is complete from the test station 210 to the interface area 300, and the transport robot is further configured to transfer the semiconductor devices from the interface area 300 to the outfeed tray 120.
The test air bag and the buffer air bag are arranged oppositely at the test station 210, in one embodiment, the test air bag and the buffer air bag are arranged oppositely from top to bottom, the test air bag is arranged above the test station, and the buffer air bag provides a bearing surface for the semiconductor device on the test station in an inflated state. The test air bag is arranged on a pressing mechanism (such as Thermal head), during the process of pressing the Thermal head to perform pressure test on the chip, the test air bag generates pressure on the semiconductor device to be tested which is placed on the test station 210, and the pressure of the buffer air bag provided by the buffer air bag is used for preventing the problem of crushing the chip when the pressure of the test air bag is abnormal.
The air pressure of the buffer air bag is originally set by adding an air pressure valve at the air inlet of the air pipe to perform manual adjustment, and the air pressure is judged according to scale values. On one hand, the chip products are more in types, and the air pressure values of the buffering air bags specified by different chip product specifications are different in size, so that manual adjustment is needed during product conversion, and the phenomenon of missing adjustment is easy to occur; on the other hand, the manual adjustment error is large, the air pressure value result is not accurate, and the buffer air pressure cannot be guaranteed to operate according to the specified parameters. The pneumatic pipeline assembly provided by the embodiment of the utility model can solve the technical problem that:
referring to fig. 1, the pneumatic line assembly includes a pneumatic valve 410 (preferably an ADAM device), a first electronic regulating valve 420 (preferably an EP device), a second electronic regulating valve 430 (preferably an EP device), a first vent line and a second vent line (not shown), wherein an inlet of the pneumatic valve 410 is configured to connect to a gas source (not shown), the first vent line is configured to communicate an outlet of the pneumatic valve 410 with the test bladder, the second vent line is configured to communicate an outlet of the pneumatic valve 410 with the buffer bladder, the first electronic regulating valve 420 is configured to regulate a gas flow of the first vent line, and the second electronic regulating valve 430 is configured to regulate a gas flow of the second vent line.
That is, the test air bag and the buffer air bag are supplied with air flow by one air source, and the second electronic control valve 430 is added, so that the manual adjustment of the air pressure valve of the buffer air bag is avoided (the pressure test device itself is provided with the air pressure valve ADAM and the first electronic control valve 420). Specifically, referring to fig. 2, the device of the ADAM-6024 model can be selected in this embodiment, and ADAM is an existing industrial control module, which can be used to control the on/off of the air passage. The electronic regulating valve adopts an EP device which can be connected with a human-computer interaction interface, and the working parameters of the EP device, such as airflow and/or airflow velocity, can be configured manually through the human-computer interaction interface. According to the embodiment of the utility model, only the second electronic regulating valve 430 and the second vent pipeline need to be arranged on the existing pressure testing equipment, the buffering air bag and the testing air bag can share one air source, and besides the parameters of the second electronic regulating valve 430 are arranged on the man-machine interaction interface, the inflation of the testing air bag can be completed without other additional operations.
When a specified parameter value is input into a human-computer interaction interface, an ADAM (adaptive dynamic analog-digital converter) can automatically convert a digital signal into an analog signal to an EP (electro-pneumatic) and then the EP can carry out accurate air inlet control, and the accurate air inlet control is generally determined by the area of an air bag for buffering air pressure and the set air pressure. The control mode solves the problem of error and inaccuracy caused by manual adjustment of the air pressure valve, and automatically controls the air inlet pressure and adjusts the pressure value provided by the buffer air bag through the buffer air pressure in the imported key parameter setting (ECM) when products are switched every time, so that the phenomenon of missing adjustment is avoided. The new control mode changes the original manual operation into an automatic system and integrates the automatic system into the existing control system, and the new control mode shares one ADAM with the original pressure air bag, so that the occupied space is very small, the risk caused by the wrong setting of the buffering air bag is avoided, the workload is reduced, and the operation is simple.
The utility model can test a plurality of chips synchronously or asynchronously, the number of the test stations 210 corresponding to a single test manipulator is multiple, the test stations as shown in figure 1 are a row of 6 test manipulators corresponding to one test manipulator, and the test manipulators are arranged on a tank chain so as to be capable of being conveyed to positions corresponding to different test stations 210. The Thermal heads corresponding to the plurality of test stations 210 one by one can be linked or independently operated, for the former, a chip needs to be placed on each test station, then the Thermal heads act, and a plurality of test air bags are synchronously pressed down; for the latter, each test station independently performs a pressure test.
In this embodiment, the number of the test manipulators and the number of the pneumatic pipeline assemblies are two, the test stations 210, the test air bags and the buffer air bags correspond to one another, and each pneumatic pipeline assembly corresponds to the test air bags and the buffer air bags of the plurality of test stations 210; the test stations 210 are arranged in double rows, and the two air pressure pipeline assemblies are symmetrically arranged. It should be noted that the number of the test manipulators and the number of the pneumatic pipeline assemblies can be flexibly adjusted according to the volume and the specific layout of the pressure test equipment, and the number of the test manipulators and the number of the pneumatic pipeline assemblies is not limited to two.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.
The foregoing is directed to embodiments of the present application and it is noted that numerous modifications and adaptations may be made by those skilled in the art without departing from the principles of the present application and are intended to be within the scope of the present application.
Claims (10)
1. A pressure test device of a semiconductor device comprises a transmission area, a test area and a junction area, wherein the transmission area is provided with a tray and a transmission manipulator, the test area is provided with a test station, a test air bag, a buffering air bag, an air pressure pipeline assembly and a test manipulator, the tray is configured to carry one or more semiconductor devices to be tested, the transmission manipulator is configured to transfer the semiconductor devices to be tested from the tray to the junction area, and the test manipulator is configured to transfer the semiconductor devices to be tested from the junction area to the test station;
the test air bag and the buffer air bag are oppositely arranged at a test station;
wherein the pneumatic line assembly comprises a pneumatic valve, a first electronic regulating valve, a second electronic regulating valve, a first vent line and a second vent line, wherein an inlet of the pneumatic valve is configured to connect to a gas source, the first vent line is configured to communicate an outlet of the pneumatic valve with the test bladder, the second vent line is configured to communicate an outlet of the pneumatic valve with the buffer bladder, and the first electronic regulating valve is configured to regulate a gas flow of the first vent line, and the second electronic regulating valve is configured to regulate a gas flow of the second vent line.
2. A pressure test apparatus for semiconductor devices according to claim 1, wherein the number of test stations corresponding to a single test manipulator is plural, and the test manipulator is provided on a tank chain so as to be capable of being conveyed to positions corresponding to different test stations.
3. The apparatus for pressure testing of semiconductor devices according to claim 2, further comprising a pressing mechanism in one-to-one correspondence with the test stations, the pressing mechanism being configured to press down a test bladder disposed above a test station so that the test bladder exerts pressure on a semiconductor device to be tested placed on the test station.
4. The apparatus for pressure testing of semiconductor devices according to claim 3, wherein the pressing mechanisms corresponding to the plurality of test stations are arranged in a linked manner or independently.
5. The apparatus for pressure testing of semiconductor devices as set forth in claim 1, wherein the number of the test manipulators and the pneumatic tube assemblies is two.
6. The apparatus for pressure testing of semiconductor devices according to claim 5, wherein the test stations, the test airbags, and the buffer airbags correspond to each other one by one, and each pneumatic line module corresponds to the test airbags and the buffer airbags of the plurality of test stations;
the test station is arranged in double rows, and the two air pressure pipeline assemblies are symmetrically arranged.
7. The apparatus for pressure testing of semiconductor devices according to claim 1, wherein the test area is further provided with an outfeed tray, the test robot is further configured to transfer a semiconductor device subjected to testing from the test station to the interface area, and the transport robot is further configured to transfer a semiconductor device from the interface area to the outfeed tray.
8. The apparatus for pressure testing of a semiconductor device according to claim 1, wherein said air pressure valve is an ADAM device.
9. The apparatus for pressure testing of semiconductor devices according to claim 1, wherein the first and second electronically controlled valves are EP devices.
10. The apparatus for pressure testing of semiconductor devices of claim 9, further comprising a human machine interface configured to set operating parameters of the EP device, the operating parameters of the EP device including airflow rate and/or airflow velocity.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122742432.8U CN216594540U (en) | 2021-11-10 | 2021-11-10 | Pressure test equipment for semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122742432.8U CN216594540U (en) | 2021-11-10 | 2021-11-10 | Pressure test equipment for semiconductor device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216594540U true CN216594540U (en) | 2022-05-24 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122742432.8U Active CN216594540U (en) | 2021-11-10 | 2021-11-10 | Pressure test equipment for semiconductor device |
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| CN (1) | CN216594540U (en) |
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2021
- 2021-11-10 CN CN202122742432.8U patent/CN216594540U/en active Active
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