CN216581536U - Full-paper packaging structure of electronic product - Google Patents

Abstract

The utility model discloses an all-paper packaging structure for electronic products, comprising a packaging box made of paper material and a buffer assembly, the packaging box comprises a box body and a box cover for closing the box body, and the The buffer assembly is arranged in the box body, the buffer assembly includes a surrounding buffer plate, the surrounding buffer plate has a concave position, and the top and bottom ends of the concave position are respectively clamped with a plurality of upper buffer plates and a plurality of lower buffer plates. , the recess, the upper buffer plate and the lower buffer plate cooperate to form a space for accommodating electronic products. The utility model is all made of paper materials. On the one hand, it is made of the same material as a whole, so the appearance is more harmonious and beautiful, and it can be recycled 100%, which is more environmentally friendly; The buffer effect is formed, and the overall size and volume are smaller, which can reduce the materials used for the entire packaging structure, thereby reducing the overall packaging cost.

Description

An all-paper packaging structure for electronic products

technical field

The utility model relates to the technical field of electronic product packaging, in particular to an all-paper packaging structure for electronic products.

Background technique

For some electronic products such as OPS (Open Pluggable Specification, open pluggable computer module), it is necessary to set a buffer lining in the packaging box during packaging to prevent the electronic products in the packaging box from being subjected to impacts such as collisions during transportation. damage occurs.

At present, the buffer linings of these electronic products are mainly made of EPS (polystyrene foam) or EPE (polyethylene foam cotton), which have the following problems: (1) It is necessary to make corresponding products according to the size and shape of different products. The cost of mold opening is high, which will lead to an increase in packaging costs; (2) it is difficult to degrade naturally and cannot be recycled, which is easy to pollute the environment and is very unenvironmental.

Utility model content

The purpose of the utility model is to provide a full paper packaging structure for electronic products, which is all made of paper materials, does not need to be formed by molds, has low production costs, can be recycled 100%, and is more environmentally friendly.

For reaching the above-mentioned purpose, the utility model adopts the following technical solutions:

An all-paper packaging structure for electronic products, comprising a packaging box made of paper material and a buffer assembly, the packaging box includes a box body and a box cover for closing the box body, and the buffer assembly is arranged on the Inside the box, the buffer assembly includes a surrounding buffer plate, the surrounding buffer plate has a concave position, and the top and bottom ends of the concave position are respectively clamped with a number of upper buffer plates and a number of lower buffer plates. , the upper buffer plate and the lower buffer plate cooperate to form a space for accommodating electronic products.

Preferably, the number of the upper buffer plate and the lower buffer plate is two respectively, the two upper buffer plates are respectively clamped on both sides of the top end of the recess, and the two lower buffer plates are spaced apart from each other. It is clamped on both sides of the bottom end of the recess.

Preferably, the surrounding buffer plate includes a bottom plate and a buffer portion connected to the peripheral side of the bottom plate, and the buffer portion surrounds the bottom plate to form the recess.

Preferably, the upper buffer plate is connected with a card plate, the buffer portion is hollow inside, and the buffer portion has a card hole for the card plate to be inserted into the inside thereof.

Preferably, the clamping plate includes a limiting segment and a connecting segment, the width of the limiting segment is greater than the width of the connecting segment, the limiting segment is clamped on the inner side of the buffer portion, and the connecting segment is used for Connect the upper buffer plate and the limiting section.

Preferably, the size and structure of the upper buffer plate and the lower buffer plate are the same.

Preferably, a placement slot for placing the antenna is further provided in the box body.

Preferably, a folded plate is connected to one side of the box body, and the folded plate is folded into the box body to form the placement slot.

Preferably, the upper buffer plate is partially covered with the placement groove.

Preferably, a fixing buckle for fixing the antenna is provided on the side wall of the placing slot.

Preferably, the packaging box is a swing-lid packaging box, the box cover is connected to one side of the box mouth of the box body, the box cover is connected with a gusset plate, and two sides of the gusset plate are respectively provided with The buckle ear of the box body is fastened.

Compared with the prior art, the beneficial effects of the present utility model are:

The utility model is all made of paper materials. On the one hand, it is made of the same material as a whole, so the appearance is more harmonious and beautiful, and it can be recycled 100%, which is more environmentally friendly; The buffer effect is formed, and the overall size and volume are smaller, which can reduce the material used for the entire packaging structure, thereby reducing the overall packaging cost.

At the same time, the utility model realizes buffering on the top and bottom of the electronic product through a plurality of upper buffer plates and a plurality of lower buffer plates which are respectively clamped to the top and bottom ends of the surrounding buffer plates at intervals, which is different from the use of a whole plate in the prior art. Compared with realizing the formation of buffers on the top and bottom of electronic products, it can further save materials and reduce costs.

Description of drawings

The utility model will be described in further detail below according to the accompanying drawings and embodiments.

Fig. 1 is the exploded schematic diagram of the whole paper packaging structure of the electronic product described in the embodiment of the present utility model;

FIG. 2 is a schematic assembly diagram of an all-paper packaging structure of an electronic product according to an embodiment of the present invention;

3 is a schematic structural diagram of the packaging box of the full paper packaging structure of the electronic product according to the embodiment of the present invention;

4 is a schematic structural diagram of the surrounding buffer plates of the all-paper packaging structure of the electronic product according to the embodiment of the present invention;

FIG. 5 is a schematic structural diagram of the upper buffer board of the full paper packaging structure of the electronic product according to the embodiment of the present invention.

In the picture:

1. Packing box; 11. Box body; 12. Box cover; 121. Buckle plate; 122. Buckle ear; 13. Placement slot; 131. Fixed buckle; 14. Folding plate; 211, the bottom plate; 212, the buffer part; 2121, the card hole; 22, the upper buffer plate; 221, the card plate;

Detailed ways

In order to make the technical problems solved by the present utility model, the technical solutions adopted and the technical effects achieved more clearly, the embodiments of the technical solutions of the present utility model are described in further detail below. Obviously, the described embodiments are only a part of the present utility model. examples, but not all examples. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative work fall within the protection scope of the present invention.

In the description of the present invention, unless otherwise expressly specified and limited, the terms "connected", "connected" and "fixed" should be understood in a broad sense, for example, it may be a fixed connection, a detachable connection, or an integrated ; It can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, and it can be the internal connection of two elements or the interaction relationship between the two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood in specific situations.

In the present invention, unless otherwise expressly specified and limited, a first feature "on" or "under" a second feature may include the first and second features in direct contact, or may include the first and second features The features are not in direct contact but through additional features between them. Also, the first feature being "above", "over" and "above" the second feature includes the first feature being directly above and obliquely above the second feature, or simply means that the first feature is level higher than the second feature. The first feature is "below", "below" and "below" the second feature includes the first feature being directly below and diagonally below the second feature, or simply means that the first feature has a lower level than the second feature.

As shown in FIGS. 1 to 5 , an embodiment of the present invention provides a full paper packaging structure for electronic products, including a packaging box 1 and a buffer assembly 2 made of paper materials. The packaging box 1 includes a box body 11 and The box cover 12 is used to close the box body 11. The buffer assembly 2 is arranged in the box body 11. The buffer assembly 2 includes a surrounding buffer plate 21, and the surrounding buffer plate 21 has a concave position. A plurality of upper buffer plates 22 and a plurality of lower buffer plates 23, the above-mentioned recesses, the upper buffer plates 22 and the lower buffer plates 23 cooperate to form a space for accommodating electronic products.

When using this embodiment, the electronic product is placed in the space formed by the surrounding buffer plate 21, the upper buffer plate 22 and the lower buffer plate 23, wherein the surrounding buffer plate 21 supports and buffers the surrounding of the electronic product, and the upper buffer plate 22 The pair and the lower buffer plate 23 respectively form support and buffer for the top and bottom of the electronic product, so as to prevent the electronic product from being damaged due to impact during transportation.

It can be understood that the electronic product packaged by this embodiment may be, but not limited to, electronic products such as OPS (OpenPluggable Specification, open pluggable computer module), tablet computer, learning machine or router.

This embodiment is all made of paper materials. On the one hand, it is made of the same material as a whole, so the appearance is more harmonious and beautiful, and it can be recycled 100%, which is more environmentally friendly; The buffer effect is formed, and the overall size and volume are smaller, which can reduce the material used for the entire packaging structure, thereby reducing the overall packaging cost.

At the same time, in this embodiment, the top and bottom of the electronic product are supported and buffered by a plurality of upper buffer plates 22 and a plurality of lower buffer plates 23 that are respectively clamped to the top and bottom ends of the surrounding buffer plates 21 at intervals, which is similar to that used in the prior art. Compared with the realization of forming a buffer for the top and bottom of an electronic product with a whole board, it can further save materials and reduce costs.

It should be noted that the packaging box 1, the surrounding buffer boards 21, the upper buffer board 22 and the lower buffer board 23 can be processed by folding or bonding paper materials such as corrugated cardboard. Specifically, in this embodiment, the packaging box 1 , the surrounding buffer plates 21 , the upper buffer plate 22 and the lower buffer plate 23 are respectively formed by punching a whole piece of corrugated cardboard into shapes and lines and then folding.

The packaging box 1 , the surrounding buffer plates 21 , the upper buffer plate 22 and the lower buffer plate 23 of this embodiment are formed by folding, and can be stacked and transported in the unfolded state after the processing in the processing plant to reduce the occupation of the packaging box 1 . Warehouse space and transportation space, saving logistics costs.

Preferably, the number of the upper buffer plate 22 and the lower buffer plate 23 is two respectively, the two upper buffer plates 22 are respectively clamped on both sides of the top of the above-mentioned concave position, and the two lower buffer plates 23 are respectively clamped in the above-mentioned concave position at intervals. Both sides of the bottom end. The two upper buffer plates 22 and the two lower buffer plates 23 in this embodiment cooperate to form support and buffer for the top and bottom of the electronic product to prevent the electronic product from being damaged.

It can be understood that, in some other embodiments, the number of the upper buffer plate 22 and the lower buffer plate 23 can also be reasonably set according to actual needs. For example, the number of the upper buffer plate 22 and the lower buffer plate 23 can be three, Four or more.

Specifically, as shown in FIG. 4 , the surrounding buffer plate 21 includes a bottom plate 211 and a buffer portion 212 connected to the peripheral side of the bottom plate 211 . Sides form support and cushion to prevent damage to electronics.

Further, as shown in FIG. 5 , the upper buffer plate 22 is connected with a clip plate 221 , the buffer portion 212 is hollow inside, and the buffer portion 212 has a clip hole 2121 for the clip plate 221 to be clipped into the inside thereof. The upper buffer plate 22 of this embodiment is clamped into the buffer portion 212 by the card plate 221 thereon, so as to prevent the upper buffer plate 22 from moving during use and losing support and buffering for the electronic product.

The clamping plate 221 includes a limiting segment 2211 and a connecting segment 2212. The width of the limiting segment 2211 is greater than the width of the connecting segment 2212. The limiting segment 2211 is clamped to the inner side of the buffer portion 212. The connecting segment 2212 is used to connect the upper buffer plate 22 and the limiting segment. Bit field 2211.

Correspondingly, the latching hole 2121 includes a protruding section for the limiting section 2211 to protrude into the buffer portion 212 and an accommodating section for accommodating the connecting section 2212 , wherein the sizes of the protruding section and the accommodating section are respectively the same as those of the limiting section 2211 and the accommodating section. The connecting segment 2212 matches.

When the buffer plate 22 is installed in this embodiment, the limiting section 2211 is first extended into the buffer portion 212 through the extending section of the clamping hole 2121, and then the connecting section 2212 is embedded in the accommodating section of the clamping hole 2121. The width of the connecting section 2212 is greater than the width of the connecting section 2212. When the connecting section 2212 is embedded in the receiving section of the card hole 2121, the limiting section 2211 will be clamped inside the receiving section of the card hole 2121, so that the upper buffer plate 22 and the surrounding buffer plates 21 are fixed. connect.

Further, the size and structure of the upper buffer plate 22 and the lower buffer plate 23 in this embodiment are the same. Correspondingly, the clamping structure of the lower buffer plate 23 and the surrounding buffer plates 21 is the same as that of the upper buffer plate 22 , and details are not described herein again in this embodiment.

In this embodiment, the size and structure of the upper buffer plate 22 and the lower buffer plate 23 are set to be the same, and only one material can be produced during production, and there is no need to produce two different materials, which can facilitate the upper buffer plate 22 and the lower buffer plate 23. of molding production. Of course, in other embodiments, the size and shape of the upper buffer plate 22 and the lower buffer plate 23 can also be set to be different.

As shown in FIGS. 2-3 , in another embodiment of the present invention, the box body 11 is further provided with a placement slot 13 for placing the antenna. By setting the placement slot 13 in the box body 11, when packaging electronic products with antennas such as OPS (Open Pluggable Specification, open pluggable computer module), routers, etc., the placement slot 13 can accommodate the antenna of the electronic product. The whole packaging structure appears more compact.

Specifically, as shown in FIG. 1 , a folding plate 14 is connected to one side of the box body 11 , and the folding plate 14 is folded into the box body 11 to form a placement groove 13 .

Further, as shown in FIG. 2 , the upper buffer plate 22 is partially covered with the placement groove 13 . The upper buffer plate 22 of this embodiment is partially covered on the placement slot 13, which can effectively prevent the antenna in the placement slot 13 from being damaged due to jumping during transportation.

Further, as shown in FIG. 3 , the side wall of the placement slot 13 also has a fixing buckle 131 for fixing the antenna. In this embodiment, when the antenna is placed in the placement slot 13, the antenna can be fixed through the fixing buckle 131 to prevent the antenna from being damaged due to shaking in the placement slot 13 during transportation, especially when the electronic product is equipped with short antennas or multiple antennas. When there is one antenna, the fixing buckle 131 can respectively fix the short antenna or multiple antennas, so as to prevent the short antenna or multiple antennas placed in the placement slot 13 from being damaged due to collision during transportation. Of course, when the size of the antenna equipped with the electronic product is close to or matches the size of the placement slot, the antenna may not be fixed by the fixing buckle 131 .

It should be noted that, the number of the fixing buckles 131 can be reasonably set according to actual needs, which is not limited in this embodiment.

As shown in FIGS. 1-3 , in another embodiment of the present invention, the packaging box 1 is a rocking-lid packaging box 1 , the box cover 12 is connected to one side of the box mouth of the box body 11 , and the box cover 12 is connected to There is a buckle plate 121 , and two sides of the buckle plate 121 are respectively provided with buckle ears 122 that can be buckled with the box body 11 . When this embodiment is used, the box cover 12 is closed on the box opening of the box body 11 and is buckled with the box body 11 through the buckle ears 122 , thereby closing the box body 11 .

It can be understood that, in other embodiments, the packaging box 1 may also adopt other structural forms such as a heaven and earth box.

The embodiment of the present invention can realize the packaging of electronic products through the following steps:

(1) Complete the molding of each part of the packaging structure;

(2) Put the surrounding buffer plates 21 into the box body 11;

(3) Put the two lower buffer plates 23 into both sides of the concave bottom end of the surrounding buffer plates 21 and engage with the buffer portions 212 of the surrounding buffer plates 21;

(4) fold the folded plate 14 of the packaging box 1 inward to form the placement slot 13;

(5) The electronic product is bagged into the concave position of the surrounding buffer plate 21, and the antenna of the electronic product is placed in the placement groove 13 and fixed by the fixing buckle 131;

(6) Put the two lower buffer plates 23 into both sides of the top of the concave position of the surrounding buffer plates 21 and engage with the buffer portions 212 of the surrounding buffer plates 21;

(7) Tightly cover the box cover 12 on the box body 11 to complete the packaging of the electronic product.

In the description herein, it should be understood that the terms "upper", "lower", "left", "right" and other azimuth or positional relationships are only for the convenience of description and simplification of operations, rather than indicating or implying The device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the present invention. In addition, the terms "first" and "second" are only used for distinction in description and have no special meaning.

In the description of this specification, reference to the description of the terms "an embodiment", "example" etc. means that a particular feature, structure, material or characteristic described in connection with the embodiment or example is included in at least one embodiment or example. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiment or example.

In addition, it should be understood that although this specification is described in terms of embodiments, not each embodiment only includes an independent technical solution, and this description in the specification is only for the sake of clarity, and those skilled in the art should take the specification as a whole , the technical solutions in each embodiment can also be appropriately combined to form other implementations that can be understood by those skilled in the art.

The technical principle of the present invention has been described above with reference to the specific embodiments. These descriptions are only for explaining the principle of the present invention, and should not be construed as limiting the protection scope of the present invention in any way. Based on the explanations herein, those skilled in the art can think of other specific embodiments of the present invention without creative efforts, which will also fall within the protection scope of the present invention.

Claims (11)

1. The utility model provides a full paper packaging structure of electronic product, its characterized in that includes packing carton (1) and buffer unit (2) made by the paper material, packing carton (1) includes box body (11) and is used for sealing lid (12) of box body (11), buffer unit (2) set up in box body (11), buffer unit (2) are including buffer board (21) all around, buffer board (21) have concave position all around, concave position top and bottom are separated the joint respectively and have a plurality of buffer boards (22) and a plurality of lower buffer board (23), concave position go up buffer board (22) with buffer board (23) cooperation forms the space that is used for holding electronic product down.

2. The all-paper packaging structure of electronic products according to claim 1, wherein the number of the upper buffer plates (22) and the lower buffer plates (23) is two, the two upper buffer plates (22) are respectively clamped at two sides of the top end of the concave portion at intervals, and the two lower buffer plates (23) are respectively clamped at two sides of the bottom end of the concave portion at intervals.

3. The all-paper packaging structure of electronic products according to claim 1, wherein the peripheral buffer board (21) comprises a bottom board (211) and a buffer part (212) connected to the peripheral side of the bottom board (211), and the buffer part (212) encloses the concave position on the bottom board (211).

4. The all-paper packaging structure of electronic products according to claim 3, wherein the upper buffer board (22) is connected with a card board (221), the buffer part (212) is hollow, and the buffer part (212) is provided with a card hole (2121) for the card board (221) to be clamped into.

5. The all-paper packaging structure of electronic products according to claim 4, wherein the card board (221) comprises a position-limiting section (2211) and a connecting section (2212), the width of the position-limiting section (2211) is greater than the width of the connecting section (2212), the position-limiting section (2211) is clamped inside the buffer portion (212), and the connecting section (2212) is used for connecting the upper buffer board (22) and the position-limiting section (2211).

6. The all-paper packaging structure of electronic products according to claim 1, wherein the upper buffer plate (22) and the lower buffer plate (23) are identical in size and structure.

7. The all-paper packaging structure of electronic products according to claim 1, characterized in that a placing slot (13) for placing an antenna is further arranged in the box body (11).

8. The all-paper packaging structure of electronic products according to claim 7, characterized in that a flap (14) is connected to one side of the box body (11), and the flap (14) is folded inwards the box body (11) to form the placing groove (13).

9. The all-paper packaging structure of electronic products according to claim 7, wherein the upper buffer board (22) partially covers the placement slot (13).

10. The all-paper packaging structure of electronic products according to claim 7, characterized in that the side wall of the placing slot (13) is provided with a fixing buckle (131) for fixing the antenna.

11. The all-paper packaging structure of electronic products according to any one of claims 1-10, wherein the packaging box (1) is a rocking-lid type packaging box (1), the box cover (12) is connected to one side of the box opening of the box body (11), a buckle plate (121) is connected to the box cover (12), and two sides of the buckle plate (121) are respectively provided with a buckle lug (122) capable of being buckled with the box body (11).

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