CN1970394B

CN1970394B - Packing box

Info

Publication number: CN1970394B
Application number: CN2005101248363A
Authority: CN
Inventors: 季君炎
Original assignee: Pegatron Corp
Current assignee: Pegatron Corp
Priority date: 2005-11-22
Filing date: 2005-11-22
Publication date: 2012-05-02
Anticipated expiration: 2025-11-22
Also published as: CN1970394A

Abstract

It relates to a packing box for an electric device. The packing box comprises an outside box, a No.1 wave plate and a No.2 wave plate. The No.1 wave plate is set inside one side of the outside box, with at least one No.1 latching section, suitable for clipping a part of the clipping electrical device. The No.2 wave plate is set at the other side inside the outside box, suitable for the surface of the adjacent electric device.

Description

Packing box

Technical field

The invention relates to a kind of packing box, and particularly relevant for a kind of adopt the wave plate as buffer structure to hold the packing box of electronics package.

Background technology

In recent years, electronic product is constantly weeded out the old and bring forth the new, thereby the packing of product problem of following is also complicated day by day.The purpose of the packing of product is to guarantee the safety of product when circulation is transported and sell furnishings.Because product often needs long-range to transport, if the packaging structure of product or design error, do not meet the mechanics requirements such as load carrying ability and compressive resistance of packing, the integraty of dress commodity in then will definitely influencing.Particularly, for the transportation and the storage of comparatively fragile electronics package, or carrying and depositing after customer's purchase, more need provide safekeeping to prevent the external force injury.

The packing box of common electronics package uses following several kinds of buffer structures usually.Wherein a kind of buffer structure is that (Extruded Polyethylene EPE) produces foam-rubber cushion for former material, and cuts and be bonded, and the production method of this kind buffer structure needs higher cost with polyethylene foamed; Alternative buffer structure then is with polystyrene foamed (Expanded Polystyrene; EPS) (be commonly called as Styrofoam) and be former material; And behind foaming, forming out reservation shape, this kind uses Styrofoam can't reclaim the demand that does not meet environmental protection as the buffer structure of material; Also having a kind of buffer structure is to be former material with paper pulp, form with the paper pulp molding mould given shape buffering usefulness pack inner box, so that the space that holds electronics package to be provided, but this kind buffer structure make in the design comparatively complicated.

Therefore, traditional packing box be used for protect these buffer structures of electronics package to comprise that cost is high, do not meet many disappearances such as environmental protection demand and design complexities height.

Summary of the invention

One of the object of the invention is providing a kind of packing box, in order to holding an electronics package, and cushions external impact.

Another object of the present invention is providing a kind of packing box, in order to reduce cost of manufacture.

Another object of the present invention is providing a kind of packing box, in order to meet the demand of environmental protection.

Based on above-mentioned or other purpose, the present invention proposes a kind of packing box, is applicable to hold an electronics package.This packing box comprises an outer container, one first wave plate and one second wave plate.The first wave plate is in-to-in one side that is disposed at outer container, and has at least one first engagement section, and it is suitable for engaging the part of electronics package.The second wave plate is the in-to-in opposite side that is disposed at outer container, and is suitable for the surface of butt electronics package.

In one embodiment of this invention, first engagement section can be an opening.In addition, the width of electronics package equals the width of first engagement section in fact.

In one embodiment of this invention, the first wave plate can be formed by at least one paper tape institute warpage.In addition, paper tape can have many broken lines, comes the warpage paper tape to form a plurality of waves via these broken lines.

In one embodiment of this invention, first engagement section is positioned at least one place of these waves of the first wave plate.

In one embodiment of this invention, at least one latter end of paper tape is to have one first buckling parts and one second buckling parts, and first buckling parts is fastened on second buckling parts.In addition, first buckling parts can be a cramp, and second buckling parts can be a button hole.

In one embodiment of this invention, the second wave plate can have at least one second engagement section, and it is suitable for engaging another part of electronics package.

In one embodiment of this invention, second engagement section can be an opening.In addition, the width of electronics package equals the width of second engagement section in fact.

In one embodiment of this invention, the second wave plate can be formed by at least one paper tape institute warpage.In addition, paper tape can have many broken lines, comes the warpage paper tape to form a plurality of waves via these broken lines.

In one embodiment of this invention, second engagement section is positioned at these waves at least one of the second wave plate.

In one embodiment of this invention, at least one latter end of paper tape is to have one the 3rd buckling parts and one the 4th buckling parts, and the 3rd buckling parts is fastened on the 4th buckling parts.In addition, the 3rd buckling parts can be a cramp, and the 4th buckling parts can be a button hole.

Based on above-mentioned,, in order to cushioning external impact, thereby reduce the possibility that electronics package sustains damage because the present invention adopts the buffer structure of wave plate as packing box.

For let above and other objects of the present invention, feature and advantage can be more obviously understandable, hereinafter is special lifts preferred embodiment, and cooperates appended graphicly, elaborates as follows.

Description of drawings

Fig. 1 is the exploded drawings for a kind of packing box of the embodiment of the invention;

Fig. 2 A is the open cube display for the first wave plate of Fig. 1;

Fig. 2 B is the expansion planar view for the first wave plate of Fig. 1;

Fig. 2 C is the block diagram for the first wave plate of Fig. 1;

Fig. 3 A to Fig. 3 D illustrates the process that the electronics package of Fig. 1 is contained in packing box;

Fig. 4 A to Fig. 4 D illustrates the lateral plan of Fig. 3 A to Fig. 3 D respectively.

[primary clustering nomenclature]

100: electronics package

200: packing box

210: outer container

220: the first wave plates

222,222 (a), 222 (b), 222 (c) and 222 (d): first engagement section

224: wave

226a: first buckling parts

226b: second buckling parts

228a: the 3rd buckling parts

228b: the 4th buckling parts

230: the second wave plates

232: the second engagement sections

L1～L9: broken line

The specific embodiment

Fig. 1 is the exploded drawings for a kind of packing box of the embodiment of the invention.Please refer to Fig. 1, packing box 200 of the present invention is to be applicable to hold an electronics package 100.This electronics package 100 for example is disc players such as CD-ROM drive or hard disk.Packing box 200 comprises an outer container 210, one first wave plate 220 and one second wave plate 230.The first wave plate 220 is configured in the in-to-in bottom side of outer container 210, and has at least one first engagement section 222, and it is suitable for engaging the part of electronics package 100.In addition, 230 of the second wave plates are the in-to-in top sides that is disposed at outer container 210, and are suitable for the surface of butt electronics package 100.

Fig. 2 A, Fig. 2 B and Fig. 2 C are respectively open cube display, expansion planar view and the block diagram of the first wave plate of Fig. 1.Please be simultaneously with reference to figure 1, Fig. 2 A to Fig. 2 C.The first wave plate 220 can be formed by paper tape institute warpage.This paper tape can be to have many broken line L1～L9, and comes the warpage paper tape to form a plurality of waves 224 (with reference to figure 2C) via these broken lines L1～L9.These waves 224 can absorb the suffered external shock power of packing box 200, and then protection is positioned at electronics package 100 wherein.

The first wave plate 220 has a plurality of first engagement sections 222 (a), 222 (b), 222 (c) and 222 (d); Wherein these first engagement sections 222 (a) and 222 (b) are positioned at the wave 224 of the middle of the first wave plate 220, and these first engagement sections 222 (c) and 222 (d) then lay respectively at two waves 224 at the two ends of the first wave plate 220.

In order to let electronics package 100 can receive the restriction of these first engagement sections 222 (a), 222 (b), 222 (c) and 222 (d) effectively, the width of the electronics package 100 of Fig. 1 can equal the width of these first engagement sections 222 (a), 222 (b), 222 (c) and 222 (d) in fact.In addition, the electronics package 100 of Fig. 1 is sticked in the then visual actual demand of the degree of depth of these first engagement sections 222 (a), 222 (b), 222 (c) and 222 (d) and adjusts.In the present embodiment, first engagement section 222 (a), 222 (b), 222 (c) and 222 (d) are all opening, in order to the part of engaging electronics package 100.For example, in Fig. 2 C, these first engagement sections 222 (a) are crossed over broken line L4 and L6 respectively with 222 (b), and these first engagement sections 222 (c) and 222 (d) then are adjacent to broken line L2 and L8 respectively.

According to present embodiment, the latter end of the first wave plate 220 can have one first buckling parts 226a and cooresponding one second buckling parts 226b.The first buckling parts 226a can be a cramp, and the second buckling parts 226b can be a button hole.With paper tape behind broken line L1 and L2 warpage, the first buckling parts 226a (being cramp) just can snap among the second buckling parts 226b (being button hole).

According to present embodiment, another latter end of the first wave plate 220 also can have one the 3rd buckling parts 228a and cooresponding one the 4th buckling parts 228b.The 3rd buckling parts 228a can be a cramp, and the 4th buckling parts 228b can be a button hole.With paper tape behind broken line L8 and L9 warpage, the 3rd buckling parts 228a (being cramp) just can snap among the 4th buckling parts 228b (being button hole).

Therefore; Through by the fastening between the fastening between the first buckling parts 226a and the second buckling parts 226b and the 3rd buckling parts 228a and the 4th buckling parts 228b; The shape of these waves 224 of the first wave plate 220 just can be kept as much as possible, thereby has preferable structural strength.

In another embodiment, the first wave plate 220 also can only have single wave 224, and then has at least one first engagement section 222 on it, but such embodiment is not with graphic representation.

Compared to the first wave plate 220, the second wave plate 230 of Fig. 1 also can be formed by paper tape institute warpage, and the structure of the second wave plate 230 more can be similar in appearance to the structure of the first wave plate 220 of Fig. 2 A to Fig. 2 C.

Fig. 3 A to Fig. 3 D illustrates the flow process that the electronics package of Fig. 1 is contained in packing box, and Fig. 4 A to Fig. 4 D illustrates the lateral plan of Fig. 3 A to Fig. 3 D respectively.Shown in Fig. 3 A and Fig. 4 A, the first wave plate 220 is placed in the in-to-in bottom side of outer container 210.After, with the electronics package 100 that will pack put into outer container 210, and make the part of electronics package 100 be sticked in these first engagement sections 222 of the first wave plate 220, shown in Fig. 3 B and Fig. 4 B.Then, the second wave plate 230 is disposed at the in-to-in top side of outer container 210, and makes these first engagement sections 222 of the wave plate 220 of winning be sticked in another part of electronics package 100, shown in Fig. 3 C and Fig. 4 C.At last, cover a plurality of cover plates (not indicating) of outer container 210, to accomplish the package handling of electronics package 100, shown in Fig. 3 D and Fig. 4 D.

What deserves to be mentioned is; Shown in Fig. 3 D and Fig. 4 D; Receive the restriction of these first engagement sections 222 of the first wave plate 220; Make electronics package 100 be restricted in the position with respect to outer container 210 on the XY plane of Fig. 3 D and on the negative Z direction, and through come limiting electronic device 100 position with respect to outer container 210 on the positive Z direction of Fig. 3 D by the second wave plate 230.

The second above-mentioned wave plate 230 also can not have second engagement section 232; But the surface of the opposite side of direct butt to electronics package 100; And cooperate the first wave plate 220 to come the position of limiting electronic device 100 with respect to outer container 210, but such embodiment is not with graphic representation.

In sum, the present invention adopts the packing box of wave plate as buffer structure, thus can cushion external impact, to reduce the possibility that electronics package sustains damage.In addition, wave plate of the present invention can be shaped through cut strip material (for example paper tape) and warpage by a cover plane cutting die, so can simplify the processing procedure and the cost of wave plate (being buffer structure).In addition, when the wave plate of packing box of the present invention adopts paper as its manufacturing materials, can meet the demand of environmental protection.

Though the present invention discloses as above with preferred embodiment; Right its is not in order to limit the present invention; Anyly have the knack of this art; Do not breaking away from the spirit and scope of the present invention, when can doing a little change and retouching, so protection scope of the present invention is as the criterion when looking accompanying the claim person of defining.

Claims

1. a packing box is applicable to and holds an electronics package, it is characterized in that, comprising:

One outer container;

One first wave plate is wavy structure, and the said first wave plate is formed by paper tape institute warpage; Said paper tape has many broken lines; Form a plurality of waves via the said paper tape of said broken line warpage, the said first wave plate is disposed at in-to-in one side of said outer container, and the said first wave plate has at least one opening; Said opening is crossed over wherein broken line of said broken line, and the width of said opening equals the width of electronics package; And

One second wave plate is wavy structure, is disposed at the in-to-in opposite side of said outer container, and is suitable for the surface of the said electronics package of butt.

2. packing box as claimed in claim 1 is characterized in that, said first engagement section is positioned at least one place of said wave of the said first wave plate.

3. packing box as claimed in claim 1 is characterized in that, at least one latter end of said paper tape has one first buckling parts and one second buckling parts, and said first buckling parts is fastened on this second buckling parts.

4. packing box as claimed in claim 3 is characterized in that, said first buckling parts is a cramp, and said second buckling parts is a button hole.

5. packing box as claimed in claim 1 is characterized in that, the said second wave plate has at least one second engagement section, and it is suitable for engaging another part of this electronics package.

6. packing box as claimed in claim 5 is characterized in that, said second engagement section is an opening.

7. packing box as claimed in claim 5 is characterized in that the width of said electronics package equals the width of said second engagement section.

8. packing box as claimed in claim 1 is characterized in that, the said second wave plate is to be formed by at least one paper tape institute warpage.

9. packing box as claimed in claim 8 is characterized in that said paper tape has many broken lines, comes a plurality of waves of back formation of this paper tape of warpage via said broken line.

10. packing box as claimed in claim 1 is characterized in that, at least one latter end of said paper tape has one the 3rd buckling parts and one the 4th buckling parts, and the 3rd buckling parts is fastened on the 4th buckling parts.

11. packing box as claimed in claim 10 is characterized in that, said the 3rd buckling parts is a cramp, and said the 4th buckling parts is a button hole.