CN216565757U - Binding equipment for printed circuit board and flexible circuit board - Google Patents

Abstract

The utility model relates to the technical field of display screen production equipment, and discloses binding equipment for a printed circuit board and a flexible circuit board, which comprises a manipulator module, a binding module and a binding module, wherein the manipulator module can clamp the printed circuit board and drive the printed circuit board to move; the prepressing module comprises a first loading platform assembly, a first supporting assembly and a first pressure head assembly, the manipulator module can convey the printed circuit board to the first supporting assembly, the first pressure head assembly can adsorb and drive the flexible circuit board to move up and down so as to be preliminarily pressed with the printed circuit board, and the first loading platform assembly can support and drive the glass substrate to lift up and down synchronously with the first pressure head assembly; the vision module comprises a telescopic arm, a first camera and a second camera, wherein the first camera and the second camera are respectively arranged on the upper side and the lower side of the telescopic arm, the telescopic arm can extend into the space between the first supporting component and the first pressure head component to respectively collect images of the flexible circuit and the printed circuit board, and the manipulator module can adjust the position of the printed circuit board according to image information collected by the first camera and the second camera.

Description

Binding equipment for printed circuit board and flexible circuit board

Technical Field

The utility model relates to the technical field of display screen production equipment, in particular to binding equipment for a printed circuit board and a flexible circuit board.

Background

The display screen generally includes a glass substrate, a flexible circuit board and a printed circuit board, and in an actual production process, mechanical connection and electrical connection need to be realized among the three.

The bonding process is a process of disposing an anisotropic conductive film at a proper position (a contact position for electrical connection on a printed circuit board/flexible circuit board) between a flexible circuit board and a glass substrate/flexible circuit board and a printed circuit board, and then performing hot pressing at a certain temperature and pressure to achieve electrical and mechanical connection. When the display screen is assembled, the flexible circuit board and the glass substrate are bonded, at this time, the first end of the flexible circuit board is mechanically and electrically connected with the glass substrate, and the second end of the flexible circuit board extends out of the glass substrate; and then, bonding the printed circuit board and the second end of the flexible circuit board together to realize the electrical connection and the mechanical connection between the glass substrate and the printed circuit board.

In the prior art, in the process of bonding the printed circuit board and the flexible circuit board, a mark point on the glass substrate is usually used as a positioning reference, however, a connection position between the flexible circuit board and the glass substrate may have a certain error, and the flexible circuit board has deviations due to different types and sizes, and if the mark point on the glass substrate is still used as the bonding reference between the flexible circuit board and the printed circuit board, the bonding position of the printed circuit board is inaccurate.

Therefore, a bonding apparatus for a printed circuit board and a flexible circuit board is needed to solve the above technical problems.

SUMMERY OF THE UTILITY MODEL

The utility model aims to provide bonding equipment for a printed circuit board and a flexible circuit board, which has high precision in bonding positions of the printed circuit board and the flexible circuit board.

In order to achieve the purpose, the utility model adopts the following technical scheme:

the utility model provides a bonding equipment of printed circuit board and flexible circuit board, the first end and the glass substrate of flexible circuit board are connected, and this bonding equipment of printed circuit board and flexible circuit board includes:

the manipulator module can clamp the printed circuit board and drive the printed circuit board to move;

the pre-pressing module comprises a first carrier assembly, a first supporting assembly and a first pressure head assembly positioned above the first supporting assembly, the manipulator module can convey the printed circuit board to the first supporting assembly, the first pressure head assembly can adsorb the second end of the flexible circuit board and drive the flexible circuit board to move up and down so as to be preliminarily pressed with the printed circuit board, and the first carrier assembly can support the glass substrate and drive the glass substrate and the first pressure head assembly to lift synchronously;

the vision module comprises a telescopic arm, a first camera and a second camera, wherein the first camera and the second camera are respectively arranged on the upper side and the lower side of the telescopic arm, the telescopic arm can extend into the space between the first supporting component and the first pressure head component, so that the first camera collects images of the flexible circuit board, the second camera collects images of the printed circuit board, and the manipulator module can adjust the position of the printed circuit board according to image information collected by the first camera and the second camera.

As an alternative, the first support assembly comprises:

the first sliding table is provided with a sliding rail;

the first supporting blocks can slide along the sliding rail, and can be supported below the contacts on the printed circuit board and also can support the flexible circuit board.

As an optional solution, the first stage assembly comprises:

a first base which can move along a preset direction;

the first bearing platform is movably connected to the first base, can bear the glass substrate and can move up and down relative to the first base.

As an alternative, the first ram assembly comprises:

the first connecting piece is movably connected to the first mounting seat and can move up and down relative to the first mounting seat;

the first pressing head bodies are connected with the first connecting piece, and each first pressing head body can adsorb different positions of the flexible circuit board and is opposite to the contact on the flexible circuit board.

As an optional scheme, the bonding apparatus for the printed circuit board and the flexible circuit board further includes a main pressing module disposed on one side of the pre-pressing module, the main pressing module includes a second stage assembly, a second support assembly and a second pressing head assembly located above the second support assembly, the second stage assembly can support the glass substrate, the second support assembly can bear the flexible circuit board and the printed circuit board after preliminary pressing, and the second pressing head assembly can further press the flexible circuit board and the printed circuit board.

As an optional solution, the present molding module further includes a third camera, the third camera can acquire an image of the flexible circuit board on the second support assembly, and the robot module can adjust the positions of the preliminarily laminated printed circuit board and the flexible circuit board relative to the second pressing head assembly according to the image acquired by the third camera.

As an optional scheme, the bonding apparatus for the printed circuit board and the flexible circuit board further includes a first carrying assembly, the first carrying assembly can grab the glass substrate and drive the glass substrate to move, the robot module can drive the preliminarily laminated flexible circuit board and the printed circuit board to move together with the first carrying assembly synchronously, so as to convey the printed circuit board onto the second stage assembly, and convey the preliminarily laminated flexible circuit board and the printed circuit board onto the second supporting assembly.

As an optional scheme, the bonding apparatus for a printed circuit board and a flexible circuit board further includes a second carrying assembly, the second carrying assembly can grab the glass substrate on the second stage assembly, and the robot module can drive the printed circuit board and the flexible circuit board after further pressing to move together with the second carrying assembly in synchronization.

As an optional solution, the bonding apparatus for a printed circuit board and a flexible circuit board further includes a loading module, and the loading module includes:

a support plate capable of supporting the printed circuit board;

the first baffle is arranged on one side of the supporting plate and can limit the first end face of the printed circuit board;

the at least two adjusting components are arranged on one side of the supporting plate, the output end of each adjusting component is connected with a second baffle plate, the at least two second baffle plates can limit a second end face of the printed circuit board together, and the second end face is perpendicular to the first end face;

the first pushing assembly is arranged on one side of the supporting plate and is opposite to the first baffle plate, and the first pushing assembly can push the printed circuit board to enable the printed circuit board to be abutted against the first baffle plate;

the second pushing assembly is arranged on one side of the supporting plate and opposite to the second baffle plate, and can push the printed circuit board to enable the printed circuit board to be abutted against the second baffle plate.

As an alternative, the robot module comprises:

a host component;

and the host machine component can enable each mechanical arm to clamp the printed circuit board and drive the printed circuit board to move and rotate in a horizontal plane.

The utility model has the beneficial effects that:

when the bonding equipment for the printed circuit board and the flexible circuit board is used, the flexible circuit board and the glass substrate which are bonded together are respectively placed on the first support component and the first carrier component, then the first pressure head component adsorbs the flexible circuit board and is matched with the first carrier component to lift to a certain height, so that the flexible circuit board leaves the upper surface of the first support component, and then the manipulator module places the printed circuit board on the first support component; then the vision assembly extends between the flexible circuit board and the printed circuit board and respectively collects image information of the flexible circuit board and the printed circuit board, and whether a second contact used for bonding on the printed circuit board is right opposite to a first contact used for bonding on the flexible circuit board is judged through comparison, if yes, the first pressure head assembly and the first carrying platform assembly synchronously drive the flexible circuit board and the glass substrate to move downwards together so as to preliminarily press the flexible circuit board and the printed circuit board; if the first contact point and the second contact point are not right opposite, the manipulator module adjusts the position of the printed circuit board on the first supporting component until the second contact point and the first contact point are right opposite, and then pressing is carried out. According to the bonding equipment for the printed circuit board and the flexible circuit board, the actual position information of the printed circuit board and the flexible circuit board is collected, compared and adjusted, so that the bonding precision between the flexible circuit board and the printed circuit board is ensured.

Drawings

Fig. 1 is a schematic structural diagram of a bonding apparatus for a printed circuit board and a flexible circuit board according to an embodiment of the present invention in one view;

FIG. 2 is a schematic diagram of a bonding apparatus for a printed circuit board and a flexible circuit board according to another aspect of the present invention;

FIG. 3 is a schematic structural diagram of a load module according to an embodiment of the present invention;

FIG. 4 is a schematic diagram of a robot module according to an embodiment of the present invention;

FIG. 5 is a schematic structural view of a pre-pressing module, a vision module and a first handling assembly according to an embodiment of the present invention;

fig. 6 is a schematic structural diagram of the main press module and the second handling assembly according to the embodiment of the present invention.

In the figure:

1-a manipulator module; 11-a host component; 12-a robotic arm; 121-a support arm; 122-a jaw assembly; 123-a rotary drive assembly;

2-a pre-pressing module; 21-a first stage assembly; 211-a first base; 212-a first carrier stage; 22-a first support member; 221-a first slide table; 222-a first support block; 23-a first ram assembly; 231-a first mount; 232-a first connector; 233-first ram body;

3-a vision module; 31-a telescopic arm; 32-a first camera; 33-a second camera;

4-local pressure module; 41-a second stage assembly; 411-a second base; 412-a second carrier stage; 42-a second support assembly; 421-a second sliding table; 422-a second support block; 43-a second ram assembly; 431-a second mount; 432-a second connector; 433 — a second ram body; 44-a third camera;

51-a first handling assembly; 52-a second handling assembly;

6-loading a module; 61-a support plate; 62-a first baffle; 63-an adjustment assembly; 64-a second baffle; 65-a first pushing assembly; 66-a second pushing assembly;

71-a first guide rail; 72-a second guide rail; 73-a third guide rail; 74-a fourth guide rail;

8-mounting the platform.

Detailed Description

The present invention will be described in further detail with reference to the accompanying drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the utility model and are not limiting of the utility model. It should be further noted that, for the convenience of description, only some of the structures related to the present invention are shown in the drawings, not all of the structures.

In the description of the present invention, unless expressly stated or limited otherwise, the terms "connected," "connected," and "fixed" are to be construed broadly, e.g., as meaning permanently connected, removably connected, or integral to one another; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.

In the present invention, unless otherwise expressly stated or limited, "above" or "below" a first feature means that the first and second features are in direct contact, or that the first and second features are not in direct contact but are in contact with each other via another feature therebetween. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.

In the description of the present embodiment, the terms "upper", "lower", "right", etc. are used in an orientation or positional relationship based on that shown in the drawings only for convenience of description and simplicity of operation, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used only for descriptive purposes and are not intended to have a special meaning.

The embodiment provides bonding equipment for a printed circuit board and a flexible circuit board, which can be used for bonding the printed circuit board and the flexible circuit board in the production process of a display screen, wherein the flexible circuit board is bonded on a glass substrate before the bonding equipment. Specifically, the first end nation of flexible circuit board is fixed on the glass substrate to realize the electricity between glass substrate and the flexible circuit board and be connected with mechanical connection, the second end of flexible circuit board stretches out outside the glass substrate, and the second end of flexible circuit board is provided with a plurality of first contacts, is provided with a plurality of second contacts on the printed circuit board, and every second contact is used for corresponding and the butt joint of a first contact is in order to realize the nation between the printed circuit board flexible circuit board.

Fig. 1 is a schematic structural diagram of a bonding apparatus for a printed circuit board and a flexible circuit board provided in this embodiment at one viewing angle, and fig. 2 is a schematic structural diagram of the bonding apparatus for the printed circuit board and the flexible circuit board provided in this embodiment at another viewing angle, as shown in fig. 1-2, the bonding apparatus for the printed circuit board and the flexible circuit board provided in this embodiment includes a machine loading module 6, a pre-pressing module 2, a pressing module 4 and a manipulator module 1, wherein the loading module 6 can bear the printed circuit board to be bonded, the pre-pressing module 2 is used for accurately positioning and preliminarily pressing the printed circuit board and the flexible circuit board, the pressing module 4 is used for further pressing the printed circuit board and the flexible circuit board after preliminary pressing to ensure the reliability of bonding, the manipulator module 1 can clamp the printed circuit board and hold the printed circuit board in the loading module 6, The pre-pressing module 2 and the main pressing module 4 are conveyed.

Specifically, in this embodiment, as shown in fig. 1 and fig. 2, the bonding apparatus for the printed circuit board and the flexible circuit board includes a mounting platform 8, the loading module 6, the pre-pressing module 2, the pressing module 4, and the manipulator module 1 are all disposed on the mounting platform 8, the pre-pressing module 2 and the pressing module 4 are sequentially arranged along the X direction, the loading module 6 is disposed on one side of the pre-pressing module 2, and the manipulator module 1 is disposed in the middle of the loading module 6, the pre-pressing module 2, and the pressing module 4, so as to facilitate transporting the printed circuit board to a desired position. In other embodiments, the specific arrangement of the loading module 6, the pre-pressing module 2, the present pressing module 4, and the robot module 1 is not limited.

Fig. 3 is a schematic structural diagram of the loading module 6 provided in this embodiment, and the loading module 6 can perform preliminary positioning on the printed circuit board, so that the manipulator module 1 can more accurately establish a relative position relationship between the manipulator module and the printed circuit board when grabbing the printed circuit board, thereby facilitating subsequent accurate transportation and position adjustment of the printed circuit board. Specifically, as shown in fig. 3, the loading module 6 includes a supporting plate 61, a first blocking plate 62, a second blocking plate 64, at least two adjusting components 63, a first pushing component 65 and a second pushing component 66, wherein the supporting plate 61 is disposed on the mounting platform 8, an external automatic device or a human being can place the printed circuit board on the supporting plate 61, the first blocking plate 62 is disposed on one side of the supporting plate 61, the first blocking plate 62 can limit a first end surface of the printed circuit board, the first pushing component 65 is disposed on one side of the supporting plate 61 and is opposite to the first blocking plate 62, the first pushing component 65 can push the printed circuit board to make the printed circuit board abut against the first blocking plate 62, the at least two adjusting components 63 are disposed on one side of the supporting plate 61, an output end of each adjusting component 63 is connected to one second blocking plate 64, the at least two second blocking plates 64 can limit a second end surface of the printed circuit board together, the second end surface is perpendicular to the first end surface, the second pushing assembly 66 is disposed on one side of the supporting plate 61 and opposite to the second baffle 64, and the second pushing assembly 66 can push the printed circuit board to make the printed circuit board abut against the second baffle 64. The cooperation of the first stop plate 62 and the first pusher assembly 65 can define the position of the printed circuit board in one direction and the cooperation of the plurality of second stop plates 64 and the second pusher assembly 66 can define the position of the printed circuit board in the other direction, thereby completely defining the position of the printed circuit board on the loading module 6 and ensuring that the robot module 1 corresponds to the position reference of the printed circuit board before gripping the printed circuit board.

Specifically, in this embodiment, as shown in fig. 3, the loading module 6 includes two sets of adjusting assemblies 63, each of the adjusting assemblies 63 may be a micrometer, and the second baffle 64 is connected to the movable end of the micrometer, so that each of the adjusting assemblies 63 can accurately adjust the position of the corresponding second baffle 64, and it is ensured that the two second baffles 64 are located on the same plane. Preferably, the first pushing assembly 65 includes a linear cylinder and a push plate, the push plate is connected to the output end of the linear cylinder and is disposed opposite to the first baffle 62, and the linear cylinder can drive the push plate to move close to the first baffle 62, so that the printed circuit board is limited between the first baffle 62 and the push plate. In other embodiments, the driving manner of the first pushing assembly 65 is not limited thereto. It is understood that the structure and operation principle of the second pushing assembly 66 are the same as those of the first pushing assembly 65, and will not be described herein.

Fig. 4 is a schematic structural diagram of the robot module 1 provided in this embodiment, as shown in fig. 2 and 4, the robot module 1 includes a host assembly 11 and a plurality of robot arms 12, wherein the plurality of robot arms 12 are respectively connected to the host assembly 11, and the host assembly 11 enables each robot arm 12 to clamp the printed circuit board and drive the printed circuit board to move and rotate on a plane parallel to the mounting platform 8. The plurality of robot arms 12 may work simultaneously to accomplish the transportation of the printed circuit boards at different stages, respectively, and improve the work efficiency of the entire printed circuit board and flexible circuit board bonding apparatus. Specifically, in the present embodiment, the robot module 1 includes four robot arms 12, and in other embodiments, the specific number of the robot arms 12 may be flexibly set, which is not limited herein.

Preferably, as shown in fig. 4, the robot arm 12 includes a plurality of sections of supporting arms 121, a rotation driving assembly 123 and a clamping jaw assembly 122, the plurality of sections of supporting arms 121 are connected in sequence, a first section of supporting arm 121 is connected with the main machine assembly 11 and can rotate relative to the main machine assembly 11 with an axis perpendicular to the plane of the mounting platform 8, the rotation driving assembly 123 is connected with a last section of supporting arm 121, and the clamping jaw assembly 122 is connected with an output end of the rotation driving assembly 123. The support arms 121 are hinged to each other, so that the clamping jaw assembly 122 can be driven to flexibly move in a horizontal plane range. Preferably, the rotary driving assembly 123 can move up and down relative to the last section of the support arm 121, so as to drive the clamping jaw assembly 122 to move up and down. Specifically, a screw is arranged on the rotary driving component 123, a motor and a nut capable of rotating relative to the support arm 121 are arranged on the last section of support arm 121, the screw is in threaded connection with the nut, and when the motor drives the nut to rotate, the screw drives the rotary driving component 123 and the clamping jaw component 122 to move up and down relative to the nut together. Alternatively, the rotation driving assembly 123 may be a motor, and an output end of the motor is connected to the clamping jaw assembly 122, so as to drive the clamping jaw assembly 122 to rotate around an output axis of the motor, and further, angle adjustment of the printed circuit board clamped by the clamping jaw assembly 122 may be achieved. Further, the clamping jaw assembly 122 includes a clamping driving source, a fixed clamping jaw and a movable clamping jaw, wherein the clamping driving source can drive the movable clamping jaw to move close to or away from the fixed clamping jaw, so as to realize the action of clamping or unclamping the printed circuit board. Of course, the jaw assembly 122 in other embodiments may be any one of the prior art without departing from the inventive concept of the present application, and is not limited thereto.

Fig. 5 is a schematic structural diagram of the pre-pressing module 2, the vision module 3, and the first carrying assembly 51 provided in this embodiment, as shown in fig. 1 and fig. 5, the pre-pressing module 2 includes a first stage assembly 21, a first support assembly 22, and a first pressure head assembly 23 located above the first support assembly 22, an external automation device or a manual operation may place the glass substrate and the flexible circuit board that have been bonded together into the pre-pressing module 2, and support the glass substrate on the first stage assembly 21, and a second end (an end extending out of the glass substrate) of the flexible circuit board is supported on the first support assembly 22. The first pressure head assembly 23 can move up and down and adsorb the flexible circuit board on the first support assembly 22, and the first stage assembly 21 can drive the glass substrate to move up and down synchronously with the first pressure head assembly 23, so that the flexible circuit board leaves the first support assembly 22. The robot module 1 can then transfer the printed circuit board onto the first support assembly 22 with the flexible circuit board spaced above the printed circuit board. The bonding equipment of printed circuit board and flexible circuit board still includes vision module 3, vision module 3 sets up the one side at pre-compaction module 2, vision module 3 includes flexible arm 31, set up first camera 32 and the second camera 33 in the upper and lower both sides of flexible arm 31 respectively, flexible arm 31 can stretch into between first supporting component 22 and the first pressure head subassembly 23, so that first camera 32 is just to the flexible circuit board, and gather the image of flexible circuit board, second camera 33 is just to printed circuit board and gather the image of printed circuit board. The vision module 3 can compare the images acquired by the first camera 32 and the second camera 33, and judge whether a second contact for bonding on the printed circuit board is just opposite to a first contact for bonding on the flexible circuit board, if so, the first pressure head assembly 23 and the first carrier assembly 21 move to drive the flexible circuit board and the glass substrate to move downwards together, and the flexible circuit board and the printed circuit board are preliminarily pressed; if the two contacts are not right opposite, the manipulator module 1 adjusts the position of the printed circuit board on the first support component 22 until the second contact and the first contact are right opposite, and then the press-fitting is performed. The bonding equipment of the printed circuit board and the flexible circuit board of the embodiment collects the actual position information of the printed circuit board and the flexible circuit board respectively, compares the actual position information with the actual position information and adjusts the actual position information, and therefore the bonding precision between the flexible circuit board and the printed circuit board is guaranteed. Alternatively, in the present embodiment, the first camera 32 and the second camera 33 may be CCD cameras. Further, the upper side of the telescopic arm 31 may be provided with a plurality of first cameras 32, and the lower side may be provided with a plurality of second cameras 33, so that the accuracy of capturing images may be improved by increasing the number of cameras.

Specifically, in this embodiment, as shown in fig. 5, the first pressing head assembly 23 includes a first mounting seat 231, a first connecting member 232, and a plurality of first pressing head bodies 233, the first connecting member 232 is movably connected to the first mounting seat 231 and can move up and down relative to the first mounting seat 231, the plurality of first pressing head bodies 233 are connected to the first connecting member 232, each first pressing head body 233 is correspondingly provided with a vacuum suction port, so as to suck different positions of the flexible circuit board, each first pressing head body 233 is correspondingly arranged opposite to a first contact on the flexible circuit board, so that when the first pressing head assembly 23 drives the flexible circuit board to move down, a second contact on the printed circuit board is just pressed to a position where the first contact on the flexible circuit board contacts. Alternatively, the specific structure for driving the first connecting member 232 to move up and down may be a linear cylinder. Further, in the present embodiment, the number of the first indenter bodies 233 is two, and in other embodiments, the number of the first indenter bodies 233 may be set as required, and is not limited herein.

Preferably, as shown in fig. 5, the first support assembly 22 includes a first sliding table 221 and a plurality of first support blocks 222, a sliding rail is disposed on the first sliding table 221, the plurality of first support blocks 222 are disposed on the sliding rail and can slide along the sliding rail, and the first support blocks 222 can be supported below the second contact on the printed circuit board, so as to ensure that the position on the printed circuit board that needs to be pressed can be stably supported, and the first support assembly 22 only supports the position of the second contact, which can make the volume of the first support assembly 22 smaller. It should be noted that, in the process of preliminary press-fitting the printed circuit board and the flexible circuit board, the mechanical arm 12 always keeps the clamping effect on the printed circuit board, so as to ensure the position stability of the printed circuit board in the preliminary press-fitting process, and further ensure the precision of the preliminary press-fitting process. In addition, when the printed circuit board specification and model are different, the position of the second contact on the printed circuit board specification and model can be different, then through adjusting the position of the first supporting block 222 on the first sliding table 221, the first supporting block 222 can be ensured to correspond to the position of the second contact on different printed circuit boards, so that the bonding equipment of the printed circuit board and the flexible circuit board can bond the printed circuit boards of different specifications, and the application range is improved.

It should be noted that, when the glass substrate is placed on the first stage assembly 21, the first support block 222 can also support the flexible circuit board, so as to ensure that the first pressure head assembly 23 can smoothly absorb the flexible circuit board.

Preferably, as shown in fig. 5, the first stage assembly 21 includes a first base 211 and a first carrying platform 212, the first base 211 can move along the X direction, the first carrying platform 212 is movably connected to the first base 211, the first carrying platform 212 can carry the glass substrate and can move up and down relative to the first base 211, so that the glass substrate can be driven to move up and down to keep the synchronous lifting and lowering with the flexible circuit board. When the shape and specification of the glass substrate are different, the first supporting stage 212 can better support the glass substrate by adjusting the position of the first base 211 along the predetermined direction. Specifically, in the present embodiment, the mounting platform 8 is provided with the first rail 71, the first rail 71 extends in the X direction, and the first base 211 is provided on the first rail 71 and can slide relative to the first rail 71, thereby achieving position adjustment. Alternatively, the position of the first base 211 on the first guide rail 71 may be adjusted by an automatic device such as a linear air cylinder, or may be adjusted manually, which is not limited herein. Further, the lifting movement of the first bearing table 212 relative to the first base 211 may be driven by a linear cylinder, or may be completed by other components or assemblies capable of outputting linear movement, and the setting may be selected according to actual needs.

Fig. 6 is a schematic structural diagram of the die block 4 and the second carrying assembly 52 provided in this embodiment, as shown in fig. 1 and 6, the die block 4 includes a second stage assembly 41, a second support assembly 42, and a second pressing head assembly 43 located above the second support assembly 42, after the flexible circuit board and the printed circuit board are preliminarily pressed, the printed circuit board and the flexible circuit board pressed into a whole are placed on the second support assembly 42, the glass substrate is placed on the second stage assembly 41, and then the second pressing head assembly 43 moves downward to be close to the flexible circuit board, so that the flexible circuit board and the printed circuit board can be further pressed. In this embodiment, the temperature and applied pressure of the second ram assembly 43 are greater than the temperature and applied pressure of the first ram assembly 23, respectively.

Because the flexible circuit board needs to be adsorbed by the vacuum adsorption port at the pre-pressing module 2, if the temperature of the first pressing head assembly 23 is too high or the pressure is too high, an indentation is generated at a position on the flexible circuit board opposite to the vacuum adsorption port of the first pressing head assembly 23, and the appearance of the flexible circuit board is affected. In the embodiment, the prepressing module 2 and the pressing module 4 are arranged, so that the bonding process between the flexible circuit board and the printed circuit board is divided into two steps, namely, the prepressing module 2 is used for accurately positioning the printed circuit board and the flexible circuit board and performing primary pressing, and the bonding precision is ensured; then, the printed circuit board and the flexible circuit are further pressed by the pressing module 4, so that bonding firmness is guaranteed, and indentation cannot be generated on the printed circuit board.

Preferably, as shown in fig. 1, 5 and 6, the bonding apparatus for the pcb and the flexible pcb further includes a first carrying assembly 51, the first carrying assembly 51 can grab the glass substrate and drive the glass substrate to move, and the robot module 1 can drive the preliminarily laminated pcb and the pcb to move together with the first carrying assembly 51 synchronously, so as to transport the pcb onto the second stage assembly 41 and transport the preliminarily laminated pcb and the pcb onto the second support assembly 42. Through the preliminary printed circuit board, flexible circuit board and the glass substrate after bonding of first transport subassembly 51 and robotic arm 12 cooperation transport to can avoid connecting this moment and taking place the position dislocation between insecure printed circuit board and the flexible circuit board, further guarantee printed circuit board and flexible circuit board's bonding precision.

Specifically, in the present embodiment, the mounting platform 8 is provided with the second guide rail 72, the second guide rail 72 extends in the X direction and extends from the side of the pre-pressing module 2 to the side of the present pressing module 4, and the first carrier unit 51 is slidably engaged with the second guide rail 72, so that the glass substrate is carried from the first stage unit 21 to the second stage unit 41. Alternatively, the mechanism for driving the first carrying assembly 51 to move on the second guide rail 72 may be a motor and a screw nut, or may be a component or an assembly, such as a linear motor, capable of performing a linear motion of conveying, and is not limited herein. Further, first transport subassembly 51 includes a plurality of vacuum adsorption mouths, and the glass substrate can be adsorbed to the vacuum adsorption mouth to the realization drives the glass substrate motion. It should be noted that the moving speed of the first carrying assembly 51 along the second guiding rail 72 for carrying the glass substrate is the same as the speed of the robot 12 for carrying the primarily laminated pcb and fpc, so as to avoid the connection position of the fpc and the glass substrate from being pulled.

Preferably, as shown in fig. 6, the present press module 4 further includes a third camera 44, the third camera 44 can capture an image of the flexible circuit board on the second support assembly 42, and the robot module 1 can adjust the positions of the preliminarily laminated printed circuit board and the flexible circuit board relative to the second press head assembly 43 according to the image captured by the third camera 44. Thereby ensuring that the pressing position when the second pressing head component 43 further presses the flexible circuit board is accurate. Alternatively, in this embodiment, the third camera 44 may be a CCD camera.

Preferably, as shown in fig. 6, the second supporting assembly 42 includes a second sliding table 421 and a plurality of second supporting blocks 422, a sliding rail is disposed on the second sliding table 421, the plurality of second supporting blocks 422 are disposed on the sliding rail and can slide along the sliding rail, and the second supporting blocks 422 can be supported below the second contacts on the printed circuit board, so as to ensure that positions on the printed circuit board that need to be pressed can be stably supported, and the second supporting assembly 42 only supports the positions of the second contacts, so that the volume of the second supporting assembly 42 is small. It should be noted that, in the process of further pressing the printed circuit board and the flexible circuit board, the mechanical arm 12 always keeps the clamping function on the printed circuit board, thereby ensuring the position stability of the printed circuit board in the process of further pressing and further ensuring the bonding precision. In addition, when the printed circuit board specification model is different, the position of the second contact on it can be different, then through adjusting the position of second supporting shoe 422 on second slip table 421, can guarantee that second supporting shoe 422 can correspond with the second contact position on the printed circuit board of different specifications, make printed circuit board and flexible circuit board's binding equipment can bind the printed circuit board of different specifications, improve application scope. It should be noted that the position adjustment of the second supporting block 422 on the sliding table may be driven by an automated device, or may be manually adjusted, and is not limited herein.

Preferably, as shown in fig. 6, the second pressing head assembly 43 includes a second mounting base 431, a second connecting member 432 and a plurality of second pressing head bodies 433, the second connecting member 432 is movably connected to the second mounting base 431 and can move up and down relative to the second mounting base 431, the plurality of second pressing head bodies 433 are connected to the second connecting member 432, and each second pressing head body 433 is disposed opposite to the first contact on the flexible circuit board, so as to ensure the accuracy of the pressing position of the second pressing head body 433. Alternatively, the specific structure for driving the second connecting part 432 to move up and down may be a linear cylinder.

Preferably, as shown in fig. 6, the second stage assembly 41 includes a second base 411 and a second carrying table 412, the second base 411 can move along the X direction, the second carrying table 412 is movably connected to the second base 411, the second carrying table 412 can carry the glass substrate, and when the shape and specification of the glass substrate are different, the second carrying table 412 can better carry the glass substrate by adjusting the position of the second base 411 along the preset direction. Specifically, in the present embodiment, the mounting platform 8 is provided with the third rail 73, the third rail 73 extends in the X direction, and the second base 411 is provided on the third rail 73 and can slide relative to the third rail 73, thereby achieving the position adjustment. Alternatively, the position of the second base 411 on the second guide rail 72 may be adjusted by an automatic device such as a linear air cylinder, or may be adjusted manually, which is not limited herein.

Preferably, as shown in fig. 6, the bonding apparatus for the pcb and the flexible pcb further includes a second carrying assembly 52, the second carrying assembly 52 can grab the glass substrate on the second stage assembly 41, and the robot module 1 can drive the pcb and the flexible pcb after being further bonded to move together with the second carrying assembly 52 synchronously, so as to convey the completely bonded pcb, flexible pcb and glass substrate to a downstream station. It should be noted that the moving speed of the second carrying assembly 52 along the fourth guiding rail 74 for carrying the glass substrate is the same as the speed of the robot 12 for carrying the printed circuit board and the flexible circuit board after further pressing, and the second carrying assembly 52 and the robot 12 carry the flexible circuit board cooperatively, so as to avoid the pulling of the connection position of the flexible circuit board and the printed circuit board and the glass substrate, respectively.

Specifically, in the present embodiment, the mounting platform 8 is provided with the fourth guide rail 74, the fourth guide rail 74 extends in the direction perpendicular to the X direction and is provided on the main press module 4 side, and the second carrier unit 52 is slidably engaged with the fourth guide rail 74, so that the glass substrate is carried from the second stage unit 41 to the downstream station. Alternatively, the mechanism for driving the second carrying assembly 52 to move on the fourth guide rail 74 may be a motor structure matching with the screw nut, or may be a component or assembly such as a linear motor capable of realizing linear conveying movement. Further, the second carrying assembly 52 includes a plurality of vacuum absorption ports, and the vacuum absorption ports can absorb the glass substrate, so as to drive the glass substrate to move.

It should be understood that the above-described embodiments of the present invention are merely examples for clearly illustrating the utility model and are not to be construed as limitations of the embodiments of the present invention, but may be modified in various embodiments and applications by those skilled in the art according to the spirit of the present invention, and the content of the present description should not be construed as a limitation of the present invention. Any modification, equivalent replacement, and improvement made within the spirit and principle of the present invention should be included in the protection scope of the claims of the present invention.

Claims (10)

1. The utility model provides a PCB and flexible circuit board's nation decides equipment, the first end and the glass substrate of flexible circuit board are connected, its characterized in that, PCB and flexible circuit board's nation decides equipment includes:

the manipulator module (1) can clamp the printed circuit board and drive the printed circuit board to move;

the pre-pressing module (2) comprises a first carrying platform assembly (21), a first supporting assembly (22) and a first pressure head assembly (23) located above the first supporting assembly (22), the manipulator module (1) can convey the printed circuit board to the first supporting assembly (22), the first pressure head assembly (23) can adsorb the second end of the flexible circuit board and drive the flexible circuit board to move up and down to be preliminarily pressed with the printed circuit board, and the first carrying platform assembly (21) can support the glass substrate and drive the glass substrate and the first pressure head assembly (23) to synchronously lift up and down;

visual module (3), set up respectively including flexible arm (31) first camera (32) and second camera (33) of the upper and lower both sides of flexible arm (31), flexible arm (31) can stretch into first supporting component (22) with between first pressure head subassembly (23), so that first camera (32) are gathered the image of flexible circuit board, second camera (33) are gathered the image of printed circuit board, manipulator module (1) can be based on first camera (32) with the image information adjustment that second camera (33) were gathered the position of printed circuit board.

2. A bonding apparatus of a printed circuit board and a flexible circuit board according to claim 1, wherein the first support member (22) comprises:

the first sliding table (221) is provided with a sliding rail;

the first supporting blocks (222) can slide along the sliding rails, and the first supporting blocks (222) can be supported below contacts on the printed circuit board and can also support the flexible circuit board.

3. A bonding apparatus of a printed circuit board and a flexible circuit board according to claim 1, wherein said first stage assembly (21) comprises:

a first base (211), the first base (211) being movable in a preset direction;

the first bearing table (212) is movably connected to the first base (211), and the first bearing table (212) can bear the glass substrate and can move up and down relative to the first base (211).

4. A bonding apparatus of a printed circuit board and a flexible circuit board according to claim 1, wherein the first ram assembly (23) comprises:

the connecting device comprises a first mounting seat (231) and a first connecting piece (232), wherein the first connecting piece (232) is movably connected to the first mounting seat (231) and can move up and down relative to the first mounting seat (231);

the first pressure head bodies (233) are connected with the first connecting pieces (232), and each first pressure head body (233) can adsorb different positions of the flexible circuit board and is opposite to a contact on the flexible circuit board.

5. A bonding apparatus for PCB and PCB according to any of claims 1-4, further comprising a local pressing module (4) disposed at one side of the pre-pressing module (2), wherein the local pressing module (4) comprises a second stage assembly (41), a second supporting assembly (42) and a second pressing head assembly (43) located above the second supporting assembly (42), the second stage assembly (41) can support the glass substrate, the second supporting assembly (42) can carry the PCB and the PCB after the preliminary pressing, and the second pressing head assembly (43) can further press the PCB and the PCB.

6. A bonding apparatus for printed circuit boards and flexible circuit boards according to claim 5, wherein the local press module (4) further comprises a third camera (44), the third camera (44) is capable of capturing an image of the flexible circuit board on the second support assembly (42), and the robot module (1) is capable of adjusting the position of the preliminarily bonded printed circuit board and flexible circuit board with respect to the second press head assembly (43) according to the image captured by the third camera (44).

7. A bonding apparatus for PCB and flexible circuit board according to claim 5, further comprising a first handling assembly (51), wherein the first handling assembly (51) can grab the glass substrate and move the glass substrate, and the robot module (1) can move the preliminarily bonded flexible circuit board and PCB together with the first handling assembly (51) synchronously to transfer the PCB onto a second stage assembly (41) and the preliminarily bonded flexible circuit board and PCB onto the second support assembly (42).

8. The bonding apparatus for printed circuit boards and flexible circuit boards according to claim 5, further comprising a second handling assembly (52), wherein the second handling assembly (52) can grasp the glass substrate on the second stage assembly (41), and the robot module (1) can drive the printed circuit boards and the flexible circuit boards after further pressing to move together with the second handling assembly (52) synchronously.

9. The bonding apparatus of printed circuit board and flexible circuit board according to any of claims 1-4, characterized in that the bonding apparatus of printed circuit board and flexible circuit board further comprises a loading module (6), the loading module (6) comprising:

a support plate (61) capable of supporting the printed circuit board;

the first baffle plate (62) is arranged on one side of the supporting plate (61), and the first baffle plate (62) can limit the first end face of the printed circuit board;

the at least two adjusting components (63) are arranged on one side of the supporting plate (61), the output end of each adjusting component (63) is connected with a second baffle plate (64), the at least two second baffle plates (64) can limit a second end face of the printed circuit board together, and the second end face is perpendicular to the first end face;

a first pushing assembly (65) arranged on one side of the supporting plate (61) and opposite to the first baffle plate (62), wherein the first pushing assembly (65) can push the printed circuit board to enable the printed circuit board to be abutted against the first baffle plate (62);

and the second pushing assembly (66) is arranged on one side of the supporting plate (61) and is opposite to the second baffle plate (64), and the second pushing assembly (66) can push the printed circuit board to enable the printed circuit board to be abutted against the second baffle plate (64).

10. Bonding device of printed circuit board and flexible circuit board according to any of claims 1-4, characterized in that the manipulator module (1) comprises:

a host component (11);

the mechanical arms (12) are respectively connected to the host machine component (11), and the host machine component (11) can enable each mechanical arm (12) to clamp the printed circuit board and drive the printed circuit board to move and rotate in a horizontal plane.

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