CN216565719U - Circuit board and electronic device - Google Patents

Abstract

The application discloses circuit board and electronic equipment, circuit board include base plate, trompil, shielding layer, at least one electrically conductive piece and insulating part, and the trompil runs through along the thickness direction of base plate and sets up on the base plate, and at least a part of shielding layer is established on the pore wall of trompil. At least one insulation part is arranged in the opening and arranged between the shielding layer and the conductive part. The characteristic impedance of the signal transmission part formed by the shielding layer, the conductive piece and the insulating part is controllable, the impedance in the whole signal transmission path can be continuous, the loss in the signal transmission process is reduced, the integrity of signal transmission is ensured, the shielding layer can provide a complete barrier, the risks of external radiation of the conductive piece and interference of various external electromagnetic signals are effectively avoided, and the overall performance of the signal transmitted by the conductive piece is better.

Description

Circuit board and electronic device

Technical Field

The application belongs to the technical field of electronic products, and particularly relates to a circuit board and electronic equipment.

Background

In the related art, as shown in fig. 1, in order to realize the electrical connection between the circuit board 100 'and other components and increase the density of the circuit board 100', pads are disposed on the front and back surfaces of the circuit board 100 ', and the circuit board 100' can realize the soldering connection with the components in the up-down direction through the pads disposed on the front and back surfaces, thereby realizing the signal transmission function.

However, with the development of electronic devices, the requirements for signal transmission rate are higher and higher, for example, USB is developed from 2.0 to 3.1, the speed is increased from 0.48Gbps to 10Gbps, the increase of functional rate puts higher requirements on the signal integrity of the circuit board 100 ', and the shielding requirements on the circuit board 100' are higher and higher.

At present, for shielding of a high-speed signal pad 102 ', in the related art, a circle of ground pads 101' are arranged around the high-speed signal pad 102 ', although the ground pads 101' can play a certain shielding role, gaps exist between adjacent pads, complete shielding cannot be achieved, and risks of external radiation and interference by external signals still exist.

SUMMERY OF THE UTILITY MODEL

The application aims at providing a circuit board and electronic equipment, and at least one of the problems of poor shielding effect is solved.

In order to solve the technical problem, the present application is implemented as follows:

in a first aspect, an embodiment of the present application provides a circuit board, including:

a substrate;

the opening penetrates through the substrate along the thickness direction of the substrate;

at least one part of the shielding layer is arranged on the hole wall of the opening;

at least one conductive member positioned within the opening;

and the insulating part is arranged between the shielding layer and the conductive piece.

In a second aspect, an embodiment of the present application provides an electronic device, including: the circuit board provided by the first aspect.

In an embodiment of the application, the circuit board comprises a substrate, an opening, a shielding layer, at least one conductive member and an insulating part, wherein the opening penetrates through the substrate along the thickness direction of the substrate, and at least one part of the shielding layer is arranged on a hole wall of the opening. Optionally, the shielding layer is entirely disposed on the wall of the opening. Or one part of the shielding layer is arranged on the hole wall of the opening, and the other part of the shielding layer extends to the surface of the substrate. The conductive piece is arranged in the opening and provided with conductive connecting ends distributed along the thickness direction of the substrate, and the conductive connecting ends are used for being welded with the parts to be connected positioned on the circuit board in the up-down direction. The insulating part is arranged between the shielding layer and the conductive piece and positioned in the opening, and the insulating part plays a role in electrically insulating the shielding layer from the conductive piece. The shield layer, the insulating portion, and the conductive member constitute a signal transmission portion.

Can set up the shielding part on the pore wall of trompil in this application, the shielding part sets up around the periphery of electrically conductive piece, to high-speed signal transmission's electrically conductive piece, the shielding layer can provide complete barrier for it, realizes shielding completely, effectively avoids electrically conductive piece to external radiation and by the risk of outside all kinds of electromagnetic signal interference for electrically conductive piece transmitted signal's wholeness can the preferred, satisfies electronic equipment's demand.

Additional aspects and advantages of the present application will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the present application.

Drawings

The above and/or additional aspects and advantages of the present application will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:

fig. 1 is a partial structural view of a circuit board in the related art;

FIG. 2 is a schematic diagram of a circuit board according to a first embodiment of the present application;

FIG. 3 is a schematic diagram of a process for making a circuit board according to one embodiment of the present application;

FIG. 4 is a schematic diagram of another process for making a circuit board according to one embodiment of the present application;

FIG. 5 is a schematic view of a circuit board according to a second embodiment of the present application;

FIG. 6 is a schematic diagram of a circuit board according to a third embodiment of the present application;

fig. 7 is a sectional view taken along a-a in fig. 6.

Reference numerals:

100 ' circuit board, 101 ' ground pad, 102 ' high speed signal pad,

100 circuit board, 110 substrate, 121 first opening, 122 second opening, 130 shielding layer, 140 conductive member, 150 insulating part.

Detailed Description

Reference will now be made in detail to embodiments of the present application, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are exemplary only for the purpose of explaining the present application and are not to be construed as limiting the present application. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

The features of the terms first and second in the description and in the claims of the present application may explicitly or implicitly include one or more of such features. In the description of the present application, "a plurality" means two or more unless otherwise specified. In addition, "and/or" in the specification and claims means at least one of connected objects, a character "/" generally means that a preceding and succeeding related objects are in an "or" relationship.

In the description of the present application, it is to be understood that the terms "central," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the present application and to simplify the description, and are not intended to indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and are therefore not to be considered limiting of the present application.

In the description of the present application, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present application can be understood in a specific case by those of ordinary skill in the art.

The circuit board 100 and the electronic device according to the embodiment of the present application are described below with reference to fig. 2 to 7.

As shown in fig. 2, 5, 6 and 7, according to an embodiment of the first aspect of the present application, there is provided a circuit board 100, including a substrate 110, an opening, a shielding layer 130, at least one conductive member 140 and an insulating portion 150, wherein the opening is opened on the substrate 110 in a thickness direction of the substrate 110. At least a portion of the shielding layer 130 is disposed on the walls of the opening. At least one conductive member 140 is positioned within the opening. The insulating part 150 is disposed between the shielding layer 130 and the conductive member 140.

The circuit board 100 according to the embodiment of the present application includes a substrate 110, an opening, a shielding layer 130, a conductive member 140, and an insulating portion 150, wherein the opening is formed on the substrate 110 in a thickness direction of the substrate 110, and at least a portion of the shielding layer 130 is formed on a wall of the opening. Optionally, the shielding layer 130 is entirely disposed on the walls of the opening. Alternatively, a portion of the shielding layer 130 is disposed on the wall of the opening, and another portion of the shielding layer 130 extends to the surface of the substrate 110. The conductive member 140 is disposed inside the opening, and the conductive member 140 has conductive connection terminals distributed in a thickness direction of the substrate 110 for soldering with the parts to be connected located in the up-down direction of the circuit board 100. Insulating part 150 is disposed between shielding layer 130 and conductive member 140, insulating part 150 is located in the opening, and insulating part 150 plays an electrical insulation role between shielding layer 130 and conductive member 140. It should be noted that the shielding layer 130, the insulating part 150, and the conductive member 140 constitute a signal transmission part.

In the present application, the adjustment of the characteristic impedance of the signal transmission portion can be realized by adjusting at least one of the cross-sectional size of the conductive member 140, the opening area of the opening, the insulating material used for the insulating portion 150, and the distance between adjacent conductive members 140 in the plurality of conductive members 140 located in one opening, so that the controllability of the characteristic impedance of the signal transmission portion is higher, that is, the characteristic impedance of the signal transmission portion can be adaptively adjusted according to the requirements of the signal transmission path, thereby ensuring the same impedance value in the whole signal transmission path, that is, the impedance in the whole signal transmission path is continuous, reducing the loss in the signal transmission process, and ensuring the integrity of the signal transmission. Secondly, for the conductive device 140 for high-speed signal transmission, the shielding layer 130 can provide a complete barrier for the conductive device 140, so as to achieve complete shielding, effectively avoid the risk that the conductive device 140 radiates outside and is interfered by various external electromagnetic signals, and make the overall performance of the signal transmitted by the conductive device 140 better.

It should be noted that the shielding layer 130 is disposed on the hole wall of the opening, and the conductive member 140 is located inside the opening, that is, the shielding layer 130 is disposed around the conductive member 140 in a circumferential direction of 360 degrees, so as to provide a circle of three-dimensional shielding for the conductive member 140, effectively prevent the conductive member 140 from radiating outwards, prevent external signals from interfering with signals transmitted on the conductive member 140, and completely solve the shielding defect in the related art, meanwhile, a shielding scheme of surrounding a circle of ground pads in the related art is not required, other signals do not need to be far away, and the problem of wasting the space of the substrate 110 can be solved.

For impedance continuity, when a high-speed signal is transmitted through a trace on the circuit board 100, the trace is called a transmission line, each transmission line has its own characteristic impedance, generally, the whole signal transmission path in the industry has the same impedance value (the conventional requirement in the industry is that the impedance value of the whole signal transmission path is 50 Ω), the calculation of the characteristic impedance value cannot leave a reference plane (a ground plane or a power plane), and if the reference plane is complete, the characteristic impedance of the transmission line is continuous. If the plane is not complete, the transmission line passes through the incomplete "ravines", where the impedance of the transmission line is momentarily increased, which is the discontinuity in impedance. Where the impedance is discontinuous, signal energy may be reflected, signal integrity may be compromised, and signal quality may deteriorate. The "impedance continuity" ensures that the signal impedance on the circuit board 100 and the signal impedance of the upper and lower parts to be connected are consistent and continuous, reduces signal reflection and sudden change caused by impedance discontinuity, and the "shielding" ensures that the signal is not interfered or interfered by others.

Alternatively, as shown in fig. 2, 5 and 6, the cross-sectional shape of the opening may be one of circular, oval, elongated, and polygonal. The cross-section of the conductive member 140 may be formed in one of a circular shape, an oval shape, a long bar shape, and a polygonal shape. Polygons include, but are not limited to, triangles, quadrilaterals (such as rectangles, diamonds), pentagons, hexagons, and the like. When the space of the circuit board 100 is limited, such as at the corners of the circuit board 100, it may be necessary to make some specially shaped conductive members 140 and openings adapted thereto so as to satisfy a specific impedance value in the limited space.

For a specific impedance value, a relatively long distance interaction between the conductive member 140 and the opening is required, and the circular conductive member 140 and the opening occupy a large area and are difficult to satisfy in practical applications. For example: when the required dc resistance value and the impedance value of the signal transmission path are very small, such a result would require that the conductive device 140 is large enough to ensure that the dc resistance value is very small, i.e. D in the above formula is very large, but the diameter D of the opening and the diameter D of the conductive device 140 cannot be infinitely close to each other in the existing manufacturing process, in order to achieve the special characteristic impedance, the conductive device 140 and the opening need to interact with each other for a relatively long distance, and through the mutual shape adjustment of the two, the specific parameter is achieved, and the requirement of the special impedance value and the dc impedance value is met.

Therefore, the opening and the conductive member 140 having a special shape are formed on the circuit board 100 to meet the design requirement of a specific impedance value and a limited space, and the special shape is not limited to a strip shape, and may be an L shape or the like.

According to some embodiments of the present application, as shown in fig. 2 and 5, the opening includes a first opening 121, and a conductive member 140 is disposed in the first opening 121.

In this embodiment, the openings include the first opening 121, and a conductive member 140 is disposed in the first opening 121, i.e., the first opening 121 and the conductive member 140 are in a one-to-one correspondence relationship. For a part of the signal transmission part in the signal transmission path formed by the first opening 121 and the conductive member 140, the characteristic impedance of the signal transmission part can be adjusted by adjusting the following formula:

wherein Z is the characteristic impedance, ∈_rIs the relative permittivity of the insulator, D is the outer conductor inner diameter, and D is the inner conductor outer diameter. That is, the relative permittivity ∈ of the insulator can be changed by changing the insulating medium constituting the insulating portion 150_rThe outer diameter D of the inner conductor is changed by changing the cross section of the conductive piece 140, the inner diameter D of the outer conductor is changed by changing the size of the first opening hole 121, and at least one of the three parameters can be adjusted, so that the characteristic impedance of the conductive piece 140 positioned in the first opening hole 121 is adjusted to be consistent with the impedance value of the whole signal transmission path, the impedance continuity of the whole signal transmission path is realized, the loss in the signal transmission process is reduced, and the integrity of signal transmission is ensured. It should be noted that the formula is only a theoretical value, and an approximate range of each parameter can be found according to the formula, and the actual product application needs to be adjusted correspondingly according to actual requirements.

It should be noted that, for any one of the first opening 121 and the conductive member 140 located inside the first opening 121, the cross section thereof may be one of a circle, an ellipse, a long bar, a polygon and an irregular shape.

It is contemplated that the cross-sectional shapes of the first opening 121 and the conductive member 140 located therein may be the same or different. For example, the conductive member 140 with a rectangular cross section or the conductive member 140 with a circular cross section may be disposed in the rectangular first opening 121.

Wherein polygons include, but are not limited to, triangles, quadrilaterals (e.g., rectangles, diamonds), pentagons, hexagons, and the like.

According to some embodiments of the present application, as shown in fig. 6, the openings include a second opening 122, and at least two conductive members 140 are disposed in the second opening 122.

In this embodiment, in a practical application scenario of the circuit board 100, there may be a group of differential pairs or a plurality of groups of differential pairs, and it is necessary to control the differential impedance of the high-speed signal, so that the opening includes the second opening 122, and at least two conductive members 140 are disposed in the second opening 122, thereby shielding the differential network. Specifically, the second opening 122 and the conductive member 140 are in a one-to-many relationship. For a signal transmission portion in a signal transmission path formed by the second opening 122 and the at least two conductive members 140, the characteristic impedance of the signal transmission portion can be adjusted by adjusting the following formula:

wherein Z is the characteristic impedance, ∈_rS is the distance between two wires of the differential wire, and d is the outer diameter of the inner conductor. That is, the relative permittivity ∈ of the insulator can be changed by changing the insulating medium constituting the insulating portion 150_rThe outer diameter d of the inner conductor is changed by changing the cross section of the conductive piece 140, the distance s between the two wires is changed by changing the relative position of the two conductive pieces 140, and at least one of the three parameters can be adjusted, so that the adjustment of the characteristic impedance of the signal transmission part formed by the at least two conductive pieces 140 positioned in the second opening 122 is realized, the characteristic impedance of the signal transmission part is kept consistent with the impedance value of the whole signal transmission path, the impedance continuity of the whole signal transmission path is realized, the loss in the signal transmission process is reduced, and the integrity of the signal transmission is ensured. It should be noted that the formula is only a theoretical value, and an approximate range of each parameter can be found according to the formula, and the actual product application needs to be adjusted correspondingly according to actual requirements.

It should be noted that, for any one of the second opening 122 and the at least two conductive members 140 located inside the second opening 122, the cross section thereof may be one of a circle, an ellipse, a long bar, a polygon and an irregular shape. That is, the shape of the cross-section of the second opening 122 and any one of the at least two conductive members 140 may be one of the above-mentioned shapes.

It is worth mentioning that polygons include, but are not limited to, triangles, quadrilaterals (such as rectangles, diamonds), pentagons, hexagons, etc.

Specifically, the cross-sectional shapes of the second opening 122 and the conductive member 140 located therein may be the same or different. For example, the conductive member 140 with a rectangular cross section or the conductive member 140 with a circular cross section may be disposed in the rectangular second opening 122.

Specifically, for at least two conductive members 140 located inside the second opening 122, the cross-sectional shapes and cross-sectional areas of the at least two conductive members 140 may be the same, for example, the at least two conductive members 140 are conductive pillars with circular cross-sections and the same areas.

Alternatively, at least two conductive members 140 have the same cross-sectional shape and different cross-sectional areas. For example, the at least two conductive members 140 are conductive posts with circular cross sections, but the diameters of the at least two conductive posts are different.

Alternatively, the cross-sectional shapes and areas of at least two of the conductive members 140 are different. For example, the cross section of the first conductive member is rectangular, the cross section of the second conductive member is triangular, and the cross sectional areas of the first conductive member and the second conductive member are different. In some embodiments of the present application, the number of openings is multiple, and the number of conductive members 140 is multiple, and specifically, the multiple openings include at least one first opening 121 and at least one second opening 122, one conductive member 140 is disposed in one first opening 121, and at least two conductive members 140 are disposed in one second opening 122. That is, for the circuit board 100, the number of the openings and the conductive members 140 is variable, and may be adaptively adjusted according to actual situations.

According to a further embodiment of the present application, as shown in fig. 6, the number of the conductive members 140 is plural, and the cross sections of the plurality of conductive members 140 located in one second opening 122 are not identical.

In this embodiment, in order to achieve continuity of the impedance value in the entire signal transmission path, the characteristic impedance of the signal transmission portion may be adjusted, and specifically, the adjusting means may adjust the cross sections of the plurality of conductive members 140 located in the same second opening 122, so that the characteristic impedance of the signal transmission portion formed by the second opening 122 and the plurality of conductive members 140 located therein is kept consistent with the impedance value of the entire signal transmission path, thereby achieving continuity of the impedance of the entire signal transmission path, reducing loss during signal transmission, and ensuring integrity of signal transmission.

Alternatively, the cross-sectional shapes of some of the plurality of conductors 140 are the same, and the cross-sectional shapes of some of the plurality of conductors 140 are different, or the cross-sectional shapes of some of the plurality of conductors 140 are the same, and the cross-sectional shapes of some of the plurality of conductors 140 are different. Therefore, the possibility of multiple combined arrangements of the at least two conductive members 140 in the second opening 122 is given, so that the adjustable range of the characteristic impedance of the signal transmission part is wide, and the requirement of the whole signal transmission path is better met. When the conductive member 140 is a conductive column, the outer diameter of the inner conductor can be adjusted by adjusting the diameter of the conductive member 140.

According to a further embodiment of the present application, as shown in fig. 6, the number of the conductive members 140 is multiple, and the distances between two adjacent conductive members 140 in the plurality of conductive members 140 located in one second opening 122 are not completely equal.

In this embodiment, in order to achieve continuity of the impedance value in the entire signal transmission path, the characteristic impedance of the signal transmission portion may be adjusted, and specifically, the adjusting means may adjust the distance between two adjacent conductive members 140 in the plurality of conductive members 140 located in the same second opening 122, so that the characteristic impedance of the signal transmission portion formed by the second opening 122 and the plurality of conductive members 140 located therein is kept consistent with the impedance value of the entire signal transmission path, thereby achieving continuity of the impedance of the entire signal transmission path, reducing loss in the signal transmission process, and ensuring integrity of the signal transmission.

Optionally, distances between two adjacent conductive members 140 in a part of the conductive members 140 in the plurality of conductive members 140 are the same, and distances between two adjacent conductive members 140 in a part of the plurality of conductive members 140 are different, so that the characteristic impedance of the signal transmission part has a wide adjustable range, and the requirement of the whole signal transmission path is better met.

According to a further embodiment of the present application, the insulation part 150 is wrapped on the side of the conductive member 140 to form a plug part, and the plug part is inserted into the opening having the shielding layer 130.

In this embodiment, as for a method of manufacturing the circuit board 100, as shown in fig. 3, an opening is formed on the substrate 110 by a hole metallization process, so that a plating layer is formed on a hole wall of the opening, and then the opening is chemically cleaned. Then, an adhesive layer is disposed on an inner wall of the plating layer, and then the conductive material wrapped with the insulating medium is inserted into the opening, at this time, the insulating part 150 is located between the plating layer and the conductive part 140, and the adhesive can improve the bonding force between the plating layer and the insulating part 150, thereby ensuring the positional stability of the conductive part 140 relative to the substrate 110. After the adhesive layer is cured, the conductive member 140 and the substrate 110 are firmly bonded, as shown in fig. 3 (a) and (b), part of the insulating medium and the conductive material protruding from the outer surface of the substrate 110 are trimmed and polished, the remaining insulating medium and the remaining conductive material are plug-in portions formed by wrapping the insulating portion 150 on the side surfaces of the conductive member 140, the insulating portion 150 and the conductive member 140 form a whole, and the plug-in portions are inserted into the openings with the shielding layer 130, so that the manufacturing process of the circuit board 100 is simplified, wherein the plug-in portions do not protrude from the substrate 110. The conductive members 140 are exposed at both ends in the thickness direction of the substrate 110 by grinding to facilitate soldering with other parts.

It should be noted that the conductive member 140 includes an end surface along the thickness direction of the substrate 110, the conductive member 140 includes an upper end surface and a lower end surface, a side surface is connected between the upper end surface and the lower end surface, and the insulating portion 150 is wrapped on the side surface of the conductive member 140, so that the normal welding of the upper end surface and the lower end surface is not affected.

According to a further embodiment of the present application, insulating part 150 is an insulating medium filled between shielding layer 130 and conductive member 140.

In this embodiment, as shown in fig. 4, an opening is formed in the substrate 110 by a hole metallization process, as shown in fig. 4 (c), so that a plating layer is formed on the wall of the opening, and then the opening is chemically cleaned. As shown in fig. 4 (d), an insulating medium with a certain dielectric constant is filled into the plated opening, both sides of the substrate 110 are polished to make the portion filled with the insulating medium have the same flatness as other portions of the substrate 110, and then chemical cleaning is performed. Finally, as shown in fig. 4 (e), a hole is drilled in the middle of the insulating medium to form a through hole, as shown in fig. 4 (f), for accommodating the conductive member 140. Wherein the center of the through hole may overlap with the center of the opening hole, i.e. the through hole is arranged concentrically with the opening hole. Alternatively, the center of the through hole does not overlap with the center of the opening hole, and the through hole is eccentrically arranged with respect to the opening hole.

According to a further embodiment of the present application, the insulation part 150 is provided with a through hole, and the conductive member 140 is a plated member, and the plated member is located in the through hole.

In this embodiment, after filling the opening with the shielding layer 130 with an insulating medium having a certain dielectric constant, the insulating medium is drilled and a through hole is formed, and the through hole is used for placing the conductive member 140. Preferably, the conductive member 140 is a plated member, that is, the conductive member 140 is disposed in the through hole by electroplating, so that the bonding strength between the conductive member 140 and the insulating medium can be improved, the shape and size of the plated member can be controlled better, and the plated member is convenient to process and prepare. Specifically, the conductive member 140 may be formed by electroless plating of copper in the through hole, and the plating process is simple and mature.

According to some embodiments of the present application, the shielding layer 130 is a plated layer.

In this embodiment, the shielding layer 130 may be formed on the substrate 110 by electroplating and/or electroless plating. The bonding force between the plating layer and the substrate 110 is strong, the connection is reliable, and the plating layer is not easy to fall off.

Specifically, the Plated layer can be prepared by using a Plated Through Hole (PTH) method, and electroless plating and electroplating are used to plate a conductive metal layer on the insulated Hole wall in the Hole of the substrate 110, so as to achieve conduction between the upper and lower side members of the substrate 110. The plating layer formed by the hole metallization has good mechanical toughness and electrical conductivity, and the whole plating layer is uniform and complete.

According to a further embodiment of the present application, an adhesive layer is provided between the plating layer and the insulating part 150.

According to some embodiments of the present application, as shown in fig. 3, 4 and 7, a portion of the shielding layer 130 extends in a direction away from the conductive member 140 and covers a surface of the substrate 110.

In this embodiment, a portion of the shielding layer 130 extends in a direction away from the conductive component 140 and finally covers the surface of the substrate 110, and another portion of the shielding layer 130 is disposed on the wall of the opening, that is, for the opening of the opening, the exposed shielding layer 130 extends radially outward, which not only increases the contact area between the shielding layer 130 and the substrate 110, improves the connection reliability, and makes the shielding layer 130 not easily fall off from the substrate 110, but also further provides a reliable shielding effect for the conductive component 140, effectively blocks the conductive component 140 from radiating outward, and can also avoid external signals from interfering with signal transmission at the conductive component 140.

According to some embodiments of the present application, as shown in fig. 2, 5, and 6, the circuit board 100 is a circuit connection board.

In this embodiment, the circuit board 100 is a circuit connection board, the circuit connection board is an interposer board, and the interposer board can realize that the first circuit board 100 located above the interposer board and the second circuit board 100 located below the interposer board are electrically connected through a circuit, and can also structurally perform a fixing function. The interposer board is a support board with a hollow middle part, the space utilization rate can be improved by adopting the interposer board, and the space in the thickness direction of the interposer board can be fully utilized, so that the area of the circuit board 100 is minimized.

According to some embodiments of the present application, the circuit board 100 may be a high density printed circuit board 100.

According to an embodiment of a second aspect of the present application, there is provided an electronic device including the circuit board 100 provided in any one of the foregoing embodiments.

Specifically, the electronic device may be a mobile terminal such as a mobile phone, a wearable device, a tablet computer, a laptop computer, a mobile computer, a handheld game console, a video recorder, a camcorder, a radio cassette recorder, a compact disc player, a mini-stereo, and the like.

In the description herein, reference to the description of the terms "one embodiment," "some embodiments," "an illustrative embodiment," "an example," "a specific example," or "some examples" or the like means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the application. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

While embodiments of the present application have been shown and described, it will be understood by those of ordinary skill in the art that: various changes, modifications, substitutions and alterations can be made to the embodiments without departing from the principles and spirit of the application, the scope of which is defined by the claims and their equivalents.

Claims (10)

1. A circuit board, comprising:

a substrate;

the opening penetrates through the substrate along the thickness direction of the substrate;

the shielding layer is at least partially arranged on the hole wall of the open hole;

at least one conductive member positioned within the opening;

and the insulating part is arranged between the shielding layer and the conductive piece.

2. The circuit board of claim 1, wherein the opening comprises:

the first opening is internally provided with one conductive piece.

3. The circuit board of claim 1, wherein the opening comprises:

and at least two conductive pieces are arranged in the second opening.

4. The circuit board of claim 3,

the number of the conductive pieces is multiple, and the cross sections of the conductive pieces in one second opening are not completely the same.

5. Circuit board according to one of claims 1 to 4,

the insulating part wraps the side face of the conductive piece to form a plug-in part, and the plug-in part is inserted into the opening hole with the shielding layer.

6. Circuit board according to one of claims 1 to 4,

the insulating part is an insulating medium filled between the shielding layer and the conductive piece.

7. The circuit board of claim 6,

the insulating part is provided with a through hole, the conductive part is an electroplated part, and the electroplated part is positioned in the through hole.

8. Circuit board according to one of claims 1 to 4,

the shielding layer is a plating layer.

9. Circuit board according to one of claims 1 to 4,

a part of the shielding layer extends to a direction far away from the conductive piece and covers the surface of the substrate.

10. An electronic device, comprising: the circuit board according to any one of claims 1 to 9.

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