CN216561858U - Circuit board, fingerprint chip subassembly, fingerprint identification module and terminal equipment - Google Patents

Abstract

The utility model discloses a circuit board, fingerprint chip assembly, fingerprint identification module and terminal equipment, the fingerprint identification module includes circuit board and fingerprint chip assembly, the circuit board has a plurality of first pads, a plurality of first pads set up along first direction interval, the center of at least two in a plurality of first pads staggers in the second direction; the fingerprint chip assembly comprises a chip and a substrate, wherein the substrate is provided with a plurality of second bonding pads which are arranged at intervals along a first direction, the centers of at least two of the second bonding pads are staggered in a second direction, and the second direction is perpendicular to the first direction; the plurality of second bonding pads and the plurality of first bonding pads are arranged in a one-to-one correspondence mode, and each second bonding pad is connected with the corresponding first bonding pad. The fingerprint identification module of this disclosed embodiment has the advantage that equipment slope risk is low at least.

Description

Circuit board, fingerprint chip subassembly, fingerprint identification module and terminal equipment

Technical Field

The utility model relates to a fingerprint identification technical field, concretely relates to circuit board, fingerprint chip subassembly, fingerprint identification module and terminal equipment.

Background

Along with the development of terminal equipment trade, each part integrates and becomes the development direction, and the fingerprint identification module also adopts among the correlation technique to integrate the setting, nevertheless integrates the setting and also leads to the equipment part to increase, leads to the equipment defective rate increase of fingerprint identification module.

Wherein, fingerprint identification module slope is the biggest factor that influences the fingerprint identification module (especially set up the fingerprint identification module at the terminal equipment side) equipment yield, and along with terminal equipment to the demand of frivolous development, the space that sets up of fingerprint identification module diminishes, and fingerprint identification module equipment takes place the slope phenomenon and leads to the problem of installation badness to be more serious.

SUMMERY OF THE UTILITY MODEL

The present disclosure is directed to solving, at least to some extent, one of the technical problems in the related art.

To this end, an embodiment of the present disclosure provides a circuit board, which has a plurality of first pads, the plurality of first pads are disposed at intervals along a first direction, centers of at least two of the plurality of first pads are staggered in a second direction, and the second direction is perpendicular to the first direction.

The circuit board of the disclosed embodiment has at least the advantage of low risk of assembly tilt.

In some embodiments, a plurality of the first pads are arranged in a wave shape or an S shape.

In some embodiments, centers of at least two adjacent ones of the plurality of first pads are aligned in the second direction.

In some embodiments, a center of at least one of the first pads is located at a middle position of the circuit board in the second direction; and/or centers of at least two of the first pads are respectively located on both sides of the circuit board in the second direction.

In some embodiments, the circuit board further has a pair of first supporting members, two of the same pair of first supporting members are respectively located on two sides of the circuit board in the second direction, and the first supporting members are used for abutting against the fingerprint chip assembly.

In some embodiments, the first support member is provided with a plurality of pairs, the plurality of pairs of first support members being spaced apart along the first direction.

In some embodiments, two of the first supports of the same pair are spaced apart along the first direction.

In some embodiments, the first support is an ink support.

In some embodiments, the circuit board is a flexible circuit board.

The embodiment of the disclosure provides a fingerprint chip assembly. The fingerprint chip assembly of the embodiment of the disclosure comprises a chip and a substrate, wherein the chip is connected with the substrate, the substrate is provided with a plurality of second bonding pads, the second bonding pads are arranged at intervals along a first direction, the centers of at least two of the second bonding pads are staggered in a second direction, and the second direction is perpendicular to the first direction.

The fingerprint chip assembly of the embodiment of the disclosure has at least the advantage of low risk of assembly tilt.

In some embodiments, a plurality of the second pads are arranged in a wave shape or an S shape.

In some embodiments, centers of at least two adjacent ones of the second pads are aligned in the second direction.

In some embodiments, a center of at least one of the second pads is located at an intermediate position of the substrate in the second direction; and/or the centers of at least two of the second pads are respectively positioned on two sides of the substrate in the second direction.

In some embodiments, the fingerprint chip assembly further has a pair of second supporting members, two of the same pair of second supporting members are respectively located at two sides of the substrate in the second direction, and the second supporting members are used for abutting against a circuit board.

In some embodiments, the second support member is provided with a plurality of pairs, and the plurality of pairs of second support members are spaced apart along the first direction.

In some embodiments, two of the second supports of the same pair are spaced apart along the first direction.

In some embodiments, the second support is an ink support.

The embodiment of the disclosure provides a fingerprint identification module. The fingerprint identification module of this disclosed embodiment includes circuit board and fingerprint chip subassembly, the circuit board be above-mentioned any embodiment the circuit board, the fingerprint chip subassembly be above-mentioned any embodiment the fingerprint chip subassembly, it is a plurality of wherein the second pad is with a plurality of first pad one-to-one sets up, every the second pad with correspond first pad links to each other.

The fingerprint identification module of the embodiment of the present disclosure has the advantage that the risk of assembling tilt is low at least.

The embodiment of the disclosure provides a terminal device. The terminal equipment of the embodiment of the disclosure comprises the fingerprint identification module of any one of the embodiments.

The terminal equipment of the embodiment of the disclosure at least has the advantage of high installation yield.

In some embodiments, the terminal device includes a middle frame, and the fingerprint identification module is disposed on the middle frame.

Drawings

Fig. 1 is a schematic structural diagram of a circuit board according to an embodiment of the present disclosure.

Fig. 2 is a schematic diagram of a partial structure of the circuit of fig. 1.

Fig. 3 is a partial structural schematic diagram of a circuit board according to another embodiment of the present disclosure.

Fig. 4 is a partial structural schematic diagram of a circuit board according to still another embodiment of the present disclosure.

Fig. 5 is a schematic structural diagram of a substrate of a fingerprint chip assembly according to an embodiment of the present disclosure.

Fig. 6 is a schematic structural diagram of a substrate of a fingerprint chip assembly according to another embodiment of the present disclosure.

Fig. 7 is a schematic structural diagram of a fingerprint identification module according to an embodiment of the disclosure.

Reference numerals:

a fingerprint recognition module 100;

a circuit board 1; a first surface 101; a second surface 102; a first pad 103; a first circuit board pad 1031; a second circuit board pad 1032; a third circuit board pad 1033; a first support 104; a first circuit board support 1041; a second circuit board support 1042;

a substrate 2; a third surface 201; a fourth surface 202; a second pad 203; a first substrate pad 1031; a second substrate pad 1032; a third substrate pad 1033; a second support 204; a first substrate support 2041; a second substrate support 2042;

a chip 3;

and (4) soldering tin.

Detailed Description

Reference will now be made in detail to embodiments of the present disclosure, examples of which are illustrated in the accompanying drawings. The embodiments described below with reference to the drawings are exemplary and intended to be illustrative of the present disclosure, and should not be construed as limiting the present disclosure.

The embodiment of the disclosure provides a circuit board applied to a fingerprint identification module. As shown in fig. 1 to 4, the circuit board 1 of the embodiment of the present disclosure has a plurality of first pads 103, and the plurality of first pads 103 are disposed at intervals in a first direction. The centers of at least two of the plurality of first pads 103 are staggered in a second direction, which is perpendicular to the first direction. Wherein, the first direction is the line output direction of the circuit board 1; illustratively, the first direction is a direction in fig. 2 to 4, and the second direction is a direction B in fig. 2 to 4.

The plurality of first pads 103 are arranged at intervals along the first direction, and it is understood that any two adjacent first pads 103 have a space therebetween in the line output direction. The centers of at least two of the first pads 103 are staggered in the second direction, which means that the centers of at least three of the first pads 103 are not on the same straight line, or the connecting line of the centers of the first pads 103 is non-straight.

For example, as shown in fig. 2 to 4, the first direction may be a length direction of the circuit board 1, and the second direction may be a width direction of the circuit board 1. The centers of at least two of the plurality of first pads 103 are staggered in the B direction. Illustratively, at least one of the plurality of first pads 103 is a first circuit board pad 1031, at least one of the plurality of first pads 103 is a second circuit board pad 1032, and a center of the first circuit board pad 1031 and a center of the second circuit board pad 1032 are disposed at an interval in the B direction.

From this, through the nonlinear setting of a plurality of first pads 103 in circuit board 1, when circuit board 1 and fingerprint chip subassembly welding equipment, can increase the area of the contact area and the holding surface between fingerprint chip subassembly and the circuit board 1 to can improve the support stability of circuit board 1 to fingerprint chip subassembly, effectively avoid fingerprint identification module equipment slope. The supporting surface is a surface formed by connecting lines of supporting points formed by the contact of the fingerprint chip assembly and the circuit board 1. The larger the support surface between the fingerprint chip assembly and the circuit board 1, the better the support stability of the circuit board 1 to the fingerprint chip assembly.

Therefore, the circuit board 1 of the embodiment of the present disclosure has at least the advantage of low risk of assembly tilt, that is, the problem of assembly tilt of the fingerprint identification module can be improved by the integrated assembly of the circuit board and the fingerprint chip assembly of the embodiment of the present disclosure.

In some embodiments, the circuit board 1 may be a flexible circuit board.

From this, the thickness of circuit board 1 is thinner, easily buckles, is favorable to using including pressing of fingerprint identification module 100 of circuit board 1.

In some embodiments, the plurality of first pads 103 are arranged in a wave or S shape. In other words, the connection line of the centers of the plurality of first pads 103 has a wave shape or an S shape.

The plurality of first pads 103 is arranged in a wave shape or an S shape, which means that the plurality of first pads 103 is arranged in a substantially wave shape or an S shape, or the plurality of first pads 103 is arranged in a regular wave shape or an S shape.

Illustratively, as shown in fig. 2 and 3, the plurality of first pads 103 are arranged in a generally wave-like shape. As shown in fig. 4, the plurality of first pads 103 are arranged in a substantially S-shape.

Therefore, the centers of the plurality of first pads 103 are staggered in the direction B, and when the circuit board 1 is assembled with the fingerprint chip assembly through the first pads 103 in a welding mode, the area of the supporting surface between the fingerprint chip assembly and the circuit board 1 can be increased, so that the supporting stability of the circuit board 1 for the fingerprint chip assembly can be improved, and the risk of assembling inclination of the circuit board 1 is reduced.

In some embodiments, centers of at least two adjacent ones of the plurality of first pads 103 are aligned in the second direction.

Illustratively, as shown in fig. 3, the first circuit board pads 1031 are arranged in three, the three first circuit board pads 1031 are arranged adjacently, and the centers of the three first circuit board pads 1031 are aligned in the B direction. That is, the connecting lines of the centers of the three first circuit board pads 1031 are straight lines, and the connecting lines of the centers of the three first circuit board pads 1031 are perpendicular to the a direction. It is understood that the second pads 203 correspond to the arrangement of the first pads 103.

Therefore, the arrangement of the first bonding pads 103 is ordered, the processing of the circuit board 1 is facilitated, and the processing cost of the circuit board 1 is reduced.

In some embodiments, the center of at least one of the plurality of first pads 103 is located at a middle position of the circuit board 1 in the second direction.

Illustratively, as shown in fig. 4, the center of the second circuit board pad 1032 is located at the middle position of the circuit board 1 in the B direction. In other words, the circuit board 1 has a center line extending in the a direction, and the center of the second circuit board pad 1032 coincides with the center line. At least one of the plurality of first pads 103 is a third circuit board pad 1033. Centers of the first circuit board pad 1031 and the third circuit board pad 1033 are located on both sides of the circuit board 1 in the B direction, respectively.

It is understood that, in correspondence with the first pads 103, the center of at least one of the plurality of second pads 203 is located at an intermediate position of the fingerprint chip assembly in the second direction. The centers of at least two of the plurality of second pads 203 are respectively located at two sides of the fingerprint chip assembly in the second direction.

Therefore, the two sides of the width direction of the circuit board 1 and the middle position of the width direction of the circuit board 1 are provided with the first welding disc 103, the supporting stability of the circuit board 1 on the fingerprint chip assembly can be improved, and the risk of inclination of the circuit board assembly is reduced.

In some embodiments, the circuit board 1 further has a pair of first supporting members 104, two of the same pair of first supporting members 104 are respectively located at two sides of the circuit board 1 in the second direction, and the first supporting members 104 are used for abutting against a fingerprint chip assembly of the fingerprint chip assembly.

Illustratively, as shown in fig. 2 to 4, the same pair of first supports 104 are respectively located on both sides of the circuit board 1 in the B direction. Each first support 104 has a first end and a second end opposite in the C direction, the first end of each first support 104 is connected to the circuit board 1, and the second end of each first support 104 abuts against the fingerprint chip assembly.

From this, when circuit board 1 assembles with fingerprint chip subassembly, circuit board 1 supports through first support piece 104 and leans on the fingerprint chip subassembly, can increase the area of the holding surface between circuit board 1 and the fingerprint chip subassembly to improve the support stability of circuit board 1 to fingerprint chip subassembly, and then reduce the risk of circuit board 1 equipment slope.

In some embodiments, the first support 104 may be an ink support. In other words, the material of the first support 104 may be ink.

Illustratively, the first support 104 may be formed on the circuit board 1 by printing.

Therefore, the material cost of the first support member 104 is low, which is beneficial to reducing the cost of the circuit board 1.

Of course, in other embodiments, the first support 104 may also be a copper first support.

Alternatively, the first support 104 is formed on the circuit board 1 by screen printing.

Illustratively, the first support 104 is formed on the circuit board 1 by silk-screen printing, and the height of the first support 104 may be 0.02 mm. Wherein the height of the first support 104 is the dimension of the first support 104 in the direction C.

Alternatively, the first support member 104 is formed on the circuit board 1 by a process of solder resist pretreatment, solder resist printing, solder resist pre-baking, solder resist exposure, solder resist development, and solder resist curing. Wherein, solder resist means solder resist.

Illustratively, the first support 104 is formed on the circuit board 1 by the above process, and the height of the first support 104 may be 0.04 mm. Wherein the height of the first support 104 is the dimension of the first support 104 in the direction C. Therefore, when the first bonding pads 103 and the second bonding pads 203 are soldered by solder paste, even if the solder paste is high, the first supporting member 104 can be used for supporting the fingerprint chip assembly, so that the circuit board 1 and the fingerprint chip assembly can be connected by soldering.

Of course, in other embodiments, the height of the first support 104 may be any one of 0.02mm to 0.04 mm; alternatively, the height of the first support 104 is less than 0.02 mm; alternatively, the height of the first support 104 is greater than 0.04 mm. It is understood that the height of the first support 104 depends on the distance between the circuit board 1 and the fingerprint chip assembly after the first pads 103 and the second pads 203 are soldered, and the height of the first support 104 should be equal to the distance between the circuit board 1 and the fingerprint chip assembly.

Optionally, the first support 104 is provided with a plurality of pairs, the plurality of pairs of first supports 104 being spaced apart along the first direction.

For example, as shown in fig. 2 to 4, the first supports 104 are provided in two pairs, wherein two first supports 104 of one pair of the first supports 104 are first circuit board supports 1041, and two first supports 104 of the other pair of the first supports 104 are second circuit board supports 1042. In the a direction, two first circuit board supports 1041 are provided at one side of two second circuit board supports 1042.

Therefore, the area of the supporting surface between the circuit board 1 and the fingerprint chip assembly can be increased by using the plurality of pairs of first supporting pieces 104, so that the supporting stability of the circuit board 1 on the fingerprint chip assembly is improved, and the risk of assembling the circuit board 1 to incline is reduced.

Optionally, both of the same pair of first supports 104 are spaced apart in the first direction.

Illustratively, as shown in fig. 4, two first circuit board supports 1041 are spaced apart in the a direction, and two second circuit board supports 1042 are spaced apart in the a direction.

Therefore, the distance between the same pair of first supporting pieces 104 is far away, the area of the supporting surface between the circuit board 1 and the fingerprint chip assembly can be increased, the supporting stability of the circuit board 1 on the fingerprint chip assembly can be improved, and the risk of inclination of the circuit board assembly is reduced.

Of course, in other embodiments, as shown in fig. 3, both of the same pair of first supports 104 may be aligned in the first direction. Alternatively, as shown in fig. 2, when the first supports 104 are provided in a plurality of pairs, two of the first supports 104 of one pair are aligned in the first direction, and two of the first supports 104 of the other pair are staggered in the first direction.

Alternatively, the cross-section of the first support 104 may be circular, rectangular, triangular, or other regular or irregular shapes. Wherein the cross section of the first support 104 is perpendicular to the C-direction.

The embodiment of the disclosure provides a fingerprint chip assembly applied to a fingerprint identification module. As shown in fig. 5 and 6, the fingerprint chip assembly of the embodiment of the present disclosure includes a chip 3 and a substrate 2, and the chip 3 is connected to the substrate 2. The substrate 2 has a plurality of second pads 203, and the plurality of second pads 203 are arranged at intervals in the first direction. The centers of at least two of the plurality of second pads 203 are staggered in a second direction, which is perpendicular to the first direction. Wherein, the first direction is the line output direction of the substrate 2; illustratively, the first direction is the a direction in fig. 5 and 6, and the second direction is the B direction in fig. 5 and 6.

The plurality of second pads 203 are arranged at intervals along the first direction, and it is understood that any two adjacent second pads 203 have a space therebetween in the line output direction. The centers of at least two of the second pads 203 are staggered in the second direction, which means that the centers of at least three of the second pads 203 are not on the same straight line, or the connecting line of the centers of the second pads 203 is non-straight.

For example, as shown in fig. 5 and 6, the first direction may be a length direction of the substrate 2, and the second direction may be a width direction of the substrate 2. The centers of at least two of the plurality of second pads 203 are staggered in the B direction. Illustratively, at least one of the plurality of second pads 203 is a first substrate pad 2031, at least one of the plurality of second pads 203 is a second substrate pad 2032, and a center of the first substrate pad 2031 and a center of the second substrate pad 2032 are spaced apart in the B direction.

From this, through the nonlinear setting of a plurality of second pads 203 in the base plate 2, when fingerprint chip subassembly and circuit board welding equipment, can increase the area of the contact area and the holding surface between fingerprint chip subassembly and the circuit board to can improve the support stability of circuit board to fingerprint chip subassembly, effectively avoid fingerprint identification module equipment slope. The supporting surface is a surface formed by connecting lines of supporting points formed by the contact of the circuit board and the fingerprint chip assembly. The larger the bearing surface between the circuit board and the fingerprint chip assembly, the better the support stability of the circuit board to the fingerprint chip assembly.

Therefore, the fingerprint chip assembly of the embodiment of the present disclosure has at least the advantage of low risk of assembly tilt. That is to say, through the integrated equipment of fingerprint chip subassembly and circuit board of this disclosed embodiment, can improve the problem of fingerprint identification module equipment slope.

Alternatively, the substrate 2 may have a flat plate shape or an arc plate shape.

In some embodiments, the plurality of second pads 203 are arranged in a wave or S shape. In other words, the connection line of the centers of the plurality of second pads 203 has a wave shape or an S shape.

The plurality of second pads 203 are arranged in a wave shape or an S shape, which means that the plurality of second pads 203 are arranged in a substantially wave shape or an S shape, or the plurality of second pads 203 are arranged in a regular wave shape or an S shape.

Illustratively, as shown in fig. 5, the plurality of second pads 203 are arranged in a substantially wave shape. As shown in fig. 6, the plurality of second pads 203 are arranged in a substantially S-shape.

Therefore, the centers of the second pads 203 are staggered in the direction B, and after the fingerprint chip assembly is welded and assembled with the circuit board through the second pads 203, the area of the supporting surface between the fingerprint chip assembly and the circuit board can be increased, so that the supporting stability of the circuit board on the substrate 2 can be improved, and the risk of assembling and inclining the fingerprint chip is reduced.

In some embodiments, centers of at least two adjacent ones of the plurality of second pads 203 are aligned in the second direction.

Illustratively, as shown in fig. 5, the first substrate pads 2031 are disposed three by three, the three first substrate pads 2031 are disposed adjacently, and the centers of the three first substrate pads 2031 are aligned in the B direction. That is, the line connecting the centers of the three first substrate pads 2031 is a straight line, and the line connecting the centers of the three first substrate pads 2031 is perpendicular to the a direction. It is understood that the first pads 103 correspond to the arrangement of the second pads 203.

Therefore, the arrangement of the second pads 203 is ordered, which is convenient for processing the substrate 2 and is beneficial to reducing the processing cost of the substrate 2.

In some embodiments, the center of at least one of the plurality of second pads 203 is located at the middle of the substrate 2 in the second direction.

Illustratively, as shown in fig. 5, the center of the second substrate pad 2032 is located at the middle of the substrate 2 in the B direction. In other words, the substrate 2 has a center line extending in the a direction, and the center of the second substrate pad 2032 coincides with the center line. At least one of the plurality of second pads 203 is a third substrate pad 2033. The centers of the first substrate pad 2031 and the third substrate pad 2033 are located on both sides of the substrate 2 in the B direction, respectively.

It is understood that, in correspondence with the second pads 203, the center of at least one of the plurality of first pads 103 is located at the middle position of the circuit board in the second direction. Centers of at least two of the plurality of first pads 103 are located on both sides of the circuit board in the second direction, respectively.

Therefore, the two sides of the width direction of the substrate 2 and the middle position of the width direction of the substrate 2 are provided with the second bonding pads 203, so that the support stability of the circuit board on the substrate 2 can be improved, and the risk of assembling and inclining the fingerprint chip assembly is reduced.

In some embodiments, the substrate 2 further has a pair of second supports 204, two of the same pair of second supports 204 are respectively located on two sides of the substrate 2 in the second direction, and the second supports 204 are used for abutting against the substrate 2 of the fingerprint chip assembly.

Illustratively, as shown in fig. 5 and 6, the same pair of second supports 204 are respectively located on both sides of the substrate 2 in the B direction. Each of the second supporters 204 has a first end and a second end opposite to each other in the C direction, the first end of each of the second supporters 204 is connected to the base plate 2, and the second end of each of the second supporters 204 abuts on the circuit board.

From this, when circuit board and fingerprint chip subassembly equipment, the fingerprint chip subassembly supports through second support piece 204 and leans on the circuit board, can increase the area of the holding surface between circuit board and the fingerprint chip subassembly to improve the support stability of circuit board to the fingerprint chip subassembly, and then reduce the risk of fingerprint chip subassembly equipment slope.

In some embodiments, the second support 204 may be an ink support. In other words, the material of the second supporting member 204 may be ink.

For example, the second support 204 may be formed on the substrate 2 by printing.

Therefore, the material cost of the second support 204 is low, which is beneficial to reducing the cost of the substrate 2.

Of course, in other embodiments, the second support 204 may also be a copper second support.

Alternatively, the second support 204 is formed on the substrate 2 by screen printing.

Illustratively, the second support 204 is formed on the substrate 2 by silk-screen printing, and the height of the second support 204 may be 0.02 mm. Wherein, the height of the second support 204 is the dimension of the second support 204 in the C direction.

Alternatively, the second support 204 is formed on the substrate 2 by using a process of solder resist pre-treatment, solder resist printing, solder resist pre-baking, solder resist exposure, solder resist development, and solder resist curing. Wherein, solder resist means solder resist.

Illustratively, the second support 204 is formed on the substrate 2 by the above process, and the height of the second support 204 is 0.04 mm. Wherein, the height of the second support 204 is the dimension of the second support 204 in the C direction. Therefore, when the first bonding pads 103 and the second bonding pads 203 are soldered by using solder paste, even if the solder paste is high in height, the second supporting member 204 can be used for supporting the substrate 2 on the circuit board, so that the circuit board and the fingerprint chip assembly can be connected by soldering.

Of course, in other embodiments, the height of the second support 204 may be any one of 0.02mm to 0.04 mm; alternatively, the height of the second support 204 is less than 0.02 mm; alternatively, the height of the second support 204 is greater than 0.04 mm. It is understood that the height of the second support 204 is determined according to the distance between the circuit board and the substrate 2 after the first and second pads 103 and 203 are soldered, and the height of the second support 204 should be equal to the distance between the circuit board and the substrate 2.

Optionally, the second supporting member 204 is provided with a plurality of pairs, and the plurality of pairs of second supporting members 204 are arranged at intervals along the first direction.

Illustratively, as shown in fig. 5 and 6, the second supports 204 are provided in two pairs, wherein two second supports 204 of one pair of second supports 204 are first substrate supports 2041 and two second supports 204 of the other pair of second supports 204 are second substrate supports 2042. In the a direction, two first substrate supports 2041 are disposed on one side of two second substrate supports 2042.

Therefore, the area of the supporting surface between the circuit board and the substrate 2 can be increased by using the plurality of pairs of second supporting pieces 204, so that the supporting stability of the circuit board on the substrate 2 is improved, and the risk of assembling and inclining the fingerprint chip assembly is reduced.

Optionally, two of the same pair of second supports 204 are spaced apart along the first direction.

Illustratively, as shown in fig. 6, two first substrate supports 2041 are spaced apart along the a-direction and two second substrate supports 2042 are spaced apart along the a-direction.

Therefore, the distance between the same pair of second supporting pieces 204 is far, the area of the supporting surface between the circuit board and the substrate 2 can be increased, the supporting stability of the circuit board on the substrate 2 is improved, and the risk of assembling and inclining the fingerprint chip assembly is reduced.

Of course, in other embodiments, as shown in fig. 5, both of the same pair of second supports 204 may be aligned in the first direction. Alternatively, as shown in fig. 6, when the second supports 204 are provided in a plurality of pairs, two of the second supports 204 of one pair are aligned in the first direction, and two of the second supports 204 of the other pair are offset in the first direction.

Alternatively, the cross-section of the second support 204 may be circular, rectangular, triangular, or other regular or irregular shapes. Wherein the cross section of the second support 204 is perpendicular to the C-direction.

The embodiment of the disclosure provides a fingerprint identification module. As shown in fig. 6, the fingerprint identification module 100 of the embodiment of the present disclosure includes a circuit board 1 and a fingerprint chip assembly. The circuit board 1 has a plurality of first pads 103, and the plurality of first pads 103 are arranged at intervals in a first direction. The centers of at least two of the plurality of first pads 103 are staggered in a second direction, which is perpendicular to the first direction. Wherein the first direction is a line output direction of the circuit board 1.

The plurality of first pads 103 are arranged at intervals along the first direction, and it is understood that any two adjacent first pads 103 have a space therebetween in the line output direction. The centers of at least two of the first pads 103 are staggered in the second direction, which means that the centers of at least three of the first pads 103 are not on the same straight line, or the connecting line of the centers of the first pads 103 is non-straight.

The fingerprint chip 3 assembly comprises a chip 3 and a substrate 2, and the chip 3 is connected with the substrate 2. The substrate 2 has a plurality of second pads 203, the plurality of second pads 203 are provided at intervals in a first direction of the substrate 2, and centers of at least two of the plurality of second pads 203 are shifted in a second direction.

The plurality of second pads 203 are arranged at intervals along the first direction, and it is understood that any two adjacent second pads 203 have a space therebetween in the line output direction. The centers of at least two of the second pads 203 are offset in the second direction, which means that the centers of at least three of the second pads 203 are not on the same straight line, or the connecting lines of the centers of the second pads 203 are non-straight lines.

The plurality of second pads 203 and the plurality of first pads 103 are arranged in a one-to-one correspondence, and each second pad 203 is connected to a corresponding first pad 103.

In order to make the technical solution of the present disclosure more easily understood, the following further describes the technical solution of the present disclosure by taking the first direction as the a direction, the second direction as the B direction, and the third direction as the C direction as examples. The third direction is perpendicular to each of the first direction and the second direction, or the first direction, the second direction and the third direction are orthogonal to each other.

Illustratively, as shown in fig. 6, the circuit board 1 has a first surface 101 and a second surface 102 opposed in the C direction. The substrate 2 has a third surface 201 and a fourth surface 202 opposite in the C direction. The first surface 101 and the third surface 201 are oppositely disposed in the C direction. As shown in fig. 2 to 4, the first surface 101 has a plurality of first pads 103, and the plurality of first pads 103 are arranged at intervals in the a direction. The third surface 201 has a plurality of second pads 203, and the plurality of second pads 203 are disposed at intervals along the a direction. The plurality of first pads 103 and the plurality of second pads 203 correspond one to one, and each first pad 103 and the corresponding second pad 203 are opposed and soldered in the C direction, thereby achieving electrical and mechanical connection of the substrate 2 and the circuit board 1.

As shown in fig. 2 to 4, the centers of at least two of the plurality of first pads 103 are staggered in the B direction. Illustratively, at least one of the plurality of first pads 103 is a first circuit board pad 1031, at least one of the plurality of first pads 103 is a second circuit board pad 1032, and a center of the first circuit board pad 1031 and a center of the second circuit board pad 1032 are disposed at an interval in the B direction.

From this, through the nonlinear setting of a plurality of first pads 103 in the circuit board 1 to and the nonlinear setting of a plurality of second pads 203 in the base plate 2, when circuit board 1 and fingerprint chip subassembly welding equipment, can increase the area of the contact area between circuit board 1 and the fingerprint chip subassembly and holding surface, thereby can improve the support stability of circuit board 1 to base plate 2, effectively avoid fingerprint identification module equipment slope. And further, the installation yield of the terminal device having the fingerprint identification module 100 of the embodiment of the disclosure can be improved. The support surface is a surface formed by connecting support points formed by contacting the substrate 2 and the circuit board 1. The larger the support surface between the substrate 2 and the circuit board 1, the better the support stability of the circuit board 1 to the substrate 2.

Therefore, the fingerprint identification module 100 of the embodiment of the present disclosure has at least an advantage of low risk of assembly tilt. That is to say, through the integrated equipment of circuit board and fingerprint chip subassembly of this disclosed embodiment, can improve the problem of fingerprint identification module equipment slope.

Optionally, the second pads 203 are connected to the corresponding first pads 103 by solder 4.

Alternatively, the circuit board 1 may be a flexible circuit board.

From this, circuit board 1's thickness is thinner, and easy the buckling is favorable to using including pressing of circuit board 1's fingerprint identification module 100.

Alternatively, the substrate 2 may have a flat plate shape or an arc plate shape.

In some embodiments, the plurality of first pads 103 is arranged in a wave or S-shape and the plurality of second pads 203 is arranged in a wave or S-shape. In other words, the connection line of the centers of the plurality of first pads 103 has a wave shape or an S shape. The connection line of the centers of the plurality of second pads 203 is waved or S-shaped.

The connection line of the centers of the plurality of first pads 103 is in a wave shape or an S shape, which means that the connection line of the centers of the plurality of first pads 103 is in a general wave shape or an S shape, or the connection line of the centers of the plurality of first pads 103 is in a regular wave shape or an S shape. The connection line of the centers of the second pads 203 is in a wave shape or an S shape, which means that the connection line of the centers of the second pads 203 is in a wave shape or an S shape, or the connection line of the centers of the second pads 203 is in a regular wave shape or an S shape.

Illustratively, as shown in fig. 2 and 3, the plurality of first pads 103 are arranged in a generally wave-like shape; as shown in fig. 5, the plurality of second pads 203 are arranged in a substantially wave shape. As shown in fig. 4, the plurality of first pads 103 are arranged in a substantially S-shape; as shown in fig. 6, the plurality of second pads 203 are arranged in a substantially S-shape.

Therefore, the centers of the plurality of first bonding pads 103 are staggered in the B direction, the centers of the plurality of second bonding pads 203 are staggered in the B direction, and when the circuit board 1 is welded and assembled through the first bonding pads 103 and the second bonding pads 203 of the substrate 2, the area of a supporting surface between the fingerprint chip assembly and the circuit board 1 can be increased, so that the supporting stability of the circuit board 1 on the fingerprint chip assembly can be improved, and the risk of assembling inclination of the fingerprint identification module is reduced.

Optionally, centers of at least two adjacent ones of the plurality of first pads 103 are aligned in the second direction. Centers of at least adjacent two of the plurality of second pads 203 are aligned in the second direction.

Illustratively, as shown in fig. 3, the first circuit board pads 1031 are arranged in three, the three first circuit board pads 1031 are arranged adjacently, and the centers of the three first circuit board pads 1031 are aligned in the B direction. That is, the connecting lines of the centers of the three first circuit board pads 1031 are straight lines, and the connecting lines of the centers of the three first circuit board pads 1031 are perpendicular to the a direction. It is understood that the second pads 203 correspond to the arrangement of the first pads 103. As shown in fig. 4, the first substrate pads 2031 are provided in three, the three first substrate pads 2031 are provided adjacently, and the centers of the three first substrate pads 2031 are aligned in the B direction. That is, the line connecting the centers of the three first substrate pads 2031 is a straight line, and the line connecting the centers of the three first substrate pads 2031 is perpendicular to the a direction. It is understood that the first pads 103 correspond to the arrangement of the second pads 203.

Therefore, the arrangement of the first bonding pads 103 is ordered, so that the processing of the circuit board 1 is facilitated, and the processing cost of the circuit board 1 is reduced; the arrangement of a plurality of second pads 203 is more orderly, and the processing of base plate 2 of being convenient for is favorable to reducing the processing cost of base plate 2 to can reduce the processing cost of fingerprint identification module 100.

Optionally, the center of at least one of the plurality of first pads 103 is located at an intermediate position of the circuit board 1 in the second direction. Centers of at least two of the plurality of first pads 103 are located on both sides of the circuit board 1 in the second direction, respectively.

Illustratively, as shown in fig. 4, the center of the second circuit board pad 1032 is located at the middle position of the circuit board 1 in the B direction. In other words, the circuit board 1 has a center line extending in the a direction, and the center of the second circuit board pad 1032 coincides with the center line. At least one of the plurality of first pads 103 is a third circuit board pad 1033. Centers of the first circuit board pad 1031 and the third circuit board pad 1033 are located on both sides of the circuit board 1 in the B direction, respectively. As shown in fig. 5, the center of the second substrate pad 2032 is located at the middle position of the substrate 2 in the B direction. In other words, the substrate 2 has a center line extending in the a direction, and the center of the second substrate pad 2032 coincides with the center line. At least one of the plurality of second pads 203 is a third substrate pad 2033. The centers of the first substrate pad 2031 and the third substrate pad 2033 are located on both sides of the substrate 2 in the B direction, respectively.

Therefore, the two sides of the width direction of the circuit board 1 and the middle position of the width direction of the circuit board 1 are provided with the first welding pads 103, the two sides of the width direction of the substrate 2 and the middle position of the width direction of the substrate 2 are provided with the second welding pads 203, and the first welding pads 103 and the second welding pads 203 can improve the supporting stability of the circuit board 1 on the substrate 2 and reduce the assembling inclination risk of the fingerprint identification module.

In some embodiments, the fingerprint identification module 100 further includes supporting members disposed in pairs, two of the supporting members in the same pair are respectively located at two sides of the circuit board 1 in the second direction, and two ends of the supporting members respectively abut against the circuit board 1 and the substrate 2.

For example, as shown in fig. 7, the supporting members are disposed on the circuit board 1, that is, the supporting members are first supporting members 104, and the same pair of first supporting members 104 are respectively located on two sides of the circuit board 1 in the B direction. Each of the first supports 104 has a first end and a second end opposite to each other in the C direction, the first end of each of the first supports 104 is connected to the circuit board 1, and the second end of each of the first supports 104 abuts on the substrate 2.

Illustratively, as shown in fig. 5 and 6, the supporting members are disposed on the substrate 2, that is, the supporting members are the second supporting members 204, and the same pair of second supporting members 204 are respectively located on both sides of the substrate 2 in the B direction. Each of the second supports 204 has a first end and a second end opposite to each other in the C direction, the first end of each of the second supports 204 is connected to the base plate 2, and the second end of each of the second supports 204 abuts on the circuit board 1.

From this, when circuit board 1 and fingerprint chip subassembly equipment, support piece 104's both ends support respectively and lean on circuit board 1 and base plate 2, can increase the area of the holding surface between circuit board 1 and the base plate 2 to improve the support stability of circuit board 1 to base plate 2, and then reduce the risk of fingerprint identification module equipment slope.

Of course, in other embodiments, the supporting members may be disposed on both the circuit board 1 and the substrate 2.

In some embodiments, the support may be an ink support. In other words, the material of the supporting member may be ink.

The support is formed, for example, by printing on the circuit board 1 and/or the substrate 2. From this, the material cost of support piece is lower, is favorable to reducing fingerprint identification module 100's cost.

Of course, in other embodiments, the support member may also be a copper support member.

Alternatively, the support member is formed on the circuit board 1 and/or the substrate 2 by screen printing.

Illustratively, the support is formed by silk-screen printing, and the height of the support is 0.02 mm. Wherein, the height of the support is the size of the support in the direction C.

Alternatively, the support member is formed on the circuit board 1 by using a process of solder resist pretreatment, solder resist printing, solder resist pre-baking, solder resist exposure, solder resist development, and solder resist curing. Wherein solder resist means that soldering is prevented.

Illustratively, the height of the support member may be 0.04mm by forming the support member through the above-described process. Wherein, the height of the support is the size of the support in the direction C.

Therefore, when the first bonding pads 103 and the second bonding pads 203 are soldered by using solder paste, even if the solder paste is high in height, the substrate 2 can be supported on the circuit board 1 by using the supporting member, so that the circuit board 1 and the substrate 2 can be connected by soldering.

Of course, in other embodiments, the height of the supporting member may be any one of 0.02mm to 0.04 mm; alternatively, the height of the support member is less than 0.02 mm; alternatively, the height of the support is greater than 0.04 mm. It is understood that the height of the support member depends on the distance between the circuit board 1 and the substrate 2 after the first pads 103 and the second pads 203 are soldered, and the height of the support member should be equal to the distance between the circuit board 1 and the substrate 2.

Optionally, the support member is provided with a plurality of pairs of support members, the pairs of support members being spaced apart along the first direction.

For example, as shown in fig. 2 to 4, the first supports 104 are provided in two pairs, wherein two first supports 104 of one pair of the first supports 104 are first circuit board supports 1041, and two first supports 104 of the other pair of the first supports 104 are second circuit board supports 1042. In the a direction, two first circuit board supports 1041 are provided at one side of two second circuit board supports 1042.

From this, utilize many pairs of support piece can increase the area of the holding surface between circuit board 1 and the base plate 2 to improve the support stability of circuit board 1 to base plate 2, and then reduce the risk of fingerprint identification module equipment slope.

Optionally, both of the supports of the same pair are spaced apart in the first direction.

Illustratively, as shown in fig. 4, two first circuit board supports 1041 are spaced apart in the a direction, and two second circuit board supports 1042 are spaced apart in the a direction.

From this, the same distance between to the support piece is far away, can increase the area of the holding surface between circuit board 1 and the fingerprint chip subassembly to can improve the support stability of circuit board 1 to the fingerprint chip subassembly, and then reduce the risk of fingerprint identification module equipment slope.

Of course, in other embodiments, both of the same pair of supports may be aligned in the first direction. Alternatively, when the supporting members are provided in plural pairs, two of the supporting members of one pair are aligned in the first direction, and two of the supporting members of the other pair are staggered in the first direction.

Alternatively, the cross-section of the support member may be circular, rectangular, triangular, or other regular or irregular shapes. Wherein the cross section of the support member is perpendicular to the C direction.

The terminal device of the embodiment of the present disclosure includes the fingerprint identification module 100 of any one of the above embodiments.

The terminal equipment can be a mobile phone, a tablet computer, a notebook computer or the like.

In the related art, the yield loss of the terminal equipment caused by the assembling inclination of the fingerprint identification module is 1.5%. Adopt this disclosed embodiment's terminal equipment, the yield that causes because fingerprint identification module equipment slope falls to below 0.5%.

Therefore, the terminal device of the embodiment of the disclosure has the advantages of high installation yield and the like.

In some embodiments, the terminal device includes a middle frame, and the fingerprint identification module is disposed on the middle frame. In other words, the fingerprint identification module is a side fingerprint module.

The middle frame can comprise a frame, and the fingerprint identification module is arranged on the frame.

Therefore, the cost of the terminal equipment is reduced, the identification speed of the terminal equipment is improved, and the user experience is improved.

In the description of the present disclosure, it is to be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the present disclosure and to simplify the description, but are not intended to indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and are therefore not to be considered limiting of the present disclosure.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present disclosure, "a plurality" means at least two, e.g., two, three, etc., unless explicitly specifically limited otherwise.

In the present disclosure, unless otherwise explicitly stated or limited, the terms "mounted," "connected," "secured," and the like are to be construed broadly, e.g., as meaning fixedly connected, detachably connected, or integral with; may be mechanically coupled, may be electrically coupled or may be in communication with each other; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meaning of the above terms in the present disclosure can be understood by those of ordinary skill in the art as appropriate.

In the present disclosure, unless otherwise expressly stated or limited, the first feature "on" or "under" the second feature may be directly contacting the first and second features or indirectly contacting the first and second features through an intermediate. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature "under," "beneath," and "under" a second feature may be directly under or obliquely under the second feature, or may simply mean that the first feature is at a lesser elevation than the second feature.

In the present disclosure, the terms "one embodiment," "some embodiments," "an example," "a specific example," or "some examples" and the like mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present disclosure. In this specification, the schematic representations of the terms used above are not necessarily intended to refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Moreover, various embodiments or examples and features of various embodiments or examples described in this specification can be combined and combined by one skilled in the art without being mutually inconsistent.

Although embodiments of the present disclosure have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present disclosure, and that variations, modifications, substitutions and alterations in the above embodiments by those of ordinary skill in the art are intended to be within the scope of the present disclosure.

Claims (20)

1. A circuit board is characterized in that the circuit board is provided with a plurality of first bonding pads, the first bonding pads are arranged at intervals along a first direction, the centers of at least two of the first bonding pads are staggered in a second direction, and the second direction is perpendicular to the first direction.

2. The circuit board of claim 1, wherein the plurality of first pads are arranged in a wave or S shape.

3. The circuit board of claim 2, wherein centers of at least two adjacent ones of the plurality of first pads are aligned in the second direction.

4. The circuit board of claim 2, wherein a center of at least one of the first pads is located at a middle position of the circuit board in the second direction; and/or

Centers of at least two of the first pads are respectively located on two sides of the circuit board in the second direction.

5. The circuit board according to any one of claims 1-4, wherein the circuit board further has a pair of first supports, two of the same pair of first supports being located on either side of the circuit board in the second direction, the first supports being configured to abut against a fingerprint chip assembly.

6. The circuit board of claim 5, wherein the first support member has a plurality of pairs, and the plurality of pairs of first support members are spaced apart along the first direction.

7. The circuit board of claim 5, wherein two of the same pair of the first supports are spaced apart along the first direction.

8. The circuit board of claim 5, wherein the first support is an ink support.

9. The circuit board of any of claims 1-4, wherein the circuit board is a flexible circuit board.

10. The fingerprint chip assembly is characterized by comprising a chip and a substrate, wherein the chip is connected with the substrate, the substrate is provided with a plurality of second bonding pads, the second bonding pads are arranged at intervals along a first direction, the centers of at least two of the second bonding pads are staggered in a second direction, and the second direction is perpendicular to the first direction.

11. The fingerprint chip assembly of claim 10, wherein the plurality of second pads are arranged in a wave or S-shape.

12. The fingerprint chip assembly of claim 11, wherein centers of at least two adjacent ones of the second pads are aligned in the second direction.

13. The fingerprint chip assembly of claim 11, wherein a center of at least one of the second pads is located at an intermediate position of the substrate in the second direction; and/or

Centers of at least two of the second pads are respectively located on two sides of the substrate in the second direction.

14. The fingerprint chip assembly of any one of claims 10-13, further comprising a pair of second supports, two of the second supports of the same pair being located on either side of the substrate in the second direction, the second supports being configured to rest on a circuit board.

15. The fingerprint chip assembly of claim 14, wherein the second support member is provided with a plurality of pairs, the pairs of second support members being spaced apart along the first direction.

16. The fingerprint chip assembly of claim 14, wherein two of the same pair of the second supports are spaced apart along the first direction.

17. The fingerprint chip assembly of claim 14, wherein the second support is an ink support.

18. The utility model provides a fingerprint identification module which characterized in that includes:

a circuit board, the circuit board being the circuit board of any one of claims 1-9; and

a fingerprint chip assembly, the fingerprint chip assembly being the fingerprint chip assembly of any one of claims 10-17;

the plurality of second bonding pads and the plurality of first bonding pads are arranged in a one-to-one correspondence mode, and each second bonding pad is connected with the corresponding first bonding pad.

19. A terminal device comprising the fingerprint recognition module of claim 18.

20. The terminal device according to claim 19, wherein the terminal device comprises a middle frame, and the fingerprint identification module is disposed on the middle frame.

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