CN216560706U - Semiconductor scraping probe structure - Google Patents
Semiconductor scraping probe structure Download PDFInfo
- Publication number
- CN216560706U CN216560706U CN202122369255.3U CN202122369255U CN216560706U CN 216560706 U CN216560706 U CN 216560706U CN 202122369255 U CN202122369255 U CN 202122369255U CN 216560706 U CN216560706 U CN 216560706U
- Authority
- CN
- China
- Prior art keywords
- probe
- semiconductor
- elastic body
- test
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
The utility model discloses a semiconductor scraping probe structure which comprises a test base, wherein an elastic body is arranged on the test base, a through hole is formed in the elastic body, a probe is inserted into the through hole, two ends of the probe are respectively located on two sides of the through hole, and two ends of the probe are respectively bent and inclined towards two sides of the probe. The elastic body can be made of rubber. Compared with the prior art, the utility model has the advantages that: the utility model has simple structure, when the device is put into use, the tested element is put into the testing base, the first end of the probe is stressed by a downward force to deform the elastic body, so that the probe rotates, and the current of the tested element flows from the first end of the probe to the second end to the PCB testing board to complete the test.
Description
Technical Field
The utility model belongs to the field of semiconductor auxiliary equipment, and particularly relates to a semiconductor scraping probe structure.
Background
The test chip needs to simulate the test of end user's procedure, and when testing, need be with the test chip mode in testing arrangement, and testing arrangement mostly uses the device body and sets up the spring probe in the device body and go on, but current spring probe is because spring life is shorter, and it is very important to obtain a semiconductor scraping probe structure of overcoming above-mentioned defect.
SUMMERY OF THE UTILITY MODEL
In order to solve at least one technical problem, the utility model provides a semiconductor scraping probe structure, which comprises a test base, wherein an elastic body is arranged on the test base, a through hole is formed in the elastic body, a probe is inserted into the through hole, two ends of the probe are respectively positioned at two sides of the through hole, and two ends of the probe are respectively bent and inclined towards two sides of the probe. The elastic body can be made of rubber.
The probe comprises a probe body, a first end and a second end, wherein the first end and the second end are integrally formed at two ends of the probe body, the first end is bent towards the first side of the probe body, and the second end is bent towards the other side of the probe body. The first end forms a semiconductor scratch test site.
The through holes are straight holes or inclined holes. The bottom of the test seat is connected with a PCB test board.
The ends of the first and second ends are curved to prevent scratching of the tested component.
Compared with the prior art, the utility model has the advantages that: the utility model has simple structure, when the device is put into use, the tested element is put into the testing base, the first end of the probe is stressed by a downward force to deform the elastic body, so that the probe rotates, and the current of the tested element flows from the first end of the probe to the second end to the PCB testing board to complete the test.
Drawings
FIG. 1 is a schematic cross-sectional view of the present invention;
FIG. 2 is a schematic cross-sectional view of the present invention in use;
FIG. 3 is a perspective view of the present invention in use;
reference numerals: 1-a test base; 2-an elastomer; 3, perforating; 4-a probe; 5-a first end; 6-a second end; 7-semiconductor scraping test site; 8-a tested element; 9-PCB test board; 10-insert column.
Detailed Description
In order that those skilled in the art will better understand the utility model and thus more clearly define the scope of the utility model as claimed, it is described in detail below with respect to certain specific embodiments thereof. It should be noted that the following is only a few embodiments of the present invention, and the specific direct description of the related structures is only for the convenience of understanding the present invention, and the specific features do not of course directly limit the scope of the present invention.
Referring to the attached drawings, the technical scheme includes that the semiconductor scraping probe structure comprises a test base, an elastic body is fixed on the test base, a through hole is formed in the elastic body, a probe is inserted into the through hole, two ends of the probe are located on two sides of the through hole respectively, and two ends of the probe are bent towards two sides of the probe respectively. The elastic body can be made of rubber.
Wherein the test base is integrally formed with an insertion column, the elastomer is provided with an insertion groove matched with the insertion column, and the insertion groove are fixedly connected in an inserting and matching manner.
The probe comprises a probe body, a first end and a second end, wherein the first end and the second end are integrally formed at two ends of the probe body, the first end is bent towards the first side of the probe body, and the second end is bent towards the other side of the probe body. The first end forms a semiconductor scratch test site.
The through holes are straight holes or inclined holes. The PCB test board is fixedly connected to the bottom of the test seat.
The ends of the first and second ends are curved to prevent scratching of the tested component.
Compared with the prior art, the utility model has the advantages that: the utility model has simple structure, when the device is put into use, the tested element is put into the testing base, the first end of the probe is stressed by a downward force to deform the elastic body, so that the probe rotates, and the current of the tested element flows from the first end of the probe to the second end to the PCB testing board to complete the test.
The above description is not intended to limit the present invention, and the present invention is not limited to the above examples, and variations, modifications, additions and substitutions which may be made by those skilled in the art within the spirit of the present invention are within the scope of the present invention.
Claims (5)
1. A semiconductor scrubbing probe structure, comprising: the testing device comprises a testing base (1), wherein an elastic body (2) is arranged on the testing base (1), a through hole (3) is formed in the elastic body (2), a probe (4) is inserted into the through hole (3), two ends of the probe (4) are respectively positioned on two sides of the through hole (3), and two ends of the probe (4) are respectively bent and inclined towards two sides of the probe (4); the probe (4) comprises a probe body, a first end (5) and a second end (6), wherein the first end (5) and the second end (6) are integrally formed at two ends of the probe body, the first end (5) is bent towards the first side of the probe body, and the second end (6) is bent towards the other side of the probe body.
2. The semiconductor scrub probe structure of claim 1, wherein: the through holes (3) are straight holes or inclined holes.
3. The semiconductor scrub probe structure of claim 1, wherein: the bottom of the test base is connected with a PCB test board (9).
4. The semiconductor scrub probe structure of claim 2, wherein: the first end (5) forms a semiconductor scrub test site (7).
5. The semiconductor scrub probe structure of claim 1, wherein: the end parts of the first end (5) and the second end (6) are arc-shaped.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202122369255.3U CN216560706U (en) | 2021-09-28 | 2021-09-28 | Semiconductor scraping probe structure |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202122369255.3U CN216560706U (en) | 2021-09-28 | 2021-09-28 | Semiconductor scraping probe structure |
Publications (1)
Publication Number | Publication Date |
---|---|
CN216560706U true CN216560706U (en) | 2022-05-17 |
Family
ID=81565806
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202122369255.3U Active CN216560706U (en) | 2021-09-28 | 2021-09-28 | Semiconductor scraping probe structure |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN216560706U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN115616371A (en) * | 2022-12-15 | 2023-01-17 | 佛山市联动科技股份有限公司 | Semiconductor device testing device and testing classifier |
-
2021
- 2021-09-28 CN CN202122369255.3U patent/CN216560706U/en active Active
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN115616371A (en) * | 2022-12-15 | 2023-01-17 | 佛山市联动科技股份有限公司 | Semiconductor device testing device and testing classifier |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TWI221684B (en) | Contact sheet for mutual electric conduction among plural electronic devices having spherical terminal or planar terminal | |
CN216560706U (en) | Semiconductor scraping probe structure | |
US6861862B1 (en) | Test socket | |
CN204514967U (en) | A kind of PCB test connector | |
JP2020502513A (en) | Spring-loaded probe having folded portion and probe assembly | |
CN216411479U (en) | Probe and integrated circuit test equipment | |
CN213903610U (en) | Elastic sheet for connector test probe module | |
TWM317015U (en) | Test probe | |
CN206515413U (en) | A kind of FPC wireline tests switching device | |
TW201027849A (en) | Connector | |
CN210894432U (en) | Novel DIMM card test fixture | |
TWI435505B (en) | Plug connector, connector and electronic components test device | |
JP2005209606A (en) | Anisotropic conductive sheet and semiconductor inspection device using the same | |
TWI599778B (en) | Test probe unit group | |
KR200345867Y1 (en) | a probe | |
CN205665942U (en) | Electronic circuit experiment connecting piece | |
CN210465502U (en) | Round crystal probe assembly | |
CN214750460U (en) | Probe shell fragment | |
JP2005061876A (en) | Probe unit, and manufacturing method for the probe unit | |
CN214895450U (en) | Probe mechanism with floatable shockproof mounting seat | |
CN211505632U (en) | Improved tweezers type test fixture | |
CN2314383Y (en) | Switching board for testing instruments of printed board circuits | |
CN217007388U (en) | Test piece | |
TW201036512A (en) | Adhesion-type memory device | |
CN215010955U (en) | Insert structure and electronic equipment |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
GR01 | Patent grant | ||
GR01 | Patent grant |