CN216545199U

CN216545199U - Semiconductor heating chip

Info

Publication number: CN216545199U
Application number: CN202122550680.2U
Authority: CN
Inventors: 李玉浩
Original assignee: Shenzhen Gaote Microelectronics Co ltd
Current assignee: Shenzhen Gaote Microelectronics Co ltd
Priority date: 2021-10-22
Filing date: 2021-10-22
Publication date: 2022-05-17
Anticipated expiration: 2031-10-22

Abstract

The utility model relates to the technical field of heating chips and discloses a semiconductor heating chip which comprises a chip body, wherein the chip body is composed of a waterproof layer, a packaging layer, a bonding film layer, an electrode layer, a silver glue layer, a semiconductor heating layer, an antibacterial layer and a heat conduction layer, the bottom of the waterproof layer is fixedly connected with the top of the packaging layer, the bottom of the packaging layer is fixedly connected with the top of the bonding film layer, two ends of the bottom of the bonding film layer are fixedly connected with the top of the electrode layer, and the bottom of the electrode layer is fixedly connected with the top of the silver glue layer. According to the utility model, the waterproof layer is arranged on the chip body, so that the chip body has waterproof performance, the service life of the chip body is prolonged, the antibacterial layer and the heat conduction layer are arranged on the chip body, so that the chip body has antibacterial performance, the safety of the chip body is improved, and the heat conductivity of the chip body is enhanced.

Description

Semiconductor heating chip

Technical Field

The utility model relates to the technical field of heating chips, in particular to a semiconductor heating chip.

Background

The electrothermal film technology is a new heating mode, and great progress is made in recent years. The electric heating element has the advantages that the electric heating film generates heat in a surface shape, the heat exchange area is large, and the electric heating conversion efficiency is high, so that the temperature rise is faster under the same power, the energy consumption is less, and the electric heating element is more energy-saving and power-saving than the traditional electric heating element. In addition, the electrothermal film can also be widely applied to the field of health care by radiating far infrared waves, and the far infrared waves can directly penetrate through skin and subcutaneous tissues and act on blood vessels, nerve endings and lymphatic vessels to cause molecular resonance and generate a warming effect, so that the electrothermal film has the effects of promoting blood circulation to remove blood stasis, diminishing inflammation and relieving pain and enhancing the immunity of a human body. In the long term, China is realizing energy transformation, electric energy mainly based on non-fossil energy becomes a primary energy main body, the electrification rate in primary energy consumption reaches 100%, and under the large background, a cleaner electric heating mode is undoubtedly more consistent with the current development trend and is also the best replacement technology of the future fossil heating mode.

The semiconductor heating chip disclosed in the chinese granted utility model patent application publication CN213472419U, however, the current semiconductor heating chip has poor water resistance and antibacterial property, and the service life of the heating chip is easily shortened.

We have proposed a semiconductor heat generating chip in order to solve the problems set forth above.

SUMMERY OF THE UTILITY MODEL

Technical problem to be solved

In view of the above-mentioned shortcomings in the prior art, an object of the present invention is to provide a semiconductor heat-generating chip, so as to solve the problems of the prior art in the above-mentioned background art that some semiconductor heat-generating chips in the market have poor water resistance and antibacterial property, and the service life of the heat-generating chip is easily shortened

To a problem of (a).

(II) technical scheme

In order to achieve the purpose, the utility model is realized by the following technical scheme:

a semiconductor heating chip comprises a chip body, wherein the chip body consists of a waterproof layer, a packaging layer, a bonding film layer, an electrode layer, a silver glue layer, a semiconductor heating layer, an antibacterial layer and a heat conduction layer;

the bottom of the waterproof layer is fixedly connected with the top of the packaging layer, the bottom of the packaging layer is fixedly connected with the top of the bonding film layer, two ends of the bottom of the bonding film layer are fixedly connected with the top of the electrode layer, the bottom of the electrode layer is fixedly connected with the top of the silver adhesive layer, the bottom of the silver adhesive layer is fixedly connected with the top of the semiconductor heating layer, the bottom of the semiconductor heating layer is fixedly connected with the top of the antibacterial layer, and the bottom of the antibacterial layer is fixedly connected with the top of the heat conducting layer.

Preferably, the waterproof layer is made of a waterproof breathable film material, and the adhesive film layer is made of a polyethylene-polyvinyl acetate copolymer material.

Preferably, the packaging layer is made of a glass material, and the semiconductor heating layer comprises a base layer and a functional layer.

Preferably, the antibacterial layer is made of a silver ion material, and the heat conduction layer is made of a silica gel material.

(III) advantageous effects

Compared with the prior art, the utility model has the beneficial effects that:

(1) through be provided with the waterproof layer on the chip body, can make the chip body have waterproof performance, improve the life of chip body.

(2) Through the structure that is provided with antibiotic layer and heat-conducting layer on the chip body, can make the chip body have antibiotic performance, improve the security of chip body to make the heat conductivity reinforcing of chip body.

Drawings

FIG. 1 is a schematic diagram of an exploded structure of a semiconductor heat-generating chip according to the present invention;

fig. 2 is a schematic perspective view of a semiconductor heating chip according to the present invention.

In the figure: 1. a chip body; 2. a waterproof layer; 3. a packaging layer; 4. bonding the film layer; 5. an electrode layer; 6. a silver glue layer; 7. a semiconductor heating layer; 8. an antimicrobial layer; 9. a thermally conductive layer.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Referring to fig. 1-2, the present invention provides a semiconductor heating chip; the chip comprises a chip body 1, wherein the chip body 1 consists of a waterproof layer 2, a packaging layer 3, a bonding film layer 4, an electrode layer 5, a silver glue layer 6, a semiconductor heating layer 7, an antibacterial layer 8 and a heat conduction layer 9;

the bottom of the waterproof layer 2 is fixedly connected with the top of the packaging layer 3, the bottom of the packaging layer 3 is fixedly connected with the top of the bonding film layer 4, both ends of the bottom of the bonding film layer 4 are fixedly connected with the top of the electrode layer 5, the bottom of the electrode layer 5 is fixedly connected with the top of the silver colloid layer 6, the bottom of the silver colloid layer 6 is fixedly connected with the top of the semiconductor heating layer 7, the bottom of the semiconductor heating layer 7 is fixedly connected with the top of the antibacterial layer 8, and the bottom of the antibacterial layer 8 is fixedly connected with the top of the heat conducting layer 9;

as a preferred technical scheme of the utility model: the waterproof layer 2 is made of waterproof breathable film material, and the bonding film layer 4 is made of polyethylene-polyvinyl acetate copolymer material;

as a preferred technical scheme of the utility model: the packaging layer 3 is made of glass materials, the semiconductor heating layer 7 comprises a base layer and a functional layer, and the base layer is made of polyester films or polyimide film materials;

as a preferred technical scheme of the utility model: the antibacterial layer 8 is made of silver ion material, and the heat conduction layer 9 is made of silica gel material.

Although the present invention has been described in detail with reference to the foregoing embodiments, it should be noted that, in the present invention, unless otherwise explicitly specified or limited, the terms "disposed," "mounted," "connected," "fixed," and the like are to be construed broadly, and for example, may be fixedly connected or detachably connected; or indirectly through an intermediary. The specific meanings of the above terms in the present invention can be understood by those of ordinary skill in the art according to specific situations; it will be apparent to those skilled in the art that modifications and equivalents may be made in the embodiments and/or portions thereof without departing from the spirit and scope of the present invention.

Claims

1. A semiconductor heating chip comprises a chip body (1), and is characterized in that the chip body (1) consists of a waterproof layer (2), a packaging layer (3), a bonding film layer (4), an electrode layer (5), a silver colloid layer (6), a semiconductor heating layer (7), an antibacterial layer (8) and a heat conduction layer (9);

the bottom of waterproof layer (2) and the top fixed connection of encapsulation layer (3), the bottom of encapsulation layer (3) and the top fixed connection of bonding rete (4), the bottom both ends of bonding rete (4) all with the top fixed connection of electrode layer (5), the bottom of electrode layer (5) and the top fixed connection of silver glue layer (6), the bottom of silver glue layer (6) and the top fixed connection of semiconductor heating layer (7), the bottom of semiconductor heating layer (7) and the top fixed connection of antibiotic layer (8), the bottom of antibiotic layer (8) and the top fixed connection of heat-conducting layer (9).

2. A semiconductor heat-generating chip according to claim 1, wherein the waterproof layer (2) is made of a waterproof breathable film material, and the adhesive film layer (4) is made of a polyethylene-polyvinyl acetate copolymer material.

3. A semiconductor heat-generating chip according to claim 1, wherein the encapsulating layer (3) is made of a glass material, and the semiconductor heat-generating layer (7) comprises a base layer and a functional layer.

4. A semiconductor heat-generating chip as recited in claim 1, wherein the antibacterial layer (8) is made of silver ion material and the heat conductive layer (9) is made of silicone material.