CN216526406U

CN216526406U - Packaging structure for improving performance of MEMS coaxial device

Info

Publication number: CN216526406U
Application number: CN202123027621.3U
Authority: CN
Inventors: 黄焱铖
Original assignee: Wuhan Jiaxun Photoelectric Co ltd
Current assignee: Wuhan Jiaxun Photoelectric Co ltd
Priority date: 2021-12-03
Filing date: 2021-12-03
Publication date: 2022-05-13
Anticipated expiration: 2031-12-03

Abstract

The utility model discloses a packaging structure for improving the performance of an MEMS coaxial device, which comprises an optical fiber component, a glass tube, a collimating lens, a metal tube and a TO component which are coaxially arranged. The optical fiber assembly is connected with the collimating lens, a contact pin of the optical fiber assembly and the collimating lens are positioned in the glass tube, and the glass tube and the TO assembly are sleeved with the metal tube. A cylindrical shell is formed at the tube cap end of the TO assembly, and an H-shaped axial section is formed inside the cylindrical shell; a separation surface is formed inside the H-shaped axial section, and a window is formed on the separation surface; the H-shaped axial section is divided by a separating surface TO form a first cavity and a second cavity, the first cavity is positioned on one side close TO the collimating lens, and the second cavity is positioned on one side close TO the TO assembly base. The utility model modifies and optimizes the TO assembly structure on the basis of the existing MEMS coaxial device, thereby improving the reliability and the stability of the product.

Description

Packaging structure for improving performance of MEMS coaxial device

Technical Field

The utility model belongs to the field of optical fiber communication, and particularly relates to a packaging structure for improving the performance of an MEMS coaxial device.

Background

The MEMS coaxial device has wide application in the field of optical fiber communication, and the main product series comprises an MEMS VOA (variable optical attenuator), an MEMS OSW (optical switch), an MEMS TLS (tunable laser light source), an MEMS TOF (tunable optical filter) and the like, and is a key component of a tunable electronic device. At present, most of the MEMS optical devices are packaged in a coaxial structure, that is, all the key elements are coaxially arranged and are substantially uniformly distributed according to the optical axis. The advantages of the structure include simple structure of the light path, compact overall size, convenient packaging and debugging, easy installation of modules at the later stage and the like, and the structure is applied to mass productization. The key elements mainly comprise a multi-core contact pin, a collimating lens, an MEMS TO assembly and the like, wherein the multi-core contact pin, the collimating lens and the MEMS TO assembly are integrally bonded and packaged through a glass tube.

Through retrieval, China with the publication number of CN207216081U specially facilitates 2018, 4 and 10, discloses a small-sized optical switch packaging structure, which comprises a shell, an optical fiber collimator, an MEMS with a reflector, a TO pipe cap and a TO pipe seat, wherein the optical fiber collimator comprises an optical fiber head, a pipe sleeve and a lens, the head of the optical fiber head is coaxially packaged in the pipe sleeve, the optical fiber head is provided with a plurality of fiber cores, at least one fiber core is an input channel, at least two fiber cores are output channels, the TO pipe cap is packaged in the shell, the TO pipe seat is fixed at one end of the TO pipe cap, and the MEMS with the reflector is fixed on the inner side face of the TO pipe seat; the tube sleeve is coaxially packaged in the other end of the TO tube cap, the collimating lens is coaxially fixed in the TO tube cap and is positioned between the sleeve and the MEMS with the reflector, and the convex surface of the collimating lens faces the MEMS with the reflector.

When the number of optical fiber contact pins is small, the packaging structure can meet the requirement of packaging strength; however, when optical fiber contact pins are excessive, because TO subassembly and shell contact surface are less, and the TO pipe cap top surface of current TO subassembly is arc with the junction of side TO lead TO the terminal surface of glass pipe less with the area of contact of TO pipe cap, connect unstably, easily cause the TO subassembly TO drop. Therefore, the packaging structure has a certain failure rate and cannot meet the use requirement of commercialization.

As shown in fig. 1, the package structure of the conventional MEMS coaxial device includes an optical system composed of an optical fiber assembly 1, a collimating lens 3, and a TO assembly 5, and after precise debugging, the optical index reaches an expected theoretical value. The contact pin of the optical fiber component 1, the collimating lens 3 and the TO structure 5 are packaged into a whole by using the glass tube 2, and then the glass tube 2 and the TO component are protected by using the metal tube 4. This kind of packaging structure's defect point lies in glass pipe 2 and TO structure 5's tie point, because TO structure 5's size is short and is located the one end of tubular metal resonator, can not balance the encapsulation intensity at both ends, and TO subassembly 5's cap top surface is arc with the junction of side moreover TO lead TO the area of contact of glass pipe terminal surface and cap terminal surface less, connect insecure, when overall structure is in the violent change of temperature or vibration impact strength when too big, above-mentioned packaging structure defect point can face the risk of losing efficacy. In particular, the above risk is further increased when the size of the entire optical element is increased.

Disclosure of Invention

In order TO overcome the problems in the prior art, the utility model provides a packaging structure for improving the performance of an MEMS coaxial device, which is characterized in that the structure of a tube cap of a TO assembly is improved, and the packaging stability is improved by increasing the contact area between the tube cap of the TO assembly and a metal tube and a glass tube.

The utility model is realized by the following scheme:

a packaging structure for improving the performance of an MEMS coaxial device comprises an optical fiber assembly, a glass tube, a collimating lens, a metal tube and a TO assembly, wherein the optical fiber assembly is connected with the collimating lens, a contact pin of the optical fiber assembly and the collimating lens are positioned in the glass tube, and the metal tube is sleeved outside the glass tube and the TO assembly; a cylindrical shell is formed at the end of a pipe cap of the TO assembly, and an H-shaped axial section is formed inside the cylindrical shell; a separation surface is formed inside the H-shaped axial section, and a window is formed on the separation surface; the H-shaped axial section is divided by a separating surface TO form a first cavity and a second cavity, the first cavity is positioned at one side close TO the collimating lens, and the second cavity is positioned at one side close TO the base of the TO assembly.

Further, an inner radius of the first cavity matches an outer radius of the collimating lens.

Further, the output end of the collimating lens is located inside the first cavity.

Furthermore, cylindric shell is integrated machine-shaping, has promoted the wholeness of pipe cap to promote the steadiness that pipe cap and other parts are connected.

Furthermore, the pipe cap of the TO assembly is fixed TO the inner wall of the metal pipe in an adhesion mode, so that the connection stability of the pipe cap and the inner wall of the metal pipe is enhanced, and the TO assembly is not prone TO falling off from the metal pipe.

Further, an optical MEMS chip is fixedly arranged on the surface, close TO the tube cap, of the base of the TO assembly.

Further, the base of TO subassembly is kept away from the surface of tube cap sets firmly a plurality of pin needles, pin needle is used for the transmission of signal of telecommunication.

Compared with the prior art, the utility model has the beneficial effects that:

(1) according TO the utility model, the existing TO assembly pipe cap is improved, and the key improvement point is that a mechanical structure extends out of the vicinity of the TO window TO form a cylindrical reinforced packaging structure, so that the contact area of the TO assembly with the metal pipe and the glass pipe is increased, the connection of the TO assembly with the metal pipe and the glass pipe is tighter, the firmness of the whole packaging structure is enhanced, and the failure proportion of the packaging structure is reduced. When the coaxial device is assembled, the output end of the collimating lens is deeply inserted into the extending cavity, then optical index debugging is carried out, and subsequent packaging is carried out after the debugging is qualified, so that the optical characteristic of the coaxial device is prevented from being influenced due TO the deviation of the relative position of the collimating lens and the TO assembly in the packaging process after the optical debugging. The utility model modifies and optimizes the existing MEMS coaxial device, reduces the failure proportion of the packaging structure, and can realize smooth upgrade and optimization of MEMS coaxial product series.

(2) The TO assembly is only required TO be structurally improved, and other components can continue TO use the assemblies in the prior art, so that the TO assembly is compatible with the existing standard production process, additional change cost cannot be increased, the structure is simple TO change, the processing is easy, the cost is low, and the TO assembly can be popularized and produced in batches.

Drawings

FIG. 1 is an axial cross-sectional view of a typical package structure of a prior art MEMS coaxial device;

FIG. 2 is an axial cross-section of the TO assembly of the present invention;

fig. 3 is an axial cross-sectional view of a MEMS coaxial device package structure of the present invention.

In the figure: 1: an optical fiber assembly; 101: an optical fiber; 102: inserting a pin; 2: a glass tube; 3: a collimating lens; 4: a metal tube; 5: an existing TO component; 6: the TO component of the present invention; 601: a pipe cap; 602: a tube holder; 603: an optical MEMS chip; 604: a pin needle; 605: a window; 606: a first cavity; 607: a second cavity.

Detailed Description

The technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. It is to be understood that the described embodiments are merely exemplary of the utility model, and not restrictive of the full scope of the utility model. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Examples

The packaging structure of the embodiment comprises an optical fiber assembly 1, a glass tube 2, a collimating lens 3, a metal tube 4 and a TO assembly 6, wherein the optical fiber assembly 101 comprises an optical fiber 101 and a pin 102 of an optical fiber connector.

As shown in FIG. 2, the present invention optimizes the TO package structure TO form the TO package 6. Wherein, the pipe cap 601 is formed with a cylindrical housing, and an "H" shaped axial cross section is formed inside the cylindrical housing; a separation surface is formed inside the H-shaped axial section, and a window 605 is formed on the separation surface; the "H" shaped axial section is divided by a dividing plane TO form a first cavity 606 and a second cavity 607, the first cavity 606 is located near the collimating lens side, and the second cavity 607 is located near the base of the TO module. The surface of the base 602 close to the second cavity 607 is fixedly provided with an optical MEMS chip 603, and the surface of the base 602 far from the second cavity 607 is fixedly provided with a plurality of pins 604. In order TO achieve better stability, in the embodiment, the cap 601 is integrally formed, and the socket 602 and the pin 604 of the TO module 6 are integrally formed, so that the reliability and the workability of the whole structure are ensured.

As shown in fig. 3, when the optical device is debugged, the output end of the collimating lens 3 extends into the first cavity 606, after the optical index is debugged TO be qualified, the contact pin 102 and the collimating lens 3 are packaged together by the glass tube 2, and because the output end of the collimating lens 3 is located in the first cavity 606, the relative position offset between the TO assembly 6 and the collimating lens 3 is not easily caused in the packaging process after the optical index is adjusted, and the optical index qualification rate of the packaged product is ensured TO be high.

The end face of the glass tube 2 close TO the TO assembly 6 and the end face of the tube cap 601 close TO the collimating lens 3 are fixedly adhered; the metal pipe 4 encapsulates in the outside of subassembly, and the inside radius of metal pipe 4 matches with the outside radius of glass pipe 2 and pipe cap 601, and the outside radius of metal pipe 4 equals with the outside radius of base 602, and the inner wall of metal pipe 4 and the outer wall adhesion of the outer wall of glass pipe 2 and pipe cap 601 are fixed. The packaging structure can prolong the length of the TO assembly 6 in the metal tube 4, increase the contact area of the tube cap 601 and the glass tube 2 and comprehensively improve the packaging strength. In the face of an environment with severe temperature change or an environment with more serious vibration impact, the packaging structure can effectively improve the performance index of the whole device. Especially, when the external dimension of the optical element becomes larger, the applicability and the optimization of the improved packaging structure are more prominent.

The foregoing has described the general principles, principal features and advantages of the utility model. It should be understood by those skilled in the art that the above embodiments do not limit the present invention in any way, and all technical solutions obtained by using equivalent alternatives or equivalent variations fall within the scope of the present invention.

Claims

1. A packaging structure for improving the performance of a MEMS coaxial device, comprising: the optical fiber assembly is connected with the collimating lens, a contact pin and the collimating lens of the optical fiber assembly are positioned in the glass tube, and the metal tube is sleeved outside the glass tube and the TO assembly; a cylindrical shell is formed at the end of a pipe cap of the TO assembly, and an H-shaped axial section is formed inside the cylindrical shell; a separation surface is formed inside the H-shaped axial section, and a window is formed on the separation surface; the H-shaped axial section is divided by a separating surface TO form a first cavity and a second cavity, the first cavity is positioned at one side close TO the collimating lens, and the second cavity is positioned at one side close TO the base of the TO assembly; the end face of one side, close TO the collimating lens, of the cylindrical shell of the TO assembly is abutted TO the end face of the glass tube.

2. The package structure of claim 1, wherein an inner radius of the first cavity matches an outer radius of the collimating lens.

3. The package structure of claim 2, wherein the output end of the collimating lens is located inside the first cavity.

4. The package structure of claim 1, wherein the cylindrical housing is integrally formed.

5. The package structure of claim 1, wherein the cap of the TO package is adhesively secured TO the inner wall of the metal tube.

6. The package structure of claim 1, wherein the base of the TO package has an optical MEMS chip mounted on a surface of the base adjacent TO the cap.

7. The package structure for improving the performance of the MEMS coaxial device as claimed in claim 1, wherein the surface of the base of the TO component away from the cap is provided with a plurality of pins.