CN113382533A - Optical fiber amplifier compatible with QSFP packaging - Google Patents
Optical fiber amplifier compatible with QSFP packaging Download PDFInfo
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- CN113382533A CN113382533A CN202110768072.0A CN202110768072A CN113382533A CN 113382533 A CN113382533 A CN 113382533A CN 202110768072 A CN202110768072 A CN 202110768072A CN 113382533 A CN113382533 A CN 113382533A
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- 239000013307 optical fiber Substances 0.000 title claims abstract description 76
- 238000004806 packaging method and process Methods 0.000 title abstract description 10
- 239000000835 fiber Substances 0.000 claims abstract description 26
- 230000003321 amplification Effects 0.000 claims abstract description 18
- 238000003199 nucleic acid amplification method Methods 0.000 claims abstract description 18
- 230000003287 optical effect Effects 0.000 claims description 54
- 230000003595 spectral effect Effects 0.000 claims description 13
- 238000005057 refrigeration Methods 0.000 claims description 8
- 238000002955 isolation Methods 0.000 claims description 5
- 239000000919 ceramic Substances 0.000 claims description 4
- 230000037431 insertion Effects 0.000 claims 2
- 238000003780 insertion Methods 0.000 claims 2
- 238000013461 design Methods 0.000 description 7
- 238000005452 bending Methods 0.000 description 6
- FPWNLURCHDRMHC-UHFFFAOYSA-N 4-chlorobiphenyl Chemical compound C1=CC(Cl)=CC=C1C1=CC=CC=C1 FPWNLURCHDRMHC-UHFFFAOYSA-N 0.000 description 5
- 238000005253 cladding Methods 0.000 description 4
- 230000004927 fusion Effects 0.000 description 4
- 238000010521 absorption reaction Methods 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 230000007774 longterm Effects 0.000 description 2
- 238000012544 monitoring process Methods 0.000 description 2
- 101150014352 mtb12 gene Proteins 0.000 description 2
- 239000002390 adhesive tape Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000005086 pumping Methods 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Lasers (AREA)
- Optical Communication System (AREA)
Abstract
The invention discloses a fiber amplifier compatible with QSFP packaging, which comprises a shell compatible with QSFP packaging structure, and is characterized in that: the LED lamp is characterized in that a PCB, an optical fiber amplification light path device and a circuit device are arranged inside the shell, a golden finger type power connector is arranged at the end of the PCB and extends out of the shell, the optical fiber amplification light path device is arranged on the upper surface of the PCB, and the circuit device is arranged on the lower surface of the PCB. The optical fiber amplifier compatible with the QSFP package has very compact internal space, the appearance of the product is compatible with the standard QSFP package, and the electric interface pin also meets the requirements of the existing QSFP package, and can meet the requirements of dynamic plugging and unplugging, plug and play and very convenient use.
Description
Technical Field
The invention relates to the field of optical fiber amplifiers, in particular to an optical fiber amplifier compatible with QSFP packaging.
Background
The multi-vendor protocol MSA of QSFP requires a maximum space height of 1.55mm of PCB to the bottom of the housing. The minimum diameter of the optical device in the industry is 1.8 mm. And the thickness requirement of the QSFP package on the PCB is 1 +/-0.1 mm, and the thickness requirement of the bottom plate of the shell is 0.6 +/-0.05 mm. The requirements for the thickness of the floor of the housing dictate that the thickness of the housing cannot be reduced to make more space in height, nor that a portion of the thickness of the interior of the housing be excavated to make more space. The thickness of the PCB limits the thinning of its thickness to make more high speed space free. If the hollowed area reduces the area of the PCB electronic part, the layout of the PCB can not be placed to realize the control of two modes of AGC and APC.
Disclosure of Invention
The invention aims to provide a fiber amplifier compatible with QSFP packaging.
In order to achieve the purpose, the invention adopts the following technical scheme:
the utility model provides a compatible QSFP encapsulated fiber amplifier, includes the casing of compatible QSFP packaging structure, inside PCB board, the optical fiber amplification light path device and the circuit device of being equipped with of casing, the tip of PCB board has golden finger type power connector, and this golden finger type power connector extends outside the casing, the upper surface of PCB board is arranged in to optical fiber amplification light path device, and the lower surface of PCB board is arranged in to the circuit device.
Furthermore, the optical fiber amplification light path device comprises a two-in-one light splitting detector, an erbium-doped optical fiber, a two-in-one IWDM, an isolation device, an LC double optical port and a 3-pin non-refrigeration pump; the two-in-one spectral detector comprises an input end spectral detector and an output end spectral detector, the erbium-doped fiber is of an annular structure, and the LC double-optical-port comprises an input end LC optical port and an output end LC optical port; the input end LC optical port is connected with one end of the input end light splitting detector, the other end of the input end light splitting detector is sequentially connected with the two-in-one IWDM, the erbium-doped optical fiber, the isolating device, the output end light splitting detector and the output end LC optical port, and the output end of the 3-pin non-refrigeration pump is connected to the two-in-one IWDM.
Furthermore, the input end light splitting detector and the output end light splitting detector are both in tubular structures.
Furthermore, the input end LC optical port and the output end LC optical port are internally integrated with optical fiber heads, the optical fiber heads comprise ceramic ferrules and optical fibers, the optical fibers are spliced and fixed on the ceramic ferrules, the optical fibers on the input end LC optical port are welded with the input end light splitting detector, and the optical fibers on the output end LC optical port are welded with the output end light splitting detector.
Furthermore, the erbium-doped fiber is an OFS L-band erbium-doped fiber, the shell is provided with a fiber bayonet, and the fiber bayonet is used for restricting the shape of the erbium-doped fiber in space, so that the erbium-doped fiber is in an elliptic disc-shaped structure.
Further, the two-in-one IWDM is an isolator and a WDM.
Further, the isolation device is a bipolar isolator.
Further, the Pump of the 3pin non-refrigeration Pump is II-VI Pump.
Further, the circuit device includes a circuit chip.
Further, the optical fiber amplifier supports two functions of APC/AGC; APC, AGC function realizes through the mode control of the register chooses to switch; when the APC mode is selected, for use at the rear of the optical transmitter, as a boost amplifier; when the AGC mode is selected, the front end for the optical receiver is used as a pre-amplifier.
The optical fiber amplifier compatible with the QSFP package has very compact internal space, the appearance of the product is compatible with the standard QSFP package, and the electric interface pin also meets the requirements of the existing QSFP package, and can meet the requirements of dynamic plugging and unplugging, plug and play and very convenient use.
Drawings
The invention is described in further detail below with reference to the accompanying drawings and the detailed description;
FIG. 1 is a schematic view of the present invention;
fig. 2 is a schematic diagram of one of the LC dual optical ports.
Detailed Description
As shown in fig. 1, the optical fiber amplifier compatible with QSFP packaging according to the present invention includes a housing (including a housing 1 and a cover plate 2) compatible with QSFP packaging structure, where a PCB 3, an optical fiber amplification optical path device, and a circuit device are disposed inside the housing, a gold finger-shaped power connector is disposed at an end of the PCB 3, the gold finger-shaped power connector extends out of the housing, the optical fiber amplification optical path device is disposed on an upper surface of the PCB 3, and the circuit device is disposed on a lower surface of the PCB 3.
The shell size, the optical port, the electrical port and the position of the PCB 3 of the QSFP all meet the requirements of a multi-supplier protocol MSA SFF8661 on QSFP + and QSFP28, and are not described herein.
The optical fiber amplifier of the invention supports two functions of APC/AGC; APC, AGC function realizes through the mode control of the register chooses to switch; when the APC mode is selected, for use at the rear of the optical transmitter, as a boost amplifier; when the AGC mode is selected, the front end for the optical receiver is used as a pre-amplifier. When in use, the user can flexibly switch between the transmitting end and the receiving end.
The circuit device comprises a circuit chip, and specifically comprises an FPGA, an RAM, an MCU, a Hot-SWAP, a LOG Amplifier, a current sensor, an ADC/DAC, a power supply, a pump drive circuit and the like. The circuit design adopts log-amplifier (log-amplifier) to replace TZA circuit to reduce the area of PCB board 3.
The size of 38 pins of the golden finger type power connector meets the requirement of MSA SFF-8636 hardware, but the definition of 38 pins flexibly endows functions according to the control requirement of the EDFA.
The optical fiber amplification light path device comprises a two-in-one light splitting detector, an erbium-doped optical fiber 5, two-in-one IWDM10, an isolation device 6, an LC double optical port 4 and a 3-pin non-refrigeration pump 9; the two-in-one spectral detector comprises an input end spectral detector 7 and an output end spectral detector 8, the erbium-doped optical fiber 5 is of an annular structure, and the LC double optical port 4 comprises an input end LC optical port and an output end LC optical port; the input end LC optical port is connected with one end of the input end light splitting detector 7, the other end of the input end light splitting detector 7 is sequentially connected with the two-in-one IWDM10, the erbium-doped optical fiber 5, the isolating device 6, the output end light splitting detector 8 and the output end LC optical port, and the output end of the 3-pin uncooled pump 9 is connected with the two-in-one IWDM 10. The input-side spectrometer 7 is a super-small 2% spectrometer (not limited to 2%, but may be 1%, 5%, 10%, etc. other spectrometer ratios that can be used for monitoring); the output end light splitting detector 8 is a super-small 2% light splitting (not limited to 2%, and may be 1%, 5%, 10% and other light splitting ratios which can be used for monitoring), after 1550nm signal light is input to the input end light splitting detector 7 from an input end LC optical port, 98% of the signal light passes through 1980/1550nm two-in-one IWDM10 and then passes through an isolator to isolate other light, then 1550nm signal light is transmitted into the erbium-doped fiber 5 through a WDM light splitting film, meanwhile, 980nm pump light is reflected into the erbium-doped fiber 5 through a 980/1550nm WDM light splitting film, at this time, 1550nm signal light amplified in the erbium-doped fiber 5 (because the erbium-doped fiber 5 amplification principle is well known and not detailed here) is output through the isolator 6, and 98% of EDFA output signals in the output end light splitting detector 8 are finally output through an output end LC optical port, wherein, the light splitting is carried out for 2 percent to monitor the output signal of the EDFA.
The input end light splitting detector 7 and the output end light splitting detector 8 are both tubular structures, the size is only phi 1.8x14mm (the diameter x length), the optical fiber output adopts 80um (the cladding diameter) and low bending loss optical fiber, and therefore the whole optical amplification system can be integrated into a smaller platform.
As shown in fig. 2, fiber heads are integrated inside the input end LC optical port and the output end LC optical port, the fiber heads include a ferrule 11 and an optical fiber 12, the optical fiber 12 is fixed to the ferrule 11 by plugging, the optical fiber 12 on the input end LC optical port is welded to the input end spectral detector 7, and the optical fiber 12 on the output end LC optical port is welded to the output end spectral detector 8. The ferrule 11 and the optical fiber 12 are assembled in the stainless steel tube 13 and directly output as an optical fiber.
The erbium-doped fiber 5 is an OFS L-band erbium-doped fiber 5, the absorption peak value of the OFS L-band erbium-doped fiber 5 at 1530nm is 37+/-3dB/m, the length of the erbium-doped fiber 5 can be as short as possible due to high absorption of the OFS L-band erbium-doped fiber, and the erbium-doped fiber 5 also adopts 80um (cladding) so as to meet the requirement of optical amplifier integration to QSFP and other smaller sizes. The shell is provided with an optical fiber bayonet which is used for restricting the shape of the erbium-doped optical fiber 5 in space, so that the erbium-doped optical fiber 5 is in an elliptic disc-shaped structure to adapt to the packaging of QSFP and ensure a larger bending radius as much as possible.
The two-in-one IWDM10 is an isolator and WDM, the size is only phi 2.5x22mm (diameter x length), the optical fiber output adopts 80um (cladding diameter), and the low bending loss optical fiber enables the whole optical amplification system to be integrated into a smaller platform.
The isolator 6 is a bipolar isolator, and has a size of only phi 2.5x22mm (diameter x length), and its optical fiber output adopts 80um (cladding diameter), low bending loss optical fiber, so that the whole optical amplification system can be integrated into a smaller platform.
The pump of the 3-pin non-refrigeration pump 9 is II-VI pump, the design size is 10x4.4x3.2mm (LxWxH), a high-reliability pump laser source is provided for the existing and emerging high-density high-integration optical amplifier system, and low-noise and high-power optical amplification is realized in a small-size system which is difficult to realize in the past; stable laser output up to 400 milliwatts can be provided in the whole working temperature range; the pump working temperature can reach an ultra-wide temperature range of-20 to 85 ℃, and the pump can stably work under various extreme working conditions; the pump adopts a refrigeration-free design, so that the power consumption of the whole pump laser is extremely low, the heat dissipation and the electric energy consumption of the whole optical amplifier system are greatly reduced, the difficulty of the heat dissipation design of the system is reduced, and the pump is more environment-friendly; the pump adopts the output pigtail design of the low bending loss HI1060 single-mode fiber, so that the whole optical amplification system can be integrated into a smaller platform, for example, standard products such as QSFP, CFP2 and CFP 4; the pump adopts a built-in fiber Bragg grating design, can provide stable laser wavelength output in the whole working temperature range, and the laser center wavelength can be 974nm or 976nm to meet the design requirements of different optical amplifiers; the pump adopts 80um (diameter of the clading, replacing the traditional 125um optical fiber) optical fiber output, so that the whole optical amplification system can be integrated into a smaller platform, such as standard products like QSFP, CFP2 and CFP 4; the pump completely meets the standard requirement (Telcordia GR-468-CORE) of a network equipment construction system in the telecommunication industry, has extremely high reliability, and can ensure the long-term stable operation of the whole optical amplifier system.
The optical fiber connection between each optical piece of the invention adopts a fusion coating process to replace the traditional heat-shrinkable tube protection, so that the space occupied by the heat-shrinkable tube (the current industry has a smaller size of phi 1.3x15mm (diameter x length)) can be effectively reduced (generally, the optical fiber amplifier has at least 5 fusion points, namely, the size space of 5 heat-shrinkable tubes is needed). The size of the coated fusion point is close to that of the uncoated optical fiber fusion point, so that the flexibility of optical fiber arrangement can be effectively improved. The coating can bear the proof test strength of 150kpis after being coated, fully meets the standard requirement (Telcordia GR-468-CORE) of network equipment construction system in the telecommunication industry, has extremely high reliability, and can ensure the long-term stable work of the whole optical amplifier system.
In the invention, the QSFP package size is 72.4mmx18.35mmx8.5mm (LxWxH), the mechanical size allows backward mechanical compatibility between QSFP + and QSFP 284X modules, and the package size meets the requirement of an industry multi-supplier protocol SFF-8661. The electrical interface and the communication protocol conform to the requirements of multi-supplier protocol SFF-8663 and SFF-8683. The package provides interoperability and electromagnetic interference control for optical modules that is compatible with QSFP packages.
The PCB board 3 is designed to have a size of 51.30mmx16.42mmx1mm (LxWxH), and the coil is placed in a maximum elliptical ring in order to reduce the bending radius of the erbium-doped fiber 5. Two unification beam split detectors carry out SMT to pin needle and paste dress welding through double-sided tape fixed to PCB board 3. Put 3-pin non-refrigeration pumping in the middle position a little, fix to PCB board 3 through double-sided tape on, carry out SMT subsides to 3 pins. Because of the limit of the surface position of the upper PCB board 3, the two-in-one IWDM10 of the passive device and the isolating device 6 are respectively placed on the two-in-one light splitting detector, and are stacked and fixed by adhesive tape or glue.
While the invention has been described in connection with the above embodiments, it is to be understood that the invention is not limited to the disclosed embodiments, which are illustrative and not restrictive, and that those skilled in the art will understand that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; such modifications and substitutions do not depart from the spirit and scope of the present invention, and they should be construed as being included in the following claims and description.
Claims (10)
1. A QSFP package-compatible optical fiber amplifier comprises a QSFP package structure-compatible shell, and is characterized in that: the LED lamp is characterized in that a PCB, an optical fiber amplification light path device and a circuit device are arranged inside the shell, a golden finger type power connector is arranged at the end of the PCB and extends out of the shell, the optical fiber amplification light path device is arranged on the upper surface of the PCB, and the circuit device is arranged on the lower surface of the PCB.
2. The QSFP packaged-compatible optical fiber amplifier of claim 1, wherein: the optical fiber amplification light path device comprises a two-in-one light splitting detector, an erbium-doped optical fiber, a two-in-one IWDM, an isolation device, an LC double light port and a 3-pin uncooled pump; the two-in-one spectral detector comprises an input end spectral detector and an output end spectral detector, the erbium-doped fiber is of an annular structure, and the LC double-optical-port comprises an input end LC optical port and an output end LC optical port; the input end LC optical port is connected with one end of the input end light splitting detector, the other end of the input end light splitting detector is sequentially connected with the two-in-one IWDM, the erbium-doped optical fiber, the isolating device, the output end light splitting detector and the output end LC optical port, and the output end of the 3-pin non-refrigeration pump is connected to the two-in-one IWDM.
3. The QSFP packaged-compatible optical fiber amplifier of claim 2, wherein: the input end spectral detector and the output end spectral detector are both of tubular structures.
4. The QSFP packaged-compatible optical fiber amplifier of claim 2, wherein: the optical fiber heads are integrated in the input end LC optical port and the output end LC optical port and comprise ceramic insertion cores and optical fibers, the optical fibers are inserted and fixed on the ceramic insertion cores, the optical fibers on the input end LC optical port are welded with the input end light splitting detector, and the optical fibers on the output end LC optical port are welded with the output end light splitting detector.
5. The QSFP packaged-compatible optical fiber amplifier of claim 2, wherein: the erbium-doped optical fiber is an OFS L-band erbium-doped optical fiber, the shell is provided with an optical fiber bayonet, and the optical fiber bayonet is used for restricting the shape of the erbium-doped optical fiber in space, so that the erbium-doped optical fiber is in an elliptic disc-shaped structure.
6. The QSFP packaged-compatible optical fiber amplifier of claim 2, wherein: the two-in-one IWDM is an isolator and a WDM.
7. The QSFP packaged-compatible optical fiber amplifier of claim 2, wherein: the isolation device is a bipolar isolator.
8. The QSFP packaged-compatible optical fiber amplifier of claim 2, wherein: and the Pump of the 3pin non-refrigeration Pump is II-VI Pump.
9. The QSFP packaged-compatible optical fiber amplifier of claim 1, wherein: the circuit device includes a circuit chip.
10. The QSFP packaged-compatible optical fiber amplifier of claim 1, wherein: the optical fiber amplifier supports two functions of APC/AGC; APC, AGC function realizes through the mode control of the register chooses to switch; when the APC mode is selected, for use at the rear of the optical transmitter, as a boost amplifier; when the AGC mode is selected, the front end for the optical receiver is used as a pre-amplifier.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110768072.0A CN113382533A (en) | 2021-07-07 | 2021-07-07 | Optical fiber amplifier compatible with QSFP packaging |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110768072.0A CN113382533A (en) | 2021-07-07 | 2021-07-07 | Optical fiber amplifier compatible with QSFP packaging |
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| CN113382533A true CN113382533A (en) | 2021-09-10 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202110768072.0A Pending CN113382533A (en) | 2021-07-07 | 2021-07-07 | Optical fiber amplifier compatible with QSFP packaging |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9496959B1 (en) * | 2015-07-01 | 2016-11-15 | Inphi Corporation | Photonic transceiving device package structure |
| CN106451044A (en) * | 2016-10-25 | 2017-02-22 | 无锡市德科立光电子技术有限公司 | Plug-in optical fiber amplifier |
| CN110505017A (en) * | 2019-06-10 | 2019-11-26 | 北京见合八方科技发展有限公司 | A kind of semiconductor optical fibre amplifying device of pluggable optical module formula |
| CN111799642A (en) * | 2020-07-24 | 2020-10-20 | 无锡市德科立光电子技术有限公司 | Optical fiber amplifier compatible with SFP + packaging |
-
2021
- 2021-07-07 CN CN202110768072.0A patent/CN113382533A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9496959B1 (en) * | 2015-07-01 | 2016-11-15 | Inphi Corporation | Photonic transceiving device package structure |
| CN106451044A (en) * | 2016-10-25 | 2017-02-22 | 无锡市德科立光电子技术有限公司 | Plug-in optical fiber amplifier |
| CN110505017A (en) * | 2019-06-10 | 2019-11-26 | 北京见合八方科技发展有限公司 | A kind of semiconductor optical fibre amplifying device of pluggable optical module formula |
| CN111799642A (en) * | 2020-07-24 | 2020-10-20 | 无锡市德科立光电子技术有限公司 | Optical fiber amplifier compatible with SFP + packaging |
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Application publication date: 20210910 |