CN216514213U

CN216514213U - Electroplating bath body

Info

Publication number: CN216514213U
Application number: CN202123240417.XU
Authority: CN
Inventors: 刘金升; 夏前刚
Original assignee: Suzhou Smick Microelectronic Equipment Co ltd
Current assignee: Suzhou Smick Microelectronic Equipment Co ltd
Priority date: 2021-12-22
Filing date: 2021-12-22
Publication date: 2022-05-13
Anticipated expiration: 2031-12-22

Abstract

The utility model discloses an electroplating tank body which comprises an electroplating tank base, wherein an electroplating inner and outer circulation tank is arranged on the electroplating tank base, a homogenizing plate driving device box is arranged on one side of the electroplating inner and outer circulation tank, an anode penetrating through the upper end of the electroplating inner and outer circulation tank is arranged on one side of the upper end of the electroplating inner and outer circulation tank, a homogenizing plate is arranged on one side of the anode, a wafer clamp is arranged on the other side of the homogenizing plate far away from the anode, a built-in heater arranged on one side of the wafer clamp is arranged in the electroplating inner and outer circulation tank, a connecting rod connected with the upper end of the electroplating inner and outer circulation tank is arranged on the upper end of the homogenizing plate, and one end of the connecting rod is connected with a homogenizing plate driving device arranged on the upper end of the homogenizing plate driving device box. The utility model has the beneficial effects that: the heater is built-in by external change, and the operation is more stable, and rate of heating is fast, and the assembly is simple, and is with low costs, and the positive pole is adjustable by fixed additional installation, can adjust suitable position at will according to electroplating process, and homogenization board drive arrangement installs additional and only changes the buckle, and the operation is stable, does not have the slope condition when the operation.

Description

Electroplating bath body

Technical Field

The utility model relates to the technical field of electroplating baths, in particular to an electroplating bath body.

Background

The existing electroplating tank body generally comprises nine parts: the device comprises an electroplating bath base, an electroplating internal and external circulation tank, an external heater, a circulation pump, an anode, a homogenizing plate driving device, a homogenizing plate, a wafer clamp and an auxiliary fastener.

The plating bath base is a fixing device, liquid medicine is input into the inner electroplating bath from a liquid inlet at the front lower part of the inner and outer electroplating circulation tanks, the inner bath electroplating liquid medicine overflows to the outer circulation tank after being full, flows out from a bottom pipeline of the outer circulation tank, flows into the circulating pump through the external heater, and then is flushed out from the bottom of the inner electroplating bath through the circulating pump, the anode and the homogenizing plate driving device start to operate after the electroplating liquid reaches a safe position, and the homogenizing plate driving device can drive the homogenizing plate to swing back and forth after operation, so that the electroplating liquid can be uniformly covered on a wafer of the wafer clamp.

The external heater of the existing electroplating tank body is inconvenient to install, has too low heating speed, is unstable to operate and has higher cost;

the anode of the existing electroplating tank body is a fixed position, and the position cannot be adjusted according to the electroplating process;

the homogenization plate driving device of the prior electroplating tank body is unstable in operation and can be gradually inclined during operation.

SUMMERY OF THE UTILITY MODEL

The utility model aims to provide an electroplating tank body to solve the problems in the background technology.

In order to achieve the purpose, the utility model provides the following technical scheme: the utility model provides an electroplating tank body, includes the plating bath base, be equipped with electroplating inside and outside circulation groove on the plating bath base, it is equipped with homogenization board drive arrangement box to electroplate inside and outside circulation groove one side, it is equipped with the positive pole that runs through its upper end and set up to electroplate inside and outside circulation groove upper end one side, positive pole one side is equipped with the homogenization board, the homogenization board is kept away from the opposite side of positive pole is equipped with wafer anchor clamps, electroplate inside and outside circulation inslot be equipped with set up in the built-in heater of wafer anchor clamps one side, homogenization board upper end be equipped with the connecting rod of electroplating inside and outside circulation groove upper end connection, connecting rod one end with the homogenization board drive arrangement who homogenizes board drive arrangement box upper end and sets up is connected.

Preferably, one side of the lower end of the electroplating internal and external circulation groove is provided with an auxiliary fastener.

Preferably, the two ends of the anode are respectively provided with an anode adjusting piece connected with the anode.

Preferably, bayonet risers of the inner and outer circulation grooves are symmetrically arranged on two sides of the lower end of the inner and outer circulation grooves for electroplating.

Preferably, the homogenizing plate driving device box is internally provided with a circulating pump, and the top of the circulating pump is connected with the homogenizing plate driving device.

Preferably, the two sides of the upper end of the electroplating internal and external circulation groove are symmetrically provided with an anode U-shaped adjusting group bayonet groove.

Preferably, the other end of the connecting rod, which is far away from the homogenizing plate driving device, is a homogenizing plate rotation stopping buckle, and the homogenizing plate rotation stopping buckle is of a structure with a flat opening at the upper end and an arc-shaped structure at the lower end.

Preferably, a universal joint is arranged between the connecting rod and the homogenizing plate driving device.

Preferably, a built-in heating groove is arranged outside the electroplating internal and external circulation groove.

Advantageous effects

According to the electroplating tank body provided by the utility model, the heater is changed from external arrangement to internal arrangement, so that the operation is more stable, the heating speed is high, the assembly is simple, the cost is low, the anode is additionally arranged from fixed type to adjustable type, the appropriate position can be randomly adjusted according to the electroplating process, the rotation stopping buckle is additionally arranged on the homogenizing plate driving device, the operation is stable, and no inclination condition exists during the operation.

Drawings

FIG. 1 is a schematic view of the overall structure of the present invention;

FIG. 2 is a schematic front view of the present invention;

fig. 3 is a schematic top view of the present invention.

Reference numerals

1-plating bath base, 2-plating internal and external circulation tank, 3-built-in heater, 4-circulation pump, 5-anode, 6-anode adjusting piece, 7-homogenizing plate driving device, 8-connecting rod, 9-homogenizing plate, 10-wafer clamp and 11-auxiliary fastener.

Detailed Description

The following are specific embodiments of the present invention and are further described with reference to the drawings, but the present invention is not limited to these embodiments.

Examples

As shown in fig. 1-3, an electroplating tank body comprises an electroplating tank base 1, an electroplating inner and outer circulation tank 2 is arranged on the electroplating tank base 1, a homogenizing plate driving device box is arranged on one side of the electroplating inner and outer circulation tank 2, an anode 5 penetrating through the upper end of the electroplating inner and outer circulation tank 2 is arranged on one side of the upper end of the electroplating inner and outer circulation tank 2, a homogenizing plate 9 is arranged on one side of the anode 5, a wafer clamp 10 is arranged on the other side, away from the anode 5, of the homogenizing plate 9, a built-in heater 3 arranged on one side of the wafer clamp 10 is arranged in the electroplating inner and outer circulation tank 2, a connecting rod 8 connected with the upper end of the electroplating inner and outer circulation tank 2 is arranged on the upper end of the homogenizing plate 9, and one end of the connecting rod 8 is connected with a homogenizing plate driving device 7 arranged on the upper end of the homogenizing plate driving device box.

Preferably, an auxiliary fastener 11 is arranged on one side of the lower end of the electroplating internal and external circulation groove 2.

Preferably, the anode 5 is provided with anode adjusting members 6 at both ends thereof.

Preferably, bayonet risers of the inner and outer circulation grooves are symmetrically arranged on two sides of the lower end of the electroplating inner and outer circulation groove 2.

Preferably, the homogenizing plate drive means box is internally provided with a circulation pump 4, the top of which is connected with the homogenizing plate drive means 7.

Preferably, the two sides of the upper end of the electroplating internal and external circulation groove 2 are symmetrically provided with an anode U-shaped adjusting group bayonet groove.

Preferably, the other end of the connecting rod 8, which is far away from the homogenizing plate driving device 7, is a homogenizing plate rotation stopping buckle, and the homogenizing plate rotation stopping buckle is of a structure with a flat opening at the upper end and an arc-shaped structure at the lower end.

Preferably, a joint gimbal is provided between the connecting rod 8 and the homogenizing plate drive 7.

Preferably, a built-in heating tank is arranged outside the electroplating internal and external circulation tank 2.

Two inner and outer circulation groove bayonet vertical plates are welded on the back side in the electroplating groove base so as to place and limit the electroplated inner and outer circulation grooves; a homogenizing plate driving device box is arranged at the front side in the plating bath base, which prevents the liquid medicine from entering the circuit and can fix the homogenizing plate driving device;

a circulating pump fixing threaded hole is formed in the lower front side in the plating bath base, and a circulating pump can be directly installed.

And the front edge and the rear edge of the outer tank of the electroplating inner and outer circulation tank are provided with an anode U-shaped adjusting group bayonet tank. The anode U-shaped adjusting group bayonet groove can be directly provided with an anode adjusting group, and then the rod part of the anode is fixed on the anode adjusting group;

the front edge and the rear edge of an outer groove of an electroplating inner and outer circulation groove are provided with homogenizing plate rotation stopping bayonet grooves which can be directly provided with homogenizing plate rotation stopping buckles, the rear end of the rod part of the homogenizing plate is inserted into the homogenizing plate rotation stopping buckles, and the front end of the rod part of the homogenizing plate is connected with a homogenizing plate driving device by a universal joint;

the outer side of the electroplating inner and outer circulation tank is provided with a built-in heater tank, so that the built-in heater can be directly placed and taken out during installation or maintenance.

The inner groove wall of the electroplating inner and outer circulation groove is provided with a limit notch for milling the wafer fixture, and the wafer fixture can be directly placed in.

Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that changes may be made in the embodiments and/or equivalents thereof without departing from the spirit and scope of the utility model. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention shall be included in the contents of the present invention within the scope of the protection of the present invention.

Claims

1. An electroplating bath body comprises an electroplating bath base (1), and is characterized in that: be equipped with on plating bath base (1) and electroplate inside and outside circulation tank (2), it is equipped with homogenization board drive arrangement box to electroplate inside and outside circulation tank (2) one side, it is equipped with positive pole (5) that run through its upper end and set up to electroplate inside and outside circulation tank (2) upper end one side, positive pole (5) one side is equipped with homogenization board (9), homogenization board (9) are kept away from the opposite side of positive pole (5) is equipped with wafer anchor clamps (10), electroplate inside and outside circulation tank (2) inslot be equipped with set up in built-in heater (3) of wafer anchor clamps (10) one side, homogenization board (9) upper end be equipped with connecting rod (8) of electroplating inside and outside circulation tank (2) upper end connection, connecting rod (8) one end with homogenization board drive arrangement (7) that homogenization board drive arrangement box upper end set up are connected.

2. The electroplating bath body according to claim 1, wherein: and an auxiliary fastener (11) is arranged on one side of the lower end of the electroplating internal and external circulation tank (2).

3. The electroplating bath body according to claim 1, wherein: and two ends of the anode (5) are respectively provided with an anode adjusting piece (6) connected with the anode.

4. The electroplating bath body according to claim 1, wherein: the bayonet risers of the inner and outer circulation grooves are symmetrically arranged on the two sides of the lower end of the electroplating inner and outer circulation groove (2).

5. The electroplating bath body according to claim 1, wherein: the homogenizing plate driving device box is internally provided with a circulating pump (4), and the top of the circulating pump is connected with the homogenizing plate driving device (7).

6. The electroplating bath body according to claim 1, wherein: and the two sides of the upper end of the electroplating internal and external circulation groove (2) are symmetrically provided with an anode U-shaped adjusting group bayonet groove.

7. The electroplating bath body according to claim 1, wherein: the other end of the connecting rod (8) far away from the homogenizing plate driving device (7) is a homogenizing plate rotation stopping buckle, and the homogenizing plate rotation stopping buckle is of a flat opening at the upper end and is of an arc structure at the lower end.

8. The electroplating bath body according to claim 1, wherein: a connected universal joint is arranged between the connecting rod (8) and the homogenizing plate driving device (7).

9. The electroplating bath body according to claim 1, wherein: and a built-in heating tank is arranged on the outer side of the electroplating internal and external circulation tank (2).