CN215404624U - Automatic liquid feeding device for PCB electroplating - Google Patents

Automatic liquid feeding device for PCB electroplating Download PDF

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Publication number
CN215404624U
CN215404624U CN202121063331.1U CN202121063331U CN215404624U CN 215404624 U CN215404624 U CN 215404624U CN 202121063331 U CN202121063331 U CN 202121063331U CN 215404624 U CN215404624 U CN 215404624U
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CN
China
Prior art keywords
box
wall
liquid feeding
fixed mounting
liquid
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN202121063331.1U
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Chinese (zh)
Inventor
周怀章
陈远兴
曹建
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Sichuan Hongan Xingsheng Electronic Technology Co ltd
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Sichuan Hongan Xingsheng Electronic Technology Co ltd
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Priority to CN202121063331.1U priority Critical patent/CN215404624U/en
Application granted granted Critical
Publication of CN215404624U publication Critical patent/CN215404624U/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Abstract

The utility model discloses an automatic liquid adding device for PCB electroplating, wherein a box body is fixedly arranged on the surface of a tool platform, a stirring assembly is rotatably arranged in the box body, a liquid adding assembly is fixedly arranged on one side of the box body, a temperature control switch and a liquid level switch are respectively and fixedly arranged on the inner wall of the box body, a baffle plate is fixedly arranged in the box body, a water tank is arranged at the bottom of the baffle plate, an electric heating block is fixedly arranged on the inner wall of the water tank, a liquid infusion assembly is fixedly connected on one side of the box body, an electroplating bath is fixedly connected at one end of the liquid infusion assembly far away from the box body, the device is used for driving a stirring rod to stir electroplating liquid through a motor and is matched with the electric heating block, the deposition of the electroplating liquid can be prevented, in addition, the device is matched with a flow meter through a throttle valve, the flow regulation of the electroplating liquid can be realized, and the uniform output of the electroplating liquid can be realized, the quality of electroplating can be improved.

Description

Automatic liquid feeding device for PCB electroplating
Technical Field
The utility model relates to the technical field of PCB (printed circuit board), in particular to an automatic liquid adding device for PCB electroplating.
Background
The PCB, which is also called a Printed Circuit Board (PCB), is an important electronic component, a support for electronic components, and a carrier for electrical interconnection of electronic components. It is called a "printed" circuit board because it is made using electronic printing.
Need electroplate it when adding man-hour to the PCB board, but current electroplating device is at the in-process of liquid feeding, because the inequality and the stirring of being heated are inhomogeneous, lead to the storage liquid to deposit easily, and then influence the electroplating operation of circuit board, current device is in electroplating process moreover, and inhomogeneous condition can appear in the plating solution, will influence the effect of electroplating like this.
Therefore, it is desirable to provide an automatic liquid adding device for PCB electroplating to solve the above problems.
SUMMERY OF THE UTILITY MODEL
The utility model aims to provide an automatic liquid adding device for PCB electroplating, which can prevent the deposition of electroplating liquid by driving a stirring rod to stir the electroplating liquid through a motor and matching with an electric heating block, can realize the adjustment of the flow of the electroplating liquid through the matching of a throttle valve and a flowmeter, can realize the uniform output of the electroplating liquid, and can improve the electroplating quality so as to solve the problems in the background art.
In order to achieve the purpose, the utility model provides the following technical scheme: the utility model provides an automatic liquid feeding device of PCB electroplating, includes the frock platform, frock platform fixed surface installs the box, the inside rotation of box installs the stirring subassembly, box one side fixed mounting has the liquid feeding subassembly, box inner wall fixed mounting has temperature detect switch and liquid level switch respectively, the inside fixed mounting of box has the baffle, the baffle bottom is provided with the water tank, water tank inner wall fixed mounting has the electrical heating piece, box one side fixedly connected with infusion subassembly, box one end fixedly connected with plating bath is kept away from to the infusion subassembly.
Preferably, the stirring assembly comprises a motor, the motor is fixedly mounted on the outer wall of the top of the box body, a rotating shaft is fixedly mounted at an output shaft end of the motor, a stirring rod is fixedly mounted on the outer wall of the rotating shaft, bearings are embedded on the surfaces of the baffle and the top of the box body, and the outer wall of the rotating shaft is attached to the inner wall of the inner ring of each bearing.
Preferably, the liquid feeding subassembly includes the liquid feeding pump, liquid feeding pump fixed mounting is in box one side outer wall, the fixed intercommunication in liquid feeding pump one side has first liquid feeding pipe, the fixed intercommunication of liquid feeding pump opposite side has the second liquid feeding pipe, the second liquid feeding pipe runs through box inner wall and fixedly connected with nozzle, the box inner wall is located nozzle installation department fixed mounting and has the filter screen.
Preferably, the infusion assembly comprises a filter, a first conduit is fixedly communicated with one side of the filter, one end, away from the filter, of the first conduit penetrates through the inner side wall of the box body, a throttle valve is arranged on the first conduit, a second conduit is fixedly communicated with the other side of the filter, one end, away from the filter, of the second conduit is fixedly connected with a water pump, a third conduit is fixedly communicated with one side of the water pump, a flow meter is arranged on the third conduit, and one end, away from the water pump, of the third conduit is fixedly connected with an electroplating bath.
Preferably, the outer wall of the top of the box body and the outer wall of one side of the box body are fixedly provided with supporting plates, the motor and the liquid adding pump are fixedly arranged on the surfaces of the supporting plates, the surface of the tooling platform is fixedly provided with two groups of supports, and the filter and the water pump are fixedly arranged on the tops of the supports.
Preferably, one side of the box body is provided with a groove, a glass plate is fixedly arranged in the groove, and a graduated scale is fixedly arranged on the glass plate.
Compared with the prior art, the utility model has the beneficial effects that:
1. the device drives the stirring rod to stir the electroplating solution through the motor, heats the electroplating solution through the electric heating block, can realize uniform heating of the electroplating solution, can realize extraction of the electroplating solution from the bottom of the box body through the arrangement of the first conduit at the bottom of the box body, and can prevent deposition of the electroplating solution to a certain extent;
2. the device mutually supports through choke valve and flowmeter, can monitor and adjust the output flow of plating solution, can improve the homogeneity of plating solution output to can improve the quality of electroplating.
Drawings
FIG. 1 is a schematic perspective view of a case according to the present invention;
FIG. 2 is a schematic front view of the present invention;
fig. 3 is a front sectional structural view of the present invention.
In the figure: 1. a tooling platform; 2. a box body; 3. a stirring assembly; 301. a motor; 302. a rotating shaft; 303. a stirring rod; 4. a liquid adding assembly; 401. a liquid adding pump; 402. a first liquid adding pipe; 403. a second liquid adding pipe; 404. a filter screen; 5. a temperature control switch; 6. a liquid level switch; 7. a baffle plate; 8. a water tank; 9. an electrical heating block; 10. a fluid delivery assembly; 1001. a filter; 1002. a first conduit; 1003. a throttle valve; 1004. a second conduit; 1005. a water pump; 1006. a third conduit; 1007. a flow meter; 11. an electroplating bath; 12. a support plate; 13. a support; 14. a glass plate.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1-3, the present invention provides a technical solution: an automatic liquid adding device for PCB electroplating comprises a tool platform 1, a box body 2 is fixedly arranged on the surface of the tool platform 1, the electroplating liquid is stored through the box body 2, a stirring assembly 3 is rotatably arranged in the box body 2, a liquid adding assembly 4 is fixedly arranged on one side of the box body 2, a temperature control switch 5 and a liquid level switch 6 are respectively and fixedly arranged on the inner wall of the box body 2, the temperature of the electroplating liquid is monitored through the temperature control switch 5, the water level of the electroplating liquid in the box body 2 is monitored through the liquid level switch 6, a baffle 7 is fixedly arranged in the box body 2, the box body 2 is divided into two parts through the baffle 7, a water tank 8 is arranged at the bottom of the baffle 7, the water source is stored through the water tank 8, an electric heating block 9 is fixedly arranged on the inner wall of the water tank 8, the electric heating block 9 is electrically connected with the temperature control switch 5, a transfusion assembly 10 is fixedly connected with one side of the box body 2, one end of the transfusion component 10 far away from the box body 2 is fixedly connected with a plating bath 11.
Stirring subassembly 3 includes motor 301, realize the rotation control to pivot 302 and stirring rod 303 through motor 301, motor 301 fixed mounting is in 2 top outer walls of box, motor 301's output shaft fixed mounting has pivot 302, realize the installation to stirring rod 303 through pivot 302, pivot 302 outer wall fixed mounting has stirring rod 303, realize the stirring to the plating solution through stirring rod 303, baffle 7 surface all inlays with 2 tops of box and is equipped with the bearing, the outer wall of pivot 302 sets up with the inner circle inner wall laminating of bearing.
Liquid feeding subassembly 4 includes liquid feeding pump 401, liquid feeding pump 401 fixed mounting is in 2 one side outer walls of box, the fixed intercommunication in liquid feeding pump 401 one side has first liquid feeding pipe 402, the fixed intercommunication in liquid feeding pump 401 opposite side has second liquid feeding pipe 403, through liquid feeding pump 401, first liquid feeding pipe 402 realizes pouring into the plating solution into 2 insides of box with second liquid feeding pipe 403, liquid feeding pump 401 and level switch 6 electric connection, second liquid feeding pipe 403 runs through 2 inner walls of box and fixedly connected with nozzle, 2 inner walls of box are located nozzle installation department fixed mounting and have filter screen 404.
The infusion set 10 comprises a filter 1001, the electroplating solution is filtered by a filter screen 404 and the filter 1001, the model of the filter 1001 is DWD-1001, the filter 1001 has the advantages of acid and alkali resistance, high temperature resistance, corrosion resistance and the like, the working principle is the known technology, one side of the filter 1001 is fixedly communicated with a first conduit 1002, one end of the first conduit 1002, which is far away from the filter 1001, penetrates through the inner side wall of the box body 2, a throttle valve 1003 is arranged on the first conduit 1002, the other side of the filter 1001 is fixedly communicated with a second conduit 1004, one end of the second conduit 1004, which is far away from the filter 1001, is fixedly connected with a water pump 1005, the plating solution is pumped by a water pump 1005, one side of the water pump 1005 is fixedly communicated with a third conduit 1006, the electroplating solution is conveyed through the first conduit 1002, the second conduit 1004 and the third conduit 1006, a flow meter 1007 is arranged on the third conduit 1006, and one end of the third conduit 1006 far away from the water pump 1005 is fixedly connected with the electroplating bath 11.
The outer wall of the top of the box body 2 and the outer wall of one side of the box body 2 are fixedly provided with a supporting plate 12, the motor 301 and the liquid adding pump 401 are fixedly arranged on the surface of the supporting plate 12, the surface of the tooling platform 1 is fixedly provided with two sets of supports 13, and the filter 1001 and the water pump 1005 are fixedly arranged on the tops of the supports 13.
One side of the box body 2 is provided with a groove, a glass plate 14 is fixedly arranged in the groove, and a graduated scale is fixedly arranged on the glass plate 14.
During the use, start liquid level switch 6, because liquid level switch 6 does not detect the plating solution, can control the liquid feeding pump 401 and start, then carry the external plating solution in the box 2 through first liquid feeding pipe 402 and second liquid feeding pipe 403, when the water level in the box 2 reaches liquid level switch 6, liquid level switch 6 control liquid feeding pump 401 closes, stop the input of plating solution, then pour into the water source into in the water tank 8, then start motor 301 and electric heating block 9 simultaneously, the water source heating, and transmit the plating solution through baffle 7, realize the heating and the stirring to the plating solution, then start filter 1001 and water pump 1005, water pump 1005 carries plating bath 11 through first pipe 1002, second pipe 1004 and third pipe 1006, in transportation process, the user can adjust throttle valve 1003, thereby control the flow of plating solution.
In the description of the present application, it should be further noted that, unless otherwise explicitly stated or limited, the terms "disposed," "mounted," "connected," and "connected" are to be construed broadly and may include, for example, a fixed connection, a detachable connection, an integral connection, a mechanical connection, an electrical connection, a direct connection, a connection through an intermediate medium, and a connection between two elements. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art according to specific circumstances.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.

Claims (6)

1. The utility model provides a PCB electroplates automatic liquid feeding device, includes frock platform (1), its characterized in that: frock platform (1) fixed surface installs box (2), stirring subassembly (3) are installed in box (2) inside rotation, box (2) one side fixed mounting has liquid feeding subassembly (4), box (2) inner wall fixed mounting has temperature detect switch (5) and liquid level switch (6) respectively, box (2) inside fixed mounting has baffle (7), baffle (7) bottom is provided with water tank (8), water tank (8) inner wall fixed mounting has electric heating piece (9), box (2) one side fixedly connected with infusion subassembly (10), box (2) one end fixedly connected with plating bath (11) are kept away from in infusion subassembly (10).
2. The automatic liquid adding device for PCB electroplating according to claim 1, characterized in that: stirring subassembly (3) include motor (301), motor (301) fixed mounting is in box (2) top outer wall, the output shaft fixed mounting of motor (301) has pivot (302), pivot (302) outer wall fixed mounting has stirring rod (303), baffle (7) surface all inlays with box (2) top and is equipped with the bearing, the outer wall of pivot (302) sets up with the inner circle inner wall laminating of bearing.
3. The automatic liquid adding device for PCB electroplating according to claim 2, characterized in that: liquid feeding subassembly (4) include liquid feeding pump (401), liquid feeding pump (401) fixed mounting is in box (2) one side outer wall, the fixed intercommunication in liquid feeding pump (401) one side has first liquid feeding pipe (402), the fixed intercommunication in liquid feeding pump (401) opposite side has second liquid feeding pipe (403), second liquid feeding pipe (403) run through box (2) inner wall and fixedly connected with nozzle, box (2) inner wall is located nozzle installation department fixed mounting and has filter screen (404).
4. The automatic liquid adding device for PCB electroplating according to claim 3, characterized in that: infusion subassembly (10) includes filter (1001), filter (1001) one side fixed intercommunication has first pipe (1002), filter (1001) one end is kept away from in first pipe (1002) runs through box (2) inside wall, be provided with choke valve (1003) on first pipe (1002), filter (1001) other side fixed intercommunication has second pipe (1004), filter (1001) one end fixedly connected with water pump (1005) are kept away from in second pipe (1004), water pump (1005) one side fixed intercommunication has third pipe (1006), be provided with flowmeter (1007) on third pipe (1006), water pump (1005) one end fixed connection plating bath (11) are kept away from in third pipe (1006).
5. The automatic liquid adding device for PCB electroplating according to claim 4, characterized in that: the utility model discloses a tool platform, including box (2), motor (301), frock platform (1), water pump (1005), box (2) top outer wall and the equal fixed mounting of box (2) one side outer wall have backup pad (12), the equal fixed mounting of motor (301) and liquid feeding pump (401) is in backup pad (12) surface, frock platform (1) fixed surface installs two sets of supports (13), filter (1001) and the equal fixed mounting of water pump (1005) are in support (13) top.
6. The automatic liquid adding device for PCB electroplating according to claim 1, characterized in that: a groove is formed in one side of the box body (2), a glass plate (14) is fixedly mounted in the groove, and a graduated scale is fixedly arranged on the glass plate (14).
CN202121063331.1U 2021-05-18 2021-05-18 Automatic liquid feeding device for PCB electroplating Expired - Fee Related CN215404624U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202121063331.1U CN215404624U (en) 2021-05-18 2021-05-18 Automatic liquid feeding device for PCB electroplating

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202121063331.1U CN215404624U (en) 2021-05-18 2021-05-18 Automatic liquid feeding device for PCB electroplating

Publications (1)

Publication Number Publication Date
CN215404624U true CN215404624U (en) 2022-01-04

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ID=79675682

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202121063331.1U Expired - Fee Related CN215404624U (en) 2021-05-18 2021-05-18 Automatic liquid feeding device for PCB electroplating

Country Status (1)

Country Link
CN (1) CN215404624U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114737188A (en) * 2022-03-01 2022-07-12 李洋 Polishing production system

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114737188A (en) * 2022-03-01 2022-07-12 李洋 Polishing production system

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Granted publication date: 20220104